TWI529790B - Breaking device - Google Patents

Description

Breaking device

The present application claims priority based on Japanese Patent Application No. 2010-153352, No. 2010-153350, No. 2010-153351, No. 2010-153353.

The present invention relates to a method of dividing a substrate composed of a brittle material such as glass, tantalum, ceramics, or a compound semiconductor. In particular, the present invention relates to a device for dividing a substrate into a unit product such as a wafer by forming a plurality of strips in a rectangular or lattice shape on a substrate.

Conventionally, a method in which a plurality of scribe lines are formed by using a dicing saw, a cutter wheel, and a laser beam on a brittle material substrate, and then an external force is applied to bend the substrate, and the scribe line is broken to take out a product such as a wafer (for example) Patent Document 1, etc.).

Fig. 20 is a perspective view showing an example of a case where a laser beam is used to form a scribe line on the substrate 21 on the stage 20. By scanning the predetermined line L along the line, the scanning mechanism 22 scans the beam point of the laser optical system 23 and then ejects the refrigerant from the nozzle 24a of the cooling mechanism 24 in a manner closely following it, using the thermal stress distribution in the substrate. Mark line S. After the scribe line forming step, the brittle material substrate is bent by pressing a portion of the scribe line with a broken bar or a roller from a surface opposite to the surface on which the scribe line is formed, and bending moment Broken along the score line.

When the bending moment is applied to the brittle material substrate along the scribe line to break, it is preferable to perform the three-point bending method in order to effectively generate the bending moment.

Fig. 21 shows a method in which a LTCC substrate (low-temperature fired ceramic substrate) 21 in which a plurality of electronic components are formed is broken by a general three-point bending method using a plate-shaped fracture bar.

The divided LTCC substrate 21 is adhered to the elastic thin film 27, and the adhesive film 27 is attached to the annular cutting frame 28 in a state of being stretched around the periphery.

A pair of upper broken bars 25 and 25 are disposed on the left and right positions of the LTCC substrate 21 at the left and right positions, and the surface opposite to the surface on which the scribe line S is provided is located below the scribe line S. The lower break bar 26 is disposed, and one of the upper break bars 25 and 25 and the lower break bar 26 is pressed against the LTCC substrate 21 to break the bending moment.

A method of breaking by a three-point bending method using a breaking bar is disclosed, for example, in Patent Document 2. Further, a means for breaking by a three-point bending method using a roller instead of a breaking bar has been disclosed in Fig. 3 of Patent Document 1.

On the other hand, the method of placing the substrate on the suction platform and breaking the state in which the suction is fixed is disclosed (see Patent Document 3).

Patent Document 1: Japanese Laid-Open Patent Publication No. 08-175837

Patent Document 2: Japanese Unexamined Patent Publication No. 05-45032

Patent Document 3: Japanese Laid-Open Patent Publication No. 2003-170419

However, there are the following problems in the means of breaking in a three-point bending manner.

As shown in Fig. 21, when the pair of upper breaking bars 25, 25 are brought into contact with the surface of the LTCC substrate 21 and the lower breaking bar 26 is protruded to cause the bending moment to be generated and broken, if the fixing of the LTCC substrate 21 is insufficient, the LTCC substrate 21 is insufficient. It will be offset and cannot be accurately divided along the predetermined line.

It is preferable to mount the LTCC substrate 21 on the suction platform having a plurality of suction holes and to fix the suction, but the presence of the break bar 26 below the lower portion of the LTCC substrate 21 in the three-point bending mode becomes significant. It is difficult to limit the setting of the suction platform. Further, although the peripheral portion of the LTCC substrate 21, that is, the dicing frame 28, is sandwiched and fixed from the upper and lower sides by a clamp or the like, the structure is complicated, and the substrate is not completely held, so that the stability is lacking.

In view of the above problems, the present invention provides a breaking device which is provided in a three-point bending manner when the brittle material substrate is divided, and the substrate is surely fixed to eliminate the substrate offset, and the scribe line can be accurately separated according to a predetermined scribe line. First, the purpose.

Further, as shown in FIG. 21, when the pair of upper break bars 25, 25 are brought into contact with the surface of the LTCC substrate 21 and the lower break bar 26 is protruded to cause the bending moment to be generated and broken, the breaking edge portion of the LTCC substrate 21 is If the elastic reaction force caused by the bending is applied upward, there is a possibility that a portion of the corner of the edge is notched or broken to be a defective product. Further, fine glass swarf (chip swarf) caused by the notch is scattered and scattered, and the glass swarf adheres to and remains on the surface of the LTCC substrate 21, which may cause a defective product. Therefore, it is necessary to add a step of removing the glass shavings in the subsequent processing, which is problematic.

