TWI644774B - a method for separating a brittle material substrate, a substrate holding member for breaking a brittle material substrate, and a frame for adhering the adhesive film used for breaking the brittle material substrate - Google Patents

Abstract

The breaking method of the brittle material substrate of the present invention can suppress the cost in breaking the brittle material substrate and does not hinder the expansion of the subsequent step.

The method for breaking a brittle material substrate comprises: a scribing step forming step of forming a scribe line at a position of a dividing object on one main surface side of the brittle material substrate; and a substrate bonding step of forming a sharded brittle material substrate The main surface is adhered to the adhesive film of the substrate holding member in which the adhesive film is formed on the frame; and the breaking step is performed to abut the front end of the upper blade while supporting the brittle material substrate from below. The other main surface side corresponding to the position where the scribe line is formed is divided and lowered while being lowered, thereby breaking the brittle material substrate; the frame is formed into a rectangular ring shape; and the region of the substrate holding member to which the brittle material substrate can be adhered The length of one side is 1.2 times or more and 1.4 times or less of the maximum outer shape of the brittle material substrate.

Description

a method for separating a brittle material substrate, a substrate holding member for breaking a brittle material substrate, and a frame for adhering the adhesive film used for breaking the brittle material substrate

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a method of breaking a substrate of a brittle material, and more particularly to a frame for affixing an adhesive film used in the breaking.

A semiconductor element such as an electronic component or an optical component is generally produced by a process of forming a circuit pattern constituting each component in two dimensions on a mother substrate which is a circular or rectangular brittle material substrate such as a semiconductor substrate. Thereafter, the mother substrate after the formation of the element is separated and singulated (wafered) into a plurality of element (wafer) units.

A well-known aspect (for example, refer patent document 1) is a method of dividing a chip (a singulation of a wafer) into a brittle material substrate such as a semiconductor substrate, and is referred to as a path by a blade tip or a laser such as a circular wheel. The predetermined dividing line of the (street) is formed as a scribe line which is a starting point of the dividing, and then the bending stress is applied to the brittle material substrate by a three-point bending method by the breaking means, and the crack (crack) is extended from the dividing starting point. Break the substrate.

The breaking is generally performed by adhering an adhesive surface of an adhesive dicing tape which is placed on a circular ring-shaped frame, that is, a dicing frame, and is adhered and fixed as a breaking object. The state of the material substrate is performed.

Patent Document 1: Japanese Patent Laid-Open Publication No. 2014-83821

Breaking of the brittle material substrate in a three-point bending manner during singulation In this case, since the individual pieces after the breaking are in contact with each other, there is a case where the individual pieces are separated by stretching (expanding) the dicing tape to which the brittle material substrate is pasted. At the time of this stretching, since it is necessary to make the dicing tape is isotropically stretched, it is necessary to use a circular ring as the frame.

On the other hand, it is necessary to set the upper edge (breaking edge) for the substrate to be broken. The frame is in contact with the cutting tape.

In addition, as a cutting frame, generally, those who follow the SEMI specifications are used.

According to these requirements, in the past, brittle material bases were used as the object of breaking. The board has a larger circle of cut frames. For example, for a 12-inch substrate, a 18-inch size cutting frame that conforms to SEMI specifications is used.

However, there is a size difference in the use of such a substrate with a brittle material. In the case of a frame, it is necessary to use a dicing tape that is larger than the size of the brittle material substrate. Further, in the case where a plurality of brittle material substrates are continuously separated in the mass production process of the element or the like, it is necessary to transport the plurality of brittle material substrates by a transport means such as a cassette, but if the cutting frame is large, The size of the transport means also becomes large, resulting in weight. Further, the size of the breaking device used in the breaking must be increased in size. These have become the factors that make the cost higher in the component manufacturing process.

