TWI679094B - Method and device for cutting brittle material substrate - Google Patents

Abstract

The invention provides a method for breaking a brittle material substrate which better protects the abutted surface of the brittle material substrate and does not have adhesion or the like.

A method for cutting a brittle material substrate includes the following steps: forming a scribe line on the main object side of the cutting object; forming one of the main surfaces of the substrate on which the scribe line is formed; Adhere to the adhesive film; make the protective film that is not adhesive to the substrate contact the entire other main surface of the substrate, and stick the part of the protective film that is not in contact with the substrate to the blank area of the adhesive film, thereby protecting The film is disposed on the substrate; and while the brittle material substrate on which the protective film is disposed is supported from below, the front edge of the upper blade is abutted against the other main surface side corresponding to the position where the scribe line is formed. The substrate is lowered at a predetermined position, thereby breaking off the brittle material substrate.

Description

Method and device for cutting brittle material substrate

The invention relates to a method and a device for breaking a substrate of a brittle material, especially a method and a device for breaking in a three-point bending manner.

As a means for breaking (fragmentation of wafers) semiconductor substrates, such as brittle material substrates, well-known aspects (for example, refer to Patent Document 1) include: A planned dividing line of a street is formed as a scribe line at the starting point of division. After that, a cracking device is used to apply bending stress to the brittle material substrate by a three-point bending method to extend a crack (crack) from the starting point of division. This breaks the substrate.

This division is generally based on the adhered surface of a dicing tape with adhesiveness, which is placed on a circular or rectangular ring-shaped frame, that is, a dicing frame. The state of the substrate of the brittle material to be broken is performed.

In addition, before breaking, for the purpose of preventing damage or preventing adhesion of pollutants, known aspects (for example, refer to Patent Document 2) include a blade (fracture blade) at least on a breaking device of a brittle material substrate. ) The surface on the abutment side (opposite to the surface on the lower support side at the time of cracking) is attached with a weak protective film.

Patent Document 1: Japanese Patent Application Laid-Open No. 2014-83821

Patent Document 2: Japanese Patent No. 4198601

The breaking of the brittle material substrate by the breaking device is further pushed in under a state where the upper edge (cracking edge) is in contact with the upper (abutted surface) side of the brittle material substrate supported below, so that the load is loaded. This is accomplished by focusing on a very small area at the front of the upper edge. Therefore, as disclosed in Patent Document 2, there may be cases where the cutting is performed in a state where the protective film is used, and even though its adhesiveness is weak, as a result of the concentration of the load, the adhesive of the protective film is still attached and left. Brittle material substrate after breaking.

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a cutting method for a brittle material substrate that better protects the abutted surface of the brittle material substrate and does not cause adhesion or the like to adhere or remain.

In order to solve the above-mentioned problem, the invention of claim 1 is a method for cutting a brittle material substrate, and is characterized by including a step of forming a scribing line to form a scribing line at a position of a cutting object on a major surface side of the brittle material substrate. ; The substrate sticking step, the main surface of the brittle material substrate with the scribe line formed, while leaving a blank area around and sticking to the adhesive film; a protective film configuration step, so that the brittle material substrate is not An adhesive protective film is in contact with the entire other main surface of the brittle material substrate, and a portion of the protective film that is not in contact with the brittle material substrate is adhered to the blank region of the adhesive film, thereby A protective film is disposed on the brittle material substrate; and a breaking step, in a state where the brittle material substrate on which the protective film is disposed is supported from below, while abutting the front end of the upper blade to the formation position with the scribe line The brittle material substrate is cut off corresponding to a predetermined cut-off position on the other main surface side and lowered one side.

The invention of claim 2 relates to a method for breaking a substrate of a brittle material, and includes a step of forming a scribing line, and a location of a breaking object on a major surface side of the substrate of the brittle material. Forming a scribe line; a substrate sticking step, the main surface of the brittle material substrate on which the scribe line is formed is adhered to the adhesive film of a substrate holding member formed by placing an adhesive film on a frame body; a protective film The disposing step is such that a protective film having no adhesiveness to the brittle material substrate is brought into contact with the entire other main surface of the brittle material substrate, and a portion of the protective film which is not in contact with the brittle material substrate is fixed to the substrate and held. A member, whereby the protective film is disposed on the brittle material substrate; and a breaking step, in a state of supporting the brittle material substrate on which the protective film is disposed from below, while abutting the front edge of the upper blade against the brittle material substrate The formation position of the scribe line corresponds to the predetermined breaking position on the other main surface side and is lowered one side, thereby breaking the brittle material substrate.