In view of the above problems, the present invention provides a novel breaking device which is a three-point bending method for breaking a brittle material substrate and which is not easy to be generated at the time of breaking, and which can obtain a beautiful cross-section. .

Further, the present invention has a third object of providing a breaking device which can be removed at the same time as breaking even if fine glass swarf is generated.

In order to solve the above object, the present invention employs the following technical means. That is, the breaking device of the present invention has a suction platform on which a sharded brittle material substrate is formed and which is sucked and held by a surface; a substrate mounting surface formed on the absorbing platform and a scribe line of the substrate a pair of upper and lower openings that are placed near the top of the scribe line; and a pair of left and right upper break bars that are disposed on the left and right sides of the scribe line and that press the surface of the brittle material substrate; A brittle material substrate is placed near the bottom of the scribe line to break the brittle material substrate, and the lower break bar is movably housed in the opening and protrudes from the opening when the substrate is broken. Here, the opening portion is preferably formed such that the lower break bar is slidable.

According to the breaking device of the present invention, when the brittle material substrate is broken by the three-point bending moment of the lower broken bar and the upper broken bar, the brittle material substrate is sucked and fixed by the suction platform, so that when the lower portion of the bar is broken The substrate is not offset, and the scribe line can be equally applied to the left and right sides, so that it can be accurately separated along the scribe line. In particular, in the present invention, by reducing the width of the opening portion of the suction platform, the reduction in the suction area of the suction platform caused by the provision of the opening portion can be minimized, and the substrate can be confirmed in the vicinity of the score line. Suction fixed.

In addition, the lower portion of the break bar that is housed in the opening is formed to protrude from the opening when the substrate is separated, so that it does not hinder the placement of the brittle material substrate on the suction platform, and the frame can be prevented from being cut when the substrate is placed. The effect of abutting and damaging the substrate or the lower break bar.

(means and effects to solve other problems)

In the above invention, the elastic pressing member which is disposed in the vicinity of the scribe line and which elastically presses the breaking edge portion when the brittle material substrate is separated to prevent the upward movement of the brittle material substrate may be provided.

According to the breaking device of the present invention, when the three-point bending moment of the lower broken bar and the upper breaking bar breaks off the brittle material substrate from the scribe line, the elastic pressing member elastically presses the upper portion of the scribe line, so When the substrate is broken, the breaking edge does not bounce upward due to the reaction force of the bending.

Therefore, it is possible to prevent a large impact from being broken at the time of breaking, and to obtain a beautiful cross section at the corner of the breaking edge, and to obtain a beautiful cross section, and to suppress the occurrence of defective products caused by the scattering of the chip breaking. effect.

Further, the front end of the elastic pressing member may be formed to have a flat surface having a width, and may be brought into contact with the vicinity of the upper surface of the scribe line in a surface contact manner.

In this way, it is easy to elastically break the edge of the break at the time of breaking, and it is possible to surely eliminate the bounce from above.

Further, the elastic pressing member may be formed of a hard material and may be biased by a spring to the brittle material substrate.

Further, at least a part of the elastic pressing member may be formed of a material having elasticity.

Thereby, the simplification of the composition and the reduction of the cost can be achieved.

Further, a glass frit suction means disposed in the vicinity of the elastic pressing member and having a suction port for attracting the glass swarf generated when the brittle material substrate is broken may be provided.

Thereby, even if fine glass swarf is generated at the time of breaking the substrate, the glass swarf suction means can be removed at the same time as the breakage, so that the defects caused by the scattering of the glass swarf can be prevented, and a good yield can be obtained.

Here, it is preferable that the suction port of the glass frit suction means is formed between the elastic pressing member and the upper breaking bar.

Thereby, the finite narrow interval between the left and right sides of the upper break bar can provide a suction opening at a position close to the score line, whereby the glass cullet can be effectively sucked and removed.

The covering body that forms the suction port of the glass frit suction means is attached to the elastic pressing member, and the inner space of the covering body may be connected to the suction pump.

Thereby, the near portion above the line to be broken can be covered with the covering body, and the suction and removal of the glass chips can be effectively performed.

Hereinafter, the details of the breaking device of the present invention will be described in detail based on the drawings. Here, an example of an electronic component in which an LTCC substrate (a low-temperature fired ceramic substrate) in which a plurality of electronic components are collectively formed into a lattice shape and is divided into a unit element by a scribe line is described based on a drawing.

