JP6406532B2 - Fragment material substrate cutting device - Google Patents

Description

  The present invention relates to a method and an apparatus for dividing a brittle material substrate, and more particularly to a method and an apparatus for dividing by a three-point bending method.

  As a method of dividing a brittle material substrate such as a semiconductor substrate (dividing chips into chips), a scribe line that is the starting point of division is formed with a cutting edge of a circular wheel or a laser on a planned division line called a street, and then a break device A mode is known in which a substrate is divided by applying a bending stress to a brittle material substrate by a three-point bending method and extending a crack from the division starting point (see, for example, Patent Document 1).

  Such division is generally performed in a state in which a brittle material substrate to be divided is attached and fixed to a surface to be bonded of a dicing tape having adhesiveness stretched on a dicing frame that is a circular ring or a rectangular ring frame. is there.

  Prior to dividing, for the purpose of preventing scratches and preventing the adhesion of contaminants, at least the surface on the side where the upper blade (break blade) of the break device of the brittle material substrate abuts (the surface on the side supported downward during the break). An aspect in which a protective film having a weak adhesive force is attached to the opposite surface) is already known (see, for example, Patent Document 2).

JP 2014-83821 A Japanese Patent No. 4198601

  To break the brittle material substrate by the break device, press the upper blade (break blade) into contact with the upper surface (contacted surface) of the brittle material substrate supported below, and push it into the minimal area at the tip of the upper blade. This is done by concentrating the load. Therefore, as disclosed in Patent Document 2, when the protective film is used for separation, even if the adhesiveness is weak, as a result of such load concentration, the protective film The adhesive may adhere to or remain on the brittle material substrate after being divided.

  The present invention has been made in view of the above problems, and provides a method for dividing a brittle material substrate that suitably protects the contacted surface of the brittle material substrate but does not cause adhesion or remaining of an adhesive or the like. For the purpose.

In order to solve the above-described problem, a brittle material substrate cutting device according to the present invention is a device for cutting a brittle material substrate by a three-point bending method , and is a cutting target position on one main surface side of the brittle material substrate. A scribe line is formed, and the one main surface is attached to the adhesive film while providing a blank area around the adhesive film, and the other main surface of the brittle material substrate has adhesiveness to the brittle material substrate. The protective film is disposed by affixing a portion of the protective film that is not in contact with the brittle material substrate to the blank area of the adhesive film while contacting a protective film that does not have the brittle material. support means for supporting from below by two lower blades in a manner to position the area where the scribe line between the two lower blades the substrate, said tip Sukuraibura An upper blade that can be brought into contact with the planned cutting position on the other main surface side corresponding to the formation position of the lead, and the upper blade is brought into contact with the planned cutting position on the other main surface corresponding to the formation position of the scribe line And a means for lowering while doing so.
The cutting apparatus of the present invention is, for example, a method for cutting a brittle material substrate, wherein a scribe line forming step for forming a scribe line at a cutting target position on one main surface side of the brittle material substrate, and the scribe line is formed. A substrate sticking step of attaching the one main surface of the brittle material substrate to an adhesive film while providing a marginal area around the one main surface; and a protective film having no adhesiveness to the brittle material substrate on the other side of the brittle material substrate A protective film in which the protective film is disposed on the brittle material substrate by affixing a portion of the protective film that is not in contact with the brittle material substrate to the blank area of the adhesive film while being in contact with the entire main surface. In the state where the brittle material substrate on which the protective film is disposed is supported from below, the tip of the upper blade is placed on the scissors. A dividing step of dividing the brittle material substrate by being lowered while being brought into contact with the scheduled cutting position on the other main surface side corresponding to the formation position of the ibile line. be able to.

The cutting apparatus of the present invention is, for example, a method for cutting a brittle material substrate, wherein a scribe line forming step for forming a scribe line at a cutting target position on one main surface side of the brittle material substrate, and the scribe line is formed. A substrate attaching step of attaching the one main surface of the brittle material substrate to the adhesive film of a substrate holding member formed by stretching an adhesive film on a frame, and has no adhesiveness to the brittle material substrate Fixing the protective film to the brittle material substrate by fixing a portion of the protective film that is not in contact with the brittle material substrate to the substrate holding member while contacting the entire other main surface of the brittle material substrate with the protective film. In the state which supported the brittle material substrate by which the protective film arrangement | positioning process arrange | positioned on the top and the said protective film are arrange | positioned from the downward direction, the tip of an upper blade Cutting method characterized by and a dividing step of dividing the brittle material substrate by the lowering while so as to abut against the cutting scheduled position of the other main surface side corresponding to the formation position of the scribe line Can be used for

