JP6446912B2 - Break device - Google Patents

Description

  The present invention relates to an apparatus for cutting a brittle material substrate.

  A semiconductor device such as an electronic device or an optical device is usually formed by two-dimensionally repetitively forming a circuit pattern constituting the device on a mother substrate which is a circular or rectangular brittle material substrate such as a semiconductor substrate. The device is manufactured by a process of dividing the mother substrate after the device formation into individual elements (chips).

  As a method of dividing a brittle material substrate such as a semiconductor substrate (dividing a chip into individual pieces), a scribe line that is a starting point of division is formed by a cutting edge of a circular wheel or a laser on a planned division line called a street, and then a break device ( A mode in which a substrate is divided by applying a bending stress to the brittle material substrate by a three-point bending method and extending a crack (crack) from the division starting point is already known (for example, see Patent Document 1). ).

  Such division is generally performed in a state in which a brittle material substrate to be divided is attached and fixed to a surface to be bonded of an adhesive dicing tape stretched on a dicing frame that is a circular annular frame.

JP 2014-83821 A

  The division by the three-point bending method is usually performed from above in a state where the brittle material substrate is supported by the two lower blades so that the position to be divided of the brittle material substrate to be divided is arranged between the two lower blades. This is done by bringing the upper blade (pressing blade) into contact with the parting target position and pushing it in.

  In order to divide the brittle material substrate into a large number of pieces, of course, it is necessary to divide the brittle material substrate in the vicinity of the end portion of the brittle material substrate. Therefore, it is necessary to arrange the two lower blades in the vicinity of the end portion. However, when the two lower blades are arranged in the vicinity of the end portion in such a manner, the position of the two lower blades supports the position of the center of gravity of the brittle material substrate so that the adhesive film bends due to the weight of the brittle material substrate, In some cases, the brittle material substrate cannot maintain a horizontal posture, and as a result, the division cannot be suitably performed.

  In addition, although it seems that the problem which concerns is increased by enlarging the size of a lower blade, since it interferes with the area | region which supports a dicing frame, such correspondence cannot be taken.

  This invention is made | formed in view of the said subject, and it aims at providing the break apparatus which can cut | disconnect a brittle material board | substrate favorably also about the edge part vicinity.

In order to solve the above-mentioned problems, the present invention is a break device for dividing a brittle material substrate by crack extension from a scribe line formed in advance on one main surface side thereof, and an adhesive film is provided on a circular annular frame. A substrate holding member that is stretched and has the one main surface side of the brittle material substrate attached to the adhesive film includes a circular opening provided in accordance with the shape of the frame and the frame The support table placed on the upper surface in a manner to match the inner end, and the opening is movable in a horizontal plane at the opening, and is provided separately from each other in the horizontal plane. A pair of stays that support the brittle material substrate from below via the adhesive film in a manner in which the planned cutting position of the brittle material substrate coincides with the position at which the gap is formed. And in a state where the substrate holding member is placed on the support table, abuts against a planned cutting position on the other main surface side of the brittle material substrate. An auxiliary support bar for supporting the brittle material substrate downward together with the pair of stages, and a pressing blade provided in a possible manner and attached to each of the pair of stages at a predetermined angle in a horizontal plane; It is characterized by providing.

The present invention is the break device described above , wherein the auxiliary support bar is rotatably provided in the horizontal plane, and is attached while maintaining the contact state when contacting the opening. Further, it is folded on the side of the stage.

The invention according to claim 2 is the break device according to claim 1 , wherein when the auxiliary support bar is in a non-contact state where the auxiliary support bar is not in contact with the opening, the auxiliary support bar is in a natural length. It is further provided with a restraining spring that restrains the rotational movement of the auxiliary support bar by being provided so as to extend when in the state.

Invention of Claim 3 is a break apparatus in any one of Claim 1 or 2 , Comprising: The diameter of the said brittle material board | substrate is set to D, and the said auxiliary | assistant support bar does not contact | abut the said opening part, The non-contact state Y> D / 2, where Y is the vertical distance in the horizontal plane from the position to be divided to the tip of the auxiliary support bar.

