JP2014083821A - Method and apparatus for segmenting brittle material substrate - Google Patents

Method and apparatus for segmenting brittle material substrate Download PDF

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JP2014083821A
JP2014083821A JP2012236572A JP2012236572A JP2014083821A JP 2014083821 A JP2014083821 A JP 2014083821A JP 2012236572 A JP2012236572 A JP 2012236572A JP 2012236572 A JP2012236572 A JP 2012236572A JP 2014083821 A JP2014083821 A JP 2014083821A
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substrate
adhesive film
brittle
blade
scribe line
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JP6039363B2 (en
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Kenji Murakami
健二 村上
Masakazu Takeda
真和 武田
Tomoko Kinoshita
知子 木下
kenta Tamura
健太 田村
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Mitsuboshi Diamond Industrial Co Ltd
三星ダイヤモンド工業株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for segmenting a substrate which allow reducing the push-in depth of an upper blade in breaking.SOLUTION: The operation procedures of a method and an apparatus for segmenting a substrate comprise: adhering a brittle material substrate W to the lower surface of an elastic adhesive film 2 supported by a dicing ring 1; forming a plurality of scribe lines S in the lower surface of the substrate W; bringing a pair of receiving blades 4 and 4 into contact with the parts of the lower surface of the substrate W at right and left positions bridging over the scribe line S to be segmented; arranging an upper blade 6 at portions opposed to the scribe lines S in the surface opposite to the surface on which the scribe lines S of the substrate W are formed; and breaking the substrate W along the scribe lines S by pressing the upper blade 6 to the substrate W from over the adhesive film 2 to produce a three-point bending moment. In breaking with the upper blade 6, the substrate W is arranged at positions where the receiving blades 4 and 4 push up the adhesive film 2 so as to produce a downward tensile force in the adhesive film 2 supporting the substrate W and broken.

Description

本発明は、ガラス、シリコン、アルミナ、セラミック、化合物半導体等の脆性材料からなる基板の分断方法、分断装置に関する。特に本発明は、基板上に形成した複数条のスクライブラインに沿って短冊状あるいは格子状に基板を分断してチップ等の製品に分断する方法並びにその分断装置に関する。   The present invention relates to a method and apparatus for dividing a substrate made of a brittle material such as glass, silicon, alumina, ceramic, and a compound semiconductor. In particular, the present invention relates to a method of dividing a substrate into strips or lattices along a plurality of scribe lines formed on the substrate and dividing the substrate into products such as chips, and a cutting apparatus therefor.
従来より、脆性材料基板に対して、ダイシングソー、カッターホイール、レーザビームを用いて、複数条のスクライブラインを形成し、その後に、外力を印加して基板を撓ませてスクライブラインに沿ってブレイクすることにより、チップ等の単位製品を取り出す方法が知られている(例えば特許文献1、特許文献2等)。   Conventionally, multiple scribe lines are formed on a brittle material substrate using a dicing saw, cutter wheel, and laser beam, and then the substrate is bent by applying external force to break along the scribe line. Thus, a method of taking out a unit product such as a chip is known (for example, Patent Document 1, Patent Document 2, etc.).
脆性材料基板に対し、スクライブラインに沿って曲げモーメントを加えてブレイクする際、曲げモーメントを効果的に生じさせるために、上記特許文献等に示すような3点曲げ方式にて行うのが好ましい。
図3は、表面に多数の電子部品(微細な電子回路)が形成されたアルミナ基板やLTCC基板(低温焼成セラミックス基板)を3点曲げ方式でブレイクして電子部品を取り出す一般的なブレイク工程を示すものである。
表面に多数の電子部品が形成され、その電子部品形成面を保護テープ11で被覆した基板Wを、ダイシングリング12に支持された弾力性のある粘着フィルム13の下面に保護テープ11を下向きにして貼り付ける。基板Wの電子部品形成面には前工程で複数条のスクライブラインSが形成されており、このスクライブラインSを跨いでその左右位置で基板Wの下面を受ける一対の受刃14が配置されている。基板WのスクライブラインSを設けた面とは反対側の面でスクライブラインSに相対する部位の上方には上刃15が配置されている。この上刃15を粘着フィルム13の上方から基板Wに押圧させることによって、基板Wを撓ませてスクライブラインSからブレイクしている。
なお、スクライブラインSから正確にブレイクするために、基板Wには上刃15との位置合わせ用のアライメントマークが設けられており、撮像装置(不図示)で基板Wの表面を撮像することで、撮像されたアライメントマークを参照してブレイク位置の位置決めを行っている。この撮像装置による位置決めは、アライメントマークに代えて、スクライブライン自体を参照して位置決めを行う場合もある。
When a brittle material substrate is broken by applying a bending moment along a scribe line, it is preferable to use a three-point bending method as shown in the above-mentioned patent document in order to effectively generate a bending moment.
