TWI666183B - Cutting method and device for laminating substrate - Google Patents

Abstract

The invention provides a method for appropriately cutting and bonding substrates.

The invention is a method for breaking a bonded substrate formed by bonding two brittle material substrates at a predetermined predetermined breaking position. The method includes a scribing step, which is formed on one of the main surfaces of the bonded substrate. A scribe line is set at the above-mentioned predetermined breaking position on the side; a holding tape attaching step is to attach a holding tape to the above-mentioned main surface of the above-mentioned bonding substrate provided with the scribe line; and a placing step is to attach the The bonding substrate of the holding tape is placed on an elastic body with a smoothed surface in a manner that the main surface is in full contact with the surface; and a breaking step is performed by placing the bonding substrate on the surface. In the state of the elastic body, the front end of the upper blade is lowered while abutting against the predetermined cutting position, thereby extending the crack from the scribe line to cut the bonded substrate.

Description

Cutting method and device for laminating substrate

The invention relates to a method for breaking a bonded substrate formed by bonding two brittle material substrates, such as a bonded substrate formed by bonding two brittle material substrates containing different materials, and a device used for the method. .

A bonding substrate formed by bonding two substrates of a brittle material using an adhesive (resin), and a bonding substrate (bonding substrate of a different material) formed by bonding two substrates of a brittle material containing different materials using an adhesive As a substrate for various components. For example, there are the following substrates, and other semiconductor substrates such as single-crystal silicon substrates that are patterned with specific elements (such as CMOS (Complementary Metal Oxide Semiconductor) sensors, etc.) formed on one main surface. One main surface is formed by bonding a glass substrate as a support substrate. This type of element is formed by bonding a single crystal silicon wafer, which is a mother substrate formed by repeating the formation of a circuit pattern two-dimensionally, with a glass substrate using an adhesive (resin), and then breaking it into short strips of a specific size. A single piece (wafer) in a shape of a grid or a grid (for example, refer to Patent Document 1).

In addition, a device (crusher) that breaks a brittle material substrate in which a scribe line has been formed on one main surface in advance by using a three-point bending method to break the scribe line is also known (for example, refer to Patent Document 2). .

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-40621

[Patent Document 2] Japanese Patent Laid-Open No. 2014-83821

As a method for breaking (singulating) a bonded substrate (different material) formed by forming a pattern on a brittle material substrate (silicon substrate), the present inventors and others have tried the following method: attaching the patterned surface After the protective film, a scribe line is formed on the other brittle material substrate (glass substrate) side, and then the scribe line is broken along the scribe line using a crusher as disclosed in Patent Document 2.

However, in the case of breaking by this method, there are cases where a crack or the like extends from the scribing direction of the scribing line to the thickness direction of the substrate due to the presence of a layer of an adhesive between the two brittle material substrates. Bad condition. In addition, since the pressing amount of the upper blade of the crusher from above (the falling distance of the upper blade from the contact of the upper blade to the bonded substrate or the protective film until the breaking is completed) is large, there is also a tendency for the bonded substrate to be easily generated. The misalignment of the position. The occurrence of these undesirable conditions is the main reason for lowering the yield of the wafer, such as the deterioration of the quality of the wafer, and is therefore not good.

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a method capable of better separating the bonded substrates, particularly the bonded substrates of different materials.

In order to solve the above problems, the inventions of the technical solutions 1 and 3 are characterized in that they are a method of breaking a bonded substrate formed by bonding two brittle material substrates at a specific predetermined cutting position, and have: The forming step is to set a scribing line at the above-mentioned predetermined breaking position on one main surface side of the above-mentioned bonded substrate; the substrate attaching step is to attach the one main surface of the above-mentioned bonded substrate provided with the above-mentioned scribing substrate. The protective film attaching step is to attach a protective film to the other main surface of the above-mentioned bonding substrate as needed; and the placing step is to attach the protective tape to the above-mentioned holding tape and attach the above-mentioned protection if necessary. The above-mentioned bonded substrate is placed on the elastic body whose surface is smoothed in such a way that the one main surface side is in full-face contact; and the breaking step is based on placing the above-mentioned bonded substrate on the elasticity. In a state of body The front end of the upper blade is lowered while abutting against the predetermined cutting position (so that the crack extends from the scribe line), and the bonded substrate is cut.