(Embodiment 1)

Fig. 1 to Fig. 6 are views showing the first embodiment. The LTCC substrate 1 separated by the present invention is adhered to the elastic thin film 2, and the adhesive film 2 is attached to the annular cutting frame 3 in a state of being stretched around the periphery (see Fig. 1). A plurality of electronic parts P are integrally formed on the LTCC substrate 1 adhered to the adhesive film 2, and a plurality of scribe lines S which define the vertical and horizontal directions of the electronic parts P are formed by the preceding scribe step. The cutting frame 3 is placed on the suction platform 10 of the breaking device A to be described later, and is movable in the Y direction by the conveying mechanism 11.

The breaking device A is provided with a suction platform 10 having a plurality of suction holes 10a on its surface, and the LTCC substrate 1 placed on the adsorption platform 10 is sucked and fixed together with the adhesive film 2 by the suction holes 10a.

The bridge portion 14 formed by sandwiching the left and right support bodies 12 and 12 disposed on the platform 10 and the horizontal horizontal frame 13 extending in the X direction is a cross-sucking platform 10. The holder member 7 that holds the breaking bar 4 that constitutes the upper portion of the breaking mechanism B is attached to the horizontal frame 13 through the driving mechanism (not shown).

Further, cameras 15 and 15 are disposed above the breaking device A. The cameras 15, 15 are movable in the X direction and the Y direction by the guides 17, 18 provided on the platen 16. The cameras 15, 15 can be manually operated up and down to adjust the focus of photography. The images captured by the cameras 15, 15 are displayed on the screen (outside the figure). A positioning mark (alignment mark) is formed on the LTCC substrate 1. By photographing the surface of the LTCC substrate 1 with the cameras 15, 15, the positioning of the break position can be performed with reference to the positioning mark for photographing. Further, the positioning of the breaking position may be performed by referring to the scribe line itself instead of the positioning mark.

Next, a portion of the breaking mechanism B that breaks the LTCC substrate 1 will be described with reference to Figs. 3 to 6 .

The breaking mechanism B is composed of a pair of right and left upper breaking bars 4 and 4 disposed above the LTCC substrate 1 to be separated, and a lower breaking bar 5 disposed below the lower surface of the LTCC substrate 1.

The upper break bars 4, 4 and the lower break bars 5 are formed of a strip-shaped plate extending in the X direction to make the front end portion thinner. In addition, the material is made of a hard material such as metal.

The pair of right and left upper breaking bars 4 and 4 are fixedly held by the holder member 7 which can be lifted and lowered, and the end portions before the refinement are spaced apart from each other by a predetermined interval, and are preferably disposed at intervals of 2.5 mm to 6.0 mm.

The suction platform 10 is provided with an elongated opening 9 that opens toward the substrate mounting surface, and the lower breaking bar 5 is disposed to be movable up and down along the longitudinal direction of the opening 9. The lower break bar 5 is pulled into the opening 9 so that the tip end thereof does not protrude from the surface of the suction platform 10, and protrudes only when the LTCC substrate 1 is broken. The thickness t of the lower break bar 5 and the width D of the opening portion 9 in which the lower break bar 5 can be moved up and down are formed to be as small as possible. Thereby, the reduction of the absorbing region of the absorbing platform 10 by the provision of the opening portion 9 can be minimized, and the contact surface of the LTCC substrate 1 and the absorbing platform 10 can be made as close as possible to the scribe line S. In the present embodiment, the thickness t of the lower broken bar 5 is 1.0 mm, and the width D of the opening portion 9 in the shorter direction is formed by adding the size of the gap in which the lower break bar 5 is slidable.

Further, the raising and lowering of the lower breaking bar 5 and the raising and lowering of the holder member 7 for holding the upper breaking bars 4, 4 are performed by a driving mechanism (outside the drawing).

When the LTCC substrate 1 is divided, as shown in FIG. 4, the LTCC substrate 1 adhered to the adhesive film 2 is placed on the absorbing platform 10. The LTCC substrate 1 is formed with a scribe line S in a preceding scribe line forming step, and the scribe line S is positioned near the lower break bar 5 and is affixed and fixed by the absorbing platform 10. Further, positioning is performed such that the center of the interval between the upper break bars 4, 4 is located near the top of the score line S. The positioning operation is performed using the positioning cameras 15, 15 which have been described previously.