FIG. 3 shows a general break process in which an alumina substrate or LTCC substrate (low temperature fired ceramic substrate) having a large number of electronic components (fine electronic circuits) formed on the surface is broken by a three-point bending method to take out the electronic components. It is shown.
A large number of electronic components are formed on the surface, and the substrate W having the electronic component forming surface covered with the protective tape 11 is placed on the lower surface of the elastic adhesive film 13 supported by the dicing ring 12 with the protective tape 11 facing downward. paste. A plurality of scribe lines S are formed on the electronic component forming surface of the substrate W in the previous step, and a pair of receiving blades 14 are arranged to receive the lower surface of the substrate W at the left and right positions across the scribe line S. Yes. An upper blade 15 is disposed above a portion facing the scribe line S on the surface opposite to the surface on which the scribe line S is provided on the substrate W. By pressing the upper blade 15 against the substrate W from above the adhesive film 13, the substrate W is bent to break from the scribe line S.
In order to accurately break from the scribe line S, the substrate W is provided with an alignment mark for alignment with the upper blade 15, and the surface of the substrate W is imaged by an imaging device (not shown). The break position is positioned with reference to the imaged alignment mark. Positioning by this imaging apparatus may be performed by referring to the scribe line itself instead of the alignment mark.
特開2011−212963号公報JP 2011-212963 A 特開2010−014945号公報JP 2010-014945 A
基板Wの上面に上刃15を押し当てて上記の3点曲げ方式で基板Wを撓ませてブレイクする場合、上刃15が基板Wの上面に接してからスクライブラインが分断されるまでの一定の押込みストローク(押込み量)が必要である。この押込み量は、例えば厚み0.64mmのアルミナ基板の場合で約0.1mmを必要としている。
上刃15による押込み動作は、1枚の基板に対してスクライブラインの数だけ行われるものであるから、押込み量が大きいと粘着テープに復元しない小さな「シワ」が生じることがある。このような「シワ」が生じると、上記した撮像装置による基板のアライメントに誤差が発生し、正確にスクライブラインSからブレイクすることができない。
また、上刃の押込み量が大きいと、図4に示すように、基板Wの分断端面16の上端縁同士が互いに干渉してこの部分が欠けたりする場合があり、製品の加工品質を大きく損なうことになるといった問題点もある。
When the upper blade 15 is pressed against the upper surface of the substrate W and the substrate W is bent by the above three-point bending method to break, the constant from when the upper blade 15 contacts the upper surface of the substrate W until the scribe line is divided Indentation stroke (indentation amount) is required. For example, in the case of an alumina substrate having a thickness of 0.64 mm, this pushing amount requires about 0.1 mm.
Since the pressing operation by the upper blade 15 is performed by the number of scribe lines for one substrate, if the pressing amount is large, a small “wrinkle” that does not restore to the adhesive tape may occur. When such “wrinkles” occur, an error occurs in the alignment of the substrate by the imaging device described above, and the break from the scribe line S cannot be performed accurately.
Further, when the pushing amount of the upper blade is large, as shown in FIG. 4, the upper end edges of the divided end surface 16 of the substrate W may interfere with each other and this portion may be chipped, which greatly impairs the processing quality of the product. There is also a problem that it will be.