In addition, the inventions of the technical solutions 2 and 3 are characterized in that they are a method for sequentially breaking a bonded substrate formed by bonding two brittle material substrates at a plurality of predetermined cutting positions, and are provided with: scribe formation A step of setting a scribing line at a plurality of the predetermined breaking positions on one main surface side of the bonding substrate; a substrate attaching step of bonding the one main surface of the bonding substrate provided with the scribing line Attach to the holding tape; the protective film attaching step is to attach a protective film to the other main surface of the above-mentioned bonding substrate as needed; the placing step is to attach to the above-mentioned holding tape and attach the above as necessary The above-mentioned bonded substrate of the protective film is placed on the elastic body formed by smoothing the surface in such a manner that the entire main surface side is in contact with the above-mentioned surface; In the state of the elastic body, repeat the following operations at the plurality of predetermined breaking positions, that is, by lowering the front end of the upper blade to abut the predetermined breaking position (so that the crack extends from the scribe line), And cut off the bonded substrate

In addition, the invention of claim 4 is characterized in that it is a method of breaking a bonded substrate formed by bonding two brittle material substrates at a specific predetermined cutting position, and the bonded substrate is on a main surface side. A scribe line is formed at the predetermined breaking position, and the one main surface is facing downward. In a state where the above-mentioned bonded substrate is supported from below by an elastic body smoothed from the surface, the front end of the upper blade is abutted. It descends at the predetermined cutting position, and cuts the bonded substrate.

The invention of claim 5 is characterized in that it is a device for breaking a bonded substrate formed by bonding two brittle material substrates at a predetermined predetermined breaking position, and is provided with a scribing forming mechanism, which A scribe line is provided at the predetermined cutting position on the main surface side of one of the above-mentioned bonded substrates; a substrate attaching mechanism attaches the one main surface of the above-mentioned bonded substrate provided with the scribe line to a holding tape; a placing mechanism , The elasticity of the above-mentioned laminating substrate to which the above-mentioned holding tape is attached is smoothed on the surface in such a manner that the main surface side is in contact with the entire surface. On the body; and a breaking mechanism that, when the bonding substrate is placed on the elastic body, lowers the front end of the upper blade while abutting against the predetermined breaking position, and then the bonding substrate Break.

In addition, the invention of claim 6 is characterized in that it is a device for breaking a bonded substrate formed by bonding two brittle material substrates at a specific predetermined cutting position, and is provided with a smooth surface An elastic body that supports the above-mentioned bonding substrate from below, the bonding substrate is formed with a scribe line at the predetermined cutting position on a main surface side and the one main surface is directed downward; and a cutting mechanism that is provided by The front end of the upper blade above the elastic body is lowered while abutting against the predetermined cutting position, and the bonded substrate is cut.

According to the present invention, the bonded substrate including the out-of-phase interface can be better cut off with a smaller amount of pressing of the blade above the previous three-point bending method. In addition, a good break can be achieved in which a single piece obtained by the break does not cause a position shift. In addition, it is possible to better suppress the detachment of the single-piece self-retaining tape obtained by the severing. This is particularly effective when the bonded substrate is sequentially cut at a plurality of predetermined cutting positions.

1‧‧‧ glass substrate

2‧‧‧ semiconductor substrate

3‧‧‧ Adjacent layer

4‧‧‧ protective film

5‧‧‧ holding belt

10‧‧‧ Laminated substrate

10a‧‧‧ (obtained by cutting and bonding substrates)

10b‧‧‧ (obtained by cutting the bonded substrate)

10c‧‧‧ (obtained by cutting and bonding substrates)