The present invention has been made in view of the above problems, and an object thereof is to provide an ability to provide a method for breaking a brittle material substrate which does not hinder the expansion of the subsequent step in the step of breaking the brittle material substrate, a substrate holding member for breaking the substrate used therein, and a substrate constituting the substrate Hold the frame of the component.

In order to solve the above problem, the invention of claim 1 or claim 5 is broken and brittle. A method for forming a material substrate, comprising: a step of forming a scribe line, forming a scribe line at a position of a dividing object on one main surface side of the brittle material substrate; and a step of adhering the substrate, the scribe line is formed The main surface of the brittle material substrate is adhered to the adhesive film of the substrate holding member in which the adhesive film is formed in the frame; and the breaking step is performed while supporting the brittle material substrate from below. The front end of the blade abuts on a predetermined predetermined position of the other main surface side corresponding to the position at which the scribe line is formed, and is lowered while separating the brittle material substrate; the frame is formed in a rectangular ring shape; preferably The length of one side of the substrate holding member to which the brittle material substrate can be adhered is 1.2 times or more and 1.4 times or less of the maximum outer shape of the brittle material substrate.

The invention of claim 2 is a method for breaking a substrate of a brittle material, characterized in that And a step of forming a scribe line, forming a scribe line at a position of the dividing object on one side of the main surface of the brittle material substrate; and a step of adhering the substrate, the main surface of the substrate of the brittle material on which the scribe line is formed Adhesive film adhered to the substrate holding member in which the adhesive film is formed on the frame; and a breaking step of abutting the front end of the upper blade while supporting the brittle material substrate from below The brittle material substrate is separated by a predetermined position corresponding to the other main surface side of the scribe line, and the brittle material substrate is separated; the frame is formed in a rectangular ring shape; the brittle material substrate is adhered to the adhesive film In the state of the brittle material substrate and the frame, a region in which the second frame of the circular ring shape can be adhered is provided.

The invention of claim 3 or claim 5 is a method of breaking a substrate of a brittle material, The main surface of the brittle material substrate on which the scribed line is formed in advance on the main surface side is adhered to the rectangular annular frame, and the adhesive film is adhered thereto, and the adhesive film can be adhered thereto. The length of one side of the region of the brittle material substrate is 1.2 times the maximum outer dimension of the brittle material substrate The adhesive film of the substrate holding member formed by the above-mentioned 1.4 times or less, and then the brittle material substrate on which the protective film is placed is supported from below, and the front end of the upper blade is brought into contact with the position where the scribe line is formed. The other main surface side is divided by a predetermined position and lowered while being separated, thereby breaking the brittle material substrate.

The invention of claim 4 is a method for breaking a substrate of a brittle material, characterized in that The main surface of the brittle material substrate on which the scribed line is formed in advance on the main surface side is adhered to the substrate holding member in which the adhesive film is formed in the rectangular annular frame. The adhesive film is adhered so that a region in which a circular ring-shaped second frame body can be adhered is provided between the brittle material substrate and the frame, and then the brittle material substrate on which the protective film is placed is supported from below. The brittle material substrate is separated by lowering the front end of the upper blade against the predetermined predetermined position of the other main surface side corresponding to the position at which the scribe line is formed.

The invention of claim 6 or claim 7 is based on the substrate of the brittle material When the three-point bending method in which the upper blade abuts is broken, the substrate holding member for adhering and holding the brittle material substrate is characterized in that an adhesive film is stretched over the rectangular annular frame, and preferably The length of one side of the region where the brittle material substrate can be adhered is 1.2 times or more and 1.4 times or less of the maximum outer shape of the brittle material substrate.

The invention of claim 8 or claim 9 is based on the substrate of the brittle material A frame for use in the three-point bending method in which the upper blade is abutted, and a frame for adhering the adhesive film for holding the brittle material substrate is formed, and is formed in a rectangular ring shape and is provided for being stretched. In the state in which the adhesive film of the brittle material substrate is adhered and adhered, the length of the side where the brittle material substrate can be adhered is 1.2 times or more and 1.4 times or less of the maximum outer shape of the brittle material substrate.

