CN104552629B - Disrumpent feelings device and method for dividing - Google Patents
Disrumpent feelings device and method for dividing Download PDFInfo
- Publication number
- CN104552629B CN104552629B CN201410309300.8A CN201410309300A CN104552629B CN 104552629 B CN104552629 B CN 104552629B CN 201410309300 A CN201410309300 A CN 201410309300A CN 104552629 B CN104552629 B CN 104552629B
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- Prior art keywords
- base plate
- composite base
- disjunction
- brisement
- disrumpent feelings
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
Abstract
The present invention relates to a kind of disrumpent feelings device and method for dividing.Its problem is the functional area disjunction of composite base plate, the composite base plate be on the brittle substrate in a functional region of mask coating resin layer and formed.In disjunction composite base plate, line is formed on brittle substrate (11) with breaking function region, then only by brittle substrate (11) brisement.In following disrumpent feelings resin bed, composite base plate (10) using by brittle substrate brisement this simultaneously as upper surface and by resin bed (12) as being configured on flat elastic supporting plate (40) in a manner of lower surface.Then, brisement line is directed at by the way that lower surface to be formed as to the extension rod (32a) of arc-shaped to press down, make cracking progress and disjunction.So, can be with disjunction into multiple chips with functional area.
Description
Technical field
Formed the present invention relates to a kind of coating resin layer etc. on the brittle substrates such as semiconductor substrate, ceramic substrate
The disrumpent feelings device and method for dividing of composite base plate.
Background technology
Semiconductor chip is the boundary bit by will be formed in the element area on semiconductor wafer in the element area
Put disjunction and manufacture.In the past, by chip disjunction into chip in the case of, rotate cutting blade by cutter device, so as to
By cutting semiconductor wafer is cut off smaller.
However, in the case of using cutter device, it is necessary to have water to discharge because discharging chip caused by cutting, in order to not
Make the water or discharge performance generation harmful effect of the chip to semiconductor chip, it is necessary to have front and rear step with real to semiconductor chip
Protection is applied, and washes water or discharge chip.Therefore, there is step to become complicated, cost can not be cut down or shorten process time
Shortcoming.In addition, because being cut using cutting blade, so the problems such as film stripping or defect can be produced.In addition, with small
, can be because of the table of water in MEMS (Micro-Electro-Mechanical Systems, MEMS) substrate of mechanical realization
Face tension force causes structure destruction, so water can not be used, can not be by cutting the problem of carrying out disjunction so as to produce.
In addition, proposing a kind of disrumpent feelings device of substrate in patent document 1,2, pass through the semiconductor die to forming line
Piece, from the back side for forming one side of ruling, along line perpendicular to the face press and by its brisement.Below, show using such a
The summary of the brisement of disrumpent feelings device.Multiple functional areas are formed neatly arrangedly on the semiconductor wafer as brisement object
Domain.In the case where carrying out disjunction, first, on the semiconductor wafer, in being spaced apart at equal intervals along longitudinal direction and horizontal stroke for functional area
Rule to being formed.Then, disjunction is carried out using disrumpent feelings device along the line.Fig. 1 (a) is placed in disrumpent feelings device before representing disjunction
Semiconductor wafer sectional view.As shown in this figure, functional area 101a, 101b are formed on composite base plate 101, in function
Line S1, S2, S3 ... are formed between region 101a, 101b.In the case where carrying out disjunction, at the back side of composite base plate 101
Adhesive tape 102 is attached, diaphragm 103 is attached in its front.Then, in brisement, as shown in Fig. 1 (b), in supporting knife 105,106
Middle configuration answer the line of brisement, be line S2 in this case, making blade 104, alignment line in portion's declines from it, from
And press composite base plate 101.In this way, brisement is carried out using the three-point bending of a pair of supporting knives 105,106 and blade 104.