The cutting apparatus according to the present invention is a method for cutting a brittle material substrate, for example, and includes a blank space around the one main surface of the brittle material substrate in which a scribe line is previously formed at a cutting target position on one main surface side. Affixing to the adhesive film while providing a region, and contacting the brittle material substrate of the protective film while contacting the entire other main surface of the brittle material substrate with a protective film having no adhesiveness to the brittle material substrate After affixed to the blank area of the adhesive film, the brittle material substrate on which the protective film is disposed is supported from below, and the tip of the upper blade corresponds to the formation position of the scribe line. said dividing the brittle material substrate by lowering while so as to abut against the cutting scheduled position of the other main surface side, it is characterized minute It can be used in the process.

The cutting apparatus of the present invention is, for example, a method for cutting a brittle material substrate, wherein the one main surface of the brittle material substrate in which a scribe line is formed in advance on a cutting target position on the one main surface side is used as a frame. Adhering to the adhesive film of the substrate holding member formed by stretching the adhesive film, and the protective film having no adhesiveness to the brittle material substrate while contacting the entire surface of the other main surface of the brittle material substrate A portion of the film that is not in contact with the brittle material substrate is fixed to the substrate holding member, the brittle material substrate on which the protective film is arranged is supported from below, and the tip of the upper blade is the scribe line The brittle material substrate is divided by being lowered while being brought into contact with the planned division position on the other main surface side corresponding to the formation position of It can be used in the cutting method according to symptoms.

A cutting apparatus according to the present invention is a device for cutting a brittle material substrate, and the one main surface of the brittle material substrate in which a scribe line is formed at a position to be cut on one main surface side is surrounded by a margin. Substrate pasting means for adhering to the adhesive film while providing a region, and the brittle material substrate of the protective film while contacting a protective film having no adhesiveness to the brittle material substrate over the other main surface of the brittle material substrate A protective film placement means for placing the protective film on the brittle material substrate by affixing a portion not in contact with the blank area of the adhesive film, and the brittle material substrate on which the protective film is placed And an upper blade capable of abutting the tip with the scheduled cutting position on the other main surface side corresponding to the formation position of the scribe line. It may also be characterized in that it comprises a means for lowering while allowing contact to the upper blade to be cut position of said other major surface corresponding to the formation position of the scribe line.

ADVANTAGE OF THE INVENTION According to this invention, a brittle material board | substrate can be parted, without producing malfunctions, such as adhesion of the adhesion thing with respect to the piece obtained by parting, and residual.

1 is a cross-sectional view illustrating a brittle material substrate 1. It is a figure which shows a mode that the brittle material board | substrate 1 in which the scribe line S was formed is stuck on the adhesion film 2. FIG. It is a figure which shows a mode that the protective film 4 is mounted on the main surface 1b of the brittle material board | substrate 1. FIG. 2 is a view showing a state in which an outer peripheral portion of the protective film 4 protruding from the main surface 1b is attached to the adhesive surface 2a of the adhesive film 2. FIG. It is a figure which shows a mode that the brittle material board | substrate 1 is parted.

  In this embodiment, a method for dividing a brittle material substrate by a so-called three-point bending method will be described. FIG. 1 is a cross-sectional view illustrating a brittle material substrate 1 to be divided in the embodiment of the present invention. FIG. 2 to FIG. 5 are diagrams schematically showing main procedures performed after the brittle material substrate 1 is prepared and divided.

  Examples of the brittle material substrate 1 include a semiconductor substrate (such as a silicon substrate) and a glass substrate. A pattern for a predetermined device (for example, a CMOS sensor) may be formed on one main surface of the semiconductor substrate.

  In dividing the brittle material substrate 1, first, as shown in FIG. 1, a scribe line S is formed at the planned division position of the one main surface 1 a. FIG. 1 shows a case where the planned cutting position and the scribe line S extend in a direction perpendicular to the drawing. The scribe line S is a line in which cracks (microcracks) extending in the thickness direction of the brittle material substrate 1 are linearly continued on the main surface 1 a side of the brittle material substrate 1.

  In FIG. 1, only one scribe line S is shown for simplicity of illustration. However, for example, the brittle material substrate 1 is divided into a strip shape or a lattice shape, so that a large number of pieces are divided into a plurality of portions. In such a case, the scribe line S is formed for all the scheduled division positions. Thereafter, although not specifically stated, in this case, the subsequent processing is also performed for all scheduled division positions.