According to the invention of claim 1 to claim 9, the upper edge (crack) can be performed at the time of breaking There is no interference between the broken blade and the frame, and the use area of the adhesive film is reduced more than conventionally, and the cost required for the breaking can be reduced.

1‧‧‧Battery material substrate

2‧‧‧Adhesive film

3, 3a, 3b‧‧‧ frame

4‧‧‧Expansion frame

4e‧‧‧ (expanded frame) peripheral end

101A, 101B‧‧‧ lower blade

102‧‧‧Upper

CR‧‧‧Crack

Interference area between I1~I4‧‧‧ (between rectangular area and frame)

RE‧‧‧Rectangular area

S‧‧ scribe

d‧‧‧Maximum dimensions

Fig. 1 is a view showing a state in which the brittle material substrate 1 is cut.

Fig. 2 is a plan view showing a state in which the brittle material substrate 1 is adhered to the adhesive film 2.

Fig. 3 is a plan view showing a state in which a brittle material substrate 1 having the same size as that of Fig. 2 is adhered to a substrate holding member using a circular ring-shaped frame 3a.

Fig. 4 is a plan view showing a state in which a brittle material substrate 1 having the same size as that of Fig. 2 is adhered to a substrate holding member using a circular ring-shaped frame 3b.

Fig. 5 is a view showing the sequence of the transfer processing.

Fig. 1 is a view showing a state in which the brittle material substrate 1 is cut. In the present embodiment, the brittle material substrate 1 is broken by a so-called three-point bending method by means of a breaking device.

The brittle material substrate 1 may, for example, be a semiconductor substrate (such as a germanium substrate) or a glass substrate. A circuit pattern for a predetermined element (for example, a CMOS sensor or the like) may be formed on one main surface of the semiconductor substrate.

When the brittle material substrate 1 is divided by a three-point bending method, first, as shown in FIG. 1, the brittle material substrate 1 having the scribe line S formed in advance at a predetermined position of one main surface thereof is adhered to Also known as the adhesive film 2 of the dicing tape. Adhesive film 2, one of its main faces becomes sticky The face is placed and placed on a frame 3, also referred to as a cutting frame. When the brittle material substrate 1 is adhered, the main surface on the side on which the score line S is formed is brought into contact with the adhesive film 2 as indicated by an arrow AR1, and the other main surface is placed on the upper surface. Thereafter, the adhesive film 2 is placed on the frame 3, and is collectively referred to as a substrate holding member. The material of the frame 3 may, for example, be a metal (aluminum, stainless steel, or the like), a resin, or the like.

In Fig. 1, it is shown that the predetermined position and the scribe are separated in a direction perpendicular to the plane of the drawing. The case where the line S extends. The scribe line S is a continuous crack in the thickness direction of the brittle material substrate 1 (micro crack) and is continuous in one line on one main surface of the brittle material substrate 1.

In addition, in FIG. 1, only one scribe line S is shown for simplification of illustration, but In the present embodiment, the brittle material substrate 1 is divided into a plurality of portions to obtain a plurality of single sheets in a short strip shape or a lattice shape (see FIG. 2). Therefore, in actuality, the brittle material substrate 1 is adhered to the adhesive film 2 after the score line S is formed at all predetermined positions.

For the formation of the score line S, a well-known technique can be applied. For example, it can be The cutting wheel (the scoring wheel) is crimped and rotated along the predetermined position to form a scribe line S, wherein the cutting wheel (sculpt wheel) is made of super hard alloy, sintered diamond, single crystal diamond, etc. The structure is formed in a disk shape, and has a ridge line functioning as a blade at the outer peripheral portion; and may be formed by scribing a diamond cusp along the predetermined position to form the scribe line S; The aspect of the scribe line S may be formed by the formation of an ablation or a metamorphic layer generated by laser (for example, ultraviolet (UV) laser irradiation); or by laser (for example, The thermal stress generated by the heating and cooling of the infrared (IR) laser forms a scribe line S.