The invention of claim 3 is a method for cutting a brittle material substrate, and is characterized in that: the main surface of the brittle material substrate with a score line is formed in advance at a cutting target position on a main surface side, and one side is provided around the main surface. There is a blank area and one side is adhered to the adhesive film, and a protective film having no adhesiveness to the brittle material substrate is brought into contact with the entire other main surface of the brittle material substrate, and the protective film is not related to the brittleness The part in contact with the material substrate is stuck on the blank area of the adhesive film, and then the fragile material substrate on which the protective film is arranged is supported from below, while the front end of the upper blade is abutted to correspond to the position where the score line is formed The cutting position at the other main surface side is lowered while one side is lowered, thereby cutting the brittle material substrate.

The invention of claim 4 is a method for cutting a brittle material substrate, and is characterized in that: the main surface of the brittle material substrate having a score line formed in advance on a cutting target position on a main surface side is adhered to the The frame is provided with the adhesive film of the substrate holding member formed by an adhesive film, and a protective film having no adhesiveness to the brittle material substrate is brought into contact with the entire other main surface of the brittle material substrate, and the The portion of the protective film that is not in contact with the brittle material substrate is fixed to the substrate holding member, and then the brittle material substrate on which the protective film is disposed is supported from below, The brittle material substrate is cut while abutting the front end of the upper edge at a predetermined cutting position on the other main surface side corresponding to the formation position of the scribe line, and thereby cutting the brittle material substrate.

The invention of claim 5 is a device for cutting a brittle material substrate, and is characterized by comprising: a substrate sticking means for forming the brittle material substrate with a score line at a cutting target position on a main surface side; One main surface, with a blank area around it and sticking to the adhesive film; the protective film arrangement means makes the protective film without adhesiveness to the brittle material substrate contact the entire other main surface of the brittle material substrate And attaching a portion of the protective film that is not in contact with the brittle material substrate to the blank area of the adhesive film, thereby arranging the protective film on the brittle material substrate; and a supporting means for supporting and disposing the protective film from below. The brittle material substrate of the protective film; an upper blade so that the front end can abut a predetermined predetermined breaking position on the other main surface side corresponding to the position where the scribe line is formed; and, while the upper blade abuts against the The formation position of the scribe line corresponds to the predetermined breaking position of the other main surface and one side is lowered.

According to the inventions of claim 1 to claim 5, the brittle material substrate can be broken without causing bad conditions such as adhesion of the adherent and remaining on a single piece obtained by cutting.

1‧‧‧ Brittle material substrate

1a, 1b ‧‧‧ (of brittle material substrate) main surface

2‧‧‧ adhesive film

2a‧‧‧ (of the adhesive film)

3‧‧‧frame

4‧‧‧ protective film

101A, 101B‧‧‧

102‧‧‧ Upper Blade

S‧‧‧ scribed

FIG. 1 is a cross-sectional view illustrating a brittle material substrate 1.

FIG. 2 is a view showing a state in which a brittle material substrate 1 on which a score line S is formed is adhered to an adhesive film 2.

FIG. 3 is a view showing a state where the protective film 4 is placed on the main surface 1 b of the brittle material substrate 1.

FIG. 4 shows the outer periphery of the protective film 4 that is exposed from the main surface 1b and is adhered to the adhesive film 2 Schematic diagram of the appearance of the adhesive surface 2a.

FIG. 5 is a view showing how the brittle material substrate 1 is cut.

In this embodiment, a method and a method for breaking a brittle material substrate by a so-called three-point bending method will be described. FIG. 1 is a cross-sectional view illustrating a brittle material substrate 1 which is an object of breaking in the embodiment of the present invention. FIGS. 2 to 5 are diagrams schematically showing the main steps performed until the breaking after the brittle material substrate 1 is prepared.

Examples of the brittle material substrate 1 include a semiconductor substrate (such as a silicon substrate) and a glass substrate. A pattern for a predetermined element (for example, a CMOS sensor, etc.) may be formed on one main surface of the semiconductor substrate.

