JPS53111586A - Method of deviding thin plate - Google Patents

Method of deviding thin plate

Info

Publication number
JPS53111586A
JPS53111586A JP2651677A JP2651677A JPS53111586A JP S53111586 A JPS53111586 A JP S53111586A JP 2651677 A JP2651677 A JP 2651677A JP 2651677 A JP2651677 A JP 2651677A JP S53111586 A JPS53111586 A JP S53111586A
Authority
JP
Japan
Prior art keywords
plate
thin plate
deviding
piezoelectric
divide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2651677A
Other languages
Japanese (ja)
Inventor
Kaoru Shimizu
Keiji Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2651677A priority Critical patent/JPS53111586A/en
Publication of JPS53111586A publication Critical patent/JPS53111586A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To form dividing grooves with a predetermined depth in a thin plate such as a piezoelectric or silicon substrate, put the plate on a resilient plate and press the plate with a roller from above to divide the plate smaller pieces.
COPYRIGHT: (C)1978,JPO&Japio
JP2651677A 1977-03-09 1977-03-09 Method of deviding thin plate Pending JPS53111586A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2651677A JPS53111586A (en) 1977-03-09 1977-03-09 Method of deviding thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2651677A JPS53111586A (en) 1977-03-09 1977-03-09 Method of deviding thin plate

Publications (1)

Publication Number Publication Date
JPS53111586A true JPS53111586A (en) 1978-09-29

Family

ID=12195631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2651677A Pending JPS53111586A (en) 1977-03-09 1977-03-09 Method of deviding thin plate

Country Status (1)

Country Link
JP (1) JPS53111586A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01190412A (en) * 1988-01-26 1989-07-31 Nachi Fujikoshi Corp Cutting of plate-shaped brittle material and its device
KR20160019849A (en) * 2014-08-12 2016-02-22 미쓰보시 다이야몬도 고교 가부시키가이샤 Method and device for dividing brittle material substrate
CN105390444A (en) * 2014-08-20 2016-03-09 三星钻石工业股份有限公司 Breaking method for brittle material substrate and breaking device
JP2016104576A (en) * 2016-02-26 2016-06-09 三星ダイヤモンド工業株式会社 Segmentation apparatus for brittle material substrate
JP2017212451A (en) * 2017-06-30 2017-11-30 三星ダイヤモンド工業株式会社 Parting device for brittle material substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01190412A (en) * 1988-01-26 1989-07-31 Nachi Fujikoshi Corp Cutting of plate-shaped brittle material and its device
KR20160019849A (en) * 2014-08-12 2016-02-22 미쓰보시 다이야몬도 고교 가부시키가이샤 Method and device for dividing brittle material substrate
JP2016040079A (en) * 2014-08-12 2016-03-24 三星ダイヤモンド工業株式会社 Segmentation method and segmentation apparatus for brittle material substrate
TWI650292B (en) * 2014-08-12 2019-02-11 日商三星鑽石工業股份有限公司 Breaking method of brittle material substrate and breaking device
CN105390444A (en) * 2014-08-20 2016-03-09 三星钻石工业股份有限公司 Breaking method for brittle material substrate and breaking device
JP2016104576A (en) * 2016-02-26 2016-06-09 三星ダイヤモンド工業株式会社 Segmentation apparatus for brittle material substrate
JP2017212451A (en) * 2017-06-30 2017-11-30 三星ダイヤモンド工業株式会社 Parting device for brittle material substrate

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