TWI654063B - Breaking device - Google Patents

Abstract

The present invention provides a breaking device that can well break a brittle material substrate even in the vicinity of an end portion.

The breaking device of the present invention comprises: a support platform which is provided with an adhesive film on a circular annular frame and a substrate holding member for attaching the brittle material substrate to the adhesive film with a circular opening and a frame The inner end portions are placed in a same manner; a pair of stages are equal to the opening portions that are freely movable in the horizontal plane and are spaced apart from each other in the horizontal plane so that the predetermined positions of the breaks are consistent with the positions of the mutual gaps. a state in which a brittle material substrate is supported from below; a pressing blade that moves freely in a horizontal plane together with the stage, and is disposed to be abuttable to a predetermined position on the other main surface side of the brittle material substrate; and an auxiliary support rod Each of the pair of stages is attached to a predetermined angle in a horizontal plane, and supports the brittle material substrate from below together with the pair of stages.

Description

Breaking device

The present invention provides an apparatus for breaking a substrate of a brittle material.

A semiconductor device such as an electronic device or an optical device is usually fabricated by two-dimensionally repeating a circuit pattern constituting the device on a mother substrate such as a semiconductor substrate or the like, which is a circular or rectangular brittle material substrate, and thereafter. The mother substrate after the formation of the device is divided and singulated (wafered) into a plurality of element (wafer) units.

As a method of dividing a brittle material substrate (a singulation of a wafer) such as a semiconductor substrate, it is known that a segmentation line called a dicing street is formed by a blade tip or a laser of a circular wheel or the like as a starting point of division. The scribing is followed by applying a bending stress to the brittle material substrate by a three-point bending method with a break device to cause the crack (crack) to extend from the starting point of the splitting, thereby breaking the substrate (for example, refer to the patent document) 1).

The above-described breaking is generally performed in a state in which a brittle material substrate as a breaking target is attached and fixed to an adhesive surface of an adhesive tape having a tacky shape, and the cutting tape is stretched in a circular ring shape. The frame is the cutting frame.

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-83821

The breaking by the 3-point bending method is usually performed by the following method, that is, The upper blade (pressing blade) is abutted from the upper side in a state where the brittle material substrate is supported by the two lower blades so that the position of the breaking target of the brittle material substrate of the object to be separated is disposed between the two lower blades. Position the object and press it in.

When the brittle material substrate is divided into a plurality of individual pieces, it is of course necessary to divide even in the vicinity of the end portion of the brittle material substrate. Therefore, it is necessary to arrange two lower blades in the vicinity of the end portion. However, when the two lower blades are disposed in the vicinity of the end portion as described above, since the positions supported by the two lower blades are offset from the position of the center of gravity of the brittle material substrate, the adhesive film is scratched by the self-weight of the brittle material substrate. The curved or brittle material substrate cannot be maintained in a horizontal posture, and as a result, there is a case where the breaking cannot be preferably performed.

In addition, although it is also intended to solve the above-mentioned problem by increasing the size of the lower blade, this countermeasure cannot be taken due to interference with the area supporting the cutting frame.

The present invention has been made in view of the above problems, and it is an object of the invention to provide a breaking device that can cut a brittle material substrate well in the vicinity of an end portion.

In order to solve the above problem, the invention of claim 1 is a breaking device characterized in that it breaks a brittle material substrate by stretching a crack from a scribe line previously formed on one main surface side thereof, and includes: a support platform which is provided with an adhesive film on a circular annular frame body, and the one main surface side of the brittle material substrate is attached to the substrate holding member of the adhesive film to conform to the shape of the frame body. The circular opening portion is disposed on the upper surface in conformity with the inner end portion of the frame; the pair of stages are equal to the opening portion and are movable in the horizontal plane and are spaced apart from each other in the horizontal plane. In the case of breaking, the brittle material substrate is supported from below via the adhesive film in such a manner that the predetermined position of the breaking of the brittle material substrate coincides with the position at which the gap is formed, and the pressing blade is coupled to the pair. The stage is movable in the horizontal plane, and is disposed to be in contact with the other main surface side of the brittle material substrate in a state where the substrate holding member is placed on the support platform. a predetermined position; and an auxiliary support rod relative to the pair of stages Each of them is attached at a predetermined angle in a horizontal plane, and supports the above-described brittle material substrate from below together with the pair of stages.