When the brittle material substrate 1 is divided, first, as shown in FIG. 1, a score line S is formed at a predetermined breaking position on one of the main surfaces 1 a. FIG. 1 shows a case where the predetermined position is divided in a direction perpendicular to the drawing surface and the scribe line S is extended. The scribe line S is a crack (microcrack) extending in the thickness direction of the brittle material substrate 1 and is continuous in a line shape on the main surface 1 a side of the brittle material substrate 1.

In addition, although only one scribe line S is shown in FIG. 1 for the sake of simplification, for example, the brittle material substrate 1 is divided into a short strip shape or a lattice shape, and is divided into a plurality of places to obtain a large number of lines. In the case of a single piece, the scribe lines S are formed for all the predetermined cutting positions. After that, although it is not specifically stated, in this case, with regard to the processing at the subsequent stage, all the predetermined breaking positions may be performed.

For the formation of the score line S, known knowledge can be applied. For example, the cutting wheel (scoring wheel) can be crimped and rotated along a predetermined breaking position to form a scribe line S. The cutting wheel (scribing wheel) is made of super-hard alloy and sintered. Diamond, single crystal diamond, etc. It also has a ridgeline that functions as a blade on the outer periphery; it can also be a scribe line S formed by scoring with a diamond sharp point along a predetermined cutting position; it can also be a laser (such as , Ultraviolet (UV) laser) irradiation of ablation or the formation of a metamorphic layer to form the scribe line S; it can also be by laser (for example, infrared (IR) laser) heating and The thermal stress generated by cooling forms a scribe line S.

Next, as shown in FIG. 2, a brittle material substrate 1 having a score line S formed thereon is stuck on an adhesive film 2 also called a dicing tape. One main surface of the adhesive film 2 becomes the adhesive surface 2a, and is arranged in a circular or rectangular ring-shaped frame body 3 which is also called a cutting frame. In addition, as the adhesive film 2, a size of a blank area (non-adhesive area) formed between the frame body 3 and the fragile material substrate when the fragile material substrate 1 is adhered is prepared. When the fragile material substrate 1 is adhered, as shown by an arrow AR1, the main surface 1a on the side on which the score line S is formed is brought into contact with the adhesive surface 2a, and the other main surface 1b is made an upper surface. After that, those having two adhesive films on three frames are collectively referred to as a substrate holding member.

In order to adhere the fragile material substrate 1 to the adhesive film 2, for example, an adhesive film sticking device (substrate sticking means) (not shown) having the following means: a supporting means (a platform, etc.) can be used to support the frame 3 horizontally In addition, the fragile material substrate 1 is supported in the opening portion (inner ring portion) of the frame body 3 in the same plane as the frame body 3 with one of the main lines facing upwards; the adhesive film arrangement means, The adhesive film 2 can be arranged on the upper surface of the frame body 3 and the brittle material substrate 1 while applying the expansion tension to the adhesive film 2 which has been cut to cover the width of the frame body 3; the adhesive film pressing means can be used to place the adhesive film 2 Adhere to the frame body 3 and the brittle material substrate 1 by pressing from the upper surface side. In the case of using this adhesive film sticking device, the formation of the substrate holding member and the sticking of the brittle material substrate 1 can be performed simultaneously.

Next, a protective film 4 is prepared. However, the protection used in this embodiment The film 4 is different from that disclosed in Patent Document 2 in that it does not have adhesiveness to at least the brittle material substrate 1. In addition, as shown in FIG. 3, in this embodiment, a protective film 4 having a sufficiently large size (area) compared to the planar size of the brittle material substrate 1 is used. Examples of the material of the protective film 4 include polyester (PET), polyvinyl chloride (PVC), and polyolefin.

As shown by an arrow AR2 in FIG. 3, the protective film 4 is placed close to the main surface 1 b of the brittle material substrate 1 which faces upward, and is placed on the main surface 1 b. Further, as shown in FIG. 4, while maintaining the mounted state, the outer peripheral portion of the protective film 4 (the portion not in contact with the brittle material substrate 1) exposed from the main surface 1 b is adhered to the adhesive surface of the adhesive film 2. 2a, that is, a blank area existing around the brittle material substrate 1. Thereby, the state where the protective film 4 is arrange | positioned and fixed on at least the main surface 1b among the brittle material substrate 1 is implement | achieved. As described above, since the protective film 4 does not have adhesiveness to the brittle material substrate 1, in this arrangement state, the protective film 4 is in contact with the entire surface of the main surface 1 b of the brittle material substrate 1 without a gap, but is not adhered.