Thereafter, as shown in FIG. 5, the holder member 7 is lowered to a position where the front ends of the pair of left and right upper break bars 4, 4 are in contact with the LTCC substrate 1. Next, as shown in Fig. 6, the lower break bar 5 is raised, and the LTCC substrate 1 is separated from the score line S by the three-point bending moment of the lower break bar 5 and the pair of left and right upper break bars 4, 4.

At the time of the breaking, the LTCC substrate 1 (through the adhesive film 2) is sucked and fixed by the suction platform 10, so that the LTCC substrate 1 does not shift when the lower break bar 5 is placed on the LTCC substrate 1, and can be accurately scribed along the scribe line S. Break. Further, by reducing the opening portion 9 of the suction platform 10 to the allowable limit of the movement of the lower breaking bar 5 (in the slidable range), the absorbing area of the absorbing platform 10 caused by the opening portion 9 can be set. The reduction suppression is minimized, and the LTCC substrate 1 can be surely occluded and fixed.

Further, the lower break bar 5 is housed in the opening 9 and is formed to protrude from the opening 9 when the substrate is broken. Therefore, the lower break bar 5 does not become a hindrance when the LTCC substrate 1 is placed on the suction platform 10, and can be prevented from being placed. When the LTCC substrate 1 is in contact with the cutting frame 3 or the like, the LTCC substrate 1 or the lower break bar 5 is damaged.

After the breaking of the score line S is completed, the upper break bars 4, 4 and the lower break bar 5 are retracted, and the LTCC substrate 1 is moved so that the lower break bar 5 reaches the lower portion of the line S below the second break, and then The same process is broken one by one.

(Embodiment 2)

7 to 13 are views showing a second embodiment. In addition, the perspective view of the entire structure of the cutting device of the second embodiment is the same as that of FIG. 1 and the side view is the same as that of FIG. 2, and therefore, the same reference numerals will be given to the same portions, and the description will be omitted.

The breaking device A is provided with a suction platform 10 having a plurality of suction holes 10a on its surface, and the LTCC substrate 1 placed on the adsorption platform 10 is sucked and fixed together with the adhesive film 2 by the suction holes 10a.

The bridge portion 14 formed by sandwiching the left and right support bodies 12 and 12 disposed on the platform 10 and the horizontal horizontal frame 13 extending in the X direction is a cross-sucking platform 10. The holder member 7 that holds the upper broken rod 4 and the elastic pressing member 6 that constitutes one of the upper portions of the breaking mechanism B is attached to the horizontal frame 13 through the driving mechanism (not shown).

Further, cameras 15 and 15 are disposed above the breaking device A. The cameras 15, 15 are movable in the X direction and the Y direction by the guides 17, 18 provided on the platen 16. The cameras 15, 15 can be manually operated up and down to adjust the focus of photography. The images captured by the cameras 15, 15 are displayed on the screen (outside the figure). A positioning mark (alignment mark) is formed on the LTCC substrate 1. By photographing the surface of the LTCC substrate 1 with the cameras 15, 15, the positioning of the break position can be performed with reference to the positioning mark for photographing. Further, the positioning of the breaking position may be performed by referring to the scribe line itself instead of the positioning mark.

Next, a portion of the breaking mechanism B that breaks the LTCC substrate 1 will be described with reference to Figs. 7 to 13 .

The breaking mechanism B of the second embodiment is composed of a pair of left and right upper breaking bars 4 and 4 disposed above the LTCC substrate 1 to be separated, and a lower breaking bar 5 disposed below the LTCC substrate 1 and the LTCC substrate 1 The elastic pressing member 6 disposed at the center between the upper breaking bars 4 and 4 is formed above.

The upper break bars 4, 4 and the lower break bars 5 and the elastic pressing members 6 are formed of a strip-shaped plate material extending in the X direction to make the front end portion thinner. In addition, the material is made of a hard material such as metal.

The pair of right and left upper breaking bars 4 and 4 are fixedly held by the holder member 7 which can be lifted and lowered, and the end portions before the refinement are spaced apart from each other by a predetermined interval, and are preferably disposed at intervals of 2.5 mm to 6.0 mm. Further, the elastic pressing member 6 is elastically held by the holder member 7 in a state where the spring end 8 is biased until the front end portion 6a thereof slightly protrudes from the front end of the upper breaking bars 4, 4.

