CN104552630B - Elastic supporting plate, disrumpent feelings device and method for dividing - Google Patents
Elastic supporting plate, disrumpent feelings device and method for dividing Download PDFInfo
- Publication number
- CN104552630B CN104552630B CN201410310194.5A CN201410310194A CN104552630B CN 104552630 B CN104552630 B CN 104552630B CN 201410310194 A CN201410310194 A CN 201410310194A CN 104552630 B CN104552630 B CN 104552630B
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- Prior art keywords
- base plate
- composite base
- brisement
- disrumpent feelings
- line
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
Present invention is related to a kind of elastic supporting plate, disrumpent feelings device and method for dividing.Its problem is can be disrumpent feelings by the resin bed of composite base plate along brisement line, and the composite base plate has on longitudinal direction and transverse direction formed by proper alignment coating resin layer on the substrate of multiple functional areas in a face, and in advance by substrate portion brisement.Composite base plate (10) sets the structure (14) protruded from each functional area in its upper surface.Spacing and the spacing identical clathrate region of the line of composite base plate (10) are dispersed with elastic supporting plate (40), and the center in each region includes the protection hole (41) for being more than functional area.When the resin bed of disrumpent feelings composite base plate (10), the structure (14) of functional area is directed at each protection hole (41) and composite base plate (10) is configured on elastic supporting plate (40).Then, portion presses down extension rod from it.So, functional area (13) can not be damaged and disjunction resin bed (12).
Description
Technical field
The present invention relates to a kind of in the coating resin layer on the brittle substrates such as semiconductor substrate, ceramic substrate
Elastic supporting plate, disrumpent feelings device and the method for dividing used during the disjunction of composite base plate.
Background technology
Semiconductor chip is the boundary bit by will be formed in the element area on semiconductor wafer in the element area
Put disjunction and manufacture.In the past, by chip disjunction into chip in the case of, rotate cutting blade by cutter device so that
By cutting semiconductor wafer is cut off smaller.
However, in the case of using cutter device, it is necessary to whom has to discharge because of the discharge chip that cutting is produced, in order to not
The water or discharge chip is set to produce harmful effect to the performance of semiconductor chip, it is necessary to have front and rear step with real to semiconductor chip
Protection is applied, and washes water or discharge chip.Therefore, step becomes complicated, it is impossible to cut down cost or shorten process time
Shortcoming.In addition, because being cut using cutting blade, so the problems such as film stripping or defect can be produced.In addition, with small
, can be because of the table of water in MEMS (Micro-Electro-Mechanical Systems, MEMS) substrate of mechanical realization
Face tension force causes structure destruction, so water can not be used, can not be by cutting the problem of carrying out disjunction so as to produce.
In addition, proposing a kind of substrate brisement device in patent document 1,2, pass through the semiconductor die to forming line
Piece, from the back side for forming one side of ruling, along line perpendicular to face pressing by its brisement.Below, show using such a
The summary of the brisement of brisement device.Form multiple functional areas neatly arrangedly on the semiconductor wafer as brisement object
Domain.In the case where carrying out disjunction, first, on the semiconductor wafer, in being spaced apart at equal intervals along longitudinal direction and horizontal stroke for functional area
Rule to being formed.Then, disjunction is carried out using brisement device along the line.Fig. 1 (a) is placed in brisement device before representing disjunction
Semiconductor wafer sectional view.As shown in this figure, functional area 101a, 101b are formed on composite base plate 101, in function
Line S1, S2, S3... are formed between region 101a, 101b.In the case where carrying out disjunction, at the back side of composite base plate 101
Adhesive tape 102 is attached, diaphragm 103 is attached in its front.Then, in brisement, shown in such as Fig. 1 (b), in supporting knife 105,106
Middle configuration answer the line of brisement, be line S2 in this case, making blade 104, alignment line in portion's declines from it, from
And press composite base plate 101.In this way, brisement is carried out using the three-point bending of a pair of supporting knives 105,106 and blade 104.
[background technology document]
[patent document]
[patent document 1] Japanese Patent Laid-Open 2004-39931 publications
[patent document 2] Japanese Patent Laid-Open 2010-149495 publications
The content of the invention
[problems to be solved by the invention]
In the brisement device with such a composition, the situation that blade 104 is pressed down and pressed when in brisement
Under, the meeting of composite base plate 101 somewhat warpage, therefore, stress can concentrate on composite base plate 101 and the leading edge of supporting knife 105,106 connects
Tactile part.Therefore, if the part of the supporting knife 105,106 of brisement device touches functional area as shown in Fig. 1 (a)
101a, 101b, then can be to functional area applying power in brisement.Accordingly, there exist the work(for being possible to damage on semiconductor wafer
The problem of energy region.