そこで本発明は、上記した従来課題の解決を図り、ブレイク時における上刃の押込み量を低減することが可能な基板分断方法並びに基板分断装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide a substrate cutting method and a substrate cutting device that can solve the above-described conventional problems and can reduce the amount of pressing of the upper blade during a break.
上記目的を達成するために本発明では次のような技術的手段を講じた。すなわち、本発明の基板分断方法では、ダイシングリングに支持された弾力性のある粘着フィルムの下面に脆性材料基板を貼り付け、前記脆性材料基板の開放された下面に複数条のスクライブラインを形成した後、分断すべきスクライブラインを跨いでその左右位置の基板下面に一対の受刃を当接させ、前記脆性材料基板のスクライブラインを設けた面とは反対側の面でスクライブラインに相対する部位に上刃を配置して、該上刃を前記粘着フィルム上方から前記脆性材料基板に押圧することによって、3点曲げモーメントにより脆性材料基板をスクライブラインに沿ってブレイクする基板分断方法であって、前記上刃によるブレイク時に、前記脆性材料基板を保持する前記粘着フィルムが下向きの張力が生じるように、前記一対の受刃が粘着フィルムを押し上げる位置に配置してブレイクするようにしている。   In order to achieve the above object, the present invention takes the following technical means. That is, in the substrate cutting method of the present invention, a brittle material substrate is attached to the lower surface of the elastic adhesive film supported by the dicing ring, and a plurality of scribe lines are formed on the opened lower surface of the brittle material substrate. After that, across the scribe line to be divided, a pair of receiving blades are brought into contact with the lower surface of the substrate at the left and right positions, and the portion opposite to the surface on which the scribe line of the brittle material substrate is provided is opposed to the scribe line. The substrate cutting method is to break the brittle material substrate along a scribe line by a three-point bending moment by placing the upper blade on the adhesive film and pressing the upper blade against the brittle material substrate from above the adhesive film, When the upper blade is broken, the pair of receiving blades are viscous so that the adhesive film holding the brittle material substrate is subjected to downward tension. Disposed in a position to push up the film so that to break.
また、本発明の基板分断装置は、ダイシングリングに支持された弾力性のある粘着フィルムの下面に脆性材料基板が貼り付けられ、前記脆性材料基板の下面に形成された分断すべきスクライブラインを跨いでその左右位置の基板下面に当接する一対の受刃が配置され、前記脆性材料基板の前記分断すべきスクライブラインを設けた面とは反対側の面で当該スクライブラインに相対する部位の上方に上刃が配置され、前記粘着フィルム上方から前記脆性材料基板を前記上刃で押圧することによって、3点曲げモーメントにより前記脆性材料基板をスクライブラインに沿ってブレイクする基板分断装置であって、前記上刃によるブレイク時に、前記脆性材料基板を保持する粘着フィルムが下向きの張力が生じるように、前記一対の受刃が粘着フィルムを押し上げる位置に配置されている構成とした。   Further, the substrate cutting apparatus of the present invention has a brittle material substrate attached to the lower surface of the elastic adhesive film supported by the dicing ring, and straddles the scribe line to be cut formed on the lower surface of the brittle material substrate. A pair of receiving blades that are in contact with the lower surface of the substrate at the left and right positions are disposed above the surface of the brittle material substrate opposite to the surface on which the scribe line to be divided is provided, and above the portion facing the scribe line. A substrate cutting apparatus in which an upper blade is disposed, and the brittle material substrate is broken along a scribe line by a three-point bending moment by pressing the brittle material substrate from above the adhesive film with the upper blade, The pair of receiving blades is attached to the adhesive film so that the adhesive film holding the brittle material substrate is subjected to downward tension when breaking by the upper blade. It has a configuration which is disposed in a position to push up the arm.