The suction platform 10 is provided with an elongated opening 9 (see FIG. 3) that opens toward the substrate mounting surface, and the lower breaking bar 5 is disposed up and down along the opening 9. The lower break bar 5 is pulled into the opening 9 so that the tip end thereof does not protrude from the surface of the suction platform 10, and protrudes only when the LTCC substrate 1 is broken. Since the outer lower break bar 5 is housed in the opening 9 of the suction platform 10 at the time of the break, the frame is not cut when the LTCC substrate 1 is placed on the suction platform 10, and the frame 3 can be prevented from being placed when the LTCC substrate 1 is placed. The LTCC substrate 1 or the lower break bar 5 is damaged by the abutment.

Further, the raising and lowering of the lower breaking bar 5 and the raising and lowering of the holder members 7 of the upper breaking bars 4 and 4 and the elastic pressing member 6 are performed by a driving mechanism (outside the drawing).

When the LTCC substrate 1 is divided, as shown in FIG. 9, the LTCC substrate 1 adhered to the adhesive film 2 is placed on the absorbing platform 10. The LTCC substrate 1 is formed with a scribe line S in a preceding scribe line forming step, such that the scribe line S is located near the lower break bar 5 and is held by the absorbing platform 10. Further, positioning is performed such that the elastic pressing member 6 disposed at the center of the interval between the upper breaking bars 4, 4 is located near the upper side of the score line S. The positioning operation is performed using the positioning cameras 15, 15 which have been described previously.

Next, as shown in FIG. 10, the holder member 7 is lowered to a position where the front ends of the pair of left and right upper break bars 4, 4 are in contact with the LTCC substrate 1. At this time, the front end portion 6a of the elastic pressing member 6 that protrudes from the upper breaking bars 4 and 4 is closer to the upper portion of the scribe line S than the upper breaking bars 4 and 4, but is retracted by its own elastic force, and becomes elastic at any time. The state of the upper portion of the score line S is pressed.

Thereafter, as shown in FIG. 11, the lower break bar 5 is raised, and the LTCC substrate 1 is separated from the score line S by the three-point bending moment of the lower break bar 5 and the pair of left and right upper break bars 4, 4.

When the cutting is performed, the upper portion of the scribe line S is elastically pressed by the elastic pressing member 6, so that the breaking edge of the LTCC substrate 1 does not bounce upward, thereby preventing the corner of the breaking edge from being nicked or Damage occurred. Further, at the time of breaking, the LTCC substrate 1 is strongly occluded and fixed by the suction hole 10a of the suction platform 10, so that the LTCC substrate 1 does not shift when the lower break bar 5 is placed on the LTCC substrate 1, and the scribe line S can be accurately followed. Break.

Further, it is preferable that the front end of the elastic pressing member 6 is a flat surface 6b having a slight width so as to be in contact with the vicinity of the upper surface of the score line S in a surface contact manner. In this way, it is easy to elastically break the edge of the break at the time of breaking, and it is possible to surely eliminate the bounce from above. Further, the width of the plane 6b is preferably 0.5 mm.

After the breaking of the scribe line S is completed, the upper breaking bars 4, 4 and the elastic pressing members 6 and the lower breaking bars 5 are retracted, and the LTCC substrate 1 is moved so that the lower breaking bars 5 reach below the scribe line S at the time of the second breaking. In the vicinity, after the same process, the break is performed one by one.

(Embodiment 3)

14 to 19 are views showing a third embodiment of the present invention. In addition, the perspective view of the entire structure of the cutting device of the second embodiment is the same as that of FIG. 1 and the side view is the same as that of FIG. 2, and therefore, the same reference numerals will be given to the same portions, and the description will be omitted.

The breaking device A is provided with a suction platform 10 having a plurality of suction holes 10a on its surface, and the LTCC substrate 1 placed on the adsorption platform 10 is sucked and fixed together with the adhesive film 2 by the suction holes 10a.

The bridge portion 14 formed by sandwiching the left and right support bodies 12 and 12 disposed on the platform 10 and the horizontal horizontal frame 13 extending in the X direction is a cross-sucking platform 10. The holder member 7 that holds the upper broken rod 4 and the elastic pressing member 6 that constitutes one of the upper portions of the breaking mechanism B is attached to the horizontal frame 13 through the driving mechanism (not shown).

Further, cameras 15 and 15 are disposed above the breaking device A. The cameras 15, 15 are movable in the X direction and the Y direction by the guides 17, 18 provided on the platen 16. The cameras 15, 15 can be manually operated up and down to adjust the focus of photography. The images captured by the cameras 15, 15 are displayed on the screen (outside the figure). A positioning mark (alignment mark) is formed on the LTCC substrate 1. By photographing the surface of the LTCC substrate 1 with the cameras 15, 15, the positioning of the break position can be performed with reference to the positioning mark for photographing. Further, the positioning of the breaking position may be performed by referring to the scribe line itself instead of the positioning mark.