For the protective film 4 to be adhered to the blank area of the adhesive film 2 while the protective film 4 contacts the entire surface of the other main surface of the fragile material substrate 1 on which the scribe line is not formed, for example, a protective film arrangement method having the following methods can be used: The supporting means (platform, etc.) can support the frame body 3 by placing the other main surface side of the brittle material substrate 1 on which one of the main surfaces of the scribe line is adhered and formed on the adhesive film 2 stretched on the frame body 3. And the brittle material substrate 1; the protective film arrangement means can place the protective film 4 on the brittle material substrate 1 (another one while applying an expanding tension to the protective film 4 that has been cut to cover the width of the brittle material substrate 1) (Main surface); the protective film sticking means (roller, etc.) can press the upper part of the protective film 4 from the upper surface of the brittle material substrate 1 (the part that does not contact the brittle material substrate 1) Stick to the blank area of the adhesive film 2.

In this embodiment, the fragile material substrate 1 is adhered in the same manner as above. In addition, a substrate holding member having a protective film 4 disposed on the main surface 1b is supplied to a breaking device for breaking. Specifically, as shown in FIG. 5, the position where the scribe line S is formed is arranged between the two lower blades 101A and 101B which are separated in the horizontal direction. In other words, the scribe line S is arranged in parallel. In a state between the two lower blades 101A and 101B arranged in parallel to each other, the substrate holding member in a state where the protective film 4 is arranged on the main surface 1b of the brittle material substrate 1 is provided with the two lower blades 101A, 101B is supported from below. In addition, the lower blades 101A and 101B are provided as members which are sufficiently rigid compared to the brittle material substrate 1.

As the breaking device, a known breaking device having a breaking blade can be used. As this breaking device, for example, a breaking device having the following means is exemplified: a supporting means (lower blades 101A, 101B, platform, etc.) that supports a brittle material substrate 1 on which a protective film 4 is arranged from below; an upper blade (fracture) Blade) so that the front end can abut the predetermined breaking position on the other main surface side corresponding to the position where the scribe line is formed; and, while the upper edge is abutted to correspond to the position where the scribe line is formed The means of breaking the predetermined position of the other main surface and lowering one side.

Alternatively, the protective film 4 may be disposed after the substrate holding member holding the brittle material substrate 1 is supported from below by the lower blades 101A and 101B.

After the above-mentioned supporting state is obtained, as shown by arrow AR3 in FIG. 5, the upper edge (crack edge) 102 is lowered from above toward the formation position of the scribe line S, and the front end thereof is sandwiched by the protective film 4 and The brittle material substrate 1 abuts and further lowers the upper blade 102 by press-fitting. Thereby, the crack extends from the score line S in the thickness direction of the substrate, and the brittle material substrate 1 is broken.

At this time, since the protective film 4 does not adhere to the fragile material substrate 1, it does not cause poor adhesion, adhesion, etc., that would occur when using a protective film with adhesive properties as in the technique disclosed in Patent Document 2. .

In addition, the fragile material substrate 1 and the protective film 4 are not directly fixed to each other, but the outer peripheral part of the protective film 4 is adhered and fixed to the adhesive film 2, so there is no case where the protective film 4 is shifted when the cutting is performed. . Furthermore, there is no case where a single piece (wafer) obtained by breaking rises, comes into contact with a nearby single piece, or causes a defect at the end.

As described above, according to this embodiment, before the fragile material substrate that has been pasted on the protective film stretched in a circular or rectangular annular frame is cut in a three-point bending manner, The non-adhesive protective film is brought into contact with the entire surface of the brittle material substrate which becomes the abutted surface of the upper edge (cracked edge) without gaps, and the outer peripheral part of the protective film is adhered and fixed to the adhesive film. In addition, it is possible to separate the fragile material substrate without causing undesirable situations such as adhesion of the adherent and remaining on the single piece obtained by the division.

<Modifications>

In the embodiment described above, although the fixed protective film 4 can be arranged by sticking the outer peripheral portion of the protective film 4 to the blank area of the adhesive surface 2a of the adhesive film 2, the configuration of the fixed protective film 4 is not limited to this. this. For example, it is also possible to provide a means for sandwiching and fixing the outer peripheral portion of the protective film 4 to the frame body 3 of the substrate holding member, or an area having adhesiveness that can be adhered and fixed. In this case, it is not necessary to provide a blank area for sticking the protective film 4.