In addition, as the substrate that disjunction is carried out using brisement device, there is answering on ceramic substrate silicone-coating
Close substrate.Composite base plate also has has a case that the functional areas such as the lens protruded from resin bed in each functional area.Such a
In composite base plate, after by ceramic substrate brisement, directly using brisement rod pressing resin bed, in the case, there is resin bed
The problem of deforming and be susceptible to damage.In addition, if wanting to carry out disjunction using laser to solve described problem, then
It is sustained damage in the presence of meeting because of the heat affecting of laser, or after irradiation laser, the problem of splash is attached to periphery.In addition,
If from regions such as the prominent lens in front as lower section composite base plate will be made to be contacted with supporting knife, then to there is the broken of resin bed
The problem of being sustained damage when disconnected.
Completed currently invention addresses such a problem, its object is to can be by brittle substrate answering by brisement
Close substrate disrumpent feelings with no damage.
[technological means for solving problem]
In order to solve the problem, elastic supporting plate of the invention supports the composite base plate, institute in disjunction composite base plate
It is the fragile material for having multiple functional areas formed by proper alignment on longitudinal direction and transverse direction in a face to state composite base plate
Coating resin on substrate, and there is the banded brisement line for being formed as clathrate with disjunction work(in the brittle substrate
Can region；The elastic supporting plate be including at least the flat board with the elastic component of the composite base plate same shape, and comprising
It is arranged at the protection hole of each center by the region of the brisement line encirclement of the clathrate.
In order to solve the problem, method for dividing of the invention is by the method for dividing of composite base plate disjunction, the composite base
Plate is the coating resin on the brittle substrate in a functional region of mask, and forms brisement line with work(described in disjunction
Can region；And propped up in the elasticity that each center in the region in the brisement line encirclement by the clathrate has protection hole
On fagging, in the way of each functional area of composite base plate corresponds to protection hole carry out position alignment and by the composite base plate
Be configured on the elastic supporting plate, by the line along brisement press down extension rod and resin bed is disrumpent feelings.
In order to solve the problem, disrumpent feelings device of the invention is by the disrumpent feelings disrumpent feelings device of the resin bed of composite base plate, institute
It is the coating resin on the brittle substrate in a functional region of mask to state composite base plate, and in the fragile material base
Plate shape is into brisement line with functional area described in disjunction；The disrumpent feelings device includes：Workbench；Elastic supporting plate, it is at least
The flat board of elastic component comprising the width with the in-plane equal with the composite base plate, and comprising being arranged at by described
The protection hole of each center in the region that the brisement line of clathrate is surrounded, is configured on the workbench, is split being formed
The face of broken string keeps the composite base plate as upper surface；Expander, includes extension rod；Travel mechanism, makes the workbench
Moved along its face；And elevating mechanism, the composite base plate and extension rod are abreast kept on one side, while making the expander
Lifted towards the face of the composite base plate on the elastic supporting plate.
[The effect of invention]
According to the present invention with such a feature, composite base plate is configured at the ledge for including each functional area
Opening elastic supporting plate on, by it is banded extension rod bottom line correspond to brisement line in the way of carry out position pair
Standard, so as to carry out disrumpent feelings.Accordingly, it is capable to which functional area can not be damaged and along brisement line by the disrumpent feelings effect of resin bed by obtaining.
Brief description of the drawings
Fig. 1 (a), Fig. 1 (b) are the sectional views of state when representing conventional semiconductor wafer brisement.
Fig. 2 (a), Fig. 2 (b) are the front view and side view of the substrate as disjunction object of embodiments of the present invention.
Fig. 3 is the stereogram of one of the disrumpent feelings device of resin bed used when disrumpent feelings for representing present embodiment.
Fig. 4 is the stereogram of one of the expander used when disrumpent feelings for representing present embodiment.
Fig. 5 is the stereogram for the elastic supporting plate for representing embodiments of the present invention.
Fig. 6 (a)~Fig. 6 (d) is the skeleton diagram of the breaking course for the composite base plate for representing the embodiment.
Fig. 7 (a)~Fig. 7 (d) is the skeleton diagram of the breaking course for the resin bed for representing the embodiment.
