JP2004026545A - Apparatus for cutting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To continuously carry out scribing and breaking with one set of an apparatus with the prevention of the occurrence of cullet deficiency in the scribing. <P>SOLUTION: The scribing and breaking apparatus for a substrate such as a glass substrate is provided with a surface plate on which the substrate is placed and a scribe cutter to face toward the upper part from the under side of the surface plate by providing a scribe cutter arranging hole on the surface plate. A press edge for pressing and supporting the substrate is provided on the upper part of the surface plate and a surface plate bending part is provided on a part of the surface plate. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a glass substrate scribing and break processing apparatus widely used for a liquid crystal display or the like.
[0002]
[Prior art]
A glass substrate widely used for a liquid crystal display or the like is used after being cut into a required size.
In addition, the liquid crystal substrate has a structure in which two glass substrates are stacked, and liquid crystal is sealed between them.With a predetermined wiring, etc., a large number of display elements are formed in a matrix and cut into a predetermined size. Processed and produced.
[0003]
Conventionally, as a method for cutting a substrate such as a glass substrate, as shown in FIG. 3, the substrate 1 is placed on a surface plate of a scribe machine 102, and a scribe line is cut from the top with a scribe cutter 106 or the like. Then, the substrate 1 is transferred to the breaker 112 by the transfer device 104, and the substrate 1 is broken (cut) along the scribe line by applying a beating impact or bending stress from above to the presser blade 103. .
However, in the method of forming a scribe line from above using a scribe cutter or the like, cullet is generated on the surface of the substrate, and the surface quality of the substrate is deteriorated.
Also, if the scribe line is not carved at a uniform depth, it will adversely affect the break quality, so that high precision is required for the flatness of the surface plate.
In addition, a scribe machine and a break machine are separately provided, and a transport device for transferring a substrate between them is required, so that the process is long and the production tact is long.
There was a technical problem that the installation space for the device was large.
[0004]
[Problems to be solved by the invention]
The present invention solves the technical problems inherent in the above-described conventional technology, prevents the occurrence of cullet defects during scribe processing, and provides a scribe and break processing apparatus capable of performing scribe and break processing continuously with one apparatus. For the purpose of providing.
[0005]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a device for scribing and breaking a substrate such as a glass substrate, and a platen on which the substrate is placed, and a plate provided with a scribe cutter provided in the platen to form a platen. A scribe cutter was provided so as to face from the bottom to the top. A holding blade for holding and supporting the substrate was provided at the top of the base, and a bent part of the base was provided at a part of the base.
[0006]
In this way, when the substrate is placed on the surface plate, scribing lines are inserted from below using a scribe cutter, etc., so that chips from the glass fall down and defects due to cullet occur. It becomes difficult to do.
In addition, when the scribe line is inserted from the bottom to the back of the substrate, the substrate is supported by the presser blade from the upper surface, so that high precision is not required for the surface plate and the scribe quality is stable. I do.
[0007]
A part of the surface plate is equipped with a platen bending part, so that bending stress can be applied along the scribe line of the substrate while the substrate is being sucked to the surface plate by suction means such as vacuum suction. That is, the scribe mechanism and the break mechanism can be incorporated into one device with a simple structure.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Preferred embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 shows a main part configuration diagram of a substrate scribe / break processing apparatus according to the present invention.
As shown in FIG. 1A, when the substrate 1 is placed on the surface plate 2 of the processing apparatus, the substrate moves forward and is installed above the scribe cutter arrangement holes 4 provided on the surface plate.
A press blade 3 is provided above the scribe cutter arrangement hole 4 so as to descend and press and support the surface of the substrate.
FIG. 2A shows a cross-sectional main part of this portion.
A scribe cutter 6 is provided in the scribe cutter arrangement hole 4 of the surface plate so as to be able to ascend, descend and travel along the substrate.
The holding blade 3 descends from the upper surface of the substrate, and the scribe cutter 6 travels on the back surface of the substrate from below to insert the scribe line 7 from the lower side while holding the substrate lightly.
[0009]
The substrate on which the scribe line 7 has entered moves above the platen bending portion 5 as shown in FIG.
FIG. 2B shows an essential part of the cross section of this portion.
A part of the surface plate can be bent.
Although not shown, the platen is provided with a suction means or the like, and a bending stress is applied to the substrate in accordance with the bending operation of the platen.
Thereby, the substrate is broken 8 along the scribe line 7.
[0010]
【The invention's effect】
In the present invention, the scribe line is inserted from the back surface (lower surface) of the substrate, so that problems caused by cullet generation can be prevented. It becomes a highly productive device.
In addition, when the scribe line is inserted from the lower surface into the substrate, the substrate is held by the presser blade from the upper part, so the scribe quality can be improved even if the accuracy of the platen on which the substrate is placed is not high compared to the conventional method. Since it is more stable, the device can be manufactured at low cost.
[Brief description of the drawings]
FIG. 1 shows a substrate scribe and break device according to the present invention.
FIG. 2 shows a state of scribe and break processing.
FIG. 3 shows a conventional scribe and break machine.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate 2 Surface plate 3 Holding blade 4 Scribe cutter arrangement hole 5 Surface plate bent part 6 Scribe cutter 7 Scribe line 8 Break line

Claims (1)

In a scribe and break processing apparatus for a substrate such as a glass substrate, a platen on which a substrate is placed, and a scribe cutter provided with a scribe cutter arrangement hole on the platen so that the scribe cutter faces upward from the bottom of the platen. A scribing / breaking apparatus for a substrate, comprising: a presser blade for pressing and supporting a substrate on an upper portion of the platen; and a bent portion of the platen on a part of the platen.

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