CN104552629A - Breaking apparatus and dividing method - Google Patents

Breaking apparatus and dividing method Download PDF

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Publication number
CN104552629A
CN104552629A CN201410309300.8A CN201410309300A CN104552629A CN 104552629 A CN104552629 A CN 104552629A CN 201410309300 A CN201410309300 A CN 201410309300A CN 104552629 A CN104552629 A CN 104552629A
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CN
China
Prior art keywords
base plate
composite base
line
brisement
brittle substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410309300.8A
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Chinese (zh)
Other versions
CN104552629B (en
Inventor
富本博之
黑田直洋
岩坪佑磨
中谷郁祥
武田真和
村上健二
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication date
Priority to JP2013215394A priority Critical patent/JP6115438B2/en
Priority to JP2013-215394 priority
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN104552629A publication Critical patent/CN104552629A/en
Application granted granted Critical
Publication of CN104552629B publication Critical patent/CN104552629B/en
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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components

Abstract

The invention provides a breaking apparatus and a dividing method. According to the object, function areas of a composite substrate are divided. A substrate made of brittle materials whose one surface is provided with the function areas coated by a resin layer so that a composite substrate is formed. When the composite substrate is divided, scribing lines are formed on the substrate (11) made of brittle materials so that the function areas are divided, and then the substrate (11) made of brittle materials is broken. When the resin layer is broken, the composite substrate (10) regards the broken surface of the substrate made of brittle materials as the upper surface and the resin layer (12) as the lower surface and is configured on a flat-plate-shaped elastic supporting plate (40). Then the lower surface forms an arc-shaped expanding rod (32a) pressing down and aligned with a breaking line, and a crack develops and the division is realized. In this way, a plurality of chips with the function areas can be divided.