According to the first to third aspects of the present invention, the brittle material substrate can be suitably divided regardless of which position of the brittle material substrate is the division target position.

In particular, according to the first and second aspects of the present invention, the auxiliary support bar and the support table do not interfere with each other even if they come into contact with each other.

In particular, according to the invention of claim 2, when the auxiliary support bar is returned from the contact state to a non-contact state, it can be returned to its position quickly.

1 is a cross-sectional view showing a schematic configuration of a break device 100 for cutting a brittle material substrate 1. FIG. 3 is a perspective view of a main part when the brittle material substrate 1 is to be cut in the break device 100.

  FIG. 1 is a cross-sectional view showing a schematic configuration of a break device (cutting device) 100 for cutting a brittle material substrate 1. FIG. 2 is a perspective view of the main part when the brittle material substrate 1 is to be cut in the break device 100.

  Examples of the brittle material substrate 1 include a semiconductor substrate (such as a silicon substrate) and a glass substrate. A circuit pattern for a predetermined device (for example, a CMOS sensor) may be formed on one main surface of the semiconductor substrate. In the present embodiment, as shown in FIG. 2, a disc-shaped brittle material substrate 1 is an object to be divided.

  When dividing the brittle material substrate 1, first, as shown in FIG. 1, the brittle material substrate 1 in which the scribe line S is formed in advance on the one main surface at the planned division position is also referred to as dicing tape. Affix to the adhesive film 2. The pressure-sensitive adhesive film 2 has one main surface that is a pressure-sensitive adhesive surface, and is stretched around a circular annular frame 3 that is also called a dicing frame. That is, the inside of the frame 3 is a region where the brittle material substrate 1 can be pasted. In attaching the brittle material substrate 1, the main surface on which the scribe line S is formed is brought into contact with the adhesive film 2, and the other main surface is the upper surface. Hereinafter, the one in which the adhesive film 2 is stretched around the frame 3 is generically referred to as a substrate holding member. Examples of the material of the frame 3 include metal (aluminum, stainless steel, etc.), resin, and the like.

  In the present embodiment, the disk-shaped brittle material substrate 1 is divided at a plurality of locations to obtain a large number of strips or lattices. Therefore, as illustrated in FIG. 1, it is assumed that the scribe line S is provided at each divided portion. The scribe line S is a line in which cracks (microcracks) extending in the thickness direction of the brittle material substrate 1 are linearly continued on one main surface of the brittle material substrate 1. In FIG. 1, it is assumed that a plurality of scheduled cutting positions and a scribe line S each extend in a direction perpendicular to the drawing.

  A known technique can be applied to the formation of the scribe line S. For example, a cutter wheel (scribing wheel) made of cemented carbide, sintered diamond, single crystal diamond, etc., which has a disk shape and has a ridge line that functions as a blade on the outer peripheral part, is pressed along the planned cutting position. It may be a mode in which the scribe line S is formed by rolling, a mode in which the scribe line S is formed by drawing a diamond point along the scheduled cutting position, or a laser (for example, The scribe line S may be formed by ablation by irradiation with ultraviolet (UV) laser or formation of an altered layer, or scribe by thermal stress due to heating and cooling by a laser (for example, infrared (IR) laser). The aspect which forms the line S may be sufficient.

  The break device 100 includes a pair of stages 101a and 101b that support the vicinity of the position to be divided of the brittle material substrate 1 from below through the adhesive film 2 at the time of division, and the brittle material substrate 1 by contacting the position to be divided from above. A pressing blade (break blade) 102 that divides and a support table 103 that supports the frame 3 from below when dividing is provided.