[background technology document]
[patent document]
[patent document 1] Japanese Patent Laid-Open 2004-39931 publications
[patent document 2] Japanese Patent Laid-Open 2010-149495 publications
The content of the invention
[problems to be solved by the invention]
In the disrumpent feelings device with such a composition, blade 104 is pressed down and pressed when in brisement situation
Under, the meeting of composite base plate 101 somewhat warpage, therefore, stress can concentrate on composite base plate 101 and the leading edge of supporting knife 105,106 connects
Tactile part.Therefore, if the part of the supporting knife 105,106 of disrumpent feelings device touches functional area as shown in Fig. 1 (a)
101a, 101b, then can be to functional area applying power in brisement.Accordingly, there exist the work(for being possible to damage on semiconductor wafer
The problem of energy region.
In addition, as the substrate for carrying out disjunction using disrumpent feelings device, there is what on ceramic substrate silicone-coating formed to answer
Close substrate.In such a composite base plate, after by ceramic substrate brisement, directly using brisement rod pressing resin bed, in this situation
Under, the problem of resin bed deformation being present and be susceptible to damage.In addition, if want to use laser to solve described problem
Carry out disjunction, then existing can sustain damage because of the heat affecting of laser, or after laser is irradiated, splash is attached to periphery
The problem of.
Completed currently invention addresses such a problem, its object is to can be by brittle substrate answering by brisement
It is disrumpent feelings with no damage to close substrate.
[technological means for solving problem]
In order to solve the problem, method for dividing of the invention is by the method for dividing of composite base plate disjunction, the composite base
Plate is the coating resin on the brittle substrate in a functional region of mask, and is formed in the brittle substrate
Brisement line is with functional area described in disjunction；On elastic supporting plate, match somebody with somebody in a manner of the face of brittle substrate turns into upper surface
The composite base plate is put, pressing down extension rod (Expand Bar) by the brisement line along the brittle substrate will set
Lipid layer is disrumpent feelings.
In order to solve the problem, method for dividing of the invention is by the method for dividing of composite base plate disjunction, the composite base
Plate be on the brittle substrate in a functional region of mask coating resin and formed；And to the brittle substrate
Uncoated resin one side delineated and form line, with the functional area of composite base plate described in disjunction, along the line
By the brittle substrate brisement of the composite base plate, on elastic supporting plate, upper surface is turned into the face of brittle substrate
Mode configure the composite base plate, extension rod is pressed down by resin bed by the brisement line along the brittle substrate
It is disrumpent feelings.
In order to solve the problem, disrumpent feelings device of the invention is by the disrumpent feelings disrumpent feelings device of the resin bed of composite base plate, institute
It is the coating resin on the brittle substrate in a functional region of mask to state composite base plate, and in the fragile material base
Plate shape is into brisement line with functional area described in disjunction；The disrumpent feelings device includes：Workbench；Elastic supporting plate, it is at least
The flat board of elastic component comprising the width with the in-plane equal with the composite base plate, it is configured at the workbench
On, the face for forming brisement line is kept into the composite base plate as upper surface；Expander, include extension rod；Travel mechanism,
The workbench is set to be moved along its face；And elevating mechanism, the composite base plate and extension rod are abreast kept on one side, on one side
The expander is set to be lifted towards the face of the composite base plate on the elastic supporting plate.
Herein, the lower end section of the extension rod of the expander can be formed as arc-shaped.
[The effect of invention]
According to the present invention with such a feature, composite base plate is configured on elastic supporting plate, with banded extension
The mode that the bottom line of rod corresponds to brisement line carries out position alignment, disrumpent feelings so as to carry out.Accordingly, it is capable to work(can not be damaged by obtaining
Can region and along brisement line by the disrumpent feelings effect of resin bed.
Brief description of the drawings
Fig. 1 (a), Fig. 1 (b) are the sectional views of state when representing conventional semiconductor wafer brisement.
Fig. 2 (a), Fig. 2 (b) are the front view and side view of the substrate as disjunction object of embodiments of the present invention.
Fig. 3 is the stereogram of one of the disrumpent feelings device for the resin bed used when disrumpent feelings for representing present embodiment.
Fig. 4 is the stereogram of one of the expander for representing present embodiment.