Description

Disrumpent feelings device and method for dividing
Technical field
The present invention relates to a kind of disrumpent feelings device and method for dividing of composite base plate of coating resin layer etc. on the brittle substrate such as semiconductor substrate, ceramic substrate.
Background technology
Semiconductor chip is by manufacturing forming element area on the semiconductor wafer in the boundary position disjunction of described element area.In the past, when wafer is divided be broken into chip, by cutter sweep, cutting blade is rotated, thus by cut semiconductor wafer is cut off less.
But; when using cutter sweep, water must being had to discharge because cutting the discharge chip produced, in order to not make this water or discharge chip, harmful effect being produced to the performance of semiconductor chip; front and back step must be had to implement protection to semiconductor chip, and wash water or discharge chip.Therefore, become complicated in steps, shortcoming cost cannot cut down or shorten process time.In addition, because using cutting blade to cut, so the problems such as film stripping or defect can be produced.In addition, in MEMS (Micro-Electro-Mechanical Systems, the MEMS) substrate with milli machine structure, structure destruction can be caused because of the surface tension of water, so water can not be used, thus produce the problem cannot being carried out disjunction by cutting.
In addition, in patent document 1,2, propose the disrumpent feelings device of a kind of substrate, by the semiconductor wafer forming line, from the back side forming line one side, along ruling its brisement perpendicular to the pressing of this face.Below, the summary of the brisement utilizing this kind of disrumpent feelings device is shown.The semiconductor wafer becoming brisement object is formed multiple functional area neatly arrangedly.When carrying out disjunction, first, on the semiconductor wafer, longitudinally and laterally line is formed at equal intervals the spaced apart of functional area.Then, disrumpent feelings device is utilized to carry out disjunction along this line.Fig. 1 (a) is placed in the sectional view of the semiconductor wafer of disrumpent feelings device before representing disjunction.As shown in this figure, composite base plate 101 forms functional area 101a, 101b, between functional area 101a, 101b, form line S1, S2, S3 ...When carrying out disjunction, attaching adhesive tape 102 at the back side of composite base plate 101, attaching diaphragm 103 in its front.Then, when brisement, as shown in Fig. 1 (b), configuring the line of answering brisement in the middle of supporting cutter 105,106, is line S2 in this case, makes blade 104 aim at line decline in portion from it, thus pressing composite base plate 101.In this way, the three-point bending of a pair supporting cutter 105,106 and blade 104 is utilized to carry out brisement.
[background technology document]
[patent document]
[patent document 1] Japanese Patent Laid-Open 2004-39931 publication
[patent document 2] Japanese Patent Laid-Open 2010-149495 publication
Summary of the invention
[inventing the problem that will solve]
In the disrumpent feelings device with this kind of formation, when being pressed toward pressing down by blade 104 when in brisement, composite base plate 101 meeting warpage a little, therefore, stress can concentrate on the part of the edge contact of composite base plate 101 and supporting cutter 105,106.Therefore, if the part of the supporting cutter of disrumpent feelings device 105,106 touches functional area 101a, 101b as shown in Fig. 1 (a), so power can be applied to functional area when brisement.Therefore, the problem of the functional area that may damage on semiconductor wafer is had.
In addition, as the substrate using disrumpent feelings device to carry out disjunction, the composite base plate of silicone-coating on ceramic substrate is had.In this kind of composite base plate, after by ceramic substrate brisement, directly utilize brisement rod pressing resin bed, in the case, there is resin bed distortion and be easy to the problem that sustains damage.In addition, if want to use laser to carry out disjunction to solve described problem, so existence can sustain damage because of the heat affecting of laser, or after irradiation laser, splash is attached to the problem of periphery.
The present invention is conceived to this kind of problem and completes, and its object is to can be disrumpent feelings with no damage by the composite base plate of brisement by brittle substrate.
[technological means of dealing with problems]
In order to solve this problem, method for dividing of the present invention is by the method for dividing of composite base plate disjunction, described composite base plate is coating resin on the brittle substrate that a mask has functional area, and forms brisement line with functional area described in disjunction at described brittle substrate; On elastic supporting plate, the mode becoming upper surface with the face of brittle substrate configures described composite base plate, by down companding exhibition rod (Expand Bar) and resin bed is disrumpent feelings of the brisement line along described brittle substrate.
In order to solve this problem, method for dividing of the present invention is by the method for dividing of composite base plate disjunction, and described composite base plate has coating resin on the brittle substrate of functional area at a mask and formed; And the uncoated resin one side of described brittle substrate is delineated and forms line, with the functional area of composite base plate described in disjunction, along the brittle substrate brisement of described line by described composite base plate, on elastic supporting plate, the mode becoming upper surface with the face of brittle substrate configures described composite base plate, by down depress along the brisement line of described brittle substrate end section be formed as arc-shaped expansion rod and resin bed is disrumpent feelings.
