TW201637856A - Method for dividing bonded substrate and dividing apparatus thereof - Google Patents

Abstract

This invention provides a method capable of properly dividing a bonded substrate formed by bonding a silicon substrate and a glass substrate with an adhesive layer and a dividing apparatus thereof. The method for dividing a bonded substrate at a specific predetermined dividing position comprises: a scribe line forming step (unit) in which a scribe line is formed by means of a specific scriber at a predetermined dividing position on one main surface of the glass substrate; a cutting groove forming step (unit) in which a groove portion is formed by using a specific groove portion forming mechanism from one main surface to the middle of the adhesive layer of the silicon substrate at a predetermined dividing position on one main surface of the silicon substrate; and a breaking step (unit) in which a bonding substrate formed with a scribe line and a groove portion is broken at between the scribe line and the groove portion.

Description

Method for dividing laminated substrate and dividing device

The present invention relates to a method and a dividing device for a substrate obtained by bonding a ruthenium substrate and a glass substrate by an adhesive layer.

The tantalum substrate is widely used as a substrate for a semiconductor element (semiconductor wafer). However, in the case of composite of a substrate and other purposes, a tantalum substrate and a glass substrate may be bonded together by an adhesive layer (adhesive) (then The substrate is bonded to the substrate. Further, in the manufacturing process of the semiconductor device using the ruthenium substrate, a method of obtaining each wafer by dividing a ruthenium substrate, which is a mother substrate in which a plurality of element patterns are two-dimensionally formed by dicing by a dicing machine, is generally used. In the case where the bonded substrate of the tantalum substrate and the glass substrate is used as the mother substrate, the same order is also employed.

In addition, a method of dividing a brittle material substrate having a resin by attaching a thermosetting resin to a main surface of a brittle material substrate is also known (for example, refer to Patent Document 1).

[Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 5170195

When the bonded substrate obtained by bonding the enamel substrate and the glass substrate by the dicing layer is divided by the dicing machine, it is difficult to increase the processing speed due to the nature of the glass substrate, and Debris (fragmentation) is likely to occur on the glass substrate, and thus there is a problem that productivity is poor. Further, it is necessary to use a special cutting blade such as a resin blade, but there is also a problem that the wear is fast and the cost is high. Further, there is also a problem that water used for the purpose of cooling during cutting easily penetrates between the adhesive layer and the glass.

The present invention has been made in view of the above problems, and an object of the invention is to provide a method of preferably dividing a bonded substrate obtained by bonding a ruthenium substrate and a glass substrate by an adhesive layer.

In order to solve the above-described problems, the invention of the first aspect of the invention is characterized in that the bonded substrate obtained by bonding the ruthenium substrate and the glass substrate to the specific predetermined division position is divided by a predetermined layer, and includes: scribing formation a step of forming a scribe line by a specific scribing tool on a predetermined predetermined position of one of the main surfaces of the glass substrate which is one of the main surfaces of the bonded substrate, and a dicing groove forming step for forming the affixing a predetermined predetermined position of one main surface of the tantalum substrate on the other main surface of the substrate, wherein the groove portion is formed by a specific groove portion forming mechanism from the one main surface of the tantalum substrate to the middle of the adhesive layer; In the step, the bonded substrate on which the scribe line and the groove portion are formed is broken between the scribe line and the groove portion.

According to a second aspect of the present invention, in the step of dividing the bonded substrate, the bonded substrate has an uppermost surface on the side of the substrate, and the side of the glass substrate is a lowermost portion. In a state in which the upper surface of the support portion including the elastic body is placed on the upper surface of the support portion including the elastic body, the split blade is pressed against the predetermined predetermined position from the upper side of the base plate and further pressed downward, thereby separating the bonded substrate.

The invention of claim 3 is the method for dividing a bonded substrate according to claim 2, wherein in the breaking step, the splitting blade is brought into contact with the bottom of the groove portion and further pressed, thereby The splitting blade cuts the above-mentioned adhesive layer, and the vertical crack is extended from the above-mentioned scribe line to break the bonded substrate.

