CN104552629B - Disrumpent feelings device and method for dividing - Google Patents

Disrumpent feelings device and method for dividing Download PDF

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Publication number
CN104552629B
CN104552629B CN201410309300.8A CN201410309300A CN104552629B CN 104552629 B CN104552629 B CN 104552629B CN 201410309300 A CN201410309300 A CN 201410309300A CN 104552629 B CN104552629 B CN 104552629B
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CN
China
Prior art keywords
base plate
composite base
brisement
disjunction
disrumpent feelings
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CN201410309300.8A
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CN104552629A (en
Inventor
富本博之
黑田直洋
岩坪佑磨
中谷郁祥
武田真和
村上健二
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2013215394A priority Critical patent/JP6115438B2/en
Priority to JP2013-215394 priority
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN104552629A publication Critical patent/CN104552629A/en
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Publication of CN104552629B publication Critical patent/CN104552629B/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components

Abstract

The present invention relates to a kind of disrumpent feelings device and method for dividing.Its problem is the functional area disjunction of composite base plate, the composite base plate be on the brittle substrate in a functional region of mask coating resin layer and formed.In disjunction composite base plate, line is formed on brittle substrate (11) with breaking function region, then only by brittle substrate (11) brisement.In following disrumpent feelings resin bed, composite base plate (10) using by brittle substrate brisement this simultaneously as upper surface and by resin bed (12) as being configured on flat elastic supporting plate (40) in a manner of lower surface.Then, brisement line is directed at by the way that lower surface to be formed as to the extension rod (32a) of arc-shaped to press down, make cracking progress and disjunction.So, can be with disjunction into multiple chips with functional area.