Fig. 5 is the stereogram for the elastic supporting plate used when disrumpent feelings for representing embodiments of the present invention.
Fig. 6 (a)~Fig. 6 (d) is the skeleton diagram of the breaking course for the composite base plate for representing the embodiment.
Fig. 7 (a)~Fig. 7 (d) is the skeleton diagram of the breaking course for the resin bed for representing the embodiment.
Embodiment
Next, embodiments of the present invention are illustrated.Fig. 2 (a), Fig. 2 (b) show one as such a substrate
The front view and side view of the composite base plate 10 of the semiconductor element of the installation oblong-shaped of example.In this embodiment, will be
The composite base plate 10 that coating resin layer, such as silicones 12 form on ceramic substrate 11 is used as disjunction object.Herein, composite base plate
The disjunction of 10 only ceramic substrate 11 is delineation is vertically penetrated into substrate and disposable disjunction, therefore this disjunction is stated
For " brisement ", and the disjunction of silicone layer 12 is to make the cracking of resin bed by applying power gradually expansion is split, thus by this
Kind disjunction is expressed as " disrumpent feelings ".In addition, the overall disjunction of composite base plate 10 is expressed as " disjunction ".In the manufacture of composite base plate 10
In step, multiple functional areas 13 are formed in lattice shape neatly arrangedly in length and breadth along the line parallel to x-axis, y-axis.The work(
Energy region 13 is for example set to group and has entered LED (Light-Emitting Diode, light emitting diode) or mechanical constituent part, sensing
The MEMS functional areas of device, actuator etc..Moreover, semiconductor chip is made in order to carry out disjunction by each functional area, such as one
Shown in point chain line, the upper equally spaced line in longitudinal direction is set to delineate preset lines Sy1~Syn, laterally upper equally spaced line is set to delineate
Preset lines Sx1~Sxm, the part of functional area is positioned at the square center surrounded by these delineation preset lines.
Next, the disrumpent feelings device 20 for disrumpent feelings resin bed of the embodiment is illustrated.It is as shown in figure 3, broken
Disconnected device 20 includes being capable of and the workbench 21 of rotation mobile towards y directions.In disrumpent feelings device 20, set in the lower section of workbench 21
Zhi Zhe travel mechanisms, the travel mechanism make workbench 21 be moved in the y-axis direction along its face, and make workbench 21 along
Its face rotates.Moreover, the composite base plate 10 on workbench 21 across following elastic supporting plates 40 mounting as disjunction object.
The top of workbench 21, sets the horizontal affixation member 22 of U-shaped, and servo is remain on the top of horizontal affixation member 22
Motor 23.Ball screw 24 is directly connected in the rotary shaft of servomotor 23, the lower end of ball screw 24 is by another water
Flat fixing component 25 supports, and makes ball screw 24 rotatable.Upper mobile member 26 possesses and the spiral shell of ball screw 24 in central portion
The box thread 27 of conjunction, possesses support shaft 28a, 28b downward from the both ends of the upper mobile member 26.Support shaft 28a, 28b
Penetrate a pair of through holes of horizontal affixation member 25 and be linked to lower mobile member 29.In the lower surface of lower mobile member 29, with
The face of workbench 21 is abreast installed with following expanders 30.Thus, rotate ball screw 24 by servomotor 23
In the case of, upper mobile member 26 is integrally formed and moved up and down with lower mobile member 29, and expander 30 also moves up and down simultaneously.
Herein, servomotor 23 is formed with horizontal affixation member 22,25 and upper and lower mobile member 26,29 lifts expander 30
Elevating mechanism.
Next, the expander 30 used in disrumpent feelings silicone layer is illustrated.Such as shown in Fig. 4 stereogram,
Expander 30 forms multiple parallel banded extension rod 32a~32n side by side in plane substrate 31.Each extension rod
All crestal lines form a plane.As long as in addition, the interval of extension rod for it is fixed and be the interval for delineating preset lines 2 with
On integral multiple, be set to 2 times in the present embodiment.Moreover, respectively as long as the section of extension rod is with can be along splitting
The shape of the protuberance of broken string pressing, then be not particularly limited, but it is preferred that the arc-shaped bent as being set to as described below.This
Outside, in Fig. 4, in order to explicitly indicate that extension rod 32a~32n, extension rod 32a~32n is made to turn into upper surface and represent, but make
Used time is to be installed on lower mobile member 29 in a manner of extending rod 32a~32n as lower section.