The invention of claim 4 is the method for dividing a bonded substrate according to claim 2, wherein In the cracking step, the blade edge side of the splitting blade is brought into contact with the opening end of the groove portion of the one main surface of the base plate, and then pressed down, thereby peeling off the adhesive layer and The vertical crack extends from the scribing line to break the bonded substrate.

The invention of claim 5 is the method for dividing a bonded substrate according to any one of claims 1 to 4, wherein the specific scribing tool is a scribing wheel.

The invention of claim 6 is the method for dividing a bonded substrate according to any one of claims 1 to 5, wherein the specific groove forming mechanism is a cutter.

The invention according to claim 7 is characterized in that the bonding substrate in which the bonding substrate and the glass substrate are bonded to each other by a bonding layer is divided into a predetermined division position, and a scribing forming unit (so-called drawing) a wire rod) which is formed by a predetermined scribing tool at a predetermined predetermined position of one of the main surfaces of the glass substrate which is one of the main surfaces of the bonded substrate; a cutting groove forming unit (so-called cutting machine) Forming a groove by using a specific groove forming mechanism from the one main surface of the cymbal substrate to the intermediate layer at a predetermined predetermined position of the main surface of the ruthenium substrate which is the other main surface of the bonded substrate And a breaking unit (so-called scriber) that breaks the bonded substrate on which the scribe line and the groove portion are formed between the scribe line and the groove portion.

According to the inventions of the first to seventh aspects, the bonded substrate obtained by bonding the tantalum substrate and the glass substrate by the adhesive layer can be preferably divided.

1‧‧‧ glass substrate

1a‧‧‧ (glass substrate) main surface

2‧‧‧矽 substrate

2a‧‧‧ (on the substrate)

3‧‧‧Next layer

4‧‧‧ upper layer

10‧‧‧Fixed substrate

10a‧‧‧ single piece

101‧‧‧marking wheel

201‧‧‧Cutting Blade

300‧‧‧breaking device

301‧‧‧Support Department

301a‧‧‧ (support) upper surface

302‧‧‧ splitting knife

302a‧‧‧(cracked knife) tip

302b‧‧‧ (knife tip) side

A‧‧‧Divisional location

AR1‧‧‧ arrow

AR2‧‧‧ arrow

AR3‧‧‧ arrow

AR4‧‧‧ arrow

AR5‧‧‧ arrow

AR6‧‧‧ arrow

AR7‧‧‧ arrow

AR8‧‧‧ arrow

AR9‧‧‧ arrow

AR10‧‧‧ arrow

AR11‧‧‧ arrow

AR12‧‧ arrow

AR13‧‧‧ arrow

AR14‧‧ arrow

AR21‧‧‧ arrow

AR22‧‧‧ arrow

AR23‧‧‧ arrow

AR24‧‧ arrow

AR25‧‧‧ arrow

AR26‧‧ arrow

B‧‧‧Decision progress location

CR1‧‧‧ crack

CR‧‧‧ vertical crack

CR2‧‧‧ vertical crack

D‧‧‧distance

DG‧‧ cutting slot

DG1‧‧‧ (cutting groove) bottom

DG2‧‧‧ (cutting groove) open end

H‧‧‧depth

RE‧‧‧ non-formed areas

SB‧‧‧ solder ball

SL‧‧‧

S1~S5‧‧‧Steps

w‧‧‧Width

Θ‧‧‧knife angle

1(a) and 1(b) are cross-sectional views schematically showing the configuration of the bonded substrate 10.

FIG. 2 is a view for explaining the procedure of dividing the bonded substrate 10 at the predetermined dividing position A.

3(a) to (c) are views for explaining the formation of the scribe line SL.

4(a) to 4(c) are views for explaining the formation (the state in formation) of the cutting groove DG.

Fig. 5 is a view for explaining the formation (state after formation) of the cutting groove DG.

FIG. 6 is a view exemplifying the bonded substrate 10 after the solder balls SB are formed.

FIG. 7 is a view schematically showing a state in which the bonded substrate 10 is broken by the breaking device 300.

8(a) to (c) are diagrams showing the first breaking method.

9(a) to 9(c) are diagrams showing the second breaking method.