Figure 2 is a view showing the state in which the brittle material substrate 1 has been adhered to the adhesive film 2. view. In the present embodiment, as the frame 3, a rectangular ring shape in which the adhesive region (the region inside the frame 3) of the adhesive film 2 is rectangular is used. In addition, if the brittle material substrate 1 is the largest flat When the surface size (outer diameter) is d and the length of one side of the adhesive region of the adhesive film 2 is L, the frame 3 is preferably used to satisfy L = 1.2 d to 1.4 d.

In the aspect shown in FIG. 2, the substrate to which the brittle material substrate 1 is adhered is held. The component is supplied to the breaking device for breaking. Specifically, as shown in FIG. 1 , the formation portion of the score line S is disposed between the two lower edges 101A and 101B which are separated in the horizontal direction, in other words, the score lines S are respectively parallel, Further, in a state in which the two lower edges 101A and 101B which are arranged in parallel with each other are arranged in parallel with the extending direction of the upper blade 102, the substrate holding member in a state in which the brittle material substrate 1 is adhered is provided by two lower portions. The blades 101A and 101B are supported from below. Further, the lower blades 101A and 101B are provided as members which are extremely rigid compared to the brittle material substrate 1. Further, the upper blade 102 has a blade length larger than the maximum outer dimension d of the brittle material substrate 1 and smaller than the length L of one side of the attachable region. Further, in the case of breaking, a protective film may be disposed on the upper surface of the brittle material substrate 1.

After the above-mentioned supporting state is performed, as indicated by an arrow AR1 in FIG. The upper blade (breaking blade) 102 is lowered from the upper side toward the position at which the score line S is formed, and the tip end thereof is brought into contact with the brittle material substrate 1, and the upper blade 102 is further lowered by press-fitting. Thereby, the crack extends from the scribe line S toward the thickness direction of the substrate, and the brittle material substrate 1 is broken.

As shown in Fig. 2, in the case where a plurality of score lines S are set (the grid in Fig. 2) When the breaking of the formation portion of the scribe line S is completed, it is necessary to relatively move the upper blade 102 and the substrate holding member to which the brittle material substrate 1 is adhered, so that the upper blade 102 is disposed at the next breaking portion. . Therefore, the rectangular area RE of the length d of one side shown in Fig. 2 becomes the relative movement range of the upper blade 102 with respect to the substrate holding member.

3 and 4 are for comparison and show that the substrate holding member using the circular ring-shaped frames 3a, 3b having the same size has the same size (maximum outer dimension d) as the brittleness of FIG. A plan view of the material substrate 1 as it is. As long as the size of the brittle material substrate 1 is the same, the size of the rectangular region RE is the same, but as shown in FIG. 3, the inner diameter of the substrate 1 is larger than the size of the brittle material substrate 1 (more specifically, the inner diameter is d). In the case of the circular ring-shaped frame 3a of 2 ^(1/2) times or less), interference regions I1 to I4 causing interference between the rectangular region RE and the casing 3a are generated. That is, it means that the upper blade 102 comes into contact with and collides with the casing 3a when the upper blade 102 is lowered for the purpose of breaking. Therefore, the frame 3a which causes such disturbance can not be used at the time of breaking.

On the other hand, as in the case of the frame 3b shown in Fig. 4, even if a frame having a very large adhesive area (more specifically, an inner diameter larger than 2 ^(1/2) times d) is used, even if it is formed In the case of a circular ring shape, it is also possible to cause no interference with the rectangular area RE. Therefore, it has been conventionally used to use the frame 3b. However, in the case where the frame 3b is used, the area of the region where the brittle material substrate 1 is not adhered to the adhesive film 2 is excessively large. In general, since the adhesive film 2 is a consumable product and is newly adhered to the frame body for each of the brittle material substrates 1 that are separated, the use of the large-area adhesive film 2 is a high cost factor.