Description

Disrumpent feelings device and method for dividing
Technical field
Formed the present invention relates to a kind of coating resin layer etc. on the brittle substrates such as semiconductor substrate, ceramic substrate The disrumpent feelings device and method for dividing of composite base plate.
Background technology
Semiconductor chip is the boundary bit by will be formed in the element area on semiconductor wafer in the element area Put disjunction and manufacture.In the past, by chip disjunction into chip in the case of, rotate cutting blade by cutter device, so as to By cutting semiconductor wafer is cut off smaller.
However, in the case of using cutter device, it is necessary to have water to discharge because discharging chip caused by cutting, in order to not Make the water or discharge performance generation harmful effect of the chip to semiconductor chip, it is necessary to have front and rear step with real to semiconductor chip Protection is applied, and washes water or discharge chip.Therefore, there is step to become complicated, cost can not be cut down or shorten process time Shortcoming.In addition, because being cut using cutting blade, so the problems such as film stripping or defect can be produced.In addition, with small , can be because of the table of water in MEMS (Micro-Electro-Mechanical Systems, MEMS) substrate of mechanical realization Face tension force causes structure destruction, so water can not be used, can not be by cutting the problem of carrying out disjunction so as to produce.
In addition, proposing a kind of disrumpent feelings device of substrate in patent document 1,2, pass through the semiconductor die to forming line Piece, from the back side for forming one side of ruling, along line perpendicular to the face press and by its brisement.Below, show using such a The summary of the brisement of disrumpent feelings device.Multiple functional areas are formed neatly arrangedly on the semiconductor wafer as brisement object Domain.In the case where carrying out disjunction, first, on the semiconductor wafer, in being spaced apart at equal intervals along longitudinal direction and horizontal stroke for functional area Rule to being formed.Then, disjunction is carried out using disrumpent feelings device along the line.Fig. 1 (a) is placed in disrumpent feelings device before representing disjunction Semiconductor wafer sectional view.As shown in this figure, functional area 101a, 101b are formed on composite base plate 101, in function Line S1, S2, S3 ... are formed between region 101a, 101b.In the case where carrying out disjunction, at the back side of composite base plate 101 Adhesive tape 102 is attached, diaphragm 103 is attached in its front.Then, in brisement, as shown in Fig. 1 (b), in supporting knife 105,106 Middle configuration answer the line of brisement, be line S2 in this case, making blade 104, alignment line in portion's declines from it, from And press composite base plate 101.In this way, brisement is carried out using the three-point bending of a pair of supporting knives 105,106 and blade 104.
[background technology document]
[patent document]
[patent document 1] Japanese Patent Laid-Open 2004-39931 publications
[patent document 2] Japanese Patent Laid-Open 2010-149495 publications
The content of the invention
[problems to be solved by the invention]
In the disrumpent feelings device with such a composition, blade 104 is pressed down and pressed when in brisement situation Under, the meeting of composite base plate 101 somewhat warpage, therefore, stress can concentrate on composite base plate 101 and the leading edge of supporting knife 105,106 connects Tactile part.Therefore, if the part of the supporting knife 105,106 of disrumpent feelings device touches functional area as shown in Fig. 1 (a) 101a, 101b, then can be to functional area applying power in brisement.Accordingly, there exist the work(for being possible to damage on semiconductor wafer The problem of energy region.
In addition, as the substrate for carrying out disjunction using disrumpent feelings device, there is what on ceramic substrate silicone-coating formed to answer Close substrate.In such a composite base plate, after by ceramic substrate brisement, directly using brisement rod pressing resin bed, in this situation Under, the problem of resin bed deformation being present and be susceptible to damage.In addition, if want to use laser to solve described problem Carry out disjunction, then existing can sustain damage because of the heat affecting of laser, or after laser is irradiated, splash is attached to periphery The problem of.
Completed currently invention addresses such a problem, its object is to can be by brittle substrate answering by brisement It is disrumpent feelings with no damage to close substrate.
[technological means for solving problem]
In order to solve the problem, method for dividing of the invention is by the method for dividing of composite base plate disjunction, the composite base Plate is the coating resin on the brittle substrate in a functional region of mask, and is formed in the brittle substrate Brisement line is with functional area described in disjunction;On elastic supporting plate, match somebody with somebody in a manner of the face of brittle substrate turns into upper surface The composite base plate is put, pressing down extension rod (Expand Bar) by the brisement line along the brittle substrate will set Lipid layer is disrumpent feelings.
In order to solve the problem, method for dividing of the invention is by the method for dividing of composite base plate disjunction, the composite base Plate be on the brittle substrate in a functional region of mask coating resin and formed;And to the brittle substrate Uncoated resin one side delineated and form line, with the functional area of composite base plate described in disjunction, along the line By the brittle substrate brisement of the composite base plate, on elastic supporting plate, upper surface is turned into the face of brittle substrate Mode configure the composite base plate, extension rod is pressed down by resin bed by the brisement line along the brittle substrate It is disrumpent feelings.