  Specifically, the support table 103 is provided with a circular opening 103h that substantially matches the inner diameter of the frame 3, and a pair of stages 101a and 101b are provided at the center of the opening 103h. They are provided slightly apart so as to form a gap G in the horizontal plane. The height positions of the upper surfaces of the stages 101a and 101b and the height position of the upper surface of the support table 103 are set to be the same. Further, the pressing blade 102 is disposed so as to be vertically movable at positions above the stages 101a and 101b, and its extending direction (blade spanning direction) is made to coincide with the longitudinal directions of the stages 101a and 101b. It becomes. More specifically, a gap G formed by the pair of stages 101a and 101b is positioned vertically below the tip of the pressing blade 102, and the extending direction of the gap G coincides with the crossing direction of the pressing blade 102. Yes. In addition, as the pressing blade 102, a blade whose size in the blade crossing direction is larger than the diameter of the brittle material substrate 1 is used.

  Further, the pair of stages 101a and 101b and the pressing blade 102 are driven by a driving mechanism (not shown) so as to be movable in the horizontal uniaxial direction within the range of the opening 103h of the support table 103. Thereby, in the break device 100, it is possible to sequentially divide a plurality of different portions of the brittle material substrate 1.

  The break device 100 further includes an auxiliary support bar 104 and a restraining spring 105.

  The auxiliary support bar 104 is attached to each of the pair of stages 101a and 101b in a manner extending in the horizontal direction. The auxiliary support bar 104 has a substantially rod shape, and one end side of the auxiliary support bar 104 is attached to the stages 101a and 101b so as to be rotatable in a horizontal plane by an attachment turning part 104a. A contact portion 104b is provided on the other end side. As a result of the movement of the auxiliary support bar 104 in the horizontal plane along with the movement of the stages 101a and 101b, the contact portion 104b comes into contact with the end portion 103e of the support table 103 that forms the opening 103h. In such a case, it is provided as a portion that actually contacts the end portion 103e. The contact portion 104b is preferably provided so as to be rotatable in a horizontal plane by a roller, a pulley, or the like. The height position of the upper surface of the auxiliary support bar 104 is the same as the height position of the upper surfaces of the stages 101a and 101b. The auxiliary support bar 104 is provided to assist the lower support of the brittle material substrate 1 by the stages 101a and 101b.

  On the other hand, the restraining spring 105 is provided between the attachment turning portion 104 a and the vicinity of the contact portion 104 b of the auxiliary support bar 104. The restraining spring 105 is provided to restrain the rotational movement of the auxiliary support bar 104 in the horizontal plane.

  The auxiliary support bar 104 attached to the stage 101a and the restraining spring 105 associated therewith, and the auxiliary support bar 104 attached to the stage 101b and the restraining spring 105 attached thereto are point-symmetric with each other. It is arranged in.

  More specifically, the auxiliary support bar 104 has a predetermined angle α (with respect to the corresponding stages 101a and 101b in a state where the contact portion 104b is not in contact with the end portion 103e of the opening 103h (non-contact state). It is provided so as to extend in the horizontal direction at an acute angle. In addition, the restraining spring 105 is provided so as to have a natural length in the non-contact state. Thereby, in the non-contact state, the posture of the auxiliary support bar 104 is kept substantially constant. FIG. 1 illustrates the case where the two auxiliary support bars 104 are in a non-contact state.

  However, when the diameter of the brittle material substrate 1 is D, the auxiliary support bar 104 and the restraining spring 105 are separated from the division target position (position of the pressing blade 102) when in the non-contact state, and the tip of the contact portion 104b. The vertical distance Y in the horizontal plane is set so as to satisfy Y> D / 2.

  On the other hand, in the state where the contact portion 104b is in contact with the end portion 103e of the opening 103h (contact state), the horizontal posture of the auxiliary support bar 104 varies depending on the positions of the stages 101a and 101b. At this time, the angle β formed between the auxiliary support bar 104 and the corresponding stages 101a and 101b is smaller than the angle α formed between the two in the non-contact state. In other words, it can be said that the auxiliary support bar 104 is folded to the side of the stage 101a or 101b in the contact state. By realizing such a folded state, the auxiliary support bar 104 and the support table 103 do not interfere with each other even if the contact state is reached. In FIG. 2, one auxiliary support bar 104 (illustrated by a solid line) is in a contact state, and the other auxiliary support bar 104 (illustrated by a broken line) is in a non-contact state. Is illustrated. However, in FIG. 2, the pressing blade 102 is omitted for convenience of illustration.