Embodiment
Next, being illustrated to embodiments of the present invention.Fig. 2 (a), Fig. 2 (b) show one as such a substrate
The front view and side view of the composite base plate 10 of the semiconductor element of the installation oblong-shaped of example.In this embodiment, will be
Coating resin layer, the composite base plate 10 of such as silicones 12 are used as disjunction object on ceramic substrate 11.Herein, composite base plate
The disjunction of 10 only ceramic substrate 11 is delineation is vertically penetrated into substrate and disposably carry out disjunction, therefore by this point
It is disconnected to be expressed as " brisement ", and the disjunction of silicone layer 12 is the cracking of resin bed is gradually expanded and is split by applying power, because
This states this disjunction " disrumpent feelings ".In addition, the overall disjunction of composite base plate 10 is expressed as " disjunction ".In composite base plate 10
In manufacturing step, multiple functional areas 13 are formed in lattice shape neatly arrangedly in length and breadth along the line parallel to x-axis, y-axis.
The functional area 13 is for example set to LED (Light-Emitting Diode, light emitting diode).Each functional area includes lens etc.
The structure 14 protruded from the face of composite base plate 10.Moreover, semiconductor chip is made in order to carry out disjunction by each functional area,
As shown in some chain lines, the upper equally spaced line in longitudinal direction is set to delineation preset lines Sy1~Syn, laterally upper equally spaced line is set to
Delineate preset lines Sx1~Sxm, the part of functional area is located at delineates the square center that preset lines are surrounded by these.
Next, being illustrated to the disrumpent feelings device 20 for disrumpent feelings resin bed 12 of the embodiment.As shown in figure 3,
Disrumpent feelings device 20 includes the workbench 21 that can be moved and rotate towards y directions.In disrumpent feelings device 20, in the lower section of workbench 21
Travel mechanism is set, and the travel mechanism makes workbench 21 be moved in the y-axis direction along its face, and makes the edge of workbench 21
The rotation of its face.Moreover, loading the composite base plate 10 as disjunction object across following elastic supporting plates 40 on workbench 21.
On the top of workbench 21, the horizontal affixation member 22 of U-shaped is set, remains and watches on the top of horizontal affixation member 22
Take motor 23.Ball screw 24 is directly connected in the rotary shaft of servomotor 23, the lower end of ball screw 24 is by another
Horizontal affixation member 25 is supported, and makes ball screw 24 rotatable.Upper mobile member 26 possesses and ball screw 24 in central portion
The box thread 27 screwed togather, possesses support shaft 28a, 28b downward from the both ends of the upper mobile member 26.Support shaft 28a,
A pair of through holes of 28b insertions horizontal affixation member 25 and be linked to lower mobile member 29.In the lower surface of lower mobile member 29,
Following expanders 30 are abreast installed with the face of workbench 21.Thus, revolve ball screw 24 by servomotor 23
Turn in the case of, upper mobile member 26 is integrally formed and moved up and down with lower mobile member 29, expander 30 also and meanwhile on move down
It is dynamic.Herein, the mobile member 26,29 of servomotor 23 with horizontal affixation member 22,25 and up and down, which is constituted, makes expander 30
The elevating mechanism of lifting.
Next, being illustrated to the expander 30 used in disrumpent feelings silicone layer.For example shown in the stereogram of Fig. 4,
Expander 30 forms multiple parallel banded extension rod 32a~32n side by side in plane substrate 31.Each extension rod
All crestal lines constitute a plane.As long as in addition, extension rod interval be to fix and be delineation preset lines interval 2 with
On integral multiple, 2 times are set in the present embodiment.As long as moreover, respectively the section of extension rod is with can be along splitting
Break pressing protuberance shape, then be not particularly limited, but it is preferred that be set to it is as described below as the arc-shaped that bends.This
Outside, in Fig. 4, in order to explicitly indicate that extension rod 32a~32n, extension rod 32a~32n is made to turn into upper surface and represent, but make
Used time is to be installed on lower mobile member 29 in the way of extending rod 32a~32n as lower section.
In the present embodiment, elastic supporting plate 40 is used when to the resin bed of disrumpent feelings composite base plate 10.Such as standing for Fig. 5
Shown in body figure, elastic supporting plate 40 is the flexible tool such as the rubber system of rectangular flat board, its size and composite base plate
10 is identical, and such as thickness is set to several millimeters.The elastic supporting plate 40 is including each functional areas corresponding to composite base plate 10
The position in the region in domain, with the x-direction and y directions line proper alignment in length and breadth multiple circular protection holes 41.Make these
Protect the spacing and the delineation preset lines S of the composite base plate 10 as disrumpent feelings object in hole 41x1~Sxm、Sy1~SynSpacing it is accurate
Ground is consistent, and each protection hole 41 is with positioned at by delineation preset lines Sx1~Sxm、Sy1~SynThe mode at the center in each region surrounded
Formed.This protects hole 41 to be used for when disrumpent feelings not to the applying power of the structures such as the lens of composite base plate 10 14, herein through hole ratio
Structure 14 is big.