Next, a portion of the breaking mechanism B that breaks the LTCC substrate 1 will be described with reference to Figs. 14 to 19 .

The breaking mechanism B of the third embodiment is composed of a pair of left and right upper breaking bars 4 and 4 disposed above the LTCC substrate 1 to be separated, and a lower breaking bar 5 disposed under the LTCC substrate 1 and the LTCC substrate 1 The elastic pressing member 6 disposed at the center between the upper breaking bars 4 and 4 is formed above.

The upper break bars 4, 4 and the lower break bars 5 and the elastic pressing members 6 are formed of a strip-shaped plate material extending in the X direction to make the front end portion thinner. In addition, the material is made of metal.

The pair of right and left upper breaking bars 4 and 4 are fixedly held by the holder member 7 which can be lifted and lowered, and the end portions before the refinement are spaced apart from each other by a predetermined interval, and are preferably disposed at intervals of 2.5 mm to 6.0 mm. Further, the elastic pressing member 6 is elastically held by the holder member 7 in a state where the spring end 8 is biased until the front end portion 6a thereof slightly protrudes from the front end of the upper breaking bars 4, 4.

Further, a suction port 20 for the glass frit suction means is formed between the upper break bars 4, 4 and the elastic pressing member 6. The suction port 20 communicates with the upper space 22 via the gap 21 between the upper breaking bars 4, 4 and the elastic pressing member 6. As shown in FIGS. 14 and 15, the gap 21 and the upper space 22 are sealed at the end portions of the upper break bars 4 and 4 by a cover plate 23, and the cover plate 23 communicates with the air passage 25 connected to the suction pump 24. Therefore, by actuating the suction pump 24, the suction port 20 can generate suction air that attracts the glass swarf.

Further, the suction platform 10 is provided with an elongated opening portion 9 (see FIG. 3) that opens toward the substrate mounting surface, and the lower breaking bar 5 is disposed so as to be movable up and down along the opening portion 9. The lower break bar 5 is pulled into the opening 9 so that the tip end thereof does not protrude from the surface of the suction platform 10, and protrudes only when the LTCC substrate 1 is broken. Since the outer lower break bar 5 is housed in the opening 9 of the suction platform 10 at the time of the break, the frame is not cut when the LTCC substrate 1 is placed on the suction platform 10, and the frame 3 can be prevented from being placed when the LTCC substrate 1 is placed. The LTCC substrate 1 or the lower break bar 5 is damaged by the abutment.

Further, the raising and lowering of the lower breaking bar 5 and the raising and lowering of the holder members 7 of the upper breaking bars 4 and 4 and the elastic pressing member 6 are performed by a driving mechanism (outside the drawing).

When the LTCC substrate 1 is divided, as shown in FIG. 16, the LTCC substrate 1 adhered to the adhesive film 2 is placed on the absorbing platform 10. The LTCC substrate 1 is formed with a scribe line S in a preceding scribe line forming step, such that the scribe line S is located near the lower break bar 5 and is held by the absorbing platform 10. Further, positioning is performed such that the elastic pressing member 6 disposed at the center of the interval between the upper breaking bars 4, 4 is located near the upper side of the score line S. The positioning operation is performed using the positioning cameras 15, 15 which have been described previously.

Next, as shown in Fig. 17, the holder member 7 is lowered to a position where the front ends of the pair of left and right upper break bars 4, 4 are in contact with the LTCC substrate 1. At this time, the front end portion 6a of the elastic pressing member 6 that protrudes from the upper breaking bars 4 and 4 is closer to the upper portion of the scribe line S than the upper breaking bars 4 and 4, but is retracted by its own elastic force, and becomes elastic at any time. The state of the upper portion of the score line S is pressed.

Thereafter, as shown in FIG. 18, the lower break bar 5 is raised, and the LTCC substrate 1 is separated from the score line S by the three-point bending moment of the lower break bar 5 and the pair of left and right upper break bars 4, 4.

When the cutting is performed, the upper portion of the scribe line S is elastically pressed by the elastic pressing member 6, so that the breaking edge of the LTCC substrate 1 does not bounce upward, thereby preventing the corner of the breaking edge from being nicked or Damage occurred.

Further, at the time of the breakage, even if the fine glass swarf is generated, the suction port 20 formed between the upper break bars 4 and 4 and the elastic pressing member 6 is opened and moved in the vicinity of the scribe line S at the break, and is quickly sucked and removed. The glass swarf does not adhere to the surface of the LTCC substrate 1.

