CN110534646A - Flexible base board and preparation method thereof, display device - Google Patents
Flexible base board and preparation method thereof, display device Download PDFInfo
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- CN110534646A CN110534646A CN201910773639.6A CN201910773639A CN110534646A CN 110534646 A CN110534646 A CN 110534646A CN 201910773639 A CN201910773639 A CN 201910773639A CN 110534646 A CN110534646 A CN 110534646A
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- base board
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
This application involves a kind of flexible base boards and preparation method thereof, display device.The flexible base board includes the first substrate layer and the first barrier layer.First barrier layer is set to the surface of first substrate layer.The film-forming region on first barrier layer is less than the film-forming region of first substrate layer.When forming flexible base board, since the film-forming region on first barrier layer is less than the film-forming region of first substrate layer, so that only described first substrate layer is contacted with rigid basement, it avoids substrate portion edge and the Various Complex structure different from layout design occurs, also avoid the problem of flexible base board is damaged when removing with rigid basement.
Description
Technical field
This application involves field of display technology, more particularly to a kind of flexible base board and preparation method thereof, display device.
Background technique
With the continuous development of display technology, display panel using more and more extensive, organic light emission (Organic
Light Emitting Diode, OLED) display panel becomes with its fast response time, lucuriant in design, frivolous the advantages that facilitating
The up-and-coming youngster of display panel industry.
The OLED display of conventional rigid uses frangible glass substrate, limits the application of OLED display.Cause
This has developed the flexible OLED display of the flexible base board using forming in recent years.However when forming flexible base board, by
It is limited in process equipment itself precision, lead to the part edge structure in flexible base board, occurs different from layout design a variety of
Labyrinth causes flexible base board to damage when removing with rigid basement.
Summary of the invention
Based on this, it is necessary to for the part edge structure in flexible base board, occur different from layout design a variety of multiple
Miscellaneous structure, causes flexible base board to occur damage problem when removing with rigid basement, provides a kind of flexible base board and its preparation side
Method, display device.
A kind of flexible base board, comprising:
First substrate layer；And
First barrier layer, is set to the surface of first substrate layer, and the film-forming region on first barrier layer is less than institute
State the film-forming region of the first substrate layer.
As a kind of preferable embodiment, on the basis of the above embodiments, further includes:
Second substrate layer is set on first barrier layer, and the film-forming region of second substrate layer is greater than described the
The film-forming region on one barrier layer but the film-forming region for being less than first substrate layer.
As a kind of preferable embodiment, on the basis of the above embodiments, further includes:
Second substrate layer is set on first barrier layer, and second substrate layer film-forming region is greater than or equal to institute
State the film-forming region of the first substrate layer.
As a kind of preferable embodiment, on the basis of the above embodiments, further includes:
Boundary portion, the boundary portion are contacted with first substrate layer, to limit first barrier layer on the boundary
Within the cavity that limit portion and first substrate layer are formed.
As a kind of preferable embodiment, on the basis of the above embodiments, the extending direction in the boundary portion and institute
The film forming direction for stating the first substrate layer is arranged at an angle, and the certain angle is 45 ° -135 °；Preferably, the boundary portion
Extending direction and first substrate layer film forming direction in 90 ° setting.
As a kind of preferable embodiment, on the basis of the above embodiments, first barrier layer is described first
The projecting edge of substrate layer is in the edge of first substrate layer；
Preferably, first barrier layer is in the projecting edge of first substrate layer on the side of first substrate layer
10um-20um in edge.
As a kind of preferable embodiment, on the basis of the above embodiments, the thickness of first substrate layer and institute
The thickness for stating the second substrate layer is all larger than the thickness on first barrier layer；
Preferably, the thickness of first substrate layer is equal to the thickness of second substrate layer.
A kind of preparation method of flexible base board, comprising:
Rigid basement is provided；
The first substrate layer is formed on the surface of the rigid basement；
The first barrier layer is formed on the surface of first substrate layer, the film-forming region on first barrier layer is less than described
The film-forming region of first substrate layer；
The rigid basement and first substrate layer are removed, to form flexible base board.
