TW201515802A - Breaking device and splitting method - Google Patents

Abstract

An object of the present invention is to split functional areas of a composite substrate. The composite substrate is formed by coating a resin layer on a brittle material substrate, which has a surface provided with the functional areas. To split the composite substrate, scribing lines are formed on the brittle material substrate 11 for separating the functional areas and then, the brittle material substrate 11 is solely broken. To break the resin layer subsequently, the composite substrate 10 is disposed on an elastic support plate 40 in such a way that the surface of the brittle material substrate that has broken is arranged as an upper surface and the resin layer 12 is arranged as a lower surface. Subsequently, an expansion bar 32a having a lower surface that is formed as an arc surface is set in alignment with the breaking line and pressed down so as to extend cracking to achieve splitting. As such, multiple chips comprising the functional areas can be formed through the splitting.

Description

Fracture device and breaking method

The present invention relates to a breaking device and a breaking method for a composite substrate in which a resin layer or the like is applied onto a brittle material substrate such as a semiconductor substrate or a ceramic substrate.

A semiconductor wafer is manufactured by dividing an element region formed on a semiconductor wafer at a boundary position of the element region. Previously, in the case where the wafer was broken into wafers, the cutting blade was rotated by the cutting device, thereby cutting the semiconductor wafer to be small by cutting.

However, in the case of using a cutting device, it is necessary to have water to discharge the discharged debris due to the cutting, and in order not to adversely affect the performance of the semiconductor wafer by the water or the discharged debris, it is necessary to protect the semiconductor wafer and The steps before cleaning off the water or discharging the debris. Therefore, the steps become complicated, and it is impossible to reduce the cost or shorten the processing time. Moreover, since cutting is performed using a dicing blade, problems such as film peeling or chipping occur. Moreover, in a MEMS (Micro-Electro-Mechanical Systems) substrate having a micro-mechanical structure, the structure is broken due to the surface tension of water, so that water cannot be used, and there is a problem that the cutting cannot be performed by cutting. .

Further, Patent Documents 1 and 2 propose a substrate breaking device which is formed by pressing a semiconductor wafer on which a scribe line is formed from a back surface of a surface on which a scribe line is formed, and perpendicularly to the surface along a scribe line. Break it. The outline of the cracking by the breaking device is shown below. A plurality of functional regions are formed neatly on the semiconductor wafer to be the object of the break. In the case of breaking, first, on the semiconductor wafer, between the functional areas A scribe line is formed in the longitudinal direction and the lateral direction at equal intervals. Then, the breaking is performed along the scribe line by means of a breaking device. Figure 1 (a) shows a cross-sectional view of a semiconductor wafer placed on a fracture device prior to breaking. As shown in the figure, functional regions 101a and 101b are formed on the composite substrate 101, and scribe lines S1, S2, S3, ... are formed between the functional regions 101a and 101b. In the case of breaking, the tape 102 is attached to the back surface of the composite substrate 101, and the protective film 103 is attached to the front surface. Then, when the crack is broken, as shown in Fig. 1(b), a scribe line to be broken is disposed in the middle of the support knives 105, 106, in this case, a scribe line S2, so that the blade 104 is aligned from the upper portion thereof. The scribing is lowered to press the composite substrate 101. In this way, the three-point bending of the pair of support blades 105, 106 and the blade 104 is used to break.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-39931

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-149495

In the fracture device having such a configuration, when the blade 104 is pressed down and pressed at the time of the fracture, the composite substrate 101 is slightly bent, and therefore, the stress is concentrated on the composite substrate 101 and the support blade 105, 106 part of the front edge contact. Therefore, if the portions of the supporting blades 105, 106 of the breaking device contact the functional regions 101a, 101b as shown in Fig. 1(a), a force is applied to the functional region at the time of the breaking. Therefore, there is a problem that it is possible to damage a functional area on a semiconductor wafer.