<Finished substrate>

FIG. 1 is a cross-sectional view schematically showing a configuration of a bonded substrate 10 to be divided in the present embodiment. In the present embodiment, the bonded substrate 10 is formed by laminating the glass substrate 1 and the ruthenium substrate 2 by the adhesive layer 3, and is formed as a single substrate as a whole.

The bonded substrate 10 is divided and divided in the thickness direction by the following method by the predetermined predetermined position A as the position at which the division is performed. The predetermined division position A is defined as a linear shape (for example, a linear shape) along the main surface of the bonded substrate 10. In FIG. 1, a case where the predetermined position A is defined is defined in a direction perpendicular to the plane of the drawing. Further, in FIG. 1, both the main surface 1a of the glass substrate 1 as the main surface of the bonded substrate 10 and the main surface 2a of the ruthenium substrate 2 are marked with a predetermined division position A, of course, in a plan view (planar perspective). In the case where the main surface of the substrate 10 is bonded, the predetermined predetermined positions A of the respective main faces are the same. In other words, if the predetermined division position A of one main surface is moved in parallel in the thickness direction of the bonded substrate 10, it is still coincident with the division predetermined position A of the other main surface.

Although not shown in FIG. 1, a plurality of predetermined predetermined positions A may be defined with respect to one bonded substrate 10, and for example, a predetermined predetermined position A may be defined in a lattice shape. In the case where a plurality of predetermined predetermined positions A are defined, the respective divided predetermined positions A may be appropriately defined within a range in which the division can be preferably performed in the following order.

Also shown in FIG. 1 is a predetermined position, that is, a breaking progress predetermined position B, which is actually broken at the time of division. The predetermined position B of the breaking progress is regarded as the two main faces of the bonded substrate 10 A surface along the thickness direction between the main surface 1a of the glass substrate 1 and the predetermined predetermined position A of each of the main surfaces 2a of the cymbal substrate 2. In the case illustrated in Fig. 1, the breaking progress predetermined position B extends in the vertical direction on the drawing.

Various materials such as alkali glass such as borosilicate glass, alkali-free glass, and soda glass are exemplified as the material of the glass substrate 1. As a material of the adhesive layer 3, a thermosetting epoxy resin etc. are illustrated.

The thickness of the glass substrate 1, the ruthenium substrate 2, and the adhesive layer 3 and the total thickness of the bonded substrate 10 are not particularly limited as long as they can be preferably divided when the bonded substrate 10 is divided by the following method. The ranges are 100 μm to 1000 μm, 50 μm to 1000 μm, 10 μm to 200 μm, and 150 μm to 1500 μm, respectively. Further, the planar size of the bonded substrate is not particularly limited, and may be a range of about 1 to 3 mm in length and 1 to 3 mm in width.

In addition, in FIG. 1, the upper surface 4 is provided on the main surface 2a of the upper surface side, and the main surface 2a of the upper surface side is the main surface of the side surface of the 矽 substrate 2, and the main surface opposite to the adjacent surface of the adhesive layer 3 The situation. Fig. 1(a) illustrates a formation of the upper layer 4 in the case where the vicinity of the division predetermined position A is the non-formation region RE in the principal surface 2a of the ruthenium substrate 2, and Fig. 1(b) is illustrated on the principal surface 2a. The entire surface is formed in the case where the upper layer 4 is formed.

In addition, in FIG. 1, for the sake of simplicity, the upper layer 4 is illustrated as a single layer, but the upper layer 4 may be a single layer or a plurality of layers including the same material or different materials. Various materials such as various metal layers, ceramic layers, semiconductor layers, amorphous layers, and resin layers are exemplified as the constituent material of the upper layer 4.

However, when the bonded substrate 10 is divided by the dividing method of the present embodiment, the presence of the upper layer 4 is not essential. Therefore, in the following description, regarding the case where the upper layer 4 is formed, the tantalum substrate 2 and the upper layer 4 are sometimes collectively referred to simply as the tantalum substrate 2, and, strictly speaking, the upper layer 4 is sometimes formed. The surface of the surface is referred to as the main surface 2a of the crucible substrate 2.

