TWM571579U - Separation equipment - Google Patents

Abstract

A separating device includes: a base, a carrier carrying a plurality of targets, and an image capturing device, wherein the carrier is driven by the base to deform the carrier, and the target is captured by the image capturing device The position is to determine whether the target is at a predetermined position.

Description

Separation equipment

This creation is directed to a separation apparatus, and more particularly to a separation apparatus for a semiconductor wafer splitting process.

In the conventional semiconductor process, after the wafer is manufactured, the thinning process, the singulation process, the packaging process, and the like are performed. Among them, the singulation process is various, for example, laser cutting, mechanical cutting, splitting and the like.

The 1A to 1C drawings are the single-cutting processes of the conventional splitting separation method. As shown in FIG. 1A, the wafer 9 is first attached to a film 1, and the film 1 is placed on a receiving table (not shown) of the splitting machine. Next, the boring tool 8 of the splitting machine is placed on the back surface A of the groove 90 of the wafer 9, so that the boring tool 8 touches the wafer 9 so that the wafer 9 is along the groove. 90 cracks (such as cracks S) form a plurality of crystal grains 9a. Thereafter, as shown in Fig. 1B, the operation of expanding the film 1 is performed such that the crystal grains 9a are separated by a predetermined distance t. Finally, as shown in FIG. 1C, the edge 1b of the film 1 is cut off, and the crystal grains 9a on the remaining portion 1a of the film 1 are transferred to another carrier (not shown) for performing. Follow-up process.

Under normal circumstances, as shown in Fig. 1B, the film 1 is subjected to an expansion force f to obtain a desired predetermined distance t.

However, in the conventional film expansion operation, since the stress distribution of the film 1 is uneven, A misalignment e is formed between the partial dies 9a, 9b, or the cleavage condition of the trowel 8 at each back surface position A of the wafer 9 is inconsistent, so that part of the back surface position A of the wafer 9 cannot follow the groove. The groove 90 is cracked, so that part of the crystal grains 9b (ie, the wrong distance e) cannot be separated as expected, so in the subsequent film expanding operation, the crystal grains 9b cannot be separated to a predetermined position, that is, at the wrong position, such as the first B. As shown in the figure, the equipment space of the splitting process belongs to the enclosed space, so that it is difficult to find the problem in real time, and the crystal grains 9b need to be transferred to the expected carrier (not shown). The problem of the positional error of 9b is caused by the subsequent scheduled process (on another machine), and all the dies 9a, 9b need to be sent back to the machine of the cleavage process to re-align the aligning process. , which in turn affects the efficiency of overall wafer fabrication.

Therefore, how to overcome the problem of wafer fabrication efficiency of the prior art is an important issue.

In order to solve the above problems of the prior art, the present invention discloses a separating apparatus, comprising: a base; a carrier disposed on the base to carry a plurality of targets; and an image capturing device corresponding to the bearing member The configuration is such that after the carrier is deformed, the position of the target is captured.

In the foregoing separating apparatus, the base system drives the carrier to be displaced to deform the carrier.

In the above separating apparatus, the carrier is a film body. For example, the target is a diced and unseparated semiconductor component, and after the carrier is deformed, each of the targets is separated by a predetermined distance.

In the foregoing separating device, the image capturing device comprises a photoelectric coupling element Pieces.

In the foregoing separating apparatus, the fixing member having an opening is fixed to fix the carrier so that the carrier covers the opening. For example, the fixing member drives the carrier to be displaced to deform the carrier.

In the foregoing separating apparatus, the acting device is further disposed on one side of the carrier to position the object between the base and the acting device. For example, the action device is a splitting device.

It can be seen from the above that the separation device of the present invention mainly adopts the design of the image capturing device to capture the position of the target after the carrier is deformed, so that the separation device of the present invention can be compared with the prior art. After the film expanding operation, it is immediately determined whether the crystal grains are located at predetermined positions, so as to avoid the problem that the objects are misplaced after the trimming operation or the transfer operation.

1‧‧ ‧ film

1b‧‧‧ edge

1a‧‧‧Reserved part

2‧‧‧Separation equipment

20‧‧‧ Pedestal

21‧‧‧Fixed parts

210‧‧‧ openings

22‧‧‧Action device

23‧‧‧ Carrying parts

23a‧‧‧ edge

24‧‧‧Image capture device

240‧‧‧ lens

8‧‧‧劈

9‧‧‧ wafer

9a, 9b‧‧‧ grain

90‧‧‧ trench

A‧‧‧back position

D‧‧‧ path length

E‧‧‧Error distance

f‧‧‧Expansion

S‧‧‧ crack

t‧‧‧Predetermined distance

W‧‧‧Width

1A to 1C are schematic side views of a conventional cleaving process; 1B' is a schematic view of the defective state of Fig. 1B; and Figs. 2A to 2B are schematic side views of the separating device of the present invention.

The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily appreciate other advantages and functions of the present invention from the disclosure of the present disclosure.

It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The qualifications are not technically meaningful, the modification or proportion of any structure Changes in the relationship or adjustment of the relationship should not fall within the scope of the technical content disclosed in this creation without affecting the effectiveness of the creation and the purpose for which it can be achieved. In the meantime, the terms "upper", "lower" and "one" as used in this specification are for convenience of description only, and are not intended to limit the scope of the invention, the relative relationship may be changed or Adjustments, if there is no material change in the content of the technology, are also considered to be the scope of implementation of this creation.