In order to solve the problem, disrumpent feelings device of the invention is by the disrumpent feelings disrumpent feelings device of the resin bed of composite base plate, institute It is the coating resin on the brittle substrate in a functional region of mask to state composite base plate, and in the fragile material base Plate shape is into brisement line with functional area described in disjunction;The disrumpent feelings device includes:Workbench;Elastic supporting plate, it is at least The flat board of elastic component comprising the width with the in-plane equal with the composite base plate, it is configured at the workbench On, the face for forming brisement line is kept into the composite base plate as upper surface;Expander, include extension rod;Travel mechanism, The workbench is set to be moved along its face;And elevating mechanism, the composite base plate and extension rod are abreast kept on one side, on one side The expander is set to be lifted towards the face of the composite base plate on the elastic supporting plate.
Herein, the lower end section of the extension rod of the expander can be formed as arc-shaped.
[The effect of invention]
According to the present invention with such a feature, composite base plate is configured on elastic supporting plate, with banded extension The mode that the bottom line of rod corresponds to brisement line carries out position alignment, disrumpent feelings so as to carry out.Accordingly, it is capable to work(can not be damaged by obtaining Can region and along brisement line by the disrumpent feelings effect of resin bed.
Brief description of the drawings
Fig. 1 (a), Fig. 1 (b) are the sectional views of state when representing conventional semiconductor wafer brisement.
Fig. 2 (a), Fig. 2 (b) are the front view and side view of the substrate as disjunction object of embodiments of the present invention.
Fig. 3 is the stereogram of one of the disrumpent feelings device for the resin bed used when disrumpent feelings for representing present embodiment.
Fig. 4 is the stereogram of one of the expander for representing present embodiment.
Fig. 5 is the stereogram for the elastic supporting plate used when disrumpent feelings for representing embodiments of the present invention.
Fig. 6 (a)~Fig. 6 (d) is the skeleton diagram of the breaking course for the composite base plate for representing the embodiment.
Fig. 7 (a)~Fig. 7 (d) is the skeleton diagram of the breaking course for the resin bed for representing the embodiment.
Embodiment
Next, embodiments of the present invention are illustrated.Fig. 2 (a), Fig. 2 (b) show one as such a substrate The front view and side view of the composite base plate 10 of the semiconductor element of the installation oblong-shaped of example.In this embodiment, will be The composite base plate 10 that coating resin layer, such as silicones 12 form on ceramic substrate 11 is used as disjunction object.Herein, composite base plate The disjunction of 10 only ceramic substrate 11 is delineation is vertically penetrated into substrate and disposable disjunction, therefore this disjunction is stated For " brisement ", and the disjunction of silicone layer 12 is to make the cracking of resin bed by applying power gradually expansion is split, thus by this Kind disjunction is expressed as " disrumpent feelings ".In addition, the overall disjunction of composite base plate 10 is expressed as " disjunction ".In the manufacture of composite base plate 10 In step, multiple functional areas 13 are formed in lattice shape neatly arrangedly in length and breadth along the line parallel to x-axis, y-axis.The work( Energy region 13 is for example set to group and has entered LED (Light-Emitting Diode, light emitting diode) or mechanical constituent part, sensing The MEMS functional areas of device, actuator etc..Moreover, semiconductor chip is made in order to carry out disjunction by each functional area, such as one Shown in point chain line, the upper equally spaced line in longitudinal direction is set to delineate preset lines Sy1~Syn, laterally upper equally spaced line is set to delineate Preset lines Sx1~Sxm, the part of functional area is positioned at the square center surrounded by these delineation preset lines.
Next, the disrumpent feelings device 20 for disrumpent feelings resin bed of the embodiment is illustrated.It is as shown in figure 3, broken Disconnected device 20 includes being capable of and the workbench 21 of rotation mobile towards y directions.In disrumpent feelings device 20, set in the lower section of workbench 21 Zhi Zhe travel mechanisms, the travel mechanism make workbench 21 be moved in the y-axis direction along its face, and make workbench 21 along Its face rotates.Moreover, the composite base plate 10 on workbench 21 across following elastic supporting plates 40 mounting as disjunction object. The top of workbench 21, sets the horizontal affixation member 22 of U-shaped, and servo is remain on the top of horizontal affixation member 22 Motor 23.Ball screw 24 is directly connected in the rotary shaft of servomotor 23, the lower end of ball screw 24 is by another water Flat fixing component 25 supports, and makes ball screw 24 rotatable.Upper mobile member 26 possesses and the spiral shell of ball screw 24 in central portion The box thread 27 of conjunction, possesses support shaft 28a, 28b downward from the both ends of the upper mobile member 26.Support shaft 28a, 28b Penetrate a pair of through holes of horizontal affixation member 25 and be linked to lower mobile member 29.In the lower surface of lower mobile member 29, with The face of workbench 21 is abreast installed with following expanders 30.Thus, rotate ball screw 24 by servomotor 23 In the case of, upper mobile member 26 is integrally formed and moved up and down with lower mobile member 29, and expander 30 also moves up and down simultaneously. Herein, servomotor 23 is formed with horizontal affixation member 22,25 and upper and lower mobile member 26,29 lifts expander 30 Elevating mechanism.
Next, the expander 30 used in disrumpent feelings silicone layer is illustrated.Such as shown in Fig. 4 stereogram, Expander 30 forms multiple parallel banded extension rod 32a~32n side by side in plane substrate 31.Each extension rod All crestal lines form a plane.As long as in addition, the interval of extension rod for it is fixed and be the interval for delineating preset lines 2 with On integral multiple, be set to 2 times in the present embodiment.Moreover, respectively as long as the section of extension rod is with can be along splitting The shape of the protuberance of broken string pressing, then be not particularly limited, but it is preferred that the arc-shaped bent as being set to as described below.This Outside, in Fig. 4, in order to explicitly indicate that extension rod 32a~32n, extension rod 32a~32n is made to turn into upper surface and represent, but make Used time is to be installed on lower mobile member 29 in a manner of extending rod 32a~32n as lower section.