<order of division>

Next, the procedure for dividing the bonded substrate 10 having the above-described configuration at the predetermined division position A will be described. Fig. 2 is a view showing the order of the division.

First, the bonded substrate 10 as illustrated in Fig. 1 is prepared (step S1). In other words, the bonded substrate 10 in which the glass substrate 1 and the ruthenium substrate 2 are bonded together by the adhesive layer 3 and the predetermined predetermined position A is defined is prepared.

Then, a scribe line SL (FIG. 3) is formed at a predetermined predetermined position A on the glass substrate 1 side of the prepared bonded substrate 10 (step S2). Fig. 3 is a view for explaining the formation of the scribe line SL. In addition, in FIG. 3, the case where each of the plurality of division predetermined positions A extending linearly in the direction perpendicular to the drawing is set is exemplified (the same applies to FIGS. 4 to 7).

The scribe line SL is a portion which becomes a starting point of the crack (vertical crack) stretching in the following step. As shown in FIG. 3( a ), the formation of the scribe line SL is performed by holding the bonded substrate 10 in a horizontal posture in which the glass substrate 1 is at the uppermost portion and the ruthenium substrate 2 is at the lowermost portion. In this case, the bonded substrate 10 may be directly held on the stage, or alternatively, the main surface 2a side of the ruthenium substrate 2 may be attached to, for example, a ring or the like in a ring shape. The holding tape such as the dicing tape of the holding member is held together with the holding member and the holding tape to hold the bonded substrate 10 on the stage.

Roughly, the formation of the scribe line SL is performed by holding the bonded substrate 10 in this position on a stage of a known scribing device (not shown) having a specific scribing tool. In this state, the scribing tool is relatively moved with respect to the division predetermined position A on the main surface 1a of the glass substrate 1.

FIG. 3(b) shows a case where the scribe line SL is formed using the known scribing wheel 101 as a scribing tool. The scribing wheel 101 is formed into a disk shape (an abacus bead shape) having a shape in which two truncated cones are connected to the lower surface (one of the larger ones) of the bottom surface, and the outer peripheral portion thereof is a tool edge. The scribe line SL is formed by pressing and rolling the scribing wheel 101 (more specifically, the blade edge thereof) on the main surface 1a of the glass substrate 1 along the predetermined dividing position A. Further, the cutting edge may be the same throughout the entire circumference of the scribing wheel 101, or may have a concave portion periodically.

In FIG. 3(b), as indicated by arrows AR1 and AR2, the scribing wheel 101 is sequentially pressed and rolled with respect to each of the divided predetermined positions A to form a scribe line SL, and finally, as shown in FIG. 3(c). The division predetermined position A is formed with a scribe line SL. Further, a vertical crack may be extended from the scribe line SL in the thickness direction of the glass substrate 1 along with the formation of the scribe line SL.

Further, as the scribing tool, a known diamond head or the like may be used.

When the scribe line SL is formed at a predetermined predetermined position on the side of the glass substrate 1, the dicing groove DG (FIG. 4) is formed by cutting at a predetermined predetermined position A on the side of the slab substrate 2 on the bonded substrate 10 (step S3). 4 and 5 are views for explaining the formation of the cutting groove DG. The cutting groove DG is formed as a groove portion, and becomes a starting point of the crack in the following steps.

As shown in FIG. 4( a ), the formation of the dicing groove DG is performed by holding the bonded substrate 10 in a horizontal posture in which the ruthenium substrate 2 is at the uppermost position and the glass substrate 1 is at the lowermost position. That is, it is performed by holding the bonded substrate 10 in a posture in which it is reversed when the scribe line SL is formed. In this case, the bonded substrate 10 may be directly held on the stage, or may be attached to the main surface 1a side of the glass substrate 1 by, for example, being stretched and held in a ring shape such as a cutting ring. A holding tape such as a dicing tape of the holding member is held, and the bonding substrate 10 is held on the stage together with the holding member and the holding tape.