本発明によれば、基板を保持する粘着フィルムが、受刃によって持ち上げられて下向きの張力が生じているので、基板は粘着フィルムによって常時スクライブラインを引き裂くような力を受けることになり、その結果、上刃の基板に対する押込み量が小さくてもスクライブラインからブレイクすることが可能となる。したがって、上刃の基板に対する押込み量を従来の方法に比べて低減することができるので、上刃の反復昇降によって粘着フィルムに小さなシワ等の変形が生じるのを抑制することができ、これにより基板の分断位置の位置ずれの発生をなくすことができる。また、上刃の基板に対する押込み量が小さく、しかも粘着フィルムによって基板がスクライブラインから引き裂く方向に引っ張り力を受けているので、ブレイクされたときに、分断端面の上端縁同士が干渉することがなくなり、欠けのない高品質の製品を作製することができるといった効果がある。   According to the present invention, since the adhesive film holding the substrate is lifted by the receiving blade and a downward tension is generated, the substrate receives a force that always tears the scribe line by the adhesive film, and as a result, It is possible to break from the scribe line even if the pressing amount of the upper blade against the substrate is small. Accordingly, the amount of pressing of the upper blade with respect to the substrate can be reduced as compared with the conventional method, so that it is possible to suppress deformation of the adhesive film due to repeated raising and lowering of the upper blade such as small wrinkles. It is possible to eliminate the occurrence of misalignment of the dividing position. In addition, since the amount of pressing of the upper blade against the substrate is small, and the adhesive film receives a pulling force in the direction to tear the substrate from the scribe line, the upper edges of the divided end surfaces do not interfere with each other when broken. There is an effect that it is possible to produce a high-quality product without chipping.
本発明の基板分断装置において、前記受刃が、上下移動可能な移動ステージを介して上下位置調整可能に形成されている構成とするのがよい。
これにより、前記受刃によって持ち上げられる粘着フィルムの持ち上げ量を、分断すべき基板に合わせて適正な位置に微調整することができる。
In the substrate cutting apparatus according to the present invention, it is preferable that the receiving blade is formed so that the vertical position can be adjusted via a movable stage that can move up and down.
Thereby, the lift amount of the adhesive film lifted by the receiving blade can be finely adjusted to an appropriate position according to the substrate to be divided.
分断対象となるアルミナ基板をダイシングリングに支持された粘着フィルム上にマウントした状態を示す斜視図。The perspective view which shows the state which mounted the alumina substrate used as a parting object on the adhesive film supported by the dicing ring. 本発明に係る基板分断装置の断面図。The sectional view of the substrate cutting device concerning the present invention. 従来の3点曲げモーメントによるブレイク工程の一例を示す断面図。Sectional drawing which shows an example of the break process by the conventional 3 point | piece bending moment. 従来の3点曲げモーメントにより基板をブレイクした状態を示す断面図。Sectional drawing which shows the state which broke the board | substrate by the conventional 3 point | piece bending moment.
以下、本発明に係る基板分断方法並びに基板分断装置の詳細を、一実施形態を示す図面に基づいて詳細に説明する。ここでは、複数の電子部品が一体成形されたアルミナ基板をブレイクして電子部品を取り出す場合を例に説明する。   Hereinafter, details of a substrate cutting method and a substrate cutting device according to the present invention will be described in detail with reference to the drawings showing an embodiment. Here, a case where an alumina substrate on which a plurality of electronic components are integrally formed is broken to take out the electronic components will be described as an example.
図1は分断対象となるアルミナ基板が、ダイシングリングに支持された粘着フィルム上にマウントされた状態を示す斜視図であり、図2は本発明に係る基板分断装置の断面図である。   FIG. 1 is a perspective view showing a state in which an alumina substrate to be cut is mounted on an adhesive film supported by a dicing ring, and FIG. 2 is a cross-sectional view of the substrate cutting apparatus according to the present invention.
加工対象となる基板Wは、図1に示すように、ダイシングリング1に支持された粘着フィルム2の粘着面に、電子部品形成面を上向きにした状態で貼り付けられている。この粘着フィルム2は弾性を有する樹脂シート材で形成され、ダイシングリング1に張られた状態で周囲が固着されている。基板Wの電子部品形成面には前工程で複数条のスクライブラインSが加工されており、その表面は保護テープ3により被覆保護されている。ブレイク加工時には保護テープ3が下向きとなるように反転させて下記の基板分断装置の固定ステージ5上にダイシングリング1が載置される。   As illustrated in FIG. 1, the substrate W to be processed is attached to the adhesive surface of the adhesive film 2 supported by the dicing ring 1 with the electronic component forming surface facing upward. The pressure-sensitive adhesive film 2 is formed of an elastic resin sheet material, and the periphery thereof is fixed while being stretched on the dicing ring 1. A plurality of scribe lines S are processed on the electronic component forming surface of the substrate W in the previous step, and the surface thereof is covered and protected by the protective tape 3. At the time of break processing, the dicing ring 1 is placed on the fixed stage 5 of the substrate cutting apparatus described below with the protective tape 3 being inverted so as to face downward.