In the present embodiment, elastic supporting plate 40 is used in the resin bed of disrumpent feelings composite base plate 10.Such as Fig. 5 solid Shown in figure, elastic supporting plate 40 is the rubber system accessory of rectangular flat board, and its size is identical with composite base plate 10, such as thickness It is set to several millimeters.
Next, the method for disjunction composite base plate 10 is illustrated.Fig. 6 (a)~Fig. 6 (d) represents breaking course Figure, Fig. 6 (a) represent a part for composite base plate 10.First, as shown in Fig. 6 (b), using the face of ceramic substrate 11 as upper surface, Stitch marker 50 is moved by chalker (not shown), is delineated along delineation preset lines.So as to which such as Fig. 2 (a) is shown, shape Into the line S in x directionsx1~Sxm, y directions line Sy1~Syn
Next, in brisement step, as shown in Fig. 6 (c), first overturn composite base plate 10.Then, use is not shown Brisement device, brisement rod 51 is located at the surface of line formed, by the way that brisement rod 51 is pressed down only to make pottery The brisement of porcelain substrate 11.
Thus, turn into only ceramic substrate 11 along line Sx1~Sxm、Sy1~SynThe state of brisement.Fig. 6 (d) is represented along x A part for composite base plate 10 after each line brisement in direction and y directions.In addition, line Sx1~Sxm、Sy1~SynSplit It is disconnected, therefore hereinafter referred to as brisement line Bx1~Bxm、By1~Byn
Next, as shown in Fig. 7 (a)~Fig. 7 (d), to making the brisement line for being formed at ceramic substrate 11 also extend into silicon tree Lipid layer and the method that terminates the disjunction of composite base plate 10 illustrate.Fig. 7 (a)~Fig. 7 (d) is the fracture for representing resin bed Figure, Fig. 7 (a) represent composite base plate a part.First, resilient support is configured on the workbench 21 of the disrumpent feelings device 20 Plate 40, and then configure composite base plate 10 in the upper surface of elastic supporting plate 40.Now, as shown in Fig. 7 (a), to be connected to elasticity The mode of supporting plate 40 configures silicone layer 12, and the face for making ceramic substrate 11 is upper surface.Then, with any of the expander 30 The crestal line alignment brisement line such as B of individual extension rod such as 32a footx1Mode positioned.So, other extend Rod is also every a surface for turning into brisement line.
Next, driving servomotor 23, makes mobile member 26 and lower mobile member 29 while decline, and make extension The extension rod of device 30 is while relative to the keeping parallelism of workbench 21 while being gradually reduced.Then, as shown in Fig. 7 (b), rod will be extended 32a is from brisement line Bx1Surface pressing ceramic substrate 11.So, as shown in Fig. 7 (c), ceramic substrate 11 is expanded rod 32a is pressed and deformed, and is sunk and elastic supporting plate 40 is similarly deformed into V shape.Now, the left and right of ceramic substrate with Extension rod 32a press-in and equably deform, therefore cracking can be made to extend to lower section along brisement line.Herein, rod is extended The cross sectional shape of lower section be not particularly limited, but in the case of such as triangle, accurately enter to exercise summit alignment The necessity of the positioning of brisement line is relative to be uprised.Therefore, in order that ceramic substrate 11, silicones 12 evenly become in this way Shape, and the section of the lower section of each extension rod is set to arc-shaped.Thus, the essence of the positioning of the crestal line alignment brisement line of extension rod is made The permissible range of degree is relative to broaden.Moreover, by making extension rod fully decline, the cracking in resin is in progress and left and right is applied and pushed away The power opened, it is disrumpent feelings so as to terminate.If disrumpent feelings end, then make servomotor 23 invert and make expander 30 increase.
Now, multiple extension rods are formed side by side in expander 30, and it is at intervals of twice of line, therefore extension can be made Rod every one along multiple brisement lines simultaneously disrumpent feelings silicones 12.
Then, workbench 21 is moved the amount of the spacing equivalent to brisement line in the y-axis direction, similarly make expander 30 Decline, thus can also be directed to the disrumpent feelings of other brisement knot beam resin beds abutted.Herein, because extension rod is at intervals of line Twice of spacing, therefore by making workbench 21 offset once to carry out the disrumpent feelings all x-axis that can terminate composite base plate 10 Direction it is disrumpent feelings.In addition, in the case of the three times at intervals of the spacing of line of extension rod, by making workbench 21 move two It is secondary and carry out disrumpent feelings to terminate the disrumpent feelings of all x-axis directions.
Then, it is rotated by 90 ° workbench 21, similarly declines expander 30 for the brisement line of y-axis, so as to will set Lipid layer is disrumpent feelings.Then, workbench 21 is moved the amount of the spacing equivalent to brisement line in the y-axis direction, similarly make expander 30 decline.So, terminate the disrumpent feelings of entire surface, the functional areas of resin and disjunction square shape are torn along each brisement line Domain, so as to form multiple MEMS chips.
In addition, in this embodiment, as the substrate as substrate, ceramic substrate is illustrated, but the present invention It is readily applicable to the various brittle substrates such as semiconductor substrate or glass substrate.
In addition, in this embodiment, as the resin for being coated on ceramic substrate, silicones is illustrated, but Can be layer, the layer such as to the Polarizer of glass substrate lamination of other various materials.
In addition, in this embodiment, expander is set to the plate-like members in lower surface with multiple extension rods, but Can also be merely with an extension rod into expander, and the expander is compressed to composite base plate and carried out disrumpent feelings.
[industrial utilizability]
The present invention is being delineated to the brittle substrate with the region that should be protected during disjunction, and can not damage to protect The region of shield and carry out disrumpent feelings, therefore, can be effectively adapted to be formed the disrumpent feelings device of the substrate of functional area.
[explanation of symbol]
10 composite base plates
11 ceramic substrates
12 silicones
13 functional areas
20 disrumpent feelings devices
21 workbench
22nd, 25 horizontal affixation member
23 servomotors
24 ball screws
26th, 29 mobile member
30 expanders
31 substrates
32a~32n extends rod
40 elastic supporting plates

