JP2004026539A - Method and apparatus for cutting glass substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of cutting a substrate by which scribing and breaking are simultaneously and continuously carried out by a simple structural apparatus and the apparatus. <P>SOLUTION: In the method of cutting the substrate such as a glass substrate, the breaking is carried out at the same time when stress is loaded from one surface of the substrate with a pressing edge and a scribe line is drawn on another surface of the substrate opposed to the pressing edge by a scribing means such as scribing cutter. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for cleaving a substrate such as a glass substrate widely used in liquid crystal displays and the like.
[0002]
[Prior art]
Conventionally, a substrate such as a glass substrate employs a cutting method in which a predetermined scribe line (partition line) is engraved, and then a break is applied along the scribe line by applying impact or bending stress.
FIG. 3 shows an example of the conventional configuration.
As shown in FIG. 3A, the substrate 1 is placed on the surface plate 102, and a scribe line 1a is formed by a scribe cutter 103 from above.
Next, as shown in FIG. 3 (b), the substrate with the scribe line is transferred to a breaker, and the platen 104 and the platen 105 are bent starting from the scribe line of the substrate to cut the substrate. Was.
Alternatively, the substrate is turned over so that the scribe line is located on the lower side, and the substrate is cut by applying a beating impact from the back side of the scribe line with a holding blade.
[0003]
In such a conventional cleaving method, first, a substrate is placed on a surface plate of a scribe device, a scribe line is carved by a scribe cutter, and this substrate is transferred to another break device to break. Since such a substrate cutting method is adopted, there is a technical problem that the positioning adjustment of the substrate is difficult, the structure of the apparatus becomes complicated, and the process becomes long.
[0004]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION An object of the present invention is to provide a method for cleaving a substrate and a device capable of performing scribe and break simultaneously or continuously with a device having a simple structure and a device therefor.
[0005]
[Means for Solving the Problems]
The technical gist of the method for cleaving a substrate according to the present invention is that, as described in claim 1, in the method for cleaving a substrate such as a glass substrate, stress is applied from one surface of the substrate by a holding blade. In this state, a scribe line such as a scribe cutter is inserted into another surface on the opposite side of the substrate, and at the same time, a break occurs.
[0006]
In this manner, when the scribe cutter is run from the back side in a state where the substrate is pressed by the pressing blade so that bending stress is generated on the substrate, that is, the substrate is bent, stress is applied to the substrate. Therefore, it works so as to break at the same time starting from the scribe line to be engraved.
This cleaving method is effective for a so-called single-plate cleaving method composed of one glass substrate.
[0007]
The invention according to claim 2 aims at providing an apparatus suitable for the cutting method, wherein the scribe cutter faces upward from below, and includes a scribe cutter and platens on both sides of the scribe cutter. In the state where a substrate such as a glass substrate was placed so as to straddle between the platens on both sides, a cleaving device provided with a holding blade for pressing the upper surface of the substrate from above was used.
[0008]
By using the cleaving apparatus having the above-described configuration, a substrate such as a glass substrate is placed so as to straddle between the surface plates as described in claim 3, and the upper surface of the substrate is pressed from above. In a state where the substrate is supported by a blade, a scribe line may be formed on the lower surface of the substrate from below using a scribe cutter or the like, and then the substrate may be pressed by a holding blade to continuously break.
[0009]
The cutting method according to claim 3 is characterized in that a scribe line is inserted into a first lower substrate of a so-called laminated substrate in which two glass substrates such as a liquid crystal substrate are overlapped, and then a continuous pressing is performed. It is suitable for a cutting method in which a break is caused by applying a pressing or hitting impact with a blade.
It is needless to say that the cleaving method according to the third aspect is not intended to be limited to the stacked substrate, but can be applied to a single plate.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Preferred embodiments of the present invention will be described below with reference to the drawings.
As shown in FIG. 1A, the surface plates 2a and 2b are arranged horizontally, and a scribe means such as a scribe cutter 3 is provided between them.
As the surface plates 2a and 2b, two surface plates may be provided side by side, or an insertion portion of a scribe cutter may be formed in one surface plate.
The glass substrate 1 is placed so as to straddle (bridge) between the surface plates 2a and 2b.
The substrate 1 is pressed from above by the holding blade 4 so as to generate bending stress.
Next, the scribe cutter 3 is raised from the lower side, and scribe traveling is performed on the back side of the substrate.
An enlarged schematic diagram at that time is shown in FIG.
Since a bending stress is applied to the substrate 1, when the vehicle 1 is run with a scribe cutter applied from below, the break 11 is started from the scribe line as it is.
Thereby, the scribe and the break proceed simultaneously.
[0011]
FIG. 2 schematically shows a method in which a scribe line is inserted in advance, and then a break is continuously made.
As shown in FIG. 2 (a), an overlapped substrate composed of the substrates 12 and 13 is placed between the surface plates 2a and 2b, and the holding blade 4 provided on the upper part is lowered so that bending stress is not applied to the substrate. Contact lightly.
In such a state, the scribe cutter 3 provided on the lower side is lifted and run, and a scribe line is inserted.
At this time, since the upper surface of the substrate is supported by the holding blade, the scribe line 14 can be stably carved.
Next, as shown in FIG. 2B, the scribe cutter 4 is lowered and retracted, pressed by the holding blade 4, and a break 15 can be continuously generated by applying a bending stress.
[0012]
【The invention's effect】
In the present invention, two platens or a platen is provided with a concave portion and scribing means is provided from the bottom to the top, the substrate is placed on the platen, and the bending stress is reduced by the holding blade from the top. Since the substrate cutting apparatus has a configuration in which the holding blade is arranged so as to be added, it is possible to break at the same time by scribing in a state where bending stress is applied to the substrate by the holding blade.
In addition, the substrate is supported from above by the presser blade, and scribed by a scribe cutter from below, so that a scribe line can be stably inserted, and then a continuous break can be performed.
Therefore, scribing and breaking can be performed simultaneously or continuously by one inexpensive device having a simple structure, the production tact is shortened as compared with the related art, and the quality can be easily formed.
Further, by inserting a scribe line from below, it is possible to prevent a problem caused by glass powder called cullet.
[Brief description of the drawings]
FIG. 1 shows an example of a substrate cutting method according to the present invention, in which a scribe and a break proceed simultaneously.
FIG. 2 shows an example of a processing method according to the present invention in which a break is continuously made after a scribe line is inserted.
FIG. 3 shows an example of a conventional scribe and break process.
[Explanation of symbols]
1, 12, 13 Substrates 2a, 2b Surface plate 3 Scribe cutter 4 Holding blade 14 Scribe line 11, 15 Break line

Claims (3)

In a method for cleaving a substrate such as a glass substrate, a scribe line is scribed by a scribe means such as a scribe cutter on another surface on the opposite side of the substrate while stress is applied from one surface of the substrate by a holding blade. A method for cleaving a substrate, characterized in that a break is made at the same time as the insertion. With the scribe cutter facing upward from below, a scribe cutter and a platen on both sides of the scribe cutter are provided, and a substrate such as a glass substrate is placed so as to extend between the platens on both sides. And a pressing blade for pressing the upper surface of the substrate from above. A substrate such as a glass substrate is placed so as to straddle between the surface plates, and the upper surface of the substrate is supported from above by a presser blade. And then breaking by pressing with the presser blade.

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