  In the contact state, the restraining spring 105 extends according to the posture of the auxiliary support bar 104. The restoring force of the restraining spring 105 at this time acts on the auxiliary support bar 104 as an urging force for returning the posture to the original position (to the posture in the non-contact state). Since the urging force is applied in such a manner, in the break device 100, the posture change of the auxiliary support bar 104 at the time of shifting (returning) from the contact state to the non-contact state is made quickly. It is like that.

  Furthermore, the break device 100 is provided with an observation camera 110 below a gap G formed by a pair of stages 101a and 101b. The camera 110 can capture an image of the upper side through the gap G as indicated by an arrow AR in FIG. In the break device 100, the arrangement positions of the pair of stages 101a and 101b and the pressing blade 102 at the time of division are adjusted based on the captured image of the camera 110.

  When the brittle material substrate 1 is divided in the break device 100 having the above-described configuration, first, a substrate holding member formed by pasting the brittle material substrate 1 can be pasted with the brittle material substrate 1 facing upward. It is placed and fixed on the support table 103 so that the region and the opening 103 h of the support table 103 coincide (so that the opening coincides with the inner end of the frame 3). Then, in a state where the substrate holding member is placed in such a manner, the horizontal position of the scribe line S provided at the position where the first division is performed matches the position of the gap G formed by the pair of stages 101a and 101b. In addition, the arrangement positions of the pair of stages 101a and 101b and the pressing blade 102 are adjusted. An image captured by the camera 110 is used for such adjustment.

  When the arrangement positions of the pair of stages 101a and 101b and the pressing blade 102 are adjusted, the pressing blade 102 is lowered from above toward the position where the scribe line S is formed, and the tip thereof is brought into contact with the brittle material substrate 1, and The pressing blade 102 is lowered so as to be pushed in. As a result, a three-point bending state in which the pair of stages 101a and 101b is the lower blade and the pressing blade 102 is the upper blade is realized, the crack extends from the scribe line S in the substrate thickness direction, and the brittle material substrate 1 Is divided.

  If the division | segmentation with respect to one division | segmentation object position is complete | finished in this aspect, the division | segmentation in the next division | segmentation object position will be performed continuously. Specifically, the horizontal position of the scribe line S provided at the next position to be divided coincides with the position of the gap G formed by the pair of stages 101a and 101b while maintaining the mounting and fixing state of the substrate holding member. As described above, the arrangement positions of the pair of stages 101a and 101b and the pressing blade 102 are adjusted. Thereafter, this is repeated until the division at all the division target positions is completed.

  At this time, for example, as shown in FIG. 1, when the vicinity of the central portion of the brittle material substrate 1 is the position to be divided (when division is performed at the scribe line S formed in the vicinity of the central portion), a pair of The horizontal postures of the auxiliary support bars 104 attached to the stages 101a and 101b are the same. Specifically, the two auxiliary support bars 104 are not in contact with the end 103e of the opening 103h. In such a case, the brittle material substrate 1 is in a state of being supported downward via the adhesive film 2 not only by the pair of stages 101a and 101b but also by the auxiliary support bar 104 attached to each of the stages. Therefore, the brittle material substrate 1 is stably supported during the division.

  On the other hand, as shown in FIG. 2, for example, when the vicinity of the edge of the brittle material substrate 1 is a position to be divided, the pair of stages 101a and 101b is aligned with the position to be divided and the end 103e of the opening 103h is It is necessary to arrange in the vicinity. FIG. 2 illustrates the case where the stage 101b is close to the end portion 103e. In this case, the auxiliary support bar 104 attached to the stage 101b is in contact with the end portion 103e and is in a folded state, and interference with the support table 103 does not occur. On the other hand, the auxiliary support bar 104 attached to the other stage 101a supports the brittle material substrate 1 downward while maintaining a non-contact state. As described above, since the auxiliary support bar 104 is provided so as to satisfy the relationship of Y> D / 2, the center position where the arrangement position of the pair of stages 101a and 101b is the gravity center position of the brittle material substrate 1 The brittle material substrate 1 is stably supported at the time of division despite the deviation.