The invention of claim 2 is the breaking device of claim 1, wherein the auxiliary support lever is rotatably disposed in the horizontal plane, and when abutting against the opening portion, the abutting state is maintained while facing The above-mentioned stage side folding is attached.

The invention of claim 3 is the breaking device of claim 2, further comprising a restricting spring that restricts a swirling action of the auxiliary support rod by being disposed in a manner that the auxiliary support rod is not in the above When the opening is in the non-contact state, the opening is a natural length, and the auxiliary support bar is extended when the auxiliary support lever is in the abutting state.

The invention of claim 4, wherein the material of the brittle material substrate is D, and the auxiliary support rod is not in contact with the opening. In the non-contact state, when the vertical distance in the horizontal plane from the position of the breaking object to the front end of the auxiliary support rod is Y, it is Y>D/2.

According to the inventions of claim 1 to claim 4, the brittle material substrate can be preferably separated regardless of the position of the breaking object at any position of the brittle material substrate.

In particular, according to the inventions of claim 2 and claim 3, the auxiliary support bar and the support platform do not interfere even when the contact state is reached.

In particular, according to the invention of claim 3, when the auxiliary support lever is restored to the non-contact state from the abutting state, the posture can be quickly restored.

1‧‧‧Battery material substrate

2‧‧‧Adhesive film

3‧‧‧ frame

100‧‧‧ Breaking device

101a, 101b‧‧‧ stage

102‧‧‧ Pressing blade

103‧‧‧Support platform

End of 103e‧‧ (supporting the opening of the platform)

103h‧‧‧ (support platform) opening

104‧‧‧Auxiliary support rod

104a‧‧‧Installation of the rotating part

104b‧‧‧Apartment

105‧‧‧Restriction spring

110‧‧‧ camera

AR‧‧‧ arrow

D‧‧‧diameter

Y‧‧‧Vertical distance

G‧‧‧(stage) gap

S‧‧‧

Fig. 1 is a cross-sectional view showing a schematic configuration of a breaking device 100 for dividing a brittle material substrate 1.

FIG. 2 is a perspective view of a main part when the breaking device 100 is intended to break the brittle material substrate 1.

Fig. 1 is a cross-sectional view showing a schematic configuration of a breaking device 100 for dividing a brittle material substrate 1. In addition, FIG. 2 is a perspective view of a main part when the breaking device 100 is intended to break the brittle material substrate 1.

As the brittle material substrate 1, a semiconductor substrate (such as a germanium substrate) or a glass substrate or the like is exemplified. A circuit pattern for a predetermined device (for example, a CMOS (complementary metal oxide semiconductor) sensor or the like) may be formed on one of the main surfaces of the semiconductor substrate. In the present embodiment, as shown in FIG. 2, the disk-shaped brittle material substrate 1 is set as a breaking target.

When the brittle material substrate 1 is separated, first, as shown in FIG. 1, the brittle material substrate 1 on which the scribe line S is formed in advance at a predetermined position of one main surface is attached to the adhesive film 2 called a dicing tape. . One of the main faces of the adhesive film 2 is an adhesive face, and the adhesive film 2 is stretched over a circular ring-shaped frame 3 called a cutting frame. That is, the inner side of the casing 3 is a region to which the brittle material substrate 1 can be attached. When the brittle material substrate 1 is attached, the main surface on the side where the scribe line S is formed is brought into contact with the adhesive film 2, and the other main surface is made to be the upper surface. Hereinafter, the adhesive film 2 is stretched over the frame 3, and is collectively referred to as a substrate holding member. Examples of the material of the frame 3 include a metal (aluminum, stainless steel, etc.), a resin, and the like.

Further, in the present embodiment, the disk-shaped brittle material substrate 1 is divided into a plurality of portions to obtain a plurality of single pieces in a short strip shape or a lattice shape. Therefore, as illustrated in FIG. 1 , it is assumed that the scribing lines S are provided at the respective breaking portions. The scribe line S is formed by continuously extending a crack (micro crack) in the thickness direction of the brittle material substrate 1 on one of the main surfaces of the brittle material substrate 1. In Fig. 1, a plurality of predetermined positions for division and a line S are respectively extended in a direction perpendicular to the drawing.