Next, the method to disjunction composite base plate 10 is illustrated.Fig. 6 (a), Fig. 6 (b) represent breaking course
Figure, Fig. 6 (a) represents a part for composite base plate 10.First, as shown in Fig. 6 (b), using the face of ceramic substrate 11 as upper surface,
Stitch marker 50 is moved by chalker (not shown), is rule along delineation preset lines.So that as shown in Fig. 2 (a), shape
Into the line S in x directionsx1~Sxm, y directions line Sy1~Syn。
Next, in the brisement step of ceramic substrate 11, such as shown in Fig. 6 (c), first overturning composite base plate 10.Connect
, using brisement device (not shown), brisement rod 51 is located at the surface of the line formed, by the way that brisement rod 51 is past
Push and only make the brisement of ceramic substrate 11.
Thus, as only ceramic substrate 11 along line Sx1~Sxm、Sy1~SynThe state of brisement.Fig. 6 (d) is represented along x
A part for composite base plate 10 after each line brisement in direction and y directions.In addition, line Sx1~Sxm、Sy1~SynSplit
It is disconnected, therefore hereinafter referred to as brisement line Bx1~Bxm、By1~Byn。
Next, as shown in Fig. 7 (a), Fig. 7 (b), to making the brisement line for being formed at ceramic substrate 11 also extend into silicones
Layer and the method that terminates the disjunction of composite base plate 10 is illustrated.Fig. 7 is the figure for the fracture for representing resin bed, Fig. 7 (a) tables
Show a part for composite base plate.First, elastic supporting plate 40 is configured on the workbench 21 of the disrumpent feelings device 20, and then in bullet
Property supporting plate 40 upper surface configuration composite base plate 10.Now, as shown in Fig. 7 (a), in the way of being connected to elastic supporting plate 40
Configure silicone layer 12.Now, elastic supporting plate 40 is completely contained in the structure 14 of the functional area 13 of composite base plate 10
The mode in protection hole 41 position and configure composite base plate 10.Sectional view now is the figure shown in Fig. 7 (a), all structures
14 turn into the position for corresponding to protection hole 41, are not contacted directly with elastic supporting plate 40.
Make the brisement line such as S of ceramic substrate 11x1As upper surface.Then, so that any one extension of the expander 30
The mode of the crestal line alignment brisement line of rod such as 32a foot is positioned.
Next, driving servomotor 23, makes mobile member 26 decline with lower mobile member 29 simultaneously, and make extension
The extension rod of device 30 is while relative to the keeping parallelism of workbench 21 while being gradually reduced.Then, as shown in Fig. 7 (b), rod will be extended
32a is from brisement line Bx1Surface pressing ceramic substrate 11.So, as shown in Fig. 7 (c), ceramic substrate 11 is expanded rod
32a is pressed and deformed, and is sunk and elastic supporting plate 40 is similarly deformed into V shape.Now as shown in Fig. 7 (b), work as pressure
Composite base plate 10 can somewhat sink when entering to extend rod 32a, but because the part corresponding to functional area 13 in its left and right is set
Protection hole 41, so the structure 14 of the protrusion of functional area 13 can be avoided to be directly contacted with elastic supporting plate 40, and will be multiple
The resin bed 12 for closing substrate 10 is disrumpent feelings.Now, the left and right of ceramic substrate is equably deformed with extension rod 32a press-in, because
This can make cracking extend to lower section along brisement line.Herein, the cross sectional shape of the lower section of extension rod is not particularly limited, but
For example in the case of triangle, the necessity for accurately entering to exercise the positioning of summit alignment brisement line is uprised relatively.Therefore,
In order that ceramic substrate 11, silicones 12 are evenly deformed in this way, and the section of the lower section of each extension rod is set to circular arc
Shape.Thus, make the permissible range of the precision of the positioning of the crestal line alignment brisement line of extension rod is relative to broaden.Moreover, by making expansion
Exhibition rod fully declines, and the cracking in resin is in progress and applies the power pushed open to left and right, so as to terminate disrumpent feelings.If disrumpent feelings terminate,
Servomotor 23 is so set to invert and expander 30 is increased.