101A, 101B‧‧‧Blades

101a, 101b‧‧‧End

102‧‧‧ Upper Blade

201‧‧‧ Elastomer

201a, 201b‧‧‧‧Concentrated elastic force

201s‧‧‧contact surface

202‧‧‧ support

A‧‧‧ Breaking scheduled position

AR1, AR2‧‧‧Arrows

AR11 ~ AR14‧‧‧Arrow

C‧‧‧ dotted line

CR‧‧‧ Crack

F1‧‧‧force

F2‧‧‧force

F2a, F2b‧‧‧ Elasticity

F3a, F3b‧‧‧force

F11a, F11b‧‧‧force

F12a, F12b‧‧‧force

F13a, F13b‧‧‧force

F14a, F14b‧‧‧Friction

G‧‧‧ Clearance

S‧‧‧ crossed

α‧‧‧ Clearance angle

β‧‧‧ Clearance angle

FIG. 1 is a schematic cross-sectional view showing a configuration of a bonded substrate 10 that is a target of a cutting method according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view showing the bonded substrate 10 on which the scribe line S is formed.

3 (a)-(c) are schematic cross-sectional views showing a breaking step using a three-point bending method of the bonded substrate 10 on which the scribe line S is formed.

4 (a) to 4 (c) are diagrams showing the breaking conditions of the bonded substrate 10 in this embodiment.

5 (a) and 5 (b) are diagrams showing the situation when the single piece obtained by the detachment is separated from the holding tape 5.

FIG. 6 is a diagram illustrating an elastic body 201 that is implemented with a measure to prevent the occurrence of an unfavorable situation in which a single piece of self-retaining belt comes off.

FIGS. 7 (a) and 7 (b) are diagrams showing the breaking conditions when the contact surface 201s of the elastic body 201 is smoothed.

FIG. 1 is a schematic cross-sectional view showing the structure of a bonded substrate (hereinafter referred to simply as a bonded substrate) 10 of a different material that is a target of the cutting method according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing the bonded substrate 10 on which the scribe line S is formed. In this embodiment, a bonding substrate 10 using a bonding layer 3 including a bonding agent and a glass substrate 1 and a semiconductor substrate (for example, a silicon substrate) 2 each of which is a brittle material substrate is used as a breaking target.

The thickness of the glass substrate 1 and the semiconductor substrate 2 and the planar size of the bonding substrate 10 are not particularly limited, and an appropriate size may be selected in view of the easiness of the cutting, the operation of the previous and subsequent steps, or the processing efficiency.

In addition, the material of the adhesive is not particularly limited as long as the bonding strength between the glass substrate 1 and the semiconductor substrate 2 is ensured, and cutting can be appropriately performed on the other hand, for example, ultraviolet (UV) curing resin can be appropriately used. . In addition, from the viewpoint that the breaking method of the present embodiment can be better realized, the thickness of the bonding layer 3 is preferably about 5 μm to 200 μm, and usually about 5 μm to 50 μm.

A pattern for a specific element (for example, a CMOS sensor or the like) may be formed on the non-adhesive surface side of the semiconductor substrate 2.

When cutting the bonded substrate 10 having the structure described above, first, as shown in FIG. 2, a scribe line S is formed on a non-adhesive surface of the glass substrate 1 along a predetermined predetermined cutting position A. FIG. 2 shows a situation where the predetermined breaking position A and the scribe line S extend in a direction perpendicular to the drawing surface. The scribe line S is formed by a continuous line of cracks (micro-cracks) extending in the thickness direction of the glass substrate 1 on the non-adhesive surface of the glass substrate 1.

In addition, in FIG. 2, for the sake of simple illustration, only one predetermined cutting position A and the scribe line S are shown. For example, the bonding substrate 10 is cut in a short strip or a grid shape at a plurality of locations. In the case where multiple single pieces are obtained by breaking, the A-shape is predetermined for all breaking positions Into a line S. In the following, if there is no special explanation, in this case, the processing of the latter stage is also performed for all the predetermined breaking positions A.