Further, the suction port 20 of the glass frit suction means shown in the above embodiment is formed between the upper break bars 4, 4 and the elastic pressing member 6, so that it can be approached in a limited narrow interval between the upper broken bars 4, 4. The suction port 20 is provided at the position of the scribe line S, whereby the glass cullet can be effectively sucked and removed.

Further, at the time of breaking, the LTCC substrate 1 is strongly occluded and fixed by the suction hole 10a of the suction platform 10, so that the LTCC substrate 1 does not shift when the lower break bar 5 is placed on the LTCC substrate 1, and the scribe line S can be accurately followed. Break.

Further, it is preferable that the front end of the elastic pressing member 6 is a flat surface 6b having a slight width so as to be in contact with the vicinity of the upper surface of the score line S in a surface contact manner. In this way, it is easy to elastically break the edge of the break at the time of breaking, and it is possible to surely eliminate the bounce from above. Further, the width of the plane 6b is preferably 0.5 mm.

After the breaking of the scribe line S is completed, the upper breaking bars 4, 4 and the elastic pressing members 6 and the lower breaking bars 5 are retracted, and the LTCC substrate 1 is moved so that the lower breaking bars 5 reach below the scribe line S at the time of the second breaking. In the vicinity, after the same process, the break is performed one by one.

In the glass frit suction means shown in the above embodiment, the suction port 20 is formed between the upper break bars 4 and 4 and the elastic pressing member 6, but the interval between the upper break bars 4 and 4 is broad as shown in FIG. In this case, the cover 26 is attached to the elastic pressing member 6 made of a hard material at this interval so that the suction port 20 for forming the glass frit suction means may be formed. In this case, the internal space 27 of the covering body 26 is sealed at both ends in the longitudinal direction by a sealing plate (outside the drawing), and passes through one of the sealing plates and communicates with the suction pump by a duct (illustration Further, the suction port 20 is caused to generate the glass frit suction air by actuating the suction pump.

In this embodiment, since the covering body 26 can surely cover the vicinity of the upper portion of the scribing line S which should be broken, the suction and removal of the glass cullet can be effectively performed.

In the above-described embodiment, the elastic pressing member 6 is formed of a hard material such as metal and is biased by the spring 8 to the LTCC substrate 1. However, similarly to FIG. 12, the spring 8 is omitted and the elastic pressing member 6 is moderately elastic. A material such as hard rubber may be formed. Further, similarly to FIG. 13, only the lower portion 6' of the elastic pressing member 6 may be formed of a material such as hard rubber having moderate elasticity.

Although the above description of the representative embodiments of the present invention has been made, the present invention is not necessarily limited to the embodiments described above. For example, in the above embodiment, the LTCC substrate is used as a substrate to be processed, but it may be a glass substrate or a germanium substrate. In addition, although the suction platform 10 is provided with a plurality of suction holes 10a as means for fixing the LTCC substrate 1 on the suction platform 10, the suction holes 10a may be removed, and other means, such as electrostatic absorption depending on the substrate, may be used. It is also possible to hold the substrate while holding it. In addition, the present invention can be appropriately modified or changed within the scope of the invention without departing from the scope of the claims.

In addition, as shown in FIG. 1, the breaking device described above has a suction platform 10 in which a suction hole 10a is formed in order to mount and suck the brittle material substrate, but is not provided with suction. In the case of the normal platform of the hole 10a, in the first object, the substrate is surely fixed to eliminate the substrate offset, and the line can be accurately divided along the predetermined line, although it is slightly inferior to the aspect in which the suction hole 10a is provided, but By providing the elastic pressing member 6 as described with reference to Fig. 9 or the like, it is possible to achieve the second object that the notch or the breakage is not easily generated at the time of breaking, and a beautiful sectional portion can be obtained.

Further, by providing the suction port 20 of the glass frit suction means described with reference to Fig. 16 or the like, it is possible to achieve the third object, that is, even if fine glass swarf is generated, it can be removed at the same time as the break.

[Industrial availability]

The breaking method of the present invention is used for the division of a substrate made of a brittle material such as a glass substrate, a crucible, a ceramic, or a compound semiconductor.