As a kind of preferable embodiment, on the basis of the above embodiments, by the rigid basement and described the
Before the removing of one substrate layer, further includes:
The second substrate layer is formed on the surface on first barrier layer；The film-forming region of second substrate layer is greater than described
The film-forming region on the first barrier layer but the film-forming region for being less than first substrate layer；Or the film forming area of second substrate layer
Domain is greater than or equal to the film-forming region of first substrate layer.
A kind of display device, including flexible base board described in any of the above embodiments.
A kind of flexible base board provided herein and preparation method thereof, display device.The flexible base board includes the first lining
Bottom and the first barrier layer.First barrier layer is set to the surface of first substrate layer.First barrier layer at
Diaphragm area is less than the film-forming region of first substrate layer.When forming flexible base board, due to the film forming on first barrier layer
The film-forming region that region is less than first substrate layer avoids so that only described first substrate layer is contacted with rigid basement
There is the Various Complex structure different from layout design in substrate portion edge, also avoid flexible base board with rigid basement
The problem of being damaged when removing.
Detailed description of the invention
Fig. 1 is the sectional view of the flexible base board provided in the application one embodiment；
Fig. 2 is the sectional view of the flexible base board provided in the application one embodiment；
Fig. 3 is the sectional view of the flexible base board provided in the application one embodiment；
Fig. 4 is the sectional view of the flexible base board provided in the application one embodiment；
Fig. 5 is the top view of the flexible base board provided in the application one embodiment；
Fig. 6 is the flow chart of the preparation method of the flexible base board provided in the application one embodiment；
Fig. 7 is the structure flow chart of the preparation method of the flexible base board provided in the application one embodiment.
Drawing reference numeral explanation:
Flexible base board 10
First substrate layer 111
Second substrate layer 112
Boundary portion 113
First barrier layer 120
Middle layer 130
Second barrier layer 140
Rigid basement 201
Specific embodiment
It is with reference to the accompanying drawings and embodiments, right in order to which the objects, technical solutions and advantages of the application are more clearly understood
The application is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the application, not
For limiting the application.
In traditional technical solution, flexible base board includes the first substrate layer, the first barrier layer and the second substrate layer.Traditional
In scheme, when forming flexible base board, it often will appear the case where area of the first barrier is greater than the first substrate layer area, lead
Cause is contacted with rigid basement again after the first barrier of fringe region of flexible base board is contacted with the first substrate layer, due to the first resistance
The problem of barrier can absorb the energy of fraction of laser light, this results in same energy, and the fringe region of flexible base board can not be removed.
Since slot-die coater (Slot die Coater, such as PI glue coating machine) is in the debugging essence of practical dispensing area
Different layers dispensing area size caused by degree and board difference is different, and accordingly, there exist the marginal zone of flexible base board, the first resistance shelves
Layer absorb laser energy, cause substrate edge region when can not normally strip down the problem of.
A kind of technical solution present in traditional scheme is, after the flexible base board of large area is first cut into small panel substrate,
Laser lift-off is carried out again.Another technical solution present in traditional scheme be by adjusting coating gap (or cry cladding between
Gap Coating Gap) adjust the size of dispensing area.Another technical solution present in traditional scheme is in the first substrate
Layer and the contact surface of rigid basement increase sacrificial layer, improve the removing power and energy of laser, thus avoid flexible base board with
The problem of rigid basement is damaged when removing.
It is removed since the above method that traditional scheme provides can not inherently solve flexible base board with rigid basement
When the problem of damaging.Therefore, referring to Fig. 1, the application provides a kind of flexible base board 10, comprising: 111 He of the first substrate layer
First barrier layer 120.
The material of first substrate layer 111 can be flexible material or elastic material.First substrate layer 111 is
The material that can be squeezed and deformed.For example, in one embodiment, the material of first substrate layer 111 is that (PI is polyamides Asia to PI
The abbreviation of amine, PI are the polymer that main chain contains imide group) or PDMS (PDMS is dimethyl silicone polymer).