The scribe line S can be formed by applying a known technique. For example, it is possible to form a scribing line S by turning a cutter wheel (scribe wheel) along a predetermined breaking position A by crimping. The cutter wheel (scribe wheel) includes a cemented carbide, sintered diamond, Single crystal diamond, etc., is disc-shaped and has a ridgeline functioning as a blade on the outer periphery; it can be in the following form: a line S is formed by cutting a line along a predetermined position A with a diamond tip; it can be as follows Aspect: The scribe line S is formed by the formation of an ablation or metamorphic layer generated by laser (such as ultraviolet (UV) laser) irradiation; it may also be in the following aspect: by laser (such as infrared ( IR) The thermal stress caused by heating and cooling caused by laser) forms the scribe line S.

In the present embodiment, the bonding substrate 10 having the scribe line S provided in this manner is used as an object, and the cutting is performed at a predetermined cutting position A. In general, the crack CR (see FIG. 4) is extended from the scribe line S in the thickness direction (more specifically, in a direction perpendicular to the main surface of the bonded substrate 10) to thereby bond the bonded substrate 10. Break.

FIG. 3 is a diagram illustrating the breaking of the bonded substrate 10 using the previous three-point bending method for comparison. In the previous cutting method, first, as shown in FIG. 3 (a), a holding tape 5 having an adhesive property is attached to the glass substrate 1 side of the bonding substrate 10. In addition, the holding tape 5 is used to hold the wafer (single wafer) obtained by the breaking so that the wafer does not scatter or the like. As the holding tape 5, for example, a so-called cutting tape used for the same purpose when cutting with a microtome is preferably used. As shown in FIG. 3, a protective film 4 may also be attached to the surface of the semiconductor substrate 2 as needed. By attaching the protective film 4 to the surface of the semiconductor substrate 4, damage to the substrate caused by the contact between the substrate and the breaking blade can be prevented.

Then, in a state where the formation portion of the scribe line S is located between the two lower blades 101A and 101B spaced apart in the horizontal direction, in other words, a scribe is made between the two lower blades 101A and 101B arranged in parallel with each other. In the aspect where the lines S are arranged in parallel, the bonding substrate 10 with the glass substrate 1 side facing downward is supported from below by two lower blades 101A and 101B. Of course Then, in this supporting state, the upper blade 102 is lowered from the formation position of the scribe line S in the upper direction (that is, the predetermined breaking position A), and abuts against the bonding substrate 10 or through the protective film 4, thereby further causing The upper blade 102 is lowered in a press-in manner. In addition, the lower blades 101A and 101B are provided with a member that is sufficiently more rigid than the bonded substrate 10.

In this aspect, when the upper blade 102 is pushed in, as shown in FIG. 3 (a), a downward force F1 is applied to a portion of the protective film 4 abutting the blade 102, and the force F1 is applied to the force. The opposing forces (forces against compression caused by the force F1 and the self-weight of the bonded substrate 10) generate upward forces F2a, F2b from the ends 101a and 101b of the two lower blades 101A and 101B toward the bonded substrate 10, respectively. As the crack CR extends, as shown in FIG. 3 (b), the left and right portions of the bonded substrate 10 are gradually broken with the ends 101 a and 101 b as fulcrum points. Along with this, the gap G, which has a wedge shape in cross-section, gradually expands from the portion where the scribe line S was formed. The extension of the crack CR is also maintained at the heterogeneous interface (the interface between the glass substrate 1 and the bonding layer 3 and the interface between the bonding layer 3 and the semiconductor substrate 2) existing inside the bonded substrate 10, so as shown in FIG. 3 (c) The bonded substrate 10 is divided perpendicular to the main surface. In addition, the angle (gap angle) formed by the two cutting surfaces generated by the cutting when the cutting is completed is set to α.

The previous breaking method of the state as described above can be said to be roughly the following method: By applying the forces F1 and F2a and F2b, the ends 101a and 101b of the two lower blades 101A and 101B are generated as the fulcrum The torque in the opposite direction causes the left and right two parts that are gradually broken by this to generate the rotation in the opposite direction, thereby breaking. In this method, a portion equivalent to the energy given to the bonded substrate 10 by pressing on the upper blade 102 is consumed by the rotation.