Further, as a substrate that is separated by a breaking device, a composite substrate in which a resin is coated on a ceramic substrate is used. In such a composite substrate, after the ceramic substrate is cracked, the resin layer is directly pressed by the split bar. In this case, there is a problem that the resin layer is deformed and is easily damaged. Moreover, if it is desired to use a laser to break in order to solve the above problem, there is damage due to the thermal influence of the laser, or after the laser is irradiated, the spatter adheres. The problem around.

The present invention has been made in view of such a problem, and an object thereof is to enable a composite substrate in which a brittle material substrate has been broken to be broken without damage.

In order to solve the problem, the breaking method of the present invention is a method for breaking a composite substrate by coating a resin on a brittle material substrate having a functional region on one side, and forming a crack in the brittle material substrate. The wire breaks the functional area; on the elastic support plate, the composite substrate is disposed such that the surface of the brittle material substrate becomes the upper surface, and the expansion bar is pressed down along the crack line of the brittle material substrate (Expand Bar) ) the resin layer is broken.

In order to solve the problem, the breaking method of the present invention is a method for breaking a composite substrate formed by coating a resin on a brittle material substrate having a functional region on one side; and not forming the above-mentioned brittle material substrate The coated resin surface is scribed to form a scribe line to break the functional region of the composite substrate, and the brittle material substrate of the composite substrate is broken along the scribe line to form a surface of the brittle material substrate on the elastic support plate. The composite substrate is placed on the upper surface, and the resin layer is fractured by forming an arc-shaped expansion rod along the fracture line of the brittle material substrate.

In order to solve the problem, the breaking device of the present invention is a breaking device for breaking a resin layer of a composite substrate, the composite substrate is coated with a resin on a brittle material substrate having a functional region on one side, and a crack is formed on the brittle material substrate. The wire breaks the functional area; the breaking device comprises: a table; an elastic supporting plate, which is a flat plate including at least an elastic member having a width in a plane direction equivalent to that of the composite substrate, and is provided in the lattice shape a protective hole at each center position of the region surrounded by the break line, disposed on the table, holding the surface of the broken line as an upper surface to hold the composite substrate; the expander including the expansion rod; and a moving mechanism The moving table moves along the surface thereof; and the lifting mechanism maintains the composite substrate and the expansion rod in parallel on one side, The surface of the expander is raised and lowered toward the surface of the composite substrate on the elastic support plate.

Here, the lower end section of the expander of the expander may be formed in an arc shape.

According to the invention having such a feature, the composite substrate is placed on the elastic supporting plate, and the lowermost end line of the strip-shaped expanded rod is aligned so as to correspond to the broken line, thereby performing fracture. Therefore, it is possible to obtain an effect of breaking the resin layer along the fracture line without damaging the functional region.

10‧‧‧Composite substrate

11‧‧‧Ceramic substrate

12‧‧‧矽 resin

13‧‧‧ functional area

20‧‧‧Fracture device

21‧‧‧Workbench

22, 25‧‧‧ horizontal fixed members

23‧‧‧Servo motor

24‧‧‧Ball screw

26, 29‧‧‧ moving components

27‧‧‧Female thread

28a‧‧‧Support shaft

28b‧‧‧Support shaft

30‧‧‧Expander

31‧‧‧Base

32a~32n‧‧‧Extension stick

40‧‧‧Flexible support plate

50‧‧‧marking wheel

51‧‧‧Break

101‧‧‧Composite substrate

101a‧‧‧ functional area

101b‧‧‧ functional area

102‧‧‧ Tape

103‧‧‧Protective film

104‧‧‧blade

105‧‧‧Support knife

106‧‧‧Support knife

B _x1 ‧‧‧crack line

S1‧‧‧

S2‧‧‧ scribing

S3‧‧‧

S _x1 ~S _xm ‧‧‧Scratch line

S _y1 ~S _yn ‧‧‧Scratch line

1(a) and 1(b) are cross-sectional views showing the state of the prior semiconductor wafer at the time of cracking.