As shown in FIG. 4(b), the dicing groove DG is formed as a groove portion that penetrates the ruthenium substrate 2 and reaches the subsequent layer 3. In other words, the cutting groove DG is formed such that its depth h is larger than the thickness of the tantalum substrate 2 and smaller than the sum of the thicknesses of the tantalum substrate 2 and the adhesive layer 3. Further, although the details are described below, the size (depth h, width w) of the cutting groove DG, the distance d between the bottom DG1 of the cutting groove DG and the adhesive layer 3 are selected according to the material corresponding to the adhesive layer 3. It is specified in the cracking method in the breaking step.

Roughly, the formation of the cutting groove DG is carried out by holding the bonded substrate 10 in this position in a known cutting device (cutting machine) (not shown) having a specific cutting mechanism. In the state of the stage, the division of the main surface 2a side of the substrate 2 is scheduled The position A is cut by a cutting mechanism in a specific range in the thickness direction and the width direction.

4(b) and 4(c), there is shown a case where a cutting groove DG is formed using a cutter having a known cutting blade 201 as a cutting mechanism. The cutting blade 201 has a disk shape (annular shape) and its outer peripheral portion serves as a tool for the blade edge. When the cutting blade 201 is used to form the cutting groove DG, first, the cutting blade 201 is rotated in the vertical plane with the main surface thereof being parallel to the vertical surface, as shown by an arrow AR3 in FIG. 4(b). The cutting blade 201 is lowered as shown, and is lowered as indicated by an arrow AR4 in Fig. 4(c) until its tip end portion reaches a target depth position corresponding to the depth h of the cutting groove DG to be formed. Then, when the blade tip portion reaches the target depth position, while maintaining the rotation state, the cutting blade 201 is relatively moved relative to the bonding substrate 10 along the predetermined dividing position A (ie, along the breaking progress predetermined position B). This forms a cutting groove DG.

When the cutting blades 201 are sequentially moved with respect to the respective divided predetermined positions A as shown by arrows AR5 and AR6 in FIG. 4(b) or as indicated by arrows AR7 and AR8 in FIG. 4(c), the cutting grooves DG are formed. Finally, the cutting groove DG is formed at all the divided predetermined positions A as shown in FIG.

When the dicing groove DG is formed, the bonded substrate 10 is in a state in which the scribe line SL is formed on one main surface side and the dicing groove DG is formed on the other main surface side at all the predetermined division positions A.

The bonded substrate 10 in this state is a substrate capable of performing the following cracking step. However, depending on the type of the bonded substrate 10, more specifically, the type of the wafer obtained by dividing the bonded substrate 10 is also The solder ball SB may be formed on the main surface 2a of the ruthenium substrate 2, and more strictly, the upper surface layer 4 is omitted in FIGS. 3 to 5 before the rupture (step S4). . FIG. 6 is a view exemplifying the bonded substrate 10 after the solder balls SB are formed. Solder balls SB are formed on the main surface 2a of the ruthenium substrate 2 (more specifically, on the main surface of the upper layer 4), and are finally divided into individual regions of the individual wafers. However, the formation of the solder ball SB is not necessary.

Further, the solder ball SB may be formed at a time point before the formation of the scribe line SL, that is, at a time point at which the substrate is initially prepared to be bonded, or after the formation of the scribe line SL and before the formation of the dicing groove DG. The form of point formation. In the case of the former, it is necessary to hold the bonded substrate 10 with the main surface 2a side of the substrate 2 having the unevenness of the solder ball SB formed while the scribing SL is formed, and in the latter case, there is a cause. In the case of removing the cutting chips during cleaning, cleaning the water used in the cutting groove DG, etc., and etching the solder balls SB, there are points to be noted, but the timing of forming the solder balls SB at the timing after the formation of the cutting grooves DG is formed. It is not related to the above points of attention, so it is preferable.

Further, the order in which the scribe lines SL are formed and the dicing grooves DG are formed may be reversed.

After the scribe line SL and the dicing groove DG are both formed, and if necessary, the solder ball SB is formed, the cracking using the rupture device 300 is performed, and between the scribe line SL and the cutting groove DG, The progress of the breaking of the predetermined position B is progressed (step S5).

FIG. 7 is a view schematically showing a state in which the bonded substrate 10 is broken by the breaking device 300.