Now, multiple extension rods are formed side by side in expander 30, and it is at intervals of twice of line, therefore extension can be made
Rod is every one along multiple brisement lines while disrumpent feelings silicones 12.
Then, workbench 21 is moved the amount of the spacing equivalent to brisement line in the y-axis direction, similarly make expander 30
Decline, thus also can be for the disrumpent feelings of the brisement knot beam resin bed of other adjoinings.Herein, because extension rod is at intervals of line
Twice of spacing, therefore by offseting workbench 21 once to carry out disrumpent feelings just to terminate all x-axis of composite base plate 10
Direction it is disrumpent feelings.In addition, in the case of the three times at intervals of the spacing of line of extension rod, by making workbench 21 move two
It is secondary and carry out disrumpent feelings just to terminate the disrumpent feelings of all x-axis directions.
Then, it is rotated by 90 ° workbench 21, similarly declines expander 30 for the brisement line of y-axis, so that will tree
Lipid layer is disrumpent feelings.Then, workbench 21 is moved the amount of the spacing equivalent to brisement line in the y-axis direction, similarly make expander
30 decline.So, terminate the disrumpent feelings of entire surface, the functional areas of resin and disjunction square shape are torn along each brisement line
Domain, so as to form multiple LED chips.
In addition, in this embodiment, in order to defencive function region by multiple protection holes of elastic supporting plate 40
41 are set to through hole, but as long as the structure 14 of composite base plate 10 will not touch elastic supporting plate 40 when disrumpent feelings,
Through hole can be not set to, and is set to the hole that depth will not touch the degree of elastic supporting plate 40 for structure 14.
In addition, in this embodiment, as the substrate as substrate, ceramic substrate is illustrated, but the present invention
It is readily applicable to the various brittle substrates such as semiconductor substrate or glass substrate.
In addition, in this embodiment, as the resin for being coated on ceramic substrate, silicones is illustrated, but
Can be layer, the layer such as to the Polarizer of glass substrate lamination of other various materials.
[industrial utilizability]
The present invention is being delineated and during disjunction, can not damage to protect to the brittle substrate with the region that should be protected
The region of shield and carry out disrumpent feelings, therefore, can be effectively adapted to be formed the disrumpent feelings device of the substrate of functional area.
[explanation of symbol]
10 composite base plates
11 ceramic substrates
12 silicones
13 functional areas
14 structures
20 disrumpent feelings devices
21 workbench
22nd, 25 horizontal affixation member
23 servomotors
24 ball screws
26th, 29 mobile member
30 expanders
31 substrates
32a~32n extends rod
40 elastic supporting plates
41 protection holes
Claims (3)
1. a kind of elastic supporting plate, it supports the composite base plate in disjunction composite base plate, and the composite base plate is at one
Face has the coating resin on the brittle substrate of multiple functional areas formed by proper alignment on longitudinal direction and transverse direction, and
Only the banded brisement line in clathrate formation is included with breaking function region in the brittle substrate；And
The elastic supporting plate is, including at least the flat board with the elastic component of the composite base plate same shape, and to include setting
Protection hole in each center in the region of the brisement line encirclement by the clathrate.
2. a kind of method for dividing, its disjunction composite base plate, the composite base plate is the fragility material in a functional region of mask
Expect coating resin on substrate, and form the brisement line of clathrate with functional area described in disjunction；And
Included in each center in the region surrounded by the brisement line of the clathrate on the elastic supporting plate for protecting hole,
Position alignment is carried out in the way of the functional area of composite base plate corresponds respectively to protection hole and configures the composite base plate,
By the line along brisement press down extension rod and resin bed is disrumpent feelings.