  In the contact state, the horizontal posture of the auxiliary support bar 104 changes depending on the arrangement position of the pair of stages 101a and 101b, and the contact position of the contact portion 104b at the end portion 103e also changes. When the abutting portion 104b is rotatably provided as described above, the displacement of the abutting position is performed by the abutting portion 104b abutting and rolling on the end portion 103e. Changes in posture are also made smoothly.

  When the break device does not include the auxiliary support bar 104, when the pair of stages 101a and 101b are positioned in the vicinity of the end 103e of the opening 103h as in the case of FIG. 2, the support balance of the brittle material substrate 1 is The adhesive film 2 collapses due to the weight of the brittle material substrate 1 at a portion away from the stage 101a or 101b, and further, due to the influence, the brittle material substrate 1 is lifted from the adhesive film 2 around the position to be divided. There is a possibility that a malfunction occurs. In addition, the occurrence of such lifting may cause problems such as the focus being lost when the camera 110 captures an image and position adjustment cannot be performed.

  On the other hand, in the break device 100 according to the present embodiment, by providing the auxiliary support bar 104, the brittle material substrate 1 is stably supported downward regardless of where the division target position is. The brittle material substrate 1 can be suitably divided at all the positions to be divided.

  As described above, according to the present embodiment, an auxiliary support bar is attached to a pair of stages serving as lower blades in a break device that cuts a brittle material substrate, and the brittle material substrate is supported not only by the stage but also by the auxiliary. By supporting the lower portion also by the support bar, the brittle material substrate can be suitably divided regardless of which position of the brittle material substrate is the division target position. Further, the auxiliary support bar is provided so that it is folded to the stage side when one end of the auxiliary support bar comes into contact with the periphery, and a spring that extends in the contact state is attached to the auxiliary support bar. Thus, when the auxiliary support bar returns from the contact state to the non-contact state, the posture can be quickly returned.

DESCRIPTION OF SYMBOLS 1 Brittle material board | substrate 2 Adhesive film 3 Frame 100 Break apparatus 101a, 101b Stage 102 Push blade 103 Support table 103e End part (of the support table opening) 103h (Support table) opening 104 Auxiliary support bar 104a Mounting rotation Part 104b contact part 105 restraining spring 110 camera G (stage) gap S scribe line

Claims (3)

A break device for dividing a brittle material substrate by crack extension from a scribe line formed on one main surface side in advance,
An adhesive film is stretched on a circular annular frame, and a substrate holding member formed by attaching the one main surface side of the brittle material substrate to the adhesive film is provided in accordance with the shape of the frame. A support table placed on the upper surface in a manner to match the circular opening and the inner end of the frame,
The opening is movable in a horizontal plane and is provided apart from each other in the horizontal plane, and in the aspect of dividing the brittle material substrate at the position where the brittle material substrate is divided coincides with the position where the gap is formed. A pair of stages for supporting the brittle material substrate from below via the adhesive film;
It is movable in a horizontal plane together with the pair of stages, and can come into contact with the planned cutting position on the other main surface side of the brittle material substrate when the substrate holding member is placed on the support table. A provided blade,
An auxiliary support bar that is attached to each of the pair of stages at a predetermined angle in a horizontal plane, and supports the brittle material substrate downward together with the pair of stages,
A break device comprising:
The auxiliary support bar is provided so as to be rotatable in the horizontal plane, and when it is in contact with the opening, it is folded to the side of the stage attached while maintaining the contact state.
Break device characterized by that. The break device according to claim 1 ,
The auxiliary support bar is provided with a natural length when the auxiliary support bar is in a non-contact state where the auxiliary support bar is not in contact with the opening, and is extended so as to extend when the auxiliary support bar is in the contact state. A restraining spring that restrains the rotational movement of
A break device further comprising: The break device according to claim 1 or 2 ,
The diameter of the brittle material substrate is D, and the vertical distance in the horizontal plane from the position to be divided to the tip of the auxiliary support bar when the auxiliary support bar is not in contact with the opening is Y. When Y> D / 2,
Break device characterized by that.

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