JP2016043638A5 - - Google Patents
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- JP2016043638A5 JP2016043638A5 JP2014171059A JP2014171059A JP2016043638A5 JP 2016043638 A5 JP2016043638 A5 JP 2016043638A5 JP 2014171059 A JP2014171059 A JP 2014171059A JP 2014171059 A JP2014171059 A JP 2014171059A JP 2016043638 A5 JP2016043638 A5 JP 2016043638A5
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- brittle material
- material substrate
- horizontal plane
- pair
- stages
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- 239000000758 substrate Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 16
- 239000002313 adhesive film Substances 0.000 claims description 6
Description
上記課題を解決するため、本発明は、脆性材料基板をあらかじめその一方主面側に形成されてなるスクライブラインからのクラック伸展によって分断するブレーク装置であって、円形環状の枠体に粘着フィルムが張設されてなりかつ前記脆性材料基板の前記一方主面側を前記粘着フィルムに貼付させてなる基板保持部材が、前記枠体の形状に合わせて設けられた円形の開口部と前記枠体の内側端部とを一致させる態様にて上面に載置される支持テーブルと、前記開口部において水平面内に移動自在とされてなるとともに、水平面内において互いに離隔して設けられてなり、分断に際し前記脆性材料基板の分断予定位置を互いの間隙の形成位置と一致させる態様にて前記粘着フィルムを介して前記脆性材料基板を下方から支持する一対のステージと、前記一対のステージとともに水平面内に移動自在とされてなるとともに、前記基板保持部材が前記支持テーブル上に載置された状態において前記脆性材料基板の他方主面側の分断予定位置に当接可能に設けられた押刃と、前記一対のステージのそれぞれに対し、水平面内において所定の角度をなして付設されてなり、前記一対のステージとともに前記脆性材料基板を下方支持する補助支持バーと、を備えることを特徴とする。 In order to solve the above-mentioned problems, the present invention is a break device for dividing a brittle material substrate by crack extension from a scribe line formed in advance on one main surface side thereof, and an adhesive film is provided on a circular annular frame. A substrate holding member that is stretched and has the one main surface side of the brittle material substrate attached to the adhesive film includes a circular opening provided in accordance with the shape of the frame and the frame The support table placed on the upper surface in a manner to match the inner end, and the opening is movable in a horizontal plane at the opening, and is provided separately from each other in the horizontal plane. A pair of stays that support the brittle material substrate from below via the adhesive film in a manner in which the planned cutting position of the brittle material substrate coincides with the position at which the gap is formed. And in a state where the substrate holding member is placed on the support table, abuts against a planned cutting position on the other main surface side of the brittle material substrate. An auxiliary support bar for supporting the brittle material substrate downward together with the pair of stages, and a pressing blade provided in a possible manner and attached to each of the pair of stages at a predetermined angle in a horizontal plane; It is characterized by providing.
本発明は、前記のブレーク装置であって、前記補助支持バーが、前記水平面内において回動自在に設けられてなり、前記開口部に当接した場合には当該当接状態を保ちつつ付設された前記ステージの側に折りたたまれる、こととしてもよい。 The present invention is the break device described above , wherein the auxiliary support bar is rotatably provided in the horizontal plane, and is attached while maintaining the contact state when contacting the opening. It may be folded on the side of the stage.
本発明は、前記のブレーク装置であって、前記補助支持バーが前記開口部と当接しない非当接状態にあるときには自然長となり、前記補助支持バーが前記当接状態にあるときに伸張するように設けられてなることによって前記補助支持バーの回動動作を拘束する拘束バネ、をさらに備えることとしてもよい。 The present invention is the break device described above , wherein when the auxiliary support bar is in a non-contact state where the auxiliary support bar is not in contact with the opening, the length becomes natural, and when the auxiliary support bar is in the contact state, the breaker extends. It is good also as providing further the restraint spring which restrains rotation operation | movement of the said auxiliary | assistant support bar by being provided in this way.
本発明は、前記のブレーク装置であって、前記脆性材料基板の直径をＤとし、前記補助支持バーが前記開口部と当接しない非当接状態にあるときの分断対象位置から前記補助支持バーの先端までの水平面内における垂直距離をＹとするとき、Ｙ＞Ｄ／２である、こととしてもよい。 The present invention is the above-described break device, wherein the diameter of the brittle material substrate is D, and the auxiliary support bar from the position to be divided when the auxiliary support bar is in a non-contact state where it does not contact the opening. when the vertical distance in the horizontal plane to the tip and Y, Y> is D / 2, it is also possible.
本発明によれば、分断対象位置が脆性材料基板のどの位置であるかによらず、脆性材料基板を好適に分断することができる。 According to the present invention, a brittle material substrate can be suitably divided regardless of which position of the brittle material substrate is the position to be divided.
特に、本発明によれば、当接状態になったとしても、補助支持バーと支持テーブルとが干渉することはない。 In particular, according to the present invention, the auxiliary support bar and the support table do not interfere with each other even if the contact state occurs.
特に、本発明によれば、補助支持バーが当接状態から非当接状態に復帰するときに、その姿勢を速やかに戻すことができる。 In particular, according to the present invention, when the auxiliary support bar returns from the contact state to the non-contact state, the posture can be quickly returned.