In order to solve this problem, disrumpent feelings device of the present invention is by disrumpent feelings device disrumpent feelings for the resin bed of composite base plate, described composite base plate is coating resin on the brittle substrate that a mask has functional area, and forms brisement line with functional area described in disjunction at described brittle substrate; Described disrumpent feelings device comprises: workbench; Elastic supporting plate, it is at least comprising the flat board of the elastic component of the width with the in-plane equal with described composite base plate, and comprise the protective hole of each center being arranged at the region surrounded by described cancellate brisement line, be configured on described workbench, the face forming brisement line is kept described composite base plate as upper surface; Expander, comprises expansion rod; Travel mechanism, makes described workbench move along its face; And elevating mechanism, keep described composite base plate and expansion rod abreast, while make described expander be elevated towards the face of the composite base plate on described elastic supporting plate.
Herein, the lower end section of the expansion rod of described expander can be formed as arc-shaped.
[effect of invention]
According to the present invention with this kind of feature, be configured at by composite base plate on elastic supporting plate, the mode corresponding to brisement line with the line bottom of banded expansion rod carries out position alignment, thus carries out disrumpent feelings.Therefore, can obtain and can not damage functional area and along brisement line by effect disrumpent feelings for resin bed.
Accompanying drawing explanation
The sectional view of state when Fig. 1 (a), Fig. 1 (b) are the semiconductor wafer brisements represented in the past.
Fig. 2 (a), Fig. 2 (b) are the front view becoming the substrate of disjunction object and the side view of embodiments of the present invention.
Fig. 3 is the stereogram of an example of the disrumpent feelings device of the resin bed used when disrumpent feelings representing present embodiment.
Fig. 4 is the stereogram of an example of the expander representing present embodiment.
Fig. 5 is the stereogram of the elastic supporting plate used when disrumpent feelings representing embodiments of the present invention.
Fig. 6 (a) ~ Fig. 6 (d) is the skeleton diagram of the breaking course of the composite base plate representing this embodiment.
Fig. 7 (a) ~ Fig. 7 (d) is the skeleton diagram of the breaking course of the resin bed representing this embodiment.
Detailed description of the invention
Next, embodiments of the present invention are described.Fig. 2 (a), Fig. 2 (b) show front view and the side view of the composite base plate 10 of the OBL semiconductor element of installation of the example as this kind of substrate.In this embodiment, using the composite base plate 10 of coating resin layer on ceramic substrate 11, such as silicones 12 as disjunction object.Herein, the disjunction of the only ceramic substrate 11 of composite base plate 10 makes delineation vertically penetrate into substrate and disposable disjunction, therefore this disjunction is expressed as " brisement ", and the disjunction of silicone layer 12 makes the be full of cracks of resin bed expand gradually by applying power and splits, therefore this disjunction is expressed as " disrumpent feelings ".In addition, the disjunction of composite base plate 10 entirety is expressed as " disjunction ".In the manufacturing step of composite base plate 10, along being parallel to x-axis, the line of y-axis forms multiple functional area 13 in length and breadth neatly arrangedly in lattice shape.This functional area 13 is such as set to the MEMS functional area that group has entered LED (Light-Emitting Diode, light emitting diode) or mechanical constituent part, sensor, actuator etc.And, making semiconductor chip to carry out disjunction by each functional area, as shown in some chain lines, longitudinal equally spaced line being set to delineation preset lines S y1~ S yn, transversely equally spaced line is set to delineation preset lines S x1~ S xm, the part of functional area is positioned at the foursquare central authorities surrounded by these delineation preset lines.
Next, the disrumpent feelings device 20 for disrumpent feelings resin bed of this embodiment is described.As shown in Figure 3, disrumpent feelings device 20 comprises the workbench 21 that can move towards y direction and rotate.In disrumpent feelings device 20, arrange travel mechanism in the below of workbench 21, described travel mechanism makes workbench 21 move in the y-axis direction along its face, and workbench 21 is rotated along its face.And, workbench 21 becomes across following elastic supporting plate 40 mounting the composite base plate 10 of disjunction object.On the top of workbench 21, the horizontal affixation member 22 of U-shaped is set, remains servomotor 23 on the top of horizontal affixation member 22.Directly be connected to ball screw 24 at the rotating shaft of servomotor 23, the lower end of ball screw 24 is supported by another horizontal affixation member 25, and makes ball screw 24 rotatable.Upper mobile member 26 possesses the box thread 27 screwed togather with ball screw 24 at central portion, possess back shaft 28a, 28b downward from the both ends of described upper mobile member 26.A pair through hole of the through horizontal affixation member 25 of back shaft 28a, 28b and be linked to lower mobile member 29.At the lower surface of lower mobile member 29, with the face of workbench 21, following expander 30 is installed abreast.Thus, when making ball screw 24 rotate by servomotor 23, upper mobile member 26 is integrated with lower mobile member 29 one-tenth and moves up and down, and expander 30 also moves up and down simultaneously.Herein, servomotor 23 forms with horizontal affixation member 22,25 and upper and lower mobile member 26,29 elevating mechanism that expander 30 is elevated.
Next, the expander 30 used when disrumpent feelings silicone layer is described.Such as, shown in the stereogram of Fig. 4, expander 30 forms multiple parallel excellent 32a ~ 32n of banded expansion side by side in plane substrate 31.These all crestal lines that respectively expansion is excellent form a plane.In addition, if the interval of expansion rod be fixing and for the interval of delineating preset lines more than 2 integral multiple, be set to 2 times in the present embodiment.And, as long as the cross section of each expansion rod along the shape of the protuberance of brisement line pressing, then can be not particularly limited for having, but be preferably set to as described below as bending arc-shaped.In addition, in the diagram, in order to clearly represent expansion excellent 32a ~ 32n, make expansion rod 32a ~ 32n become upper surface and represent, but be in use expand excellent 32a ~ 32n become below mode be installed on lower mobile member 29.