2(a) and 2(b) are a front view and a side view of a substrate to be separated in accordance with an embodiment of the present invention.

Fig. 3 is a perspective view showing an example of a breaking device for a resin layer at the time of breaking in the embodiment.

Fig. 4 is a perspective view showing an example of the expander of the embodiment.

Fig. 5 is a perspective view showing an elastic support plate for breaking at the embodiment of the present invention.

6(a) to 6(d) are schematic views showing the breaking process of the composite substrate of the embodiment.

Fig. 7 (a) to (d) are schematic views showing the breaking process of the resin layer of the embodiment.

Next, an embodiment of the present invention will be described. 2 is a front view and a side view showing a composite substrate 10 in which a semiconductor element is formed in a rectangular shape as an example of such a substrate. In the embodiment, the composite substrate 10 to be separated is a composite substrate 10 obtained by coating a resin layer, for example, a resin 12 on a ceramic substrate 11. Here, the division of only the ceramic substrate 11 of the composite substrate 10 causes the scribe to extend vertically to the substrate to be separated at one time, so that the division is expressed as "cracking" and the breaking of the enamel resin layer 12 is performed. Since the crack of the resin layer is gradually expanded by the application of force, the breaking is expressed as "fracture". Further, the division of the entire composite substrate 10 is expressed as "breaking". In the manufacturing step of the composite substrate 10, a plurality of functional regions 13 are formed in a lattice shape along a line parallel to the x-axis and the y-axis. The functional area 13 is, for example, a MEMS functional area in which an LED (Light-Emitting Diode) or a mechanical component, a sensor, an actuator, or the like is incorporated. Further, in order to form a semiconductor wafer for each functional region, as shown by a one-dot chain line, the longitudinally equally spaced lines are set as the scribed lines S _y1 to S _yn , and the horizontally equally spaced lines are set. To score the predetermined lines S _x1 ~S _xm , the parts of the functional area are located in the center of the square surrounded by the scribed lines.

Next, the breaking device 20 for breaking the resin layer of the embodiment will be described. As shown in FIG. 3, the breaking device 20 includes a table 21 that is movable and rotatable in the y direction. In the breaking device 20, a moving mechanism is provided below the table 21, and the moving mechanism moves the table 21 along the surface thereof in the y-axis direction, thereby rotating the table 21 along the surface thereof. Further, the composite substrate 10 to be separated is placed on the table 21 via the elastic support plate 40 described below. On the top of the workbench 21, there is The horizontal fixing member 22 has a servo motor 23 held on the upper portion of the horizontal fixing member 22. A ball screw 24 is directly coupled to the rotating shaft of the servo motor 23. The lower end of the ball screw 24 is supported by another horizontal fixing member 25, and the ball screw 24 is rotatable. The upper moving member 26 includes a female screw 27 that is screwed to the ball screw 24 at the center portion, and support shafts 28a and 28b are provided downward from both end portions of the upper moving member 26. The support shafts 28a and 28b pass through one of the horizontal fixing members 25 to the through holes and are coupled to the lower moving member 29. The expander 30 described below is attached to the lower surface of the lower moving member 29 in parallel with the surface of the table 21. As a result, when the ball screw 24 is rotated by the servo motor 23, the upper moving member 26 and the lower moving member 29 are integrally moved up and down, and the expander 30 is simultaneously moved up and down. Here, the servo motor 23, the horizontal fixing members 22 and 25, and the upper and lower moving members 26 and 29 constitute an elevating mechanism for moving the expander 30 up and down.

Next, the expander 30 for breaking the resin layer will be described. For example, as shown in the perspective view of FIG. 4, the expander 30 is formed with a plurality of parallel strips side by side in a planar base 31. Shaped rods 32a~32n. All of the ridges of each of the expanders form a plane. Further, the interval between the rods may be fixed and is an integral multiple of 2 or more of the interval between the planned lines, and is doubled in the present embodiment. In addition, the cross section of each of the expandable rods is not particularly limited as long as it has a shape capable of being pressed along the fracture line, but is preferably an arc shape that is curved as described below. In FIG. 4, in order to clearly show the extension bars 32a to 32n, the extension bars 32a to 32n are shown as the upper surface, but in the case of use, the extension bars 32a to 32n are attached to the lower movement member 29 so as to be downward. .