基板分断装置は、図2に示すように、反転された基板Wの下面に形成されているスクライブラインSを跨いでその左右位置の基板下面を左右一対の受刃4、4と、ダイシングリング1を載置する固定ステージ5と、基板WのスクライブラインSに相対する部位の上方に配置された上刃6とを備えている。受刃4、4は、その上面が平らな面で形成されている。
ダイシングリング1を固定ステージ5上に載置したとき、基板Wを下面に保持する粘着フィルム2が、受刃4、4によって持ち上げられて下向きの張力(弾性復元力)が生じるように、前記一対の受刃4、4の位置が予め設定されている。この持ち上げ量Hは、例えば、ダイシングリング1の内径が250mm、基板Wの厚みが0.64mmの場合に1.3mm程度が好適である。
As shown in FIG. 2, the substrate cutting apparatus has a pair of left and right receiving blades 4, 4 and a dicing ring 1 on the lower surface of the substrate across the scribe line S formed on the lower surface of the inverted substrate W. And an upper blade 6 disposed above a portion of the substrate W facing the scribe line S. The upper surfaces of the receiving blades 4 and 4 are formed as flat surfaces.
When the dicing ring 1 is placed on the fixed stage 5, the adhesive film 2 that holds the substrate W on the lower surface is lifted by the receiving blades 4, 4 so that downward tension (elastic restoring force) is generated. The positions of the receiving blades 4 and 4 are preset. For example, when the inner diameter of the dicing ring 1 is 250 mm and the thickness of the substrate W is 0.64 mm, the lifting amount H is preferably about 1.3 mm.
また、本実施例では、左右の受刃4、4の間隔が調整できるように調整機構(不図示)を介して支持台7に取り付けられている。さらに、支持台7は、移動機構(不図示)によって上下移動可能に形成された移動ステージ8に取り付けられており、これにより受刃4、4の高さ位置が微調整できるように形成されている。   In this embodiment, the support blade 7 is attached via an adjustment mechanism (not shown) so that the distance between the left and right receiving blades 4 and 4 can be adjusted. Further, the support base 7 is attached to a moving stage 8 formed so as to be movable up and down by a moving mechanism (not shown), and is formed so that the height position of the receiving blades 4 and 4 can be finely adjusted. Yes.
なお、図示は省略するが、基板Wには従来と同じように、上刃6との位置合わせ用のアライメントマークが設けられており、撮像装置(不図示)でアライメントマークを撮像することでブレイク位置の位置決めを行ってからブレイクを行う。この場合、アライメントマークを用いずにスクライブライン自体を参照してブレイク位置の位置決めをすることもできる。   Although not shown in the figure, the substrate W is provided with an alignment mark for alignment with the upper blade 6 as in the prior art, and a break is obtained by imaging the alignment mark with an imaging device (not shown). Break after positioning the position. In this case, the break position can be positioned by referring to the scribe line itself without using the alignment mark.
上記のごとく形成された基板分断装置では、上刃6を前記粘着フィルム2の上方から基板Wに押圧することによって、受刃4、4とによる3点曲げモーメントによって基板WをスクライブラインSに沿ってブレイクする。
このブレイク動作の際、基板Wを下面に保持する粘着フィルム2が、受刃4、4によって持ち上げられて下向きの張力が生じているので、基板Wは、粘着フィルム2の図中矢印で示すような外方向への引っ張り力によって常時スクライブラインSを引き裂くような力を受けることになり、その結果、上刃6の基板に対する押込み量が小さくてもスクライブラインSからブレイクすることが可能となる。
In the substrate cutting apparatus formed as described above, the substrate W is moved along the scribe line S by the three-point bending moment by the receiving blades 4 and 4 by pressing the upper blade 6 against the substrate W from above the adhesive film 2. Break.