Claims (1)
円形環状の枠体に粘着フィルムが張設されてなりかつ前記脆性材料基板の前記一方主面側を前記粘着フィルムに貼付させてなる基板保持部材が、前記枠体の形状に合わせて設けられた円形の開口部と前記枠体の内側端部とを一致させる態様にて上面に載置される支持テーブルと、
前記開口部において水平面内に移動自在とされてなるとともに、水平面内において互いに離隔して設けられてなり、分断に際し前記脆性材料基板の分断予定位置を互いの間隙の形成位置と一致させる態様にて前記粘着フィルムを介して前記脆性材料基板を下方から支持する一対のステージと、
前記一対のステージとともに水平面内に移動自在とされてなるとともに、前記基板保持部材が前記支持テーブル上に載置された状態において前記脆性材料基板の他方主面側の分断予定位置に当接可能に設けられた押刃と、
前記一対のステージのそれぞれに対し、水平面内において所定の角度をなして付設されてなり、前記一対のステージとともに前記脆性材料基板を下方支持する補助支持バーと、
を備えることを特徴とするブレーク装置。 A break device for dividing a brittle material substrate by crack extension from a scribe line formed on one main surface side in advance,
An adhesive film is stretched on a circular annular frame, and a substrate holding member formed by attaching the one main surface side of the brittle material substrate to the adhesive film is provided in accordance with the shape of the frame. A support table placed on the upper surface in a manner to match the circular opening and the inner end of the frame,
The opening is movable in a horizontal plane and is provided apart from each other in the horizontal plane, and in the aspect of dividing the brittle material substrate at the position where the brittle material substrate is divided coincides with the position where the gap is formed. A pair of stages for supporting the brittle material substrate from below via the adhesive film;
It is movable in a horizontal plane together with the pair of stages, and can come into contact with the planned cutting position on the other main surface side of the brittle material substrate when the substrate holding member is placed on the support table. A provided blade,
An auxiliary support bar that is attached to each of the pair of stages at a predetermined angle in a horizontal plane, and supports the brittle material substrate downward together with the pair of stages,
A break device comprising:
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014171059A JP6446912B2 (en) | 2014-08-26 | 2014-08-26 | Break device |
| KR1020150047233A KR102351929B1 (en) | 2014-08-26 | 2015-04-03 | Breaking apparatus |
| CN201510177779.9A CN106142369B (en) | 2014-08-26 | 2015-04-15 | Disconnecting device |
| TW104116538A TWI654063B (en) | 2014-08-26 | 2015-05-22 | Breaking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014171059A JP6446912B2 (en) | 2014-08-26 | 2014-08-26 | Break device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016043638A JP2016043638A (en) | 2016-04-04 |
| JP2016043638A5 true JP2016043638A5 (en) | 2017-08-17 |
| JP6446912B2 JP6446912B2 (en) | 2019-01-09 |
Family
ID=55540184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014171059A Active JP6446912B2 (en) | 2014-08-26 | 2014-08-26 | Break device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6446912B2 (en) |
| KR (1) | KR102351929B1 (en) |
| CN (1) | CN106142369B (en) |
| TW (1) | TWI654063B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI797154B (en) * | 2018-01-31 | 2023-04-01 | 日商三星鑽石工業股份有限公司 | Film peeling mechanism and substrate breaking system |
| TW202041343A (en) * | 2018-12-18 | 2020-11-16 | 日商三星鑽石工業股份有限公司 | Method for fabricating ceramic chip and chip of prior to plastic working for ceramic chip fabricating |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004026539A (en) * | 2002-06-24 | 2004-01-29 | Nakamura Tome Precision Ind Co Ltd | Method and apparatus for cutting glass substrate |
| JP4589201B2 (en) * | 2005-08-23 | 2010-12-01 | 株式会社ディスコ | Substrate cutting equipment |
| KR100748305B1 (en) * | 2006-03-02 | 2007-08-09 | 삼성에스디아이 주식회사 | Transferring mehtod for full cutted substrate |
| US20100175834A1 (en) * | 2009-01-13 | 2010-07-15 | Shin-Kan Liu | Wafer splitting laminate mechanism |
| TWI508153B (en) * | 2010-04-30 | 2015-11-11 | Mitsuboshi Diamond Ind Co Ltd | Disconnection device and disconnection method of brittle material substrate |
| JP5182339B2 (en) * | 2010-08-31 | 2013-04-17 | 三星ダイヤモンド工業株式会社 | Substrate break device |
| JP5187421B2 (en) * | 2010-11-30 | 2013-04-24 | 三星ダイヤモンド工業株式会社 | Breaking method for brittle material substrate |
| KR101217398B1 (en) * | 2011-02-25 | 2013-01-02 | 앰코 테크놀로지 코리아 주식회사 | Apparatus for Dicing Wafer and Method for Dicing Wafer by using the same |
| JP5589899B2 (en) * | 2011-03-03 | 2014-09-17 | 株式会社デンソー | Substrate dividing method and dividing apparatus |
| JP2013071335A (en) * | 2011-09-28 | 2013-04-22 | Mitsuboshi Diamond Industrial Co Ltd | Method for dicing mother substrate |
| JP6039363B2 (en) * | 2012-10-26 | 2016-12-07 | 三星ダイヤモンド工業株式会社 | Method and apparatus for dividing brittle material substrate |
-
2014
- 2014-08-26 JP JP2014171059A patent/JP6446912B2/en active Active
-
2015
- 2015-04-03 KR KR1020150047233A patent/KR102351929B1/en active IP Right Grant
- 2015-04-15 CN CN201510177779.9A patent/CN106142369B/en active Active
- 2015-05-22 TW TW104116538A patent/TWI654063B/en active
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