A well-known technique can be applied to the formation of the scribe line S. For example, the cutter wheel (marking wheel) which is formed into a disk shape including a cemented carbide, a sintered diamond, a single crystal diamond, or the like and which has a ridge line functioning as a blade in the outer peripheral portion may be separated. The predetermined position is crimped and rolled to form a scribe line S; or may be formed by dividing the predetermined position by using a diamond pen Forming a line S to form a line S; or forming a scribe line S by ablation by a laser (for example, ultraviolet (UV) laser) or forming a metamorphic layer; The scribe line S is formed by utilizing thermal stress generated by heating and cooling of a laser such as an infrared (IR) laser.

The breaking device 100 includes a pair of stages 101a and 101b which are equal to the vicinity of the position of the breaking target supporting the brittle material substrate 1 from below via the adhesive film 2, and a pressing blade (breaking blade) 102. The brittle material substrate 1 is separated from the position of the breaking object from above; and the support platform 103 supports the frame 3 from below at the time of breaking.

Specifically, the support platform 103 is provided with a circular opening 103h that substantially coincides with the inner diameter of the casing 3, and the pair of stages 101a and 101b are slightly spaced apart so as to form a gap G in the horizontal plane. The center position of the opening portion 103h. Further, the height position of the upper surface of the stage 101a, 101b and the height position of the upper surface of the support platform 103 are set to be the same. Further, the pressing blade 102 is disposed at a position above the stages 101a and 101b so as to be vertically movable in the vertical direction, and its extending direction (blade moving direction) coincides with the longitudinal direction of each of the stages 101a and 101b. More specifically, the gap G formed by the pair of stages 101a and 101b is located vertically below the front end of the pressing blade 102, and the direction in which the gap G extends coincides with the direction in which the blade of the pressing blade 102 moves. Further, as the pressing blade 102, the size in which the blade moving direction is larger than the diameter of the brittle material substrate 1 is used.

Further, the pair of stages 101a and 101b and the pressing blade 102 are driven by a driving mechanism (not shown), and are movable in the horizontal uniaxial direction within the range of the opening 103h of the support platform 103. Thereby, the breaking device 100 can sequentially separate a plurality of different portions of the brittle material substrate 1.

The breaking device 100 further includes an auxiliary support rod 104 and a restriction spring 105.

The auxiliary support bar 104 is attached to each of the pair of stages 101a and 101b in a state of extending in the horizontal direction. The auxiliary support rod 104 is formed in a substantially rod shape, and one end side thereof is rotatably mounted in a horizontal plane with respect to the stages 101a and 101b by the attachment of the rotary portion 104a. In addition, The other end side is provided with an abutting portion 104b. The abutting portion 104b is provided as a result of the movement of the auxiliary support rod 104 in the horizontal plane accompanying the movement of the stages 101a and 101b, and the auxiliary support rod 104 abuts on the end portion of the support platform 103 where the opening portion 103h is formed. In the case of 103e, it actually abuts the end portion 103e. The abutting portion 104b is preferably rotatably disposed in a horizontal plane by a roller or a pulley. Further, the height position of the upper surface of the auxiliary support bar 104 is set to be the same as the height position of the upper surface of the stage 101a, 101b. The auxiliary support bar 104 is provided to assist the support of the brittle material substrate 1 from below by the stages 101a, 101b.

On the other hand, the restricting spring 105 is disposed between the mounting rotary portion 104a and the vicinity of the abutting portion 104b of the auxiliary support rod 104. The restricting spring 105 is provided to limit the swirling motion in the horizontal plane of the auxiliary support rod 104.

Further, the auxiliary support rod 104 attached to the stage 101a, the restriction spring 105 attached thereto, the auxiliary support rod 104 attached to the stage 101b, and the restriction spring 105 attached thereto are arranged in point symmetry relationship with each other. .

More specifically, the auxiliary support lever 104 forms a predetermined angle with respect to the corresponding stages 101a and 101b in a state where the contact portion 104b is not in contact with the end portion 103e of the opening 103h (non-contact state). α (an acute angle) is set to extend in the horizontal direction. Further, the restriction spring 105 is provided in such a manner that it becomes a natural length in the non-contact state. Thereby, in the non-contact state, the posture of the auxiliary support lever 104 is kept substantially fixed. In addition, FIG. 1 illustrates a case where both of the auxiliary support rods 104 are in a non-contact state.

The auxiliary support rod 104 and the restriction spring 105 are provided so that when the diameter of the brittle material substrate 1 is D, the position of the self-disconnecting object (the arrangement position of the pressing blade 102) in the non-contact state is to the abutting portion 104b. The vertical distance Y in the horizontal plane from the front end is Y>D/2.