A. . . Breaking device

B. . . Broken mechanism

S. . . Scribing

1. . . LTCC substrate (brittle material substrate)

2. . . Adhesive film

3. . . Cutting frame

4. . . Upper broken bar

5. . . Lower break bar

6. . . Elastic pressing member

6a. . . Elastic pressing member front end

6b. . . Front end face of elastic pressing member

7. . . Hold member

8. . . spring

9. . . Opening

10. . . Suction platform

20. . . The attraction of the glass frit attraction

26. . . Cover

27‧‧‧Internal space of the cover

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an embodiment of a breaking device of the present invention.

Figure 2 is a side elevational view of the apparatus shown in Figure 1.

Fig. 3 is a perspective view showing a portion of the breaking mechanism in the first embodiment.

Fig. 4 is a cross-sectional view showing a portion of the breaking mechanism in the first embodiment in which the LTCC substrate to be processed is placed on the suction platform.

Figure 5 is an enlarged cross-sectional view showing the breaking step of the substrate.

Fig. 6 is an enlarged cross-sectional view showing a state in which the lower portion is broken and the substrate is broken from the state of Fig. 5;

Fig. 7 is a perspective view showing a portion of the upper portion of the broken rod in the second embodiment.

Figure 8 is a longitudinal sectional view taken along the length direction of Figure 7.

Fig. 9 is a cross-sectional view showing a portion of the breaking mechanism in the second embodiment in which the LTCC substrate to be processed is placed on the absorbing platform.

Figure 10 is an enlarged cross-sectional view showing the breaking step of the substrate.

Fig. 11 is an enlarged cross-sectional view showing a state in which the lower portion is broken and the substrate is broken from the state of Fig. 10.

Figure 12 is a cross-sectional view showing another embodiment of the elastic pressing member in the present invention.

Figure 13 is a cross-sectional view showing still another embodiment of the elastic pressing member in the present invention.

Fig. 14 is a perspective view showing a portion of the upper portion of the broken rod in the third embodiment.

Figure 15 is a longitudinal sectional view taken along the length direction of Figure 14.

Fig. 16 is a cross-sectional view showing a portion of the breaking mechanism in the third embodiment in which the LTCC substrate to be processed is placed on the absorbing platform.

Figure 17 is an enlarged cross-sectional view showing the breaking step of the substrate.

Fig. 18 is an enlarged cross-sectional view showing a state in which the lower portion is broken and the substrate is broken from the state of Fig. 17;

Fig. 19 is a cross-sectional view showing another embodiment of the suction port portion of the glass smear attracting means in the present invention.

Figure 20 is a perspective view showing an example of a general scribing step.

Fig. 21 is an explanatory view showing a state in which the substrate is divided by the conventional three-point bending moment.

B. . . Broken mechanism

S. . . Scribing

1. . . LTCC substrate (brittle material substrate)

2. . . Adhesive film

4. . . Upper broken bar

5. . . Lower break bar

7. . . Hold member

9. . . Opening

10. . . Suction platform

Claims (8)

A breaking device, wherein a squeezing platform is formed on a surface of a squeezing brittle material substrate; and a substrate is placed on the substrate mounting surface of the absorbing platform; and the scribe line of the substrate is placed above a pair of upper and lower split bars disposed above the left and right sides of the scribe line and pressing the surface of the brittle material substrate; disposed adjacent to the lower portion of the scribe line and below the score line a brittle material substrate is formed in the vicinity of the brittle material substrate, and the lower fracture bar is formed to be movably housed in the opening and protrudes from the opening when the substrate is divided; and is disposed in the above-described scribe The elastic pressing member that is close to the upper side of the wire and elastically presses the breaking edge portion when the brittle material substrate is broken to prevent the upper portion from bounce. The breaking device of claim 1, wherein the opening portion is formed such that a lower break bar is slidable. The breaking device according to claim 1, wherein the front end of the elastic pressing member is formed to have a plane having a width, and is brought into contact with the vicinity of the upper surface of the scribe line in a surface contact manner. The breaking device according to claim 1, wherein the elastic pressing member is formed of a hard material and is biased toward the brittle material substrate by a spring. For example, the breaking device of claim 1 of the patent scope, wherein the aforementioned bomb The at least one portion of the sexual pressing member is formed of a material having elasticity. The breaking device according to the first aspect of the invention is characterized in that the glass chip suction means is disposed in the vicinity of the elastic pressing member and has a suction port for attracting the glass swarf generated when the brittle material substrate is broken. The breaking device according to claim 6, wherein the suction port of the glass frit suction means is formed between the elastic pressing member and the upper breaking bar. The breaking device according to claim 6, wherein the covering body forming the suction port of the glass frit suction means is attached to the elastic pressing member, and the inner space of the covering body communicates with the suction pump.