First barrier layer 120 is set to the surface of first substrate layer 111.First barrier layer 120 at
Diaphragm area is less than the film-forming region of first substrate layer 111.The material on first barrier layer 120 is inorganic material.One
In a embodiment, it is compound that first barrier layer 120 is that silicon oxide layer, silicon nitride layer or silica and silicon nitride form
Layer.The effect on first barrier layer 120: when the flexible base board 10 is applied to OLED device, production flexibility OLED's
In the process, it needs that energy can be generated using laser irradiation.First barrier layer 120 is used as inorganic material, can absorb energy
Amount, generated energy further consumes when by laser irradiation, to reduce irradiation to the thin film transistor (TFT) in flexible OLED
Semiconductor layer cause undesirable influence.
Here when removing the rigid basement of the flexible base board 10, laser irradiation can be used.This laser irradiation category
In laser lift-off technique.Laser lift-off technique (LLO, Laser Lift-off) is the skill that composite film is decomposed using laser energy
Art.Laser lift-off can separate the sedimentary on upper layer from the substrate layer of lower layer, it is possible to reduce etching, grinding, scribing, it is heavier
What is wanted is that substrate after being separated can repeat to use.
In the present embodiment, first substrate layer 111 provided is directly arranged at rigid basement (such as glass substrate).Make
During being separated first substrate layer 111 and rigid basement with the method for laser irradiation, first substrate layer 111 is more
Removing easy to accomplish will not cause any damage to the entire flexible base board 10.For example, wavelength is selected to arrive for 308nm
When the laser irradiation of 373nm, first substrate layer 111 is easier to absorb the laser of the wavelength and be easier to realize described first
Falling off between substrate layer 111 and rigid basement.In the present embodiment, when forming the flexible base board 10, due to described first
The film-forming region on barrier layer 120 is less than the film-forming region of first substrate layer 111, so that only described first substrate layer 111
It is contacted with rigid basement, the Various Complex knot different from layout design occurs in the part edge for avoiding the flexible base board 10
Structure also avoids the problem of flexible base board 10 is damaged when removing with rigid basement.
Referring to Fig. 2, as a kind of preferable embodiment, on the basis of the above embodiments, further includes: the second substrate
Layer 112.Second substrate layer 112 is set on first barrier layer 120.The film-forming region of second substrate layer 112
Film-forming region greater than first barrier layer 120 but the film-forming region less than first substrate layer 111.
Specifically, the film-forming region on first substrate layer 111 and first barrier layer 120 can be according to the flexibility
The size of substrate 10 is adjusted.Preferably, by taking sectional view shown in Fig. 2 as an example, first substrate layer 111 is in plane
Interior extension width is 10 millimeters to 20 millimeters wider than the extension width of first barrier layer 120 planar.It is arranged in this way
Width is relatively reasonable, is easiest to be formed the flexible base board 10 not with rigid basement adhesion.In one embodiment, more preferably
Ground, the extension width of first substrate layer 111 planar are wider than the extension width of first barrier layer 120 planar
10 millimeters.
In the present embodiment, when forming the flexible base board 10, the film-forming region on first barrier layer 120 is less than described
The film-forming region of first substrate layer 111.The film-forming region of second substrate layer 112 be greater than first barrier layer 120 at
Diaphragm area but the film-forming region for being less than first substrate layer 111, second substrate layer 112 can be by first barrier layer
120 are wrapped between first substrate layer 111 and second substrate layer 112 so that only first substrate layer 111 with
There is the Various Complex structure different from layout design in rigid basement contact, the part edge for avoiding the flexible base board 10,
Also avoid the problem of flexible base board 10 is damaged when removing with rigid basement.
Referring to Fig. 3, further including the second substrate on the basis of the above embodiments as a kind of preferable embodiment
Layer 112.The material of second substrate layer 112 is identical with the material of first substrate layer 111.In one embodiment, institute
The material for stating the second substrate layer 112 is PI (PI is the abbreviation of polyimides, and PI is the polymer that main chain contains imide group)
Or PDMS (PDMS is dimethyl silicone polymer).