In the present embodiment, elastic supporting plate 40 is used in the resin bed of disrumpent feelings composite base plate 10.Such as Fig. 5 solid
Shown in figure, elastic supporting plate 40 is the rubber system accessory of rectangular flat board, and its size is identical with composite base plate 10, such as thickness
It is set to several millimeters.
Next, the method for disjunction composite base plate 10 is illustrated.Fig. 6 (a)~Fig. 6 (d) represents breaking course
Figure, Fig. 6 (a) represent a part for composite base plate 10.First, as shown in Fig. 6 (b), using the face of ceramic substrate 11 as upper surface,
Stitch marker 50 is moved by chalker (not shown), is delineated along delineation preset lines.So as to which such as Fig. 2 (a) is shown, shape
Into the line S in x directionsx1~Sxm, y directions line Sy1~Syn。
Next, in brisement step, as shown in Fig. 6 (c), first overturn composite base plate 10.Then, use is not shown
Brisement device, brisement rod 51 is located at the surface of line formed, by the way that brisement rod 51 is pressed down only to make pottery
The brisement of porcelain substrate 11.
Thus, turn into only ceramic substrate 11 along line Sx1~Sxm、Sy1~SynThe state of brisement.Fig. 6 (d) is represented along x
A part for composite base plate 10 after each line brisement in direction and y directions.In addition, line Sx1~Sxm、Sy1~SynSplit
It is disconnected, therefore hereinafter referred to as brisement line Bx1~Bxm、By1~Byn。
Next, as shown in Fig. 7 (a)~Fig. 7 (d), to making the brisement line for being formed at ceramic substrate 11 also extend into silicon tree
Lipid layer and the method that terminates the disjunction of composite base plate 10 illustrate.Fig. 7 (a)~Fig. 7 (d) is the fracture for representing resin bed
Figure, Fig. 7 (a) represent composite base plate a part.First, resilient support is configured on the workbench 21 of the disrumpent feelings device 20
Plate 40, and then configure composite base plate 10 in the upper surface of elastic supporting plate 40.Now, as shown in Fig. 7 (a), to be connected to elasticity
The mode of supporting plate 40 configures silicone layer 12, and the face for making ceramic substrate 11 is upper surface.Then, with any of the expander 30
The crestal line alignment brisement line such as B of individual extension rod such as 32a footx1Mode positioned.So, other extend
Rod is also every a surface for turning into brisement line.
Next, driving servomotor 23, makes mobile member 26 and lower mobile member 29 while decline, and make extension
The extension rod of device 30 is while relative to the keeping parallelism of workbench 21 while being gradually reduced.Then, as shown in Fig. 7 (b), rod will be extended
32a is from brisement line Bx1Surface pressing ceramic substrate 11.So, as shown in Fig. 7 (c), ceramic substrate 11 is expanded rod
32a is pressed and deformed, and is sunk and elastic supporting plate 40 is similarly deformed into V shape.Now, the left and right of ceramic substrate with
Extension rod 32a press-in and equably deform, therefore cracking can be made to extend to lower section along brisement line.Herein, rod is extended
The cross sectional shape of lower section be not particularly limited, but in the case of such as triangle, accurately enter to exercise summit alignment
The necessity of the positioning of brisement line is relative to be uprised.Therefore, in order that ceramic substrate 11, silicones 12 evenly become in this way
Shape, and the section of the lower section of each extension rod is set to arc-shaped.Thus, the essence of the positioning of the crestal line alignment brisement line of extension rod is made
The permissible range of degree is relative to broaden.Moreover, by making extension rod fully decline, the cracking in resin is in progress and left and right is applied and pushed away
The power opened, it is disrumpent feelings so as to terminate.If disrumpent feelings end, then make servomotor 23 invert and make expander 30 increase.