On the other hand, in the case of this embodiment, it is used as described above to satisfy L. >d rectangular rectangular frame 3. Thereby, the size of the rectangular area RE becomes smaller than the size of the attachable area. Further, since the blade length of the upper blade 102 is smaller than the length L, it is possible to perform the breakage without causing interference between the upper blade 102 and the frame 3. Further, since the area of the adhesive film 2 is small as compared with the case of using the frame 3b, the cost can be suppressed.

Next, for supplying the broken brittle material substrate 1 to the expansion processing The transfer process will be described. Fig. 5 is a view showing the sequence of the transfer processing. Extended processing In order to separate the individual sheets that are in contact with each other after the separation, the adhesive film 2 to which the brittle material substrate 1 is adhered is stretched (expanded) so as to protrude from the back side, and is processed by a known expansion device. At the time of this stretching, since it is necessary to make the adhesive film 2 extend in an isotropic manner, it is necessary to use a circular ring. In other words, the substrate holding member in a state in which the adhesive film 2 is formed in the frame 3 formed in a rectangular ring shape cannot be supplied to the expansion device while maintaining the original state. Therefore, the action performed is a transfer process.

First, as shown in FIG. 5(a), after the substrate holding member is kept broken, A plan view of the state of the brittle material substrate 1. In the brittle material substrate 1 after the breaking, although the crack CR is stretched thereon, the individual pieces obtained by the breaking are still in contact with each other.

Next, in FIG. 5(a), the brittle material substrate 1 and the frame 3 are present after being separated. In the inter-region, the expansion frame 4 is placed as shown in FIG. 5(b) and adhered to the adhesive film 2. The expansion frame 4 is a circular annular frame having an inner diameter larger than the maximum outer dimension d of the brittle material substrate 1 but having an outer diameter equal to or less than the length L of the adhesive region of the adhesive film 2. Further, as shown in FIG. 5(b), the outer peripheral end portion 4e may be in contact with the frame body 3.

As described above, since the frame 3 satisfies the requirements of L=1.2d to 1.4d, it is able to The expansion frame 4 is preferably selected and applied. For example, when the brittle material substrate 1 has a length of 12 turns, as the expansion frame 4, a 12-inch cutting frame conforming to the SEMI standard can be used.

As shown in FIG. 5(b), after the expansion frame 4 is pasted, the frame 3 is adhered. The film 2 is peeled off, and then the adhesive film 2 is cut along the outer peripheral end portion 4e of the expansion frame 4. As a result, as shown in FIG. 5(c), in the circular ring-shaped expansion frame 4, an adhesive film to which the brittle material substrate 1 is adhered (strictly, a plurality of pieces after being separated) is obtained. 2 sets of expansion frames set in a circular ring The state of the body 4. In other words, the state in which the brittle material substrate 1 after the breaking is transferred to the new substrate holding member (the substrate holding member for expansion) in which the adhesive film 2 is stretched in the circular ring-shaped expansion frame 4 can be realized.

By supplying the expansion substrate holding member to the expansion device, it is possible to perform comparison Good extension processing.

As described above, according to the present embodiment, the three-point bending method is employed. When the brittle material substrate is divided into a plurality of single sheets, the substrate holding member for adhering and holding the brittle material substrate is used at a side of the attachable region of the pasteable brittle material substrate, and the length is 1.2 times the maximum outer shape of the brittle material substrate. When the above-mentioned ring-shaped frame of 1.4 times or less is provided with an adhesive film, it is possible to prevent interference between the upper blade (cracking blade) and the frame and to use the area of the adhesive film when the cutting is performed. It is more reduced than previously known and can reduce the cost of performing the breaking.