FIG. 4 is a diagram showing the breaking state of the bonded substrate 10 in this embodiment. In this embodiment, the situation of cutting the bonded substrate 10 is also the same as the previous method. First, an adhesive holding tape 5 is attached to the glass substrate 1 side of the bonded substrate 10.

Next, as shown in FIG. 4 (a), the bonding substrate 10 is placed on the elastic body 201 in such a manner that the main surface side of the side to which the holding tape 5 is attached faces downward. on. In this embodiment, the elastomer 201 refers to a material having a hardness of 65 ° to 95 °, preferably 70 ° to 90 °, and for example, 80 °. As this elastic body 201, for example, a silicone rubber or the like can be preferably used. Furthermore, as shown in FIG. 4 (a), the elastic body 201 may also be supported by a support body 202 such as a platform. When the scribe line is viewed (identified) from the side of the elastic body 201 and the support body 202, the elastic body 201 and the support body 202 are preferably transparent.

In this embodiment, the cutting is performed in this mounted state. Specifically, in order to extend the crack CR from the scribe line S in the thickness direction, the upper blade 102 is lowered from above toward the formation position of the scribe line S (that is, the predetermined breaking position A), and abuts against the bonding. The substrate 10 further lowers the upper blade 102 by press-fitting.

In this aspect, when the upper blade 102 is pressed in, as shown in FIG. 4 (a), a downward force F1 is applied to a portion of the protective film 4 which is in contact with the blade 102. Therefore, as a reaction force to the force F1 (a force against compression caused by the force F1 and the self-weight of the bonded substrate 10), the elastic body 201 faces the bonded substrate 10, directly below the contact position of the above blade 102. An upward elastic force F2 is generated at the position. After that, the left and right parts of the bonded substrate 10 gradually begin to tilt, and the crack CR extends from the scribe line S, as shown in FIG. 4 (b). The gap G having a wedge shape gradually expands. In the case of the breaking method of this embodiment, the crack CR extends at the heterogeneous interface (the interface between the glass substrate 1 and the bonding layer 3 and the interface between the bonding layer 3 and the semiconductor substrate 2) existing inside the bonded substrate 10. Maintained. Therefore, as shown in FIG. 4 (c), the bonding substrate 10 is finally divided perpendicular to the main surface.

In more detail, when the crack CR starts to stretch and the gap G starts to be formed, the elastic forces F2a and F2b act on the abutting surfaces of the bonded substrate 10 and the left and right portions, respectively, with the elastic body 201. Moreover, as in the previous method, as the crack CR is extended, as shown in FIG. 4 (b), the gap G having a wedge shape in cross-section gradually expands from the place where the scribe line S was formed.

In addition, at this time, as shown in FIG. 4 (b), the vicinity of the left and right two cross sections forming the gap G becomes the elastic force concentration portions where the elastic forces F2a and F2b function collectively, respectively. 201a, 201b, so it can be said that the breaking method of this embodiment is also based on the three-point bending method.

However, in the case of the breaking method of this embodiment, unlike the previous breaking method described above, as the gap G gradually expands, the elastic force concentration portions 201a and 201b shift as shown by arrows AR1 and AR2, but Since the bonding substrate 10 is supported by the elastic body 201 as a whole, it is difficult for the bonding substrate 10 to generate a moment with the elastic force concentration portions 201 a and 201 b as the fulcrum. This means that in the cutting method of the present embodiment, the energy imparted to the bonded substrate 10 by pushing in the upper blade 102 contributes to the cutting more efficiently. Specifically, the forces F3a and F3b in opposite directions generated at the predetermined breaking position of the bonded substrate 10 (the position where the crack CR extends) are larger than those in the previous method. The forces F3a and F3b effectively exert an effect on the extension of the crack CR, especially on the breaking (tearing) of the adhesive layer 3.

As a result, in the case of the cutting method according to this embodiment, even if the pressing amount of the upper blade 102 is not as large as before, the bonded substrate 10 can be cut preferably. When the magnitude of the gap angle in the cutting method of this embodiment is β, β <α holds. Therefore, since the gap angle α generated in the case of the previous cutting method becomes large, and the problem that the position shift occurs on the bonded substrate 10 is caused, the cutting method of the present embodiment is better suppressed.