Second substrate layer 112 is set on first barrier layer 120, the film forming area of second substrate layer 112
Domain is greater than or equal to the film-forming region of first substrate layer 111.Second substrate layer 112 can be by first barrier layer
120 and in first substrate layer 111 is wrapped in.
In the present embodiment, when forming the flexible base board 10, the only material directly contacted with rigid basement is identical
First substrate layer 111 and second substrate layer 112.Second substrate layer 112 is by first substrate layer 111 and institute
It states in the first barrier layer 120 is wrapped in, can further avoid contact of first barrier layer 120 with rigid basement, keep away
There is the Various Complex structure different from layout design in the part edge for having exempted from the flexible base board 10, also avoids the flexibility
The problem of substrate 10 is damaged when removing with rigid basement.
Referring to Fig. 4, as a kind of preferable embodiment, on the basis of the above embodiments, the flexible base board 10
It further include boundary portion 113.The boundary portion 113 is contacted with first substrate layer 111, to limit first barrier layer
120 within the cavity that the boundary portion 113 and first substrate layer 111 are formed.
The material in the boundary portion 113 is identical as the material of first substrate layer 111 and second substrate layer 112.
During preparing flexible base board 10, the boundary portion 113 can directly be contacted with rigid basement (such as glass substrate).
In the present embodiment, the material in the boundary portion 113 and first substrate layer 111 and second substrate layer 112
Material it is identical.First substrate layer 111, second substrate layer 112 and the boundary portion 113 can collectively form ring-type
Structure sheaf 110.The cyclic structure layer 110 has the first inner surface.From Fig. 4, the sectional view of the flexible base board 10 can be with
Find out, the cyclic structure layer 110 wraps up first barrier layer 120.First barrier layer 120 is set to the cyclic structure layer
In 110.One surface on first barrier layer 120 is directly contacted with first inner surface.It is appreciated that in the flexibility
In the stereochemical structure of substrate 10, the cyclic structure layer 110 coats first barrier layer 120 completely.The cyclic structure layer
110 form a cube, and first barrier layer 120 is set in cube, and is directly contacted with the inner surface of cube.
In the present embodiment, first barrier layer 120 is set in the cyclic structure layer 110, avoid laser lift-off (or swash
Light irradiation) when inorganic material first barrier layer 120 and rigid basement adhesion.Referring to Fig. 5, providing the flexibility
The top view of substrate 10.It can be seen that the cyclic structure layer 110 wraps up the setting of the first barrier layer 120 in Fig. 5.
In flexible base board 10 described in the present embodiment, first substrate layer 111, second substrate layer 112 and described
Boundary portion 113 together constitutes cyclic structure layer 110.The cyclic structure layer 110 wraps up setting for first barrier layer 120
Meter.It when forming flexible base board 10, avoids that process equipment itself precision is limited, causes in the edge part of the flexible base board 10
There is the Various Complex structure different from layout design in the structure divided, also avoids the flexible base board 10 and shells with rigid basement
From when damage the problem of.
As a kind of preferable embodiment, on the basis of the above embodiments, the extending direction in the boundary portion 113 with
The film forming direction of first substrate layer 111 is arranged at an angle.The certain angle is 45 ° -135 °.Preferably, described
The film forming direction of the extending direction in boundary portion 113 and first substrate layer 111 is in 90 ° of settings.
In the present embodiment, the method for forming the boundary portion 113, which can be, is being arranged described second by the way of sprinkling cloth
When substrate layer 112,112 overflow of the second substrate layer coats first barrier layer 120 and first substrate layer 111.In
In one embodiment, the extension width of second substrate layer 112 planar is planar than first substrate layer 111
Extension width is 3 millimeters to 5 millimeters wide.The boundary portion 113 is advantageously formed in this way, is also beneficial to form the cyclic annular organic layer
110.In one embodiment, the extension width of second substrate layer 112 planar is than first substrate layer 111 flat
Extension width in face is 3 millimeters wide.The width that second substrate layer 112 is arranged is greater than the width of first substrate layer 111
So that when forming the flexible base board 10, only identical first substrate layer 111 of material and the limiting bed 113 and just
Property substrate contact, there is the Various Complex structure different from layout design in the part edge for avoiding the flexible base board 10,
Avoid the problem of flexible base board 10 is damaged when removing with rigid basement.