On the other hand, in a state (abutment state) in which the contact portion 104b abuts against the end portion 103e of the opening portion 103h, the horizontal posture of the auxiliary support lever 104 is in accordance with the positions of the stages 101a, 101b. The difference is that the angle β formed by the auxiliary support rod 104 and the corresponding stages 101a and 101b is smaller than the angle α formed by the two in the non-contact state. For example, in the abutting state, the auxiliary support bar 104 is folded toward the side of the stage 101a or 101b. By achieving this folded state, the auxiliary support bar 104 and the support platform 103 do not interfere even when the contact state is reached. In addition, FIG. 2 exemplifies a case where one of the auxiliary support bars 104 (shown by a solid line) is in an abutting state, and the other (indicated by a broken line) the auxiliary support bar 104 is in a non-contact state. However, in FIG. 2, the pressing blade 102 is abbreviate|omitted for convenience of illustration.

Further, in the abutting state, the restricting spring 105 is extended in accordance with the posture of the auxiliary support lever 104. At this time, the restoring force of the restriction spring 105 acts on the auxiliary support lever 104 as an ability to restore the posture to the original state (the posture in the non-contact state). In the breaking device 100, the posture change of the auxiliary support lever 104 when the transition state is shifted (restored) to the non-contact state is rapidly performed.

Further, the breaking device 100 is provided with a camera 110 for observation under the gap G formed by the pair of stages 101a and 101b. The camera 110 can capture the upper side through the gap G as indicated by an arrow AR in FIG. In the breaking device 100, the arrangement position of one of the stages 101a and 101b and the pressing blade 102 at the time of the breaking is adjusted based on the captured image of the camera 110.

When the brittle material substrate 1 is separated in the breaking device 100 having the above configuration, first, the substrate holding member to which the brittle material substrate 1 is attached is placed such that the brittle material substrate 1 is in the upper side, and the attachable region is attached. It is placed and fixed on the support platform 103 so as to conform to the opening 103h of the support platform 103 (the opening is aligned with the inner end of the frame 3). Further, in a state in which the substrate holding member is placed in this state, the horizontal position of the scribe line S provided at the position where the first division is performed coincides with the position of the gap G formed by the pair of stages 101a and 101b. In this manner, the arrangement positions of the pair of stages 101a and 101b and the pressing blade 102 are adjusted. The captured image of the camera 110 is used in this adjustment.

After adjusting the arrangement positions of the pair of stages 101a and 101b and the pressing blade 102, the pressing blade 102 is lowered from the upper side toward the position where the scribe line S is formed, and the tip end thereof abuts against the brittle material substrate. 1. Further, the pressing blade 102 is lowered by press-fitting. Thereby, the pair of stages 101a and 101b are brought into the lower blade, and the pressing blade 102 is bent at the three points of the upper blade, and the crack is extended from the scribe line S in the thickness direction of the substrate to break the brittle material substrate 1.

When the breaking of the position of a breaking object is completed in this state, the breaking of the position of the next breaking object is performed. Specifically, the substrate holding member is placed in a fixed state, and the horizontal position of the scribe line S provided at the next breaking target position coincides with the position of the gap G formed by the pair of stages 101a and 101b. The arrangement positions of the pair of stages 101a and 101b and the pressing blade 102 are adjusted. Hereinafter, this operation is repeated until the division of all the break target positions is completed.

In this case, for example, as shown in FIG. 1, when the vicinity of the central portion of the brittle material substrate 1 is the position of the separation target (when it is formed at a position where the scribe line S is formed near the central portion), it is attached to The horizontal postures of the auxiliary support bars 104 of each of the pair of stages 101a and 101b are the same. Specifically, each of the two auxiliary support bars 104 is in a state of being non-contact with the end portion 103e of the opening portion 103h. In this case, the brittle material substrate 1 is supported not only by the pair of stages 101a and 101b but also by the auxiliary support rod 104 attached to each of the pair of stages 101a and 101b via the adhesive film 2 from below. status. Thereby, the brittle material substrate 1 is stably supported at the time of breaking.