In the present embodiment, elastic supporting plate 40 is used when the resin bed of disrumpent feelings composite base plate 10.As shown in the perspective view of fig. 5, elastic supporting plate 40 is rubber accessories of rectangular flat board, and its size is identical with composite base plate 10, and such as thickness is set to a few millimeter.
Next, the method for disjunction composite base plate 10 is described.Fig. 6 (a) ~ Fig. 6 (d) is the part that the figure representing breaking course, Fig. 6 (a) represent composite base plate 10.First, as shown in Fig. 6 (b), using the face of ceramic substrate 11 as upper surface, by not shown chalker, stitch marker 50 is moved, delineate along delineation preset lines.Thus as shown in Fig. 2 (a), form the line S in x direction x1~ S xm, y direction line S y1~ S yn.
Next, in brisement step, as shown in Fig. 6 (c), first make composite base plate 10 overturn.Then, not shown brisement device is used, directly over the line making brisement rod 51 be positioned to have been formed, by brisement rod 51 is only made ceramic substrate 11 brisement toward pressing down.
Thus, become only ceramic substrate 11 along line S x1~ S xm, S y1~ S ynthe state of brisement.Fig. 6 (d) represents the part along the composite base plate 10 after each line brisement in x direction and y direction.In addition, rule S x1~ S xm, S y1~ S ynall by brisement, therefore hereinafter referred to brisement line B x1~ B xm, B y1~ B yn.
Next, as shown in Fig. 7 (a) ~ Fig. 7 (d), the method terminating the disjunction of composite base plate 10 to making the brisement line being formed at ceramic substrate 11 also extend to silicone layer is described.Fig. 7 (a) ~ Fig. 7 (d) is the part that the figure of the fracture representing resin bed, Fig. 7 (a) represent composite base plate.First, the workbench 21 of described disrumpent feelings device 20 configures elastic supporting plate 40, and then configure composite base plate 10 at the upper surface of elastic supporting plate 40.Now, as shown in Fig. 7 (a), configure silicone layer 12 in the mode being connected to elastic supporting plate 40, make the face of ceramic substrate 11 be upper surface.Then, brisement line such as B is aimed at the crestal line of the foot of any one expansion rod such as 32a of this expander 30 x1mode position.So, other expansion rods also become directly over brisement line every one.
Next, drive servomotor 23, mobile member 26 and lower mobile member 29 are declined simultaneously, and the expansion of expander 30 rod is declined on one side gradually relative to workbench 21 keeping parallelism.Then, as shown in Fig. 7 (b), excellent 32a will be expanded from brisement line B x1directly over press ceramic substrate 11.So, as shown in Fig. 7 (c), ceramic substrate 11 is expanded excellent 32a and presses and be out of shape, and sinks and make elastic supporting plate 40 similarly be deformed into V shape.Now, the left and right of ceramic substrate is out of shape, therefore, it is possible to make be full of cracks extend to below along brisement line equably along with the press-in of the excellent 32a of expansion.Herein, the cross sectional shape of the below of expansion rod is not particularly limited, but when such as triangle, carries out accurately the necessity of the location of summit alignment brisement line is uprised relatively.Therefore, in order to make ceramic substrate 11, silicones 12 is out of shape in this way evenly, and the cross section of the below of each expansion rod is set to arc-shaped.Thus, the permissible range of the precision of the location of the crestal line of expansion rod alignment brisement line is made relatively to broaden.And, by making expansion rod sufficient decent, the be full of cracks progress in resin and left and right is applied to the power pushed open, thus terminate disrumpent feelings.If disrumpent feelings end, servomotor 23 is so made to reverse and make expander 30 increase.
Now, form multiple expansion rod side by side at expander 30, and it is spaced apart the twice of line, therefore can makes expansion rod every one along multiple brisement line disrumpent feelings silicones 12 simultaneously.
Then, make workbench 21 in the y-axis direction movement be equivalent to the amount of the spacing of brisement line, similarly make expander 30 decline, thus also can disrumpent feelings for other adjacent brisement toe-in bundle resin beds.Herein, owing to expanding the twice being spaced apart the spacing of line of rod, therefore undertaken by making workbench 21 offset once disrumpent feelingsly just can terminating the disrumpent feelings of all x-axis directions of composite base plate 10.In addition, when expand rod be spaced apart three times of the spacing of line, undertaken by making workbench 21 move twice disrumpent feelingsly just can terminating the disrumpent feelings of all x-axis directions.
Then, make workbench 21 half-twist, the brisement line for y-axis makes expander 30 decline similarly, thus resin bed is disrumpent feelings.Then, make workbench 21 in the y-axis direction movement be equivalent to the amount of the spacing of brisement line, similarly make expander 30 decline.So, terminate whole disrumpent feelings, tear the functional area of resin and disjunction square shape along each brisement line, thus multiple MEMS chip can be formed.
In addition, in this embodiment, as the substrate becoming substrate, ceramic substrate is illustrated, but the present invention also goes for the various brittle substrate such as semiconductor substrate or glass substrate.
In addition, in this embodiment, as the resin coating ceramic substrate, silicones is illustrated, but also can be other various materials layer, such as to layers such as the Polarizers of glass substrate lamination.
In addition, in this embodiment, expander is set to the plate-like members at lower surface with multiple expansion rod, but also can only utilizes an expansion clavate to become expander, and this expander is compressed to composite base plate and carries out disrumpent feelings.
[industrial utilizability]
The present invention delineating the brittle substrate with the region that should protect during disjunction, can not damage the region that should protect and carrying out disrumpent feelings, therefore, effectively can be applicable to the disrumpent feelings device of the substrate forming functional area.
[explanation of symbol]
10 composite base plates
11 ceramic substrates
12 silicones
13 functional areas
20 disrumpent feelings devices
21 workbench
22,25 horizontal affixation member
23 servomotors
24 ball screws
26,29 mobile members
30 expanders
31 substrates
32a ~ 32n expands rod
40 elastic supporting plates