In the present embodiment, the elastic support plate 40 is used when the resin layer of the composite substrate 10 is broken. As shown in the perspective view of Fig. 5, the elastic supporting plate 40 is a rectangular rubber flat jig having the same size as the composite substrate 10, for example, having a thickness of about several mm.

Next, a method of breaking the composite substrate 10 will be described. Fig. 6 is a view showing a breaking process, and Fig. 6(a) shows a part of the composite substrate 10. First, as shown in Fig. 6(b), the surface of the ceramic substrate 11 is used as the upper surface, and the scribing wheel 50 is moved by a scribing device (not shown) to perform scribing along the scribed line. Therefore, as shown in FIG. 2(a), the scribe lines S _x1 to S _xm in the x direction and the scribe lines S _y1 to S _{yn in the} y direction are formed.

Then, in the cracking step, as shown in FIG. 6(c), the composite substrate 10 is first inverted. Then, using a breaking device (not shown), the split rod 51 is positioned directly above the already formed scribe line, and only the ceramic substrate 11 is broken by pressing the split rod 51 downward.

Thereby, only the ceramic substrate 11 is broken along the scribe lines S _x1 to S _xm and S _y1 to S _yn . Fig. 6(d) shows a portion of the composite substrate 10 after the respective scribe lines are broken along the x direction and the y direction. Further, since the scribe lines S _x1 to S _xm and S _y1 to S _yn are all broken, they are hereinafter referred to as break lines B _x1 to B _xm and B _y1 to B _yn .

Next, as shown in FIG. 7, the method of extending the fracture line formed on the ceramic substrate 11 to the resin layer and ending the division of the composite substrate 10 will be described. Fig. 7 is a view showing a fracture process of the resin layer, and Fig. 7(a) shows a part of the composite substrate. First, the elastic supporting plate 40 is placed on the table 21 of the breaking device 20, and the composite substrate 10 is placed on the upper surface of the elastic supporting plate 40. At this time, as shown in FIG. 7(a), the resin layer 12 is placed in contact with the elastic supporting plate 40 so that the surface of the ceramic substrate 11 is the upper surface. Then, positioning is performed such that the lowermost ridge line of any one of the expanders 30, for example, 32a, is aligned with a broken line such as B _x1 . In this way, the other expansion rods become every other broken line, that is, directly above the broken line.

Then, the servo motor 23 is driven to lower the upper moving member 26 and the lower moving member 29 at the same time, and the expanding rod side of the expander 30 is gradually lowered while being kept parallel with respect to the table 21. Then, as shown in FIG. 7(b), the expanded rod 32a is pressed against the ceramic substrate 11 from directly above the break line _Bx1 . As described above, as shown in FIG. 7(c), the ceramic substrate 11 is pressed and deformed by the expansion bar 32a, and is sunk to deform the elastic support plate 40 into a V shape. At this time, since the right and left sides of the ceramic substrate are uniformly deformed by the press-fitting of the expansion rod 32a, the crack can be extended downward along the fracture line. Here, the cross-sectional shape of the underside of the expansion rod is not particularly limited. However, in the case of, for example, a triangular shape, the necessity of accurately positioning the apex alignment break line is relatively high. Therefore, in order to deform the ceramic substrate 11 and the resin 12 in a balanced manner in this manner, the cross section below each of the expanded rods is formed in an arc shape. Thereby, the allowable range of the accuracy of positioning the ridge line of the expansion rod aligned with the broken line is relatively wide. Further, by sufficiently lowering the expansion rod, the crack in the resin progresses and the pushing force is applied to the right and left, thereby terminating the fracture. When the break is completed, the servo motor 23 is reversed and the expander 30 is raised.