Now, multiple extension rods are formed side by side in expander 30, and it is at intervals of twice of line, therefore extension can be made
Rod every one along multiple brisement lines simultaneously disrumpent feelings silicones 12.
Then, workbench 21 is moved the amount of the spacing equivalent to brisement line in the y-axis direction, similarly make expander 30
Decline, thus can also be directed to the disrumpent feelings of other brisement knot beam resin beds abutted.Herein, because extension rod is at intervals of line
Twice of spacing, therefore by making workbench 21 offset once to carry out the disrumpent feelings all x-axis that can terminate composite base plate 10
Direction it is disrumpent feelings.In addition, in the case of the three times at intervals of the spacing of line of extension rod, by making workbench 21 move two
It is secondary and carry out disrumpent feelings to terminate the disrumpent feelings of all x-axis directions.
Then, it is rotated by 90 ° workbench 21, similarly declines expander 30 for the brisement line of y-axis, so as to will set
Lipid layer is disrumpent feelings.Then, workbench 21 is moved the amount of the spacing equivalent to brisement line in the y-axis direction, similarly make expander
30 decline.So, terminate the disrumpent feelings of entire surface, the functional areas of resin and disjunction square shape are torn along each brisement line
Domain, so as to form multiple MEMS chips.
In addition, in this embodiment, as the substrate as substrate, ceramic substrate is illustrated, but the present invention
It is readily applicable to the various brittle substrates such as semiconductor substrate or glass substrate.
In addition, in this embodiment, as the resin for being coated on ceramic substrate, silicones is illustrated, but
Can be layer, the layer such as to the Polarizer of glass substrate lamination of other various materials.
In addition, in this embodiment, expander is set to the plate-like members in lower surface with multiple extension rods, but
Can also be merely with an extension rod into expander, and the expander is compressed to composite base plate and carried out disrumpent feelings.
[industrial utilizability]
The present invention is being delineated to the brittle substrate with the region that should be protected during disjunction, and can not damage to protect
The region of shield and carry out disrumpent feelings, therefore, can be effectively adapted to be formed the disrumpent feelings device of the substrate of functional area.
[explanation of symbol]
10 composite base plates
11 ceramic substrates
12 silicones
13 functional areas
20 disrumpent feelings devices
21 workbench
22nd, 25 horizontal affixation member
23 servomotors
24 ball screws
26th, 29 mobile member
30 expanders
31 substrates
32a~32n extends rod
40 elastic supporting plates
Claims (6)
1. a kind of method for dividing, its disjunction composite base plate, the composite base plate are the fragility materials in a functional region of mask
Expect coating resin on substrate, and brisement line is formed with functional area described in disjunction in the brittle substrate；And
On elastic supporting plate, the composite base plate is configured in a manner of the face of brittle substrate turns into upper surface,
Extension rod is pressed down by the brisement line along the brittle substrate resin bed is disrumpent feelings.
2. method for dividing according to claim 1, wherein the lower end section of the extension rod is formed as arc-shaped.
3. a kind of method for dividing, its disjunction composite base plate, the composite base plate are the fragility materials in a functional region of mask
Expect coating resin on substrate and formed；And
The face of the uncoated resin of the brittle substrate is delineated and forms line, with composite base plate described in disjunction
Functional area,
Rule along described by the brittle substrate brisement of the composite base plate,
On elastic supporting plate, the composite base plate is configured in a manner of the face of brittle substrate turns into upper surface,
Extension rod is pressed down by the brisement line along the brittle substrate resin bed is disrumpent feelings.
4. method for dividing according to claim 3, wherein the lower end section of the extension rod is formed as arc-shaped.