Claims (6)

1. a method for dividing, its disjunction composite base plate, described composite base plate is coating resin on the brittle substrate that a mask has functional area, and forms brisement line with functional area described in disjunction at described brittle substrate; And
On elastic supporting plate, the mode becoming upper surface with the face of brittle substrate configures described composite base plate,
By the brisement line along described brittle substrate down companding exhibition rod and resin bed is disrumpent feelings.
2. method for dividing according to claim 1, the lower end section of wherein said expansion rod is formed as arc-shaped.
3. a method for dividing, its disjunction composite base plate, described composite base plate has coating resin on the brittle substrate of functional area at a mask and formed; And
The face of the uncoated resin of described brittle substrate is delineated and forms line, with the functional area of composite base plate described in disjunction,
Along the brittle substrate brisement of described line by described composite base plate,
On elastic supporting plate, the mode becoming upper surface with the face of brittle substrate configures described composite base plate,
By down depress along the brisement line of described brittle substrate end section be formed as arc-shaped expansion rod and resin bed is disrumpent feelings.
4. method for dividing according to claim 3, the lower end section of the expansion rod of wherein said expander is formed as arc-shaped.
5. a disrumpent feelings device, the resin bed of it is disrumpent feelings composite base plate, described composite base plate is coating resin on the brittle substrate that a mask has functional area, and on described brittle substrate, forms brisement line with functional area described in disjunction; Described disrumpent feelings device comprises:
Workbench;
Elastic supporting plate, it is at least comprising the flat board of the elastic component of the area with the in-plane equal with described composite base plate, comprise the protective hole of each center being arranged at the region surrounded by described cancellate brisement line, be configured on described workbench, the face forming brisement line is kept described composite base plate as upper surface;
Expander, comprises expansion rod;
Travel mechanism, makes described workbench move along its face; And
Elevating mechanism, keeps described composite base plate and expansion rod, abreast while make described expander be elevated towards the face of the composite base plate on described elastic supporting plate.
6. disrumpent feelings device according to claim 5, the lower end section of the expansion rod of wherein said expander is formed as arc-shaped.
CN201410309300.8A 2013-10-16 2014-07-01 Disrumpent feelings device and method for dividing Active CN104552629B (en)