At this time, a plurality of expansion rods are formed side by side in the expander 30, and the interval is twice as long as the scribe line, so that the expansion rod can simultaneously break the enamel resin 12 along the plurality of rupture lines every other broken line. .

Then, the table 21 is moved in the y-axis direction by an amount corresponding to the distance between the break lines, and the expander 30 is similarly lowered, whereby the breakage of the resin layer can be ended for the other adjacent broken lines. Here, since the interval between the extension bars is twice the distance between the scribe lines, the fracture of all the x-axis directions of the composite substrate 10 can be terminated by breaking the table 21 once. Moreover, when the interval between the extension bars is three times the distance between the scribe lines, When the stage 21 is moved twice and is broken, all the fractures in the x-axis direction are ended.

Then, the table 21 is rotated by 90°, and the expander 30 is similarly lowered for the y-axis breakage line to break the resin layer. Then, the table 21 is moved in the y-axis direction by an amount corresponding to the distance between the broken lines, and the expander 30 is similarly lowered. In this way, the entire surface is broken, and the resin is broken along each fracture line to break the square functional region, thereby forming a plurality of MEMS wafers.

In the embodiment, the ceramic substrate is described as a substrate to be a base. However, the present invention is also applicable to various brittle material substrates such as a semiconductor substrate or a glass substrate.

Further, in the embodiment, the enamel resin is described as a resin applied to the ceramic substrate, but may be a layer of other various materials, for example, a layer such as a polarizing plate laminated on the glass substrate.

Further, in this embodiment, the expander is a flat member having a plurality of expanders on the lower surface, but the expander may be formed by only one expander, and the expander may be pressed against the composite substrate to be broken. .

[Industrial availability]

When the brittle material substrate having the region to be protected is cut and cut, the present invention can be broken without damaging the region to be protected. Therefore, the present invention can be effectively applied to a fracture device for forming a substrate having a functional region.

11‧‧‧Ceramic substrate

12‧‧‧矽 resin

32a‧‧‧Extension stick

40‧‧‧Flexible support plate

B _x1 ‧‧‧crack line

Claims (5)

A breaking method for dividing a composite substrate by coating a resin on a brittle material substrate having a functional region on one side, and forming a crack line on the brittle material substrate to break the functional region; The breaking method is performed on the elastic supporting plate, and the composite substrate is disposed such that the surface of the brittle material substrate becomes the upper surface; and the resin layer is fractured by pressing the expanded rod along the fracture line of the brittle material substrate. A breaking method for separating a composite substrate formed by coating a resin on a brittle material substrate having a functional region; and the breaking method is performed on the uncoated resin surface of the brittle material substrate Scribing to form a scribe line to break the functional region of the composite substrate; to break the brittle material substrate of the composite substrate along the scribe line; and to form the upper surface of the brittle material substrate on the elastic support plate The composite substrate is disposed, and the resin layer is fractured by forming an arc-shaped expansion rod along the fracture line of the brittle material substrate. The breaking method of claim 1 or 2, wherein the lower end section of the expander of the expander is formed in an arc shape. A breaking device for breaking a resin layer of a composite substrate, the composite substrate is coated with a resin on a brittle material substrate having a functional region, and a fracture line is formed on the brittle material substrate to break the functional region; The device comprises: a work table; an elastic support plate, which comprises at least the same plane as the composite substrate The flat plate of the elastic member having the width of the direction includes a protection hole provided at each central position of the region surrounded by the lattice-shaped crack line, and the elastic support plate is disposed on the table, and the surface of the broken line is formed Holding the composite substrate as an upper surface; an expander including an expansion rod; a moving mechanism for moving the table along the surface thereof; and a lifting mechanism for holding the composite substrate and the expansion rod in parallel on one side The expander moves up and down toward the surface of the composite substrate on the elastic support plate. The breaking device of claim 4, wherein the lower end of the expansion rod of the expander is formed in an arc shape.