As a kind of preferable embodiment, on the basis of the above embodiments, first barrier layer 120 is described
The projecting edge of one substrate layer 111 is in the edge of first substrate layer 111.Preferably, first barrier layer 120 exists
The projecting edge of first substrate layer 111 10um-20um in the edge of first substrate layer 111.
Specifically, first barrier layer 120 first substrate layer 111 projecting edge in first substrate
In the edge of layer 111, the film forming area of first substrate layer 111 is less than relative to the film-forming region on first barrier layer 120
Domain further defines the relationship of film-forming region marginal portion.First barrier layer 120 is in first substrate layer 111
Projecting edge is not in the edge and described the on first barrier layer 120 in the edge of first substrate layer 111
The phenomenon that projecting edge of one substrate layer 111 flushes.
In the present embodiment, first barrier layer 120 first substrate layer 111 projecting edge described first
In the edge of substrate layer 111, a possibility that first barrier layer 120 is contacted with rigid basement can be further limited.When
When defining that first barrier layer 120 does not contact directly with rigid basement, only identical first substrate layer 111 of material
And/or second substrate layer 112 and/or the limiting bed 113 are contacted with rigid basement, avoid the flexible base board 10
There is the Various Complex structure different from layout design in part edge, also avoids the flexible base board 10 and shells with rigid basement
From when damage the problem of.
Referring to Fig. 4, as a kind of preferable embodiment, on the basis of the above embodiments, the flexible base board 10
It further include middle layer 130.
The middle layer 130 is set in the cyclic annular organic layer 110, and directly with the cyclic annular organic layer 110 the
The contact of two inner surfaces.The middle layer 130 can be amorphous silicon (a-Si) or silicon nitride.The middle layer 130 can also be
The mixed layer of amorphous silicon, polysilicon or amorphous silicon and polysilicon.The mixed layer of amorphous silicon and polysilicon can be understood as amorphous silicon
In doped in polycrystalline silicon material or polysilicon doped with amorphous silicon material.
The effect of the middle layer 130: when the flexible base board 10 maintains rigid basement, the flexible base board 10 is wrapped
The middle layer or flexible base board 10 that include amorphous silicon include the mixing middle layer of amorphous silicon and polysilicon.When by laser irradiation
When mode removes the rigid basement of the flexible base board 10, amorphous silicon may all be converted to polysilicon, it is also possible to Partial Conversion
For polysilicon.
Preferably, the extension width of the middle layer 130 planar is equal to first barrier layer 120 planar
Extension width.It is wide that the extension width of the middle layer 130 planar is equal to the extension of first barrier layer 120 planar
Degree, can contact to avoid the middle layer 130 with rigid basement, the middle layer 130 of amorphous silicon when preventing laser lift-off
With the adhesion of rigid basement.
With continued reference to Fig. 4, as a kind of preferable embodiment, on the basis of the above embodiments, the flexible base board
10 further include: the second barrier layer 140.
Second barrier layer 140 covers the cyclic annular organic layer 110 and is arranged.
Second barrier layer 140 is directly contacted with the lateral wall of the cyclic annular organic layer 110.Second barrier layer
140 part edge can directly contact glass substrate rigid basement.During laser lift-off, large area is directly and glass lined
The material layer that bottom rigid basement directly contacts is first substrate layer of the first organic layer 111.First organic layer first serves as a contrast
The material of bottom 111 is more suitable for the wavelength of laser lift-off, and first substrate layer of the first organic layer 111 of large area drives institute
It states the second barrier layer 140 to remove with the glass substrate rigid basement, not will cause second barrier layer 140 and rigid basement
Adhesion, will not to the flexible base board 10 generate destruction.