Claims (5)

A method for breaking a brittle material substrate is to break the brittle material substrate, and is characterized by comprising: a step of forming a scribing line, forming a scribing line at a position of a breaking object on a major surface side of the brittle material substrate; , Forming the main surface of the brittle material substrate with the scribed line, while providing a blank area around the side and adhering to the adhesive film; a protective film arrangement step so that the brittle material substrate is not adhesive The protective film is in contact with the entire other main surface of the brittle material substrate, and a portion of the protective film that is not in contact with the brittle material substrate is adhered to the blank area of the adhesive film, thereby disposing the protective film in The fragile material substrate; and a breaking step, in a state where the fragile material substrate on which the protective film is disposed is supported from below, while abutting the front end of the upper blade against the other corresponding to the position where the score line is formed One main surface side is cut off at a predetermined position and one side is lowered, whereby the brittle material substrate is cut off. A method for breaking a brittle material substrate is to break the brittle material substrate, and is characterized by comprising: a step of forming a scribing line, forming a scribing line at a location of a breaking object on a major surface side of the brittle material substrate; and a step of attaching the substrate. The main surface of the brittle material substrate on which the scribe line is formed is adhered to the adhesive film of the substrate holding member formed by placing an adhesive film on the frame body; the protective film arrangement step makes the brittle material A protective film having no adhesiveness on the substrate is in contact with the entire other main surface of the brittle material substrate, and a portion of the protective film that is not in contact with the brittle material substrate is fixed to the substrate holding member, thereby protecting the protective film. Arranged on the fragile material substrate; and a breaking step, while supporting the fragile material substrate on which the protective film is arranged from below, while abutting the front edge of the upper blade to correspond to the position where the score line is formed The other main surface side is cut at a predetermined position and one side is lowered, thereby breaking the brittle material substrate. A method for breaking a brittle material substrate is to break the brittle material substrate. The method is characterized in that the main surface of the brittle material substrate with a score line is formed in advance at a cutting target position on a main surface side, and one side is around A blank area is provided, and one side is adhered to the adhesive film, and a protective film having no adhesiveness to the brittle material substrate is brought into contact with the entire other main surface of the brittle material substrate, and the protective film is not connected with the protective film. The part contacting the brittle material substrate is adhered to the blank area of the adhesive film, and then the brittle material substrate on which the protective film is arranged is supported from below, while the front end of the upper blade abuts the formation position with the scribe line The brittle material substrate is cut off corresponding to a predetermined cut-off position on the other main surface side and lowered one side. A method for breaking a brittle material substrate is to break the brittle material substrate. The method is characterized in that: the main surface of the brittle material substrate with a score line formed in advance on a main surface side of the breaking object is adhered to the The adhesive film of the substrate holding member formed by placing an adhesive film on the frame body, and a protective film having no adhesiveness to the brittle material substrate is brought into contact with the entire other main surface of the brittle material substrate, and The portion of the protective film that is not in contact with the brittle material substrate is fixed to the substrate holding member, and thereafter, the brittle material substrate on which the protective film is disposed is supported from below, while the front end of the upper blade abuts against the score line. The formation position corresponds to the predetermined breaking position on the other main surface side and is lowered one side, thereby breaking the brittle material substrate. A breaking device for a brittle material substrate is used for breaking a brittle material substrate, and is characterized in that it comprises: a substrate sticking means for forming a scribe line on the brittle material substrate with a score line at a cutting object position on a main surface side; The one main surface is provided with a blank area around the side and adhered to the adhesive film; the protective film arrangement means makes the protective film having no adhesiveness to the brittle material substrate contact the other main surface of the brittle material substrate. Surface, and the portion of the protective film that is not in contact with the brittle material substrate is adhered to the blank area of the adhesive film, thereby arranging the protective film on the brittle material substrate; the supporting means is configured to support and arrange from below The brittle material substrate of the protective film; an upper blade so that the front end can abut a predetermined breaking position on the other main surface side corresponding to the position where the score line is formed; and, while the upper blade abuts on Means for breaking the predetermined position of the other main surface corresponding to the formation position of the scribe line and lowering one side.