  A known technique can be applied to the formation of the scribe line S. For example, a cutter wheel (scribing wheel) made of cemented carbide, sintered diamond, single crystal diamond, etc., which has a disk shape and has a ridge line that functions as a blade on the outer peripheral part, is pressed along the planned cutting position. It may be a mode in which the scribe line S is formed by rolling, a mode in which the scribe line S is formed by drawing a diamond point along the scheduled cutting position, or a laser (for example, The scribe line S may be formed by ablation by irradiation with ultraviolet (UV) laser or formation of an altered layer, or scribe by thermal stress due to heating and cooling by a laser (for example, infrared (IR) laser). The aspect which forms the line S may be sufficient.

  Next, as shown in FIG. 2, the brittle material substrate 1 on which the scribe line S is formed is attached to an adhesive film 2 also called a dicing tape. The pressure-sensitive adhesive film 2 has one main surface serving as a pressure-sensitive adhesive surface 2a, and is stretched around a circular ring or rectangular ring frame 3, which is also called a dicing frame. Moreover, as the adhesive film 2, the thing of the size in which a blank area | region (non-sticking area | region) is formed between the frame 3 and a brittle material board | substrate is prepared when the brittle material board | substrate 1 is affixed. When affixing the brittle material substrate 1, the main surface 1a on which the scribe line S is formed is brought into contact with the adhesive surface 2a as shown by an arrow AR1, and the other main surface 1b is the upper surface. . Hereinafter, the one in which the adhesive film 2 is stretched around the frame 3 is generically referred to as a substrate holding member.

  In order to attach the brittle material substrate 1 to the adhesive film 2, for example, the frame 3 is supported in a horizontal state, and in the opening (inner ring) of the frame 3 in the same plane as the frame 3. A supporting means (table or the like) that can support the brittle material substrate 1 with the scribe line formed on one main surface facing upward, and tension that pushes the adhesive film 2 that is cut to a width covering the frame 3 are added. The adhesive film 2 can be placed on the frame 3 and the brittle material substrate 1 by pressing the adhesive film 2 from the upper surface side. An adhesive film sticking device (substrate sticking means) having an adhesive film pressing means that can be attached can be used. When such an adhesive film sticking apparatus is used, the formation of the substrate holding member and the sticking of the brittle material substrate 1 are performed simultaneously.

Subsequently, the protective film 4 is prepared. However, the protective film 4 used in the present embodiment is different from that disclosed in Patent Document 2 and has no adhesiveness to at least the brittle material substrate 1. Further, as shown in FIG. 3, in the present embodiment, a protective film 4 having a size (area) sufficiently larger than the planar size of the brittle material substrate 1 is used. Examples of the material of the protective film 4 include polyester (PET), polyvinyl chloride (PVC), and polyolefin.

  Then, as shown by an arrow AR2 in FIG. 3, the protective film 4 is brought close to the main surface 1b facing upward of the brittle material substrate 1 and placed on the main surface 1b. Furthermore, as shown in FIG. 4, the outer peripheral portion of the protective film 4 that protrudes from the main surface 1 b (the portion that is not in contact with the brittle material substrate 1) is kept in the pressure-sensitive adhesive film 2 while maintaining the mounting state. It is affixed to the blank area which exists on the surface 2a and around the brittle material substrate 1. Thereby, a state in which the protective film 4 is arranged and fixed on at least the main surface 1b of the brittle material substrate 1 is realized. As described above, since the protective film 4 does not have adhesiveness to the brittle material substrate 1, in such an arrangement state, the protective film 4 is not in contact with the entire surface of the main surface 1 b of the brittle material substrate 1 without a gap. Yes, but not sticky.

  In order to attach the protective film 4 to the blank area of the adhesive film 2 while being in contact with the other main surface of the brittle material substrate 1 where the scribe line is not formed, for example, an adhesive film stretched on the frame 3 A support means (table or the like) that can support the frame 3 and the brittle material substrate 1 with the other main surface side of the brittle material substrate 1 on which the one main surface having the scribe line formed in 2 is attached upward, Protective film disposing means capable of disposing the protective film 4 on the upper surface (the other main surface) of the brittle material substrate 2 while applying a tension to push the protective film 4 cut to a width covering the brittle material substrate 1; The margin of the adhesive film 2 by pressing the portion of the protective film 4 that protrudes from the upper surface of the brittle material substrate 2 (the portion that is not in contact with the brittle material substrate 1) from the upper surface side. A protective film sticking means for sticking the band (rollers and the like), it may be used a protective film arrangement means having.