3. a kind of disrumpent feelings device, the resin bed of its is disrumpent feelings composite base plate, the composite base plate is in a functional region of mask
Brittle substrate on coating resin, and on the brittle substrate formed clathrate brisement line with described in disjunction
Functional area；The disrumpent feelings device includes：
Workbench；
Elastic supporting plate, it is the elastic component including at least the area with the in-plane equal with the composite base plate
Flat board, comprising the protection hole for being arranged at each center by the region of the brisement line encirclement of the clathrate, is configured at institute
State on workbench, the face of brisement line will be formed as upper surface and keep the composite base plate；
Expander, includes extension rod；
Travel mechanism, makes the workbench along its planar movement；And
Elevating mechanism, abreast keeps the composite base plate and extension rod on one side, while making the expander towards the elasticity branch
Composite base plate face lifting on fagging.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-215393 | 2013-10-16 | ||
| JP2013215393A JP6213134B2 (en) | 2013-10-16 | 2013-10-16 | Elastic support plate, breaking device and dividing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104552630A CN104552630A (en) | 2015-04-29 |
| CN104552630B true CN104552630B (en) | 2017-11-03 |
Family
ID=53009606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410310194.5A Expired - Fee Related CN104552630B (en) | 2013-10-16 | 2014-07-01 | Elastic supporting plate, disrumpent feelings device and method for dividing |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6213134B2 (en) |
| KR (1) | KR20150044374A (en) |
| CN (1) | CN104552630B (en) |
| TW (1) | TWI607975B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6243699B2 (en) * | 2013-10-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | Fragment material substrate cutting device |
| JP6705129B2 (en) * | 2015-06-29 | 2020-06-03 | 三星ダイヤモンド工業株式会社 | How to break the board |
| JP2017001180A (en) * | 2016-09-29 | 2017-01-05 | 三星ダイヤモンド工業株式会社 | Surface layer fracturing apparatus of brittle material substrate |
| EP3703106A4 (en) * | 2017-10-27 | 2021-08-25 | Mitsuboshi Diamond Industrial Co., Ltd. | Method for segmenting substrate having metal film |
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| DE4133150A1 (en) * | 1991-09-30 | 1993-04-01 | Siemens Ag | Cross cutting semiconductor optical waveguide strip - using linear bottom support and upper pressure plate with spring loaded cutting wedge fitting into etched separating groove |
| JP2001250798A (en) * | 2000-03-06 | 2001-09-14 | Sony Corp | Method and apparatus for dividing material along scribing line |
| CN1348850A (en) * | 2000-10-02 | 2002-05-15 | 三星钻石工业株式会社 | Method and device for mfg. brittle substrates |
| CN1678439A (en) * | 2002-07-02 | 2005-10-05 | 三星钻石工业股份有限公司 | Pasted base board cutting system and base board cutting method |
| CN102329075A (en) * | 2010-07-05 | 2012-01-25 | 三星钻石工业股份有限公司 | Breaking device |
| CN103203806A (en) * | 2012-01-16 | 2013-07-17 | 三星钻石工业股份有限公司 | Method for breaking brittle material substrate |
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|---|---|---|---|---|
| JPH0784006B2 (en) * | 1986-07-29 | 1995-09-13 | 松下電器産業株式会社 | Substrate dividing device |
| CN1330596C (en) * | 2002-04-01 | 2007-08-08 | 三星钻石工业股份有限公司 | Parting method for fragile material substrate and parting device using the method |
-
2013
- 2013-10-16 JP JP2013215393A patent/JP6213134B2/en not_active Expired - Fee Related
-
2014
- 2014-06-23 TW TW103121613A patent/TWI607975B/en not_active IP Right Cessation
- 2014-07-01 CN CN201410310194.5A patent/CN104552630B/en not_active Expired - Fee Related
- 2014-07-29 KR KR20140096313A patent/KR20150044374A/en not_active Application Discontinuation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4133150A1 (en) * | 1991-09-30 | 1993-04-01 | Siemens Ag | Cross cutting semiconductor optical waveguide strip - using linear bottom support and upper pressure plate with spring loaded cutting wedge fitting into etched separating groove |
| JP2001250798A (en) * | 2000-03-06 | 2001-09-14 | Sony Corp | Method and apparatus for dividing material along scribing line |
| CN1348850A (en) * | 2000-10-02 | 2002-05-15 | 三星钻石工业株式会社 | Method and device for mfg. brittle substrates |
| CN1678439A (en) * | 2002-07-02 | 2005-10-05 | 三星钻石工业股份有限公司 | Pasted base board cutting system and base board cutting method |
| CN102329075A (en) * | 2010-07-05 | 2012-01-25 | 三星钻石工业股份有限公司 | Breaking device |
| CN103203806A (en) * | 2012-01-16 | 2013-07-17 | 三星钻石工业股份有限公司 | Method for breaking brittle material substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI607975B (en) | 2017-12-11 |
| JP6213134B2 (en) | 2017-10-18 |
| TW201516010A (en) | 2015-05-01 |
| CN104552630A (en) | 2015-04-29 |
| JP2015077711A (en) | 2015-04-23 |
| KR20150044374A (en) | 2015-04-24 |
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