<Preventing detachment after breaking>

As described above, the bonded substrate 10 can be divided by the three-point bending method by being supported by the elastic body 201. However, when a single bonded substrate 10 is cut at a plurality of locations to obtain a plurality of single pieces, depending on the combination of the elastic body 201 and the holding tape 5 to which the bonded substrate 10 is attached, it may be obtained by cutting. The single piece is released from the holding belt 5. FIG. 5 is a diagram showing a situation when the separation occurs. In addition, the illustration of the bonded substrate 10 is simplified in FIG. 5, and the illustration of the upper blade 102 and the support 202 is omitted.

Fig. 5 (a) shows the force acting on the holding belt 5 when the single piece 10a is obtained by the previous division, and then when the single piece 10b is to be obtained.

First, as described above, when a force F1 is applied to the bonded substrate 10 from the upper blade 102 in order to obtain a single piece 10b, the formation of the gap G progresses. At this time, the single piece 10b and the bonded substrate are gradually peeled from each other. The remaining part (hereinafter, also referred to as a single sheet for convenience) 10c acts on the holding bands 5 following the single sheets, and serves to stretch the holding band 5 outward along the surface of the elastic body 201. Force F11a, F11b. Moreover, the forces F11a and F11b also include components in this direction of the adhesive force acting between the single piece 10b and the portion 10c and the holding band 5. The forces F11a and F11b are equivalent to the forces that cause the holding belt 5 to follow the movement of the single piece to the outside when following the breaking.

However, with respect to the holding band 5 to which the forces F11a and F11b act, the frictional forces F12a and F12b act along the surface of the elastomer 201 in a direction opposite to the forces F11a and F11b. . Here, the frictional forces F12a and F12b are forces having the maximum static frictional force as the maximum value. The larger the static frictional coefficient, the larger the frictional forces F12a and F12b. The larger the static friction coefficient, the more the holding belt 5 is made of a material that is less likely to slide relative to the elastic body 201.

Further, in the holding belt 5, the elastic body 201 compresses as the upper blade 102 is pushed in, and F13a and F13b that are intended to be stretched in the direction centering on the holding belt also function. In addition, when the upper blade 102 is used for compression, the elastic body 201 is also displaced by receiving a force in the same direction as that of the holding belt 5. Therefore, the forces F13a and 13b act to prevent friction between the two.

As a result, during the breaking operation, the forces F11a and F11b are applied to the holding belt 5 to the outside, and the forces F12a and F12b and the forces F13a and 13b are applied to the center.

Therefore, in order to perform the breaking well, the required forces F11a and F11b exceed the combined forces F12a + F13a and combined forces F12b + F13b when F12a and F13a are at their maximum values, respectively. It is assumed that the holding belt 5 is formed of a material that is not easy to slide relative to the elastic body 201. Therefore, when the forces F11a and F11b do not exceed the total forces F12a + F13a and F12b + F13b, respectively, the holding belt 5 is intended to be stretched compared to the single piece 10b. The force of 5 toward the outside, the force toward the inside is greater, so as shown in the figure As shown by the dotted line C in 5 (b), the single piece 10b and the holding tape 5 are no longer maintained in a bonding state, and the single piece 10b may be detached from the holding tape 5 in the middle of the break. That is, the single piece 10 b obtained by breaking the bonded substrate 10 may be detached from the holding tape 5. Moreover, although such a detachment is unlikely to occur in a monolithic piece 10c that is heavier than the monolithic piece 10b, the same situation may be caused in principle.

FIG. 6 is a diagram illustrating an elastic body 201 to which a measure for preventing such an undesirable situation is implemented.

Specifically, in order to reduce the static friction coefficient between the holding belt 5 and the elastic body 201, that is, to make the holding belt 5 easily slide relative to the elastic body 201, the contact surface 201s of the elastic body 201 and the holding belt 5 is smoothed. deal with. Here, the smoothing process is exemplified by film attachment or coating.