During the breaking operation, the adhesive film 2 that holds the substrate W on the lower surface is lifted by the receiving blades 4 and 4 and a downward tension is generated, so that the substrate W is indicated by an arrow in the drawing of the adhesive film 2. As a result, a force that always tears the scribe line S is received by the outward pulling force. As a result, even if the amount of pressing of the upper blade 6 against the substrate is small, it is possible to break from the scribe line S.
本発明の効果を実際に確認するため、ダイシングリング1の内径が250mm、基板Wの厚みが0.64mm、粘着フィルム2の持ち上げ量Hが1.3mmの条件でブレイクテストを行った結果、ダイシングリング1に張られた粘着フィルムを水平な姿勢(テンションを与えていない状態)にしてブレイクした場合の上刃押込み量が0.1mmであったのに対し、本発明方法で実施した場合は約半分の0.05mmの押込み量でブレイクすることができた。   In order to actually confirm the effect of the present invention, as a result of performing a break test under the conditions where the inner diameter of the dicing ring 1 is 250 mm, the thickness of the substrate W is 0.64 mm, and the lifting amount H of the adhesive film 2 is 1.3 mm, dicing The upper blade pressing amount when the adhesive film stretched on the ring 1 was broken in a horizontal posture (state where no tension was applied) was 0.1 mm. Breaking was possible with half the amount of indentation of 0.05 mm.
以上のように、本発明によれば、ブレイク時における上刃6の基板Wに対する押込み量を従来手段に比べて略半分程度に低減することができるので、上刃6の反復昇降によって粘着フィルム2に生じる小さなシワ等の変形を抑制することができ、これにより基板の撮像装置による位置合わせ後の位置ずれの発生をなくすことができる。また、上刃6の基板Wに対する押込み量が小さく、しかも粘着フィルム2の外方向への引っ張り力によって基板がスクライブラインSから引き裂く方向に力を受けているので、ブレイクされたときに分断端面の上端縁同士が干渉することがなくなり、欠けのない高品質の製品を作製することができる。   As described above, according to the present invention, the pressing amount of the upper blade 6 with respect to the substrate W at the time of the break can be reduced to about half as compared with the conventional means. The deformation of small wrinkles and the like that occur in the substrate can be suppressed, so that the occurrence of the positional deviation after the alignment by the imaging device of the substrate can be eliminated. Further, since the pressing amount of the upper blade 6 with respect to the substrate W is small, and the substrate receives a force in the direction of tearing the substrate from the scribe line S due to the outward pulling force of the adhesive film 2, The upper edges do not interfere with each other, and a high-quality product without chipping can be produced.
以上本発明の代表的な実施例について説明したが、本発明は必ずしも上記の実施形態に特定されるものではない。例えば、基板Wの電子部品形成面を被覆する保護テープ3は、受刃4、4の上面に設けてもよく、あるいは保護テープ自体を省略することも可能である。また、受刃4、4はスクライブラインSを挟んで基板W下面の一部を受けるようにしてもよい。さらに、加工対象の基板として、本実施例ではアルミナ基板を例にしたが、LTCC基板やガラス基板、シリコン基板であってもよい。
その他本発明では、その目的を達成し、請求の範囲を逸脱しない範囲内で適宜修正、変更することが可能である。
While typical examples of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, the protective tape 3 that covers the electronic component forming surface of the substrate W may be provided on the upper surfaces of the receiving blades 4, 4, or the protective tape itself may be omitted. The receiving blades 4 and 4 may receive a part of the lower surface of the substrate W with the scribe line S interposed therebetween. Furthermore, in the present embodiment, an alumina substrate is taken as an example of a substrate to be processed, but an LTCC substrate, a glass substrate, or a silicon substrate may be used.
Others The present invention can be appropriately modified and changed within the scope of achieving the object and without departing from the scope of the claims.