In addition, the brittle material substrate after the break is supplied to the expansion processing. When the brittle material substrate and the rectangular annular frame used for the separation are adhered to the circular ring-shaped expansion frame, the adhesive film is cut along the outer periphery of the expansion frame, thereby obtaining The state of the substrate board for expansion which has a structure in which an adhesive film is formed in a circular annular expansion frame is transferred to the state of the substrate. Thereby, the divided brittle material substrate in a state in which a plurality of single sheets are in contact with each other can be preferably supplied to the expansion processing for separating the individual sheets.

Claims (8)

A breaking method for a brittle material substrate, comprising: a step of forming a scribe line, forming a scribe line at a position of a dividing object on one main surface side of the brittle material substrate; and a substrate pasting step And the main surface of the brittle material substrate on which the score line is formed is adhered to the adhesive film of the substrate holding member in which the adhesive film is formed on the frame; and the breaking step is performed to support the bottom surface In the state of the brittle material substrate, the brittle material substrate is separated by lowering the front end of the upper blade against the predetermined predetermined position on the other main surface side corresponding to the position at which the scribe line is formed; The frame is formed in a rectangular ring shape, and a region in which the circular ring-shaped second frame body can be adhered is provided between the brittle material substrate and the frame in a state in which the brittle material substrate is adhered to the adhesive film. A method for breaking a substrate of a brittle material is a substrate for breaking a brittle material, characterized in that the main surface of a substrate of a brittle material on which a score line is formed in advance on a main surface side is adhered to The rectangular annular frame is provided with the adhesive film of the substrate holding member which is adhered to the film, and then the brittle material substrate is supported from below, and the front end of the upper blade is brought into contact with the formation position of the scribe line. The other main surface side is divided by a predetermined position and lowered, whereby the brittle material substrate is separated, and a region in which the second frame of the circular ring can be adhered is provided between the brittle material substrate and the frame. . A method for breaking a brittle material substrate, characterized in that a main surface of a brittle material substrate is adhered to an adhesive film, and a second frame capable of adhering a circular ring is disposed between the brittle material substrate and the frame After the body region is adhered, the brittle material substrate is supported from below, and the front end of the upper blade is brought into contact with the predetermined position of the other main surface side corresponding to the position where the scribe line is formed, and is lowered. This breaks the substrate of the brittle material. The method for breaking a brittle material substrate according to claim 1 or 2, wherein a length of one side of the substrate holding member to which the brittle material substrate is adhered is 1.2 times a maximum outer dimension of the brittle material substrate. Above, 1.4 times or less. A substrate holding member for breaking a brittle material substrate is used for adhering and holding the brittle material substrate when the brittle material substrate is cut by a three-point bending method in which the upper blade is brought into contact with the upper surface, and is characterized in that: An adhesive film is stretched over the rectangular annular frame, and a second frame that can be attached to the circular ring is disposed between the brittle material substrate and the frame in a state in which the brittle material substrate is adhered to the adhesive film. The area of the body. The substrate holding member for breaking the brittle material substrate according to the fifth aspect of the invention, wherein the length of the region on which the brittle material substrate can be adhered is 1.2 times or more and 1.4 times or less the maximum outer dimension of the brittle material substrate. A frame for attaching an adhesive film, which is used for breaking a brittle material substrate by a three-point bending method in which an upper blade is abutted from above, and is provided with an adhesive film for adhering and holding the brittle material substrate , characterized in that it is formed into a rectangular ring shape, In a state in which the brittle material substrate is adhered to the adhesive film, a region in which the circular second annular frame can be adhered is provided between the brittle material substrate and the frame. The frame for the adhesive film stretching used in the breaking of the brittle material substrate according to the seventh aspect of the patent application, wherein the brittle material can be adhered in a state in which the adhesive film for holding the brittle material substrate is adhered. The length of one side of the substrate region is 1.2 times or more and 1.4 times or less the maximum outer dimension of the brittle material substrate.