FIG. 7 is a diagram showing the breaking condition when the contact surface 201s of the elastic body 201 is smoothed. In FIG. 7, similar to FIG. 5, the illustration of the bonded substrate 10 is simplified, and the illustration of the upper blade 102 and the support 202 is omitted.

First, in FIG. 7 (a), the same force as in FIG. 5 (a) shows the force acting on the holding belt 5 when the single piece 10 a is obtained by the previous division, and then the single piece 10 b is obtained. In this case, the kind of force acting on the holding belt 5 is the same as that shown in FIG. 5 (a), but at this time, since the contact surface 201s is smoothed to reduce the static friction coefficient, the holding belt 5 is self-elastic. The maximum value of the frictional forces F14a, F14b received by 201 is smaller than the maximum value of the frictional forces F12a, F12b shown in FIG. 5 (a). As a result, when the forces F11a and F11b are larger than the values of the combined forces F14a + F13a and F14b + F13b when the friction forces F14a and F14b are the maximum static friction forces, as shown in FIG. 7 (b), they are pressed by the upper blade 102. The holding belt 5 which lives in the center part follows this movement when the individual pieces 10b and 10c want to move outward. At this time, the holding band 5 is stretched as shown by arrows AR11 to AR14, and the single piece 10b is cut without being detached.

Furthermore, in more detail, the frictional forces F14a and F14b acting between the holding belt 5 and the elastic body 201 when the holding belt 5 follows the movement of the single pieces 10b and 10c are dynamic friction forces, and the dynamic friction force depends on the dynamic friction coefficient. Value, but for the contact surface 201s of the elastic body 201 In the case of the smoothing process, not only the static friction coefficient decreases, but the dynamic friction coefficient also decreases. Therefore, if the smoothing process is performed, the detachment of the single piece 10b can be better suppressed.

As described above, according to this embodiment, a bonding substrate formed by bonding two brittle material substrates, especially two brittle material substrates containing different materials, with an adhesive is cut at a predetermined predetermined cutting position. At this time, first, a scribing line is provided at a predetermined cutting position on a main surface side of the bonded substrate. Then, the main surface on which the scribe line is formed is attached to a holding tape, and if necessary, a protective film is attached to the other main surface, and then the laminating substrate is placed on the elastomer with the side of the holding tape as a lower side. . In this loading state, the upper blade is lowered from a predetermined position of the upper substrate with respect to the bonding substrate. Thereby, the laminated substrate including the out-of-phase interface can be better cut off with a smaller pressing amount of the upper blade than the previous three-point bending method. In addition, a good break can be achieved in which a single piece obtained by the break does not cause a position shift.

In addition, by smoothing the surface of the elastomer in advance, it is possible to better suppress the detachment of the single-piece self-retaining tape obtained by the severing.

<Modifications>

As the brittle material substrate of the above embodiment, in addition to glass substrates and silicon substrates, various semiconductor substrates, ceramic substrates such as sapphire substrates, alumina substrates, and glass ceramic substrates (so-called LTCC (Low Temperature Co-fired Ceramic, Ceramics) substrates) and so on.

In the case of bonding substrates of different materials, it is preferred to form a protective film on the side of a brittle material substrate with easy breakability (high brittleness, small thickness) as needed, and to have a property of low breakability (low brittleness, A large thickness) is formed on the substrate side of the brittle material.

Claims (12)