Claims (6)

1. a kind of method for dividing, its disjunction composite base plate, the composite base plate are the fragility materials in a functional region of mask Expect coating resin on substrate, and brisement line is formed with functional area described in disjunction in the brittle substrate;And
On elastic supporting plate, the composite base plate is configured in a manner of the face of brittle substrate turns into upper surface,
Extension rod is pressed down by the brisement line along the brittle substrate resin bed is disrumpent feelings.
2. method for dividing according to claim 1, wherein the lower end section of the extension rod is formed as arc-shaped.
3. a kind of method for dividing, its disjunction composite base plate, the composite base plate are the fragility materials in a functional region of mask Expect coating resin on substrate and formed;And
The face of the uncoated resin of the brittle substrate is delineated and forms line, with composite base plate described in disjunction Functional area,
Rule along described by the brittle substrate brisement of the composite base plate,
On elastic supporting plate, the composite base plate is configured in a manner of the face of brittle substrate turns into upper surface,
Extension rod is pressed down by the brisement line along the brittle substrate resin bed is disrumpent feelings.
4. method for dividing according to claim 3, wherein the lower end section of the extension rod is formed as arc-shaped.
5. a kind of disrumpent feelings device, the resin bed of its is disrumpent feelings composite base plate, the composite base plate is in a functional region of mask Brittle substrate on coating resin, and on the brittle substrate formed brisement line with functional areas described in disjunction Domain;The disrumpent feelings device includes:
Workbench;
Elastic supporting plate, it is the elastic component including at least the area with the in-plane equal with the composite base plate Flat board, it is configured on the workbench, the face for forming brisement line is kept into the composite base plate as upper surface;
Expander, include extension rod;
Travel mechanism, the workbench is set to be moved along its face;And
Elevating mechanism, the composite base plate and extension rod are abreast kept on one side, while making the expander towards the elasticity branch The face lifting of composite base plate on fagging.
6. disrumpent feelings device according to claim 5, wherein the lower end section of the extension rod of the expander is formed as circular arc Shape.
CN201410309300.8A 2013-10-16 2014-07-01 Disrumpent feelings device and method for dividing Active CN104552629B (en)

Priority Applications (2)

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JP2013215394A JP6115438B2 (en) 2013-10-16 2013-10-16 Breaking device and cutting method
JP2013-215394 2013-10-16

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CN104552629B true CN104552629B (en) 2017-11-10

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6243699B2 (en) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 Fragment material substrate cutting device
JP6561565B2 (en) * 2015-04-30 2019-08-21 三星ダイヤモンド工業株式会社 Method and apparatus for dividing bonded substrate
JP2017001180A (en) * 2016-09-29 2017-01-05 三星ダイヤモンド工業株式会社 Surface layer fracturing apparatus of brittle material substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151443A (en) * 2000-11-08 2002-05-24 Victor Co Of Japan Ltd Device for cleaving semiconductor element
JP4210981B2 (en) * 2002-09-27 2009-01-21 住友電気工業株式会社 Cleaving device and cleavage method
CN103203806A (en) * 2012-01-16 2013-07-17 三星钻石工业股份有限公司 Method for breaking brittle material substrate
JP5421699B2 (en) * 2009-09-07 2014-02-19 三菱電機株式会社 Semiconductor element separation method and semiconductor element separation apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151443A (en) * 2000-11-08 2002-05-24 Victor Co Of Japan Ltd Device for cleaving semiconductor element
JP4210981B2 (en) * 2002-09-27 2009-01-21 住友電気工業株式会社 Cleaving device and cleavage method
JP5421699B2 (en) * 2009-09-07 2014-02-19 三菱電機株式会社 Semiconductor element separation method and semiconductor element separation apparatus
CN103203806A (en) * 2012-01-16 2013-07-17 三星钻石工业股份有限公司 Method for breaking brittle material substrate

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CN104552629A (en) 2015-04-29
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TWI620636B (en) 2018-04-11
KR20150044367A (en) 2015-04-24
JP2015079824A (en) 2015-04-23

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