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JP2013215394A JP6115438B2 (en) 2013-10-16 2013-10-16 Breaking device and cutting method
JP2013-215394 2013-10-16

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CN104552629B CN104552629B (en) 2017-11-10

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104552614A (en) * 2013-10-25 2015-04-29 三星钻石工业股份有限公司 Cutting method and device of substrate made of fragile material
CN106079115A (en) * 2015-04-30 2016-11-09 三星钻石工业股份有限公司 The dividing method of adhesive substrates and segmenting device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017001180A (en) * 2016-09-29 2017-01-05 三星ダイヤモンド工業株式会社 Surface layer fracturing apparatus of brittle material substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151443A (en) * 2000-11-08 2002-05-24 Victor Co Of Japan Ltd Device for cleaving semiconductor element
JP4210981B2 (en) * 2002-09-27 2009-01-21 住友電気工業株式会社 Cleaving device and cleavage method
CN103203806A (en) * 2012-01-16 2013-07-17 三星钻石工业股份有限公司 Method for breaking brittle material substrate
JP5421699B2 (en) * 2009-09-07 2014-02-19 三菱電機株式会社 Semiconductor element separation method and semiconductor element separation apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151443A (en) * 2000-11-08 2002-05-24 Victor Co Of Japan Ltd Device for cleaving semiconductor element
JP4210981B2 (en) * 2002-09-27 2009-01-21 住友電気工業株式会社 Cleaving device and cleavage method
JP5421699B2 (en) * 2009-09-07 2014-02-19 三菱電機株式会社 Semiconductor element separation method and semiconductor element separation apparatus
CN103203806A (en) * 2012-01-16 2013-07-17 三星钻石工业股份有限公司 Method for breaking brittle material substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104552614A (en) * 2013-10-25 2015-04-29 三星钻石工业股份有限公司 Cutting method and device of substrate made of fragile material
CN104552614B (en) * 2013-10-25 2018-02-02 三星钻石工业股份有限公司 The cutting-off method and shearing device of brittle substrate
CN106079115A (en) * 2015-04-30 2016-11-09 三星钻石工业股份有限公司 The dividing method of adhesive substrates and segmenting device

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KR20150044367A (en) 2015-04-24
TW201515802A (en) 2015-05-01
CN104552629B (en) 2017-11-10
JP6115438B2 (en) 2017-04-19
JP2015079824A (en) 2015-04-23
TWI620636B (en) 2018-04-11

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