A method for breaking a brittle material substrate, which is characterized in that it is a method for breaking a brittle material substrate at a specific predetermined breaking position, and includes: a scribing forming step, which is located on a main surface side of one of the above substrates A scribe line is set at the above-mentioned predetermined breaking position; a substrate attaching step is to attach the main surface of the substrate provided with the scribe line to a holding tape; and a placing step is to attach the above holding tape The above-mentioned substrate is placed on the elastic body whose surface is smoothed by film attachment or coating in such a manner that the entire main surface side is in full contact with the above-mentioned one; and a breaking step, which is based on placing the above-mentioned substrate on In the state of the elastic body, the substrate is broken by lowering the front end of the upper blade while abutting the predetermined cutting position; the smoothed elastic body is connected with the holding belt when the substrate is broken. There is no gap between them. For example, the method for cutting a brittle material substrate according to claim 1, wherein a protective film attaching step is provided at least after the scribing step and before the cutting step, and the protective film attaching step is on the other main surface of the substrate. Attach a protective film. For example, the method for cutting a brittle material substrate according to claim 1 or 2, wherein the brittle material substrate is a bonded substrate formed by bonding two substrates. A cutting method for a brittle material substrate is characterized in that it is a method for sequentially cutting a brittle material substrate at a plurality of predetermined cutting positions, and includes: a scribing step, which is based on one of the above substrates. A plurality of the above-mentioned cut-off predetermined positions are provided with a scribe line on the side; the holding tape attaching step is to attach the above-mentioned main surface of the substrate provided with the scribe line to the holding tape; and the placing step is to apply the affixed tape. The substrate with the above-mentioned holding tape is placed on the elastic body whose surface is smoothed by film attachment or coating in such a manner that the one main surface side is in full contact with the above; and a breaking step, which involves In the state where the substrate is placed on the elastic body, the following operations are repeated at the plurality of predetermined breaking positions, that is, by lowering the front end of the upper blade while abutting on the predetermined breaking position, the above The substrate is broken; the smoothed elastic body does not generate a gap between the substrate and the holding belt when the substrate is broken. For example, the method for cutting a brittle material substrate according to claim 4, wherein a protective film attaching step is provided at least after the scribing step and before the cutting step, and the protective film attaching step is on the other main surface of the substrate. Attach a protective film. For example, the method for cutting a brittle material substrate according to claim 4 or 5, wherein the brittle material substrate is a bonded substrate formed by bonding two substrates. A cutting method for a brittle material substrate is characterized in that it is a method for breaking a brittle material substrate at a specific predetermined cutting position, and the substrate is formed with a scribe line at the predetermined cutting position on a main surface side. The above-mentioned holding tape is attached, and the above-mentioned one main surface faces downward. In a state where the substrate is supported from below by an elastic body whose surface is smoothed by film attachment or coating, the front end of the upper blade is made. The aforesaid substrate is broken while abutting on the predetermined breaking position, and the smoothed elastic body does not generate a gap between the substrate and the holding belt when the substrate is broken. The cutting method of the brittle material substrate according to claim 7, wherein the brittle material substrate is a bonded substrate formed by bonding two substrates. A breaking device for a brittle material substrate is characterized in that it is a device that breaks a brittle material substrate at a specific predetermined breaking position, and is provided with a scribing forming mechanism that is located on a main surface side of one of the substrates. A scribe line is provided at the above-mentioned predetermined breaking position; a substrate attaching mechanism attaches the main surface of the substrate provided with the scribe line to a holding tape; and a placing mechanism attaching the substrate to which the holding tape is attached On the main surface side of the whole surface contact, placed on the surface of the elastic body smoothed by film attachment or coating; and a breaking mechanism for placing the substrate on the elastic body In the state, the substrate is broken by lowering the front end of the upper blade while abutting the predetermined cutting position; the smoothed elastic body does not fall between the substrate and the holding band when the substrate is broken. Create a gap. For example, the method for cutting a brittle material substrate according to claim 9, wherein the brittle material substrate is a bonded substrate formed by bonding two substrates. A breaking device for a brittle material substrate is characterized in that it is a device for breaking a brittle material substrate at a specific predetermined breaking position, and has the elasticity of smoothing the surface by film attachment or coating A body that supports the substrate from below, the substrate is formed with a scribe line and attached with the holding tape at the predetermined cutting position on a main surface side, and the one main surface faces downward; and a cutting mechanism, The front end of the blade provided above the elastic body is lowered while abutting against the predetermined cutting position to cut the substrate; the smoothed elastic body is between the substrate and the holding belt when the substrate is cut. No gap is created. For example, the method for cutting a brittle material substrate according to claim 11, wherein the brittle material substrate is a bonded substrate formed by bonding two substrates.