Figures 2A and 2B are schematic illustrations of the side of the separation device 2 of the present invention.

As shown in FIG. 2A, the separation device 2 is a machine tool for a cleaving process, and includes: a machine body (not shown), a base 20 disposed on a lower side of the machine body, and a a fixing member 21 of the opening 210, a carrier member 23 fixed to the fixing member 21 to cover the opening 210, an action device 22 disposed on the upper side of the machine body, and a pair of images to be disposed by the carrier member 23 Device 24.

The fixing member 21 is disposed on the machine body and is located between the base 20 and the acting device 22 during the splitting operation (as shown in FIG. 2A).

In the embodiment, the fixing member 21 is a conductor ring (for example, a metal ring such as a hoop) or an insulating ring.

Moreover, the diameter D of the opening 210 of the fixing member 21 (or the width of the carrier 23) is greater than the width W of the base 20 such that the base 20 is located within the projected position of the opening 210.

The carrier member 23 is disposed on the base 20 to carry an object, and the base 20 and the carrier member 23 are configured to be relatively displaced.

In the embodiment, the carrier 23 is a film body, such as a release sheet, a UV tape or a thermal tape.

Furthermore, the article is a wafer 9 having a trench 90 as shown in FIG. 1A.

The action device 22 is located above the carrier 23 during the splitting operation (as shown in FIG. 1A) (as shown in FIG. 2A) to act on the object to make the object A plurality of targets are formed (such as a broken line shown in FIG. 2A as a split line).

In the present embodiment, the action device 22 is a physical power supply device, such as a cutting member, a vibrating member, a wind power member, a splitting tool (such as the file 8 shown in FIG. 1A) or the like, to generate a flaw. Split effect.

Furthermore, the target is a diced and unseparated semiconductor component such as a die 9a.

The image capturing device 24 is disposed in the process of the separating operation (as shown in FIG. 2B) and can be disposed around the carrier 23 capable of capturing the target, such as the upper side or the lower side of the carrier 23. .

In this embodiment, the image capturing device 24 is a Charge Coupled Device (CCD) camera, as shown in FIG. 2B, which includes a lens 240 and a receiver (not shown), and the receiver The image is taken by the lens 240 to detect the position of the target after the carrier 23 is deformed. For example, after the carrier 23 is deformed, as shown in FIG. 2B, each of the objects is separated by a predetermined distance t so that the image capturing device 24 captures a map of the relative positions of the objects. Should be It is understood that the variety of the image capturing device 24 is various and is not limited to the above.

After performing the splitting operation shown in Fig. 2A, the separation operation shown in Fig. 2B is performed. During the separation operation, since the base 20 and the carrier 23 are configured to be relatively displaceable, the base 20 is moved relative to the fixing member 21 (for example, the base 20 is raised to drive the carrier 23 or descend. The fixing member 21 drives the carrier member 23) to support the base portion 20 to support the intermediate portion of the carrier member 23, so that the intermediate portion of the carrier member 23 is displaced upward and deformed, and the edge 23a thereof is sloped to The carrier 23 is caused to have a expanding force such that the respective dies 9a are separated from each other by a predetermined distance t from each other. Next, the image capturing device 24 captures a relationship diagram of the relative positions between the respective crystal grains 9a to instantly determine whether each of the crystal grains 9a is located at the correct position.

Therefore, if all of the crystal grains 9a are located at the correct positions, subsequent operations (such as trimming and rewinding as shown in FIG. 1C) are performed, for example, the edges of the carrier 23 are cut off, and the load is carried. The die 9a on the remaining portion of the member 23 is transferred to another carrier (not shown). On the other hand, if at least one of the dies 9a is located at the wrong position, the cleavage operation can be re-executed immediately to avoid subsequent processes or to deliver the misplaced objects to the next machine.

In summary, the separating device 2 of the present invention is designed by the image capturing device 24 to immediately capture and judge whether the crystal grains 9a are located at predetermined positions after the film expanding operation. Knowing the technology, the separation device 2 of the present invention can find the misplaced objects before the trimming operation or the transfer operation, thereby improving the efficiency of the overall wafer fabrication.

The above embodiments are intended to illustrate the principles of the present invention and its effects, and are not intended to limit the present invention. Anyone who is familiar with the art may modify the above embodiments without departing from the spirit and scope of the creation. Therefore, the scope of protection of this creation should be as listed in the scope of patent application described later.

Claims (8)

A separating device includes: a base; a carrier disposed on the base to carry a plurality of targets; and an image capturing device configured to configure the carrier to capture the carrier after the carrier is deformed The location of the target. The separation device of claim 1, wherein the base member drives the carrier to be displaced to deform the carrier. The separation device of claim 1, wherein the carrier is a film body. The separating apparatus of claim 1, wherein the image taking device comprises a photoelectric coupling element. The separating device according to claim 1, further comprising a fixing member having an opening for fixing the carrier to cover the opening. The separation device of claim 5, wherein the target is a semiconductor component. The separating device according to claim 1, further comprising an acting device disposed on one side of the carrier to position the object between the base and the acting device. The separation device of claim 7, wherein the action device is a splitting device.