Preferably, second outer surface of the inner surface on second barrier layer 140 and the second substrate layer 112 and described
The third outer surface in limiting bed boundary portion 113 directly contacts.Wherein, limiting bed boundary portion 113 has third inner surface
With third outer surface.The third inner surface in limiting bed boundary portion 113 and first barrier layer 120 and the centre
Layer 130 contacts.Or the third inner surface in limiting bed boundary portion 113 is contacted with first barrier layer 120.
As a kind of preferable embodiment, on the basis of the above embodiments, the thickness of first substrate layer 111 and
The thickness of second substrate layer 112 is all larger than the thickness on first barrier layer 120.Preferably, first substrate layer 111
Thickness be equal to second substrate layer 112 thickness.
In the present embodiment, the thickness of the flexible base board 10 is between 14 microns to 18 microns, it is preferable that the flexibility base
Plate 10 with a thickness of 16 microns.In one embodiment, the flexible base board 10 with a thickness of 18 microns.First substrate layer
111 with a thickness of 7 microns to 10 microns, it is preferable that first substrate layer 111 with a thickness of 8 microns.First substrate layer
111 thickness refers to the thickness that the direction on first barrier layer 120 is directed toward by first substrate layer 111.In general, described
The thickness of first substrate layer 111 is greater than the thickness on first barrier layer 120.In one embodiment, first substrate layer
111 thickness is equal to the thickness of second substrate layer 112.
Please refer to Fig. 6 and Fig. 7, a kind of preparation method of flexible base board, comprising:
S100 provides rigid basement 201.The rigid basement 201 can be glass substrate.
S200 forms the first substrate layer 111 on the surface of the rigid basement 201.The film forming of first substrate layer 111
Region (area in other words) is less than the region (area in other words) of the rigid basement 201.Specifically, can be planar,
The length of first substrate layer 111 and the wide length and width for being respectively less than the rigid basement 201.
S300 forms the first barrier layer 120 on the surface of first substrate layer 111.First barrier layer 120 at
Diaphragm area is less than the film-forming region of first substrate layer 111.
Specifically it is to be understood that the extension width of first substrate layer 111 planar is than first barrier layer
120 extension width planar is 10 millimeters to 20 millimeters wide.In this step, first substrate layer 111 can be in plane
Extension width in interior both direction planar than first barrier layer 120 wide 10 milli of extension width in both direction
Rice is to 20 millimeters.It is also possible to extension width of first substrate layer 111 planar at least one direction than described
Extension width of first barrier layer 120 planar at least one direction is 10 millimeters to 20 millimeters wide.
S400 removes the rigid basement 201 and first substrate layer 111, to form flexible base board 10.
In this step, when removing the rigid basement 201 with first substrate layer 111, it can be shone using laser
The mode penetrated is removed.The wavelength for being more advantageous to the laser for absorbing first substrate layer 111 is selected in laser irradiation, than
Such as selecting optical maser wavelength is the laser of 308nm to 373nm.
In the present embodiment, the film-forming region of the preparation method of the flexible base board provided, first barrier layer 120 is small
In the film-forming region of first substrate layer 111, first substrate layer 111 is kept away in directly contacting with the rigid basement 201
First barrier layer 120 of inorganic material and the rigid basement 201 when laser lift-off (or laser irradiation) are exempted from
Adhesion.The film-forming region on first barrier layer 120 is less than the design of the film-forming region of first substrate layer 111, so that
It when forming flexible base board, avoids that process equipment itself precision is limited, leads to the knot in the marginal portion of the flexible base board 10
There is the Various Complex structure different from layout design in structure, also avoids the flexible base board 10 and removes with rigid basement 201
When the problem of damaging.
As a kind of preferable embodiment, on the basis of the above embodiments, by the rigid basement 201 with it is described
Before the removing of first substrate layer 111, further includes: form the second substrate layer 112 on the surface on first barrier layer 120.