本発明の分断方法並びに分断装置は、アルミナ基板、LTCC基板、ガラス基板、シリコン、セラミック、化合物半導体等の脆性材料からなる基板の分断に利用される。   The cutting method and the cutting apparatus of the present invention are used for cutting a substrate made of a brittle material such as an alumina substrate, an LTCC substrate, a glass substrate, silicon, a ceramic, and a compound semiconductor.
S スクライブライン
W 基板
1 ダイシングリング
2 粘着フィルム
3 保護テープ
4 受刃
6 上刃
S scribe line W substrate 1 dicing ring 2 adhesive film 3 protective tape 4 receiving blade 6 upper blade

Claims (3)

  1. ダイシングリングに支持された弾力性のある粘着フィルムの下面に脆性材料基板を貼り付け、前記脆性材料基板の開放された下面に複数条のスクライブラインを形成した後、分断すべきスクライブラインを跨いでその左右位置の基板下面に一対の受刃を当接させ、前記脆性材料基板のスクライブラインを設けた面とは反対側の面でスクライブラインに相対する部位に上刃を配置して、該上刃を前記粘着フィルム上方から前記脆性材料基板に押圧することによって、3点曲げモーメントにより脆性材料基板をスクライブラインに沿ってブレイクする基板分断方法であって、
    前記上刃によるブレイク時に、前記脆性材料基板を保持する前記粘着フィルムが下向きの張力が生じるように、前記一対の受刃が粘着フィルムを押し上げる位置に配置してブレイクするようにした基板分断方法。
    A brittle material substrate is attached to the lower surface of the elastic adhesive film supported by the dicing ring, and a plurality of scribe lines are formed on the opened lower surface of the brittle material substrate, and then straddle the scribe lines to be divided. A pair of receiving blades are brought into contact with the lower surface of the substrate at the left and right positions, and an upper blade is disposed on the surface opposite to the surface on which the scribe line of the brittle material substrate is provided and is opposed to the scribe line. A substrate cutting method for breaking a brittle material substrate along a scribe line by a three-point bending moment by pressing a blade against the brittle material substrate from above the adhesive film,
    A substrate cutting method in which the pair of receiving blades are arranged at positions where the adhesive film pushes up the adhesive film so that the adhesive film holding the brittle material substrate is subjected to downward tension when breaking by the upper blade.
  2. ダイシングリングに支持された弾力性のある粘着フィルムの下面に脆性材料基板が貼り付けられ、前記脆性材料基板の下面に形成された分断すべきスクライブラインを跨いでその左右位置の基板下面に当接する一対の受刃が配置され、前記脆性材料基板の前記分断すべきスクライブラインを設けた面とは反対側の面で当該スクライブラインに相対する部位の上方に上刃が配置され、前記粘着フィルム上方から前記脆性材料基板を前記上刃で押圧することによって、3点曲げモーメントにより前記脆性材料基板をスクライブラインに沿ってブレイクする基板分断装置であって、
    前記上刃によるブレイク時に、前記脆性材料基板を保持する粘着フィルムが下向きの張力が生じるように、前記一対の受刃が粘着フィルムを押し上げる位置に配置されている基板分断装置。
    A brittle material substrate is affixed to the lower surface of the elastic adhesive film supported by the dicing ring, and abuts against the lower surface of the substrate in the left-right position across the scribe line formed on the lower surface of the brittle material substrate. A pair of receiving blades are disposed, and an upper blade is disposed above a portion facing the scribe line on the surface opposite to the surface on which the scribe line to be divided of the brittle material substrate is provided, and above the adhesive film A substrate cutting device that breaks the brittle material substrate along a scribe line by a three-point bending moment by pressing the brittle material substrate with the upper blade;
    A substrate cutting apparatus in which the pair of receiving blades are disposed at positions where the adhesive film pushes up the adhesive film so that downward pressure is generated in the adhesive film holding the brittle material substrate when the upper blade breaks.
  3. 前記受刃が、上下移動可能な移動ステージを介して上下位置調整可能に形成されている請求項2に記載の基板分断装置。   The substrate cutting apparatus according to claim 2, wherein the receiving blade is formed so that the vertical position can be adjusted via a movable stage that can move up and down.
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