5. a kind of disrumpent feelings device, the resin bed of its is disrumpent feelings composite base plate, the composite base plate is in a functional region of mask
Brittle substrate on coating resin, and on the brittle substrate formed brisement line with functional areas described in disjunction
Domain；The disrumpent feelings device includes：
Workbench；
Elastic supporting plate, it is the elastic component including at least the area with the in-plane equal with the composite base plate
Flat board, it is configured on the workbench, the face for forming brisement line is kept into the composite base plate as upper surface；
Expander, include extension rod；
Travel mechanism, the workbench is set to be moved along its face；And
Elevating mechanism, the composite base plate and extension rod are abreast kept on one side, while making the expander towards the elasticity branch
The face lifting of composite base plate on fagging.
6. disrumpent feelings device according to claim 5, wherein the lower end section of the extension rod of the expander is formed as circular arc
Shape.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-215394 | 2013-10-16 | ||
| JP2013215394A JP6115438B2 (en) | 2013-10-16 | 2013-10-16 | Breaking device and cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104552629A CN104552629A (en) | 2015-04-29 |
| CN104552629B true CN104552629B (en) | 2017-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410309300.8A Expired - Fee Related CN104552629B (en) | 2013-10-16 | 2014-07-01 | Disrumpent feelings device and method for dividing |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6115438B2 (en) |
| KR (1) | KR102259441B1 (en) |
| CN (1) | CN104552629B (en) |
| TW (1) | TWI620636B (en) |
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|---|---|---|---|---|
| JP6243699B2 (en) * | 2013-10-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | Fragment material substrate cutting device |
| JP6407056B2 (en) * | 2015-02-20 | 2018-10-17 | 株式会社ディスコ | Dividing device and dividing method |
| JP6561565B2 (en) * | 2015-04-30 | 2019-08-21 | 三星ダイヤモンド工業株式会社 | Method and apparatus for dividing bonded substrate |
| JP2017001180A (en) * | 2016-09-29 | 2017-01-05 | 三星ダイヤモンド工業株式会社 | Surface layer fracturing apparatus of brittle material substrate |
| EP3410473B1 (en) * | 2017-05-30 | 2021-02-24 | Infineon Technologies AG | Apparatus and method for dividing substrates |
| TW202041343A (en) * | 2018-12-18 | 2020-11-16 | 日商三星鑽石工業股份有限公司 | Method for fabricating ceramic chip and chip of prior to plastic working for ceramic chip fabricating |
| KR20220032522A (en) * | 2019-07-16 | 2022-03-15 | 닛토덴코 가부시키가이샤 | How to divide composites |
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| JP5170195B2 (en) | 2010-09-24 | 2013-03-27 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle material substrate with resin |
| JP2013089622A (en) * | 2011-10-13 | 2013-05-13 | Mitsuboshi Diamond Industrial Co Ltd | Breaking method of semiconductor substrate |
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2013
- 2013-10-16 JP JP2013215394A patent/JP6115438B2/en active Active
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2014
- 2014-06-17 KR KR1020140073640A patent/KR102259441B1/en active IP Right Grant
- 2014-06-23 TW TW103121614A patent/TWI620636B/en not_active IP Right Cessation
- 2014-07-01 CN CN201410309300.8A patent/CN104552629B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002151443A (en) * | 2000-11-08 | 2002-05-24 | Victor Co Of Japan Ltd | Device for cleaving semiconductor element |
| JP4210981B2 (en) * | 2002-09-27 | 2009-01-21 | 住友電気工業株式会社 | Cleaving device and cleavage method |
| JP5421699B2 (en) * | 2009-09-07 | 2014-02-19 | 三菱電機株式会社 | Semiconductor element separation method and semiconductor element separation apparatus |
| CN103203806A (en) * | 2012-01-16 | 2013-07-17 | 三星钻石工业股份有限公司 | Method for breaking brittle material substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102259441B1 (en) | 2021-06-01 |
| TW201515802A (en) | 2015-05-01 |
| JP6115438B2 (en) | 2017-04-19 |
| CN104552629A (en) | 2015-04-29 |
| KR20150044367A (en) | 2015-04-24 |
| JP2015079824A (en) | 2015-04-23 |
| TWI620636B (en) | 2018-04-11 |
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