The film-forming region of second substrate layer 112 is greater than the film-forming region on first barrier layer 120 but is less than described
The film-forming region of first substrate layer 111.Or the film-forming region of second substrate layer 112 is greater than or equal to first substrate
The film-forming region of layer 111.
In the present embodiment, the design of second substrate layer 112 further prevents first barrier layer 120 and institute
State the direct contact of rigid basement 201.The setting of second substrate layer 112 can further guarantee the direct and rigidity
The film layer that substrate 201 contacts only has first substrate layer 111 or is only identical with 111 material of the first substrate layer
Film layer.When forming the flexible base board 10, during removing, avoid the flexible base board 10 with rigid basement
The problem of being damaged when 201 removing.
A kind of display device, including flexible base board described in any of the above embodiments 10.The flexible base board 10 can be used for making
Standby smart phone, tablet computer, vehicle audio or other display devices for applying display panel.Such as the flexible base board
10 can be also used for production intelligent advertisement board.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the concept of this application, various modifications and improvements can be made, these belong to the protection of the application
Range.Therefore, the scope of protection shall be subject to the appended claims for the application patent.
Claims (10)
1. a kind of flexible base board characterized by comprising
First substrate layer (111)；And
First barrier layer (120) is set to the surface of first substrate layer (111), the film forming of first barrier layer (120)
Region is less than the film-forming region of first substrate layer (111).
2. flexible base board according to claim 1, which is characterized in that further include:
Second substrate layer (112) is set on first barrier layer (120), the film-forming region of second substrate layer (112)
Film-forming region greater than first barrier layer (120) but the film-forming region less than first substrate layer (111).
3. flexible base board according to claim 1, which is characterized in that further include:
Second substrate layer (112) is set on first barrier layer (120), and the second substrate layer (112) film-forming region is big
In or be equal to first substrate layer (111) film-forming region.
4. flexible base board according to any one of claim 1-3, which is characterized in that further include:
Boundary portion (113), the boundary portion (113) contact with first substrate layer (111), stop to limit described first
Layer (120) is within the cavity that the boundary portion (113) and first substrate layer (111) are formed.
5. flexible base board according to claim 4, which is characterized in that the extending direction of the boundary portion (113) with it is described
The film forming direction of first substrate layer (111) is arranged at an angle, and the certain angle is 45 ° -135 °；Preferably, the boundary
The film forming direction of the extending direction in limit portion (113) and first substrate layer (111) is in 90 ° of settings.
6. flexible base board according to claim 4, which is characterized in that first barrier layer (120) is in first lining
The projecting edge of bottom (111) is in the edge of first substrate layer (111)；
Preferably, first barrier layer (120) is in the projecting edge of first substrate layer (111) in first substrate
10um-20um in the edge of layer (111).
7. flexible base board according to claim 6, which is characterized in that the thickness of first substrate layer (111) and described
The thickness of second substrate layer (112) is all larger than the thickness of first barrier layer (120)；
Preferably, the thickness of first substrate layer (111) is equal to the thickness of second substrate layer (112).
8. a kind of preparation method of flexible base board characterized by comprising
It provides rigid basement (201)；
The first substrate layer (111) are formed on the surface of the rigid basement (201)；
The first barrier layer (120) are formed on the surface of first substrate layer (111), the film forming of first barrier layer (120)
Region is less than the film-forming region of first substrate layer (111)；
The rigid basement (201) and first substrate layer (111) are removed, to form flexible base board (10).
9. the preparation method of flexible base board according to claim 8, which is characterized in that by the rigid basement (201)
Before first substrate layer (111) removing, further includes:
The second substrate layer (112) are formed on the surface of first barrier layer (120)；The film forming of second substrate layer (112)
Region is greater than the film-forming region of first barrier layer (120) but is less than the film-forming region of first substrate layer (111)；Or
The film-forming region of second substrate layer (112) is greater than or equal to the film-forming region of first substrate layer (111).
10. a kind of display device, which is characterized in that including flexible base board of any of claims 1-7 (10).
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