The breaking device 300 mainly includes a support portion 301 including an elastic body, and the laminated substrate 10 is placed on the upper surface 301a, and the splitting blade 302 has a cutting edge triangular shape extending in the longitudinal direction of the specific blade. And it moves up and down in the vertical direction.

The support portion 301 is preferably formed of an elastomer having a hardness of 65 to 95, preferably 70 to 90, for example, 80. As the support portion 301, for example, an anthrone rubber or the like can be preferably used. Furthermore, the support portion 301 can be further supported by a rigid (non-elastic) support (not shown).

As shown in Fig. 7, at the time of the fracture, the bonded substrate 10 is placed such that the side of the substrate 2 on which the dicing groove DG is formed is the uppermost portion, and the side of the glass substrate 1 on which the scribe line SL is formed is the lowermost portion. On the upper surface 301a of the support portion 301. Further, FIG. 7 shows a case where the bonded substrate 10 is placed on the support portion 301 so as to extend the predetermined position A (so that the scribe line SL and the dicing groove DG) extend in the direction perpendicular to the drawing. Upper surface 301a, and The splitting cutter 302 (more specifically, the cutting edge) is disposed vertically above the divided predetermined position A along the extending direction of the divided predetermined position A.

The rupture of the rupture device 300 is roughly achieved by cutting the predetermined position A (ie, cutting) in the vertical direction with respect to the 矽 substrate 2 side as indicated by an arrow AR9. The formation position of the groove DG is lowered, and the cutter 302 is also fractured after the split blade 302 abuts against the bonded substrate 10. Then, as shown by the arrow AR10, the bonded substrate 10 is divided into wafers of a desired size and number by sequentially performing the cracking with respect to all the divided predetermined positions A.

More specifically, in the present embodiment, two kinds of cracking methods different in principle are used separately depending on the material of the adhesive layer 3. In this case, the shape of the blade edge 302a (see FIGS. 8 and 9) or the size of the cutting groove DG of the splitting blade 302 are different depending on the selected breaking method. Hereinafter, two types of cracking methods will be described in order.

(1st splitting method)

Fig. 8 is a view showing a first breaking method. The first breaking method is abutting against the cutting groove DG by causing the splitting blade 302 to descend in the vertical direction as indicated by an arrow AR9 in Fig. 7, firstly as shown in Fig. 8 (a) ) is shown to progress between the front end of the cutting edge 302a and the bottom DG1 of the cutting groove DG.

Specifically, when the front end of the cutting edge 302a abuts against the bottom DG1 of the cutting groove DG as shown by an arrow AR11 in FIG. 8(b), the splitting blade 302 is also pressed downward by a specific force. The blade edge 302a receives resistance from the adhesive layer 3 as indicated by the arrow AR12, and also descends on the side of the layer 3 as it is cut along the predetermined position B. Thereby, the division of the layer 3 proceeds.

In this case, the force which presses the split blade 302 downward in the vertical direction also acts as a force for pressing the bonded substrate 10 against the support portion 301 as the elastic body along the predetermined position A. The combined substrate 10 is symmetrical with respect to the scribe line SL from the support portion 301 by an upward urging force as indicated by an arrow AR13. In the system, as the force and self-break As a result of the force applied to the lower side of the knife 302, the so-called three-point bending is achieved on the side of the glass substrate 1 of the bonded substrate 10. As indicated by the arrow AR14, the vertical crack CR is separated from the scribe line SL. The progress predetermined position B extends vertically upward.

The breaking (cutting) of the bonding layer 3 from the upper side by the splitting blade 302 and the stretching of the vertical crack CR of the glass substrate 1 from the lower side of the slitting knife 302 progress along the breaking progress predetermined position B. The breaking is completed when both of them finally reach the interface between the layer 3 and the glass substrate 1. That is, the bonded substrate 10 is divided into two single pieces 10a as shown in FIG. 8(c).