  In the present embodiment, the substrate holding member in which the brittle material substrate 1 is stuck in the above-described manner and the protective film 4 is disposed on the main surface 1b is subjected to division by a break device. Specifically, as shown in FIG. 5, the scribe line S is formed between the two lower blades 101 </ b> A and 101 </ b> B separated in the horizontal direction, in other words, they are arranged in parallel to each other. Two substrate holding members in a state in which the protective film 4 is disposed on the main surface 1b of the brittle material substrate 1 are arranged in such a manner that the scribe lines S are disposed in parallel between the two lower blades 101A and 101B. The lower blades 101A and 101B are supported from below. The lower blades 101 </ b> A and 101 </ b> B are provided by members having sufficient rigidity as compared with the brittle material substrate 1.

  As the break device, a known break device having a break blade can be used. As the break device, for example, support means (lower blades 101A, 101B, a table, etc.) for supporting the brittle material substrate 1 on which the protective film 4 is disposed, and the tip correspond to the formation position of the scribe line. An upper blade (break blade) that can be brought into contact with the scheduled cutting position on the other main surface side, and the upper blade is brought into contact with the scheduled cutting position on the other main surface corresponding to the formation position of the scribe line. And a break device including a lowering means.

  Alternatively, the protective film 4 may be disposed after a substrate holding member that holds the brittle material substrate 1 is supported from below by the lower blades 101A and 101B.

  After obtaining the above support state, the upper blade (break blade) 102 is lowered from above toward the position where the scribe line S is formed as indicated by an arrow AR3 in FIG. Then, it is brought into contact with the brittle material substrate 1 and further lowered so as to push in the upper blade 102. Thereby, a crack extends in the substrate thickness direction from the scribe line S, and the brittle material substrate 1 is divided.

  At this time, since the protective film 4 is not adhered to the brittle material substrate 1, adhesion / adhesion caused when an adhesive protective film is used as in the technique disclosed in Patent Document 2 There is no problem of remaining.

  Further, although the brittle material substrate 1 and the protective film 4 are not directly fixed to each other, the outer peripheral portion of the protective film 4 is stuck and fixed to the adhesive film 2, so that the position shifts to the protective film 4 when dividing. Will not occur. Furthermore, the pieces (chips) obtained by the division do not float and come into contact with neighboring pieces, and there is no occurrence of chipping at the ends.

  As described above, according to the present embodiment, a brittle material substrate in a state of being attached to a protective film stretched on a circular annular or rectangular annular frame is divided by a three-point bending method. Prior to making contact with a non-adhesive protective film on the entire upper surface of the brittle material substrate, which is the contact surface of the upper blade (break blade), the outer peripheral portion of the protective film is fixed to the protective film. By doing so, it is possible to cut the brittle material substrate without causing problems such as adhesion / remaining of an adhesive to the pieces obtained by the cutting.

<Modification>
In the above-described embodiment, the protective film 4 is arranged and fixed by sticking the outer peripheral portion of the protective film 4 to the blank area of the adhesive surface 2a of the adhesive film 2, but the protective film 4 is arranged and fixed. The aspect is not limited to this. For example, a mode in which a means for holding and fixing the outer peripheral portion of the protective film 4 or a sticky adhesive area is provided on the frame 3 of the substrate holding member may be used. In such a case, it is not necessary to provide a blank area for attaching the protective film 4.

DESCRIPTION OF SYMBOLS 1 Brittle material board | substrate 1a, 1b Main surface 2 (Adhesive film board | substrate) 2 Adhesive film 2a (Adhesive film adhesive face) 3 Frame 4 Protective film 101A, 101B Lower blade 102 Upper blade S Scribe line

Claims (1)

An apparatus for dividing a brittle material substrate by a three-point bending method , wherein a scribe line is formed at a position to be divided on one main surface side of the brittle material substrate, and the one main surface is formed on the adhesive film. The brittle material substrate of the protective film is pasted while providing a blank area around the surface of the brittle material substrate, and a protective film having no adhesiveness to the brittle material substrate is brought into contact with the entire surface of the other main surface of the brittle material substrate. A mode in which the protective film is disposed by sticking a portion that is not in contact with the blank area of the adhesive film, and the brittle material substrate is positioned between two lower blades where a scribe line is formed. support means for supporting from below by two lower blades at the abutment to be cut position of the other main surface side corresponding to the distal end to the forming position of the scribing line A brittle material substrate comprising: an upper blade capable of lowering the upper blade, and a means for lowering the upper blade so that the upper blade is brought into contact with the planned cutting position of the other main surface corresponding to the formation position of the scribe line. Cutting device.