On the other hand, for example, as shown in FIG. 2, when the vicinity of the end portion of the brittle material substrate 1 is the position to be separated, it is necessary to arrange the pair of stages 101a and 101b at the position of the separation target and arrange them in the opening. Near the end 103e of 103h. FIG. 2 illustrates a case where the stage 101b is close to the end portion 103e. In this case, the auxiliary support rod 104 attached to the stage 101b comes into contact with the end portion 103e to be folded, and does not interfere with the support platform 103. On the other hand, the auxiliary support rod 104 attached to the other stage 101a is kept in a non-contact state to support the brittle material substrate 1 from below. As described above, the auxiliary support rod 104 is disposed in such a manner as to form a relationship of Y>D/2, and therefore the position of the pair of stages 101a, 101b is shifted from the center position of the center of gravity of the brittle material substrate 1, that is, the brittle material substrate. 1 break It will still be steadily supported.

Further, when the contact state is in the contact state, the horizontal posture of the auxiliary support lever 104 changes according to the arrangement position of the pair of stages 101a and 101b, and the abutment position of the abutment portion 104b of the end portion 103e also changes, but When the abutting portion 104b is rotatably provided as described above, the displacement of the abutting position is achieved by the abutting portion 104b abutting on the end portion 103e and rolling, thereby changing the horizontal posture of the auxiliary support rod 104. It also went smoothly.

In the case where the breaking device does not include the auxiliary support bar 104, the support of the brittle material substrate 1 is unbalanced in the case where the pair of stages 101a, 101b are located near the end portion 103e of the opening portion 103h as in Fig. 2 The adhesive film 2 is deflected by the self-weight of the brittle material substrate 1 in a portion away from the stage 101a or 101b, and the brittle material substrate 1 may be floated from the adhesive film 2 in the vicinity of the position of the breaking target due to the influence. And other bad conditions. Further, by the occurrence of the floating, there is a case where the focus cannot be aligned when the camera 110 is photographed, and the position adjustment cannot be performed.

On the other hand, in the breaking device 100 of the present embodiment, the auxiliary support bar 104 is included, whereby the brittle material substrate 1 is stably supported from below regardless of the position of the breaking object, and thus is located at all the positions of the breaking objects. The brittle material substrate 1 can be preferably separated.

As described above, according to the present embodiment, in the breaking device for dividing the brittle material substrate, an auxiliary support rod is attached to the stage as one of the lower blades, and the brittle material substrate is supported not only by the stage at the time of breaking. The auxiliary support bar is also supported from below, whereby the brittle material substrate can be preferably separated regardless of the position of the breaking target substrate as the brittle material substrate. Further, the auxiliary support lever is previously set to be folded toward the stage side when one end portion thereof abuts against the periphery, and a spring that is extended in the abutting state in advance is attached to the auxiliary support lever, thereby assisting the support lever When the self-abutment state returns to the non-abutment state, its posture can be quickly restored.

Claims (3)

A breaking device characterized in that a brittle material substrate is divided by a crack extending from a scribe line formed on a main surface side thereof, and includes: a support platform, which will be in a circular ring shape a frame having an adhesive film on the frame and having the one main surface side of the brittle material substrate attached to the substrate holding member of the adhesive film so as to have a circular opening portion that conforms to the shape of the frame body and the above A state in which the inner end portions of the frame body are aligned is placed on the upper surface; a pair of stages which are equal to the above-mentioned opening portions are freely movable in the horizontal plane, and are disposed apart from each other in the horizontal plane to make the brittleness at the time of breaking The predetermined position of the material substrate is the same as the position at which the gaps are formed, and the brittle material substrate is supported from below via the adhesive film; and the pressing blade moves freely in the horizontal plane together with the pair of stages. And a predetermined position at which the other substrate side of the brittle material substrate can be abutted in a state in which the substrate holding member is placed on the support platform; and an auxiliary support rod; Each of the pair of stages is attached to a predetermined angle in a horizontal plane, and the brittle material substrate is supported from below with the pair of stages; and the auxiliary support rod is rotatably provided in the horizontal plane, In the case of abutting against the opening portion, the abutting state is folded toward the attached stage side. The breaking device of claim 1, further comprising a restricting spring that restricts a swinging motion of the auxiliary support lever by being disposed in a manner that the auxiliary support lever is not in contact with the opening portion In the abutment state, it becomes a natural length, and is extended when the auxiliary support rod is in the abutting state. The breaking device of claim 1 or 2, wherein the diameter of the brittle material substrate is set It is D, and when the auxiliary support rod is in a non-contact state in which the auxiliary support rod is not in contact with the opening portion, the vertical distance in the horizontal plane from the position of the separation target to the front end of the auxiliary support rod is Y, and Y>D/ 2.