In the case of performing the splitting by the first breaking method as described above, it is necessary to prevent the cutting edge 302a from being engaged with the cutting edge 302 DG before the cutting edge 302 is lowered at least before the leading end of the cutting edge 302a abuts against the bottom DG1 of the cutting groove DG. The manner in which the cutting groove DG is in contact is defined by the size of the cutting groove DG, and the angle formed by the cutting edge 302a in the cross section perpendicular to the blade span direction, that is, the cutting edge angle θ must be specified. In general, the size of the cutting groove DG is relatively larger than that of the second breaking method described below, and the cutting edge angle θ is relatively small.

(second break method)

Fig. 9 is a view showing a second breaking method. The second breaking method is abutting against the cutting groove DG by causing the splitting blade 302 to descend in the vertical direction as indicated by an arrow AR9 in Fig. 7, firstly as shown in Fig. 9(a). After each of the two side faces 302b of the blade edge 302a is formed between the corresponding opening end portion DG2 of the cutting groove DG, the cutting progresses. Here, the opening end portion DG2 of the cutting groove DG refers to the edge portion of the cutting groove DG on the surface of the ruthenium substrate 2.

Specifically, when the side surface 302b of the cutting edge 302a is abutted against the open end DG2 of the cutting groove DG as indicated by an arrow AR21 in FIG. 9(b), the splitting blade 302 is also pressed downward by a specific force. When the two side faces 302b of the blade edge 302a are each as shown by the arrow AR22, the force which is symmetrical with respect to the predetermined position A and deviates from each other acts on the corresponding opening end DG2 of the cutting groove DG which is in the oblique direction contact. .

If the open end DG2 is subjected to a force in this state, as indicated by the arrow AR23, Then, the portion of the layer 3 where the cutting groove DG is not formed generates a force which is symmetrical with respect to the predetermined position B of the breaking progress and in the opposite direction. The force is increased as the pressure of the splitting knife 302 is increased, and finally the layer 3 is opened from the bottom DG1 of the cutting groove DG to the vertical downward direction indicated by the arrow AR24. As a result, the crack CR1 along the predetermined position B of the breaking progress is formed in the subsequent layer 3. The crack CR1 finally reaches the interface between the subsequent layer 3 and the glass substrate 1.

When the splitting blade 302 is pressed downward in the vertical direction after the formation of the crack CR1, the force applied to the bonded substrate 10 by the splitting blade 302 is used as the supporting substrate 10 with respect to the support portion 301 as an elastic body. The force of pressing the predetermined position A is effective. Therefore, as in the case of the first breaking method, the bonded substrate 10 receives a force acting upward from the support portion 301 as indicated by an arrow AR25. Therefore, the three-point bending is realized on the side of the glass substrate 1 of the bonded substrate 10. As indicated by an arrow AR26, the vertical crack CR2 extends vertically from the scribe line SL along the breaking progress predetermined position B. Finally, the breaking is completed when the vertical crack CR2 reaches the interface between the bonding layer 3 and the glass substrate 1. That is, the bonded substrate 10 is divided into two single pieces 10a as shown in FIG. 9(c).

When the crack is broken by the second splitting method as described above, the side 302b of the cutting edge 302a must be before the front end of the cutting edge 302a abuts against the bottom DG1 of the cutting groove DG when the splitting blade 302 is lowered. The size of the cutting groove DG is defined in contact with the opening end DG2 of the cutting groove DG and the blade angle θ is determined. In general, the size of the cutting groove DG is relatively smaller than that of the first breaking method described above, and the cutting edge angle θ is relatively large. Further, the distance d between the bottom DG1 of the cutting groove DG and the adhesive layer 3 must also be determined in consideration of the balance with the amount of pressing of the split blade 302. This is because if the distance d is too large, there is a possibility that the crack CR1 cannot reach the interface between the adhesive layer 3 and the glass substrate 1.

Further, the use of the first splitting method and the second splitting method is preferably selected in consideration of the material (composition, viscosity, elasticity, etc.) of the adhesive layer 3. For example, when the adhesiveness of the adhesive layer 3 is high, there is a tendency that the cutting by the splitting blade 302 is difficult to progress preferably. Therefore, when the second cracking method is applied as compared with the first cracking method, The possibility of breaking down Higher sex.

Alternatively, the breaking may be performed by the method corresponding to the first breaking method at the time of initial cracking, and then the side surface 302b of the cutting edge 302a may be brought into contact with the opening end portion DG2 of the cutting groove DG. One side makes the break progress.

As described above, according to the present embodiment, the bonded substrate can be preferably divided by the division of the bonded substrate obtained by bonding the ruthenium substrate and the glass substrate by the subsequent layer, that is, on the side of the glass substrate. The scribe line is formed at a predetermined position, and a dicing groove reaching the contiguous layer is formed at a predetermined predetermined position on the side of the cymbal substrate, and the breaking progress is made between the scribe line and the dicing groove by cleavage. Since the glass substrate is not cut, chipping of the glass substrate is suppressed, and productivity and cost are reduced. Moreover, water does not penetrate between the adhesive layer and the glass substrate.

1‧‧‧ glass substrate

1a‧‧‧ (glass substrate) main surface

2‧‧‧矽 substrate

2a‧‧‧ (on the substrate)

3‧‧‧Next layer

10‧‧‧Fixed substrate

300‧‧‧breaking device

301‧‧‧Support Department

301a‧‧‧ (support) upper surface

302‧‧‧ splitting knife

AR9‧‧‧ arrow

AR10‧‧‧ arrow

DG‧‧ cutting slot

SL‧‧‧

Claims (8)

A method for dividing a bonded substrate, which is characterized in that a bonded substrate obtained by bonding a tantalum substrate and a glass substrate to a specific predetermined position is divided by a bonding layer, and includes a scribing forming step, And forming a scribe line by a specific scribe line tool at a predetermined predetermined position of one of the main surfaces of the glass substrate which is one of the main surfaces of the bonded substrate; and a dicing groove forming step for forming the bonded substrate a predetermined predetermined position of the main surface of the one of the base surfaces of the other main surface, wherein the groove portion is formed by a specific groove forming mechanism from the one main surface of the base substrate to the middle of the adhesive layer; and a cracking step The bonded substrate on which the scribe line and the groove portion are formed is ruptured between the scribe line and the groove portion. The method of dividing a bonded substrate according to claim 1, wherein the bonding substrate is placed on the bonded substrate such that the side of the substrate is the uppermost portion and the side of the glass substrate is the lowermost portion. In the state of the upper surface of the support portion of the body, the split blade is brought into contact with the predetermined predetermined position from the upper side of the above-mentioned ruthenium substrate, and further pressed, thereby separating the bonded substrate. The method for dividing a bonded substrate according to claim 2, wherein in the breaking step, the splitting blade is brought into contact with the bottom of the groove portion and further pressed, whereby the above-mentioned step is performed by the splitting blade The layer is cut and the vertical crack is stretched from the above-mentioned scribe line to break the bonded substrate. The method of dividing a bonded substrate according to claim 2, wherein in the breaking step, the blade edge side of the splitting blade is brought into contact with the opening end of the groove portion of the one main surface of the base plate, and then Further pressing down, thereby peeling off the above layer and making The vertical crack extends from the scribing line to break the bonded substrate. The method of dividing a bonded substrate according to any one of claims 1 to 4, wherein the specific scribing tool is a scribing wheel. The method of dividing a bonded substrate according to any one of claims 1 to 4, wherein the specific groove forming mechanism is a cutter. The method of dividing a bonded substrate according to claim 5, wherein the specific groove forming mechanism is a cutter. A device for splicing a substrate, wherein the bonded substrate obtained by bonding a ruthenium substrate and a glass substrate to a predetermined layer is divided by a predetermined predetermined position, and includes a scribe line forming unit. Forming a scribe line by a specific scribing tool on the main division surface of one of the main surfaces of the glass substrate which is one of the main surfaces of the bonded substrate; the dicing groove forming unit is the other side of the bonded substrate a predetermined position of the main surface of one of the ruthenium substrates on the main surface, a groove portion is formed by a specific groove portion forming mechanism from the one main surface of the ruthenium substrate to the middle layer; and a rupture unit is formed The bonded substrate having the scribe line and the groove portion is broken between the scribe line and the groove portion.