JPH0864556A - Separation of glass substrate - Google Patents

Abstract

PURPOSE: To realize the improvement of a throughput, a cost reduction and the like in a process of separating a glass substrate with a multitude of elements formed on its surface into the elements. CONSTITUTION: The surface of a glass substrate 10 with elements formed on its surface from the side of the surface is cut half by dicing. Subsequently, scribing lines 23 are formed at the positions of half cuttings on the rear of the substrate 10 from the side of the rear. The substrate is broken along the lines 23 and the substrate is separated into the elements.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating a glass substrate having a circuit formed thereon.

[0002]

2. Description of the Related Art In recent years, various contact image sensors for office equipment, facsimiles, and input terminals of computers have been developed. Contact image sensor
A long line sensor of the same size as the original is required to read at the same magnification. In particular, for the purpose of cost reduction and further size reduction, a thin transparent protective film is coated on the optical sensor without using a rod lens array, converging fiber, etc., and the document is read while moving in close contact with it. The development of image reading devices of the type that performs

FIG. 14 shows an example of this main image reading apparatus. Here, the photoelectric conversion element portion 12 is formed on the opaque layer 18 provided on the transparent substrate 11, and the window portion (the opaque layer 18 is provided from the light source 34 disposed on the back surface side of the substrate 11). The light L incident on the surface P of the document and reflected by the surface of the document P is received by the photoelectric conversion element unit 12.

On the upper electrode 17, a passivation A layer 14 is formed mainly for the purpose of stabilizing and protecting the surface of the semiconductor layer, and the uppermost portion which comes into direct contact with the document is called a wear-resistant layer from the scratches caused by the document and the entire apparatus is exposed. Is provided with a high hardness translucent insulating layer 22. Further, between the passivation A layer and the wear resistant layer, a passivation B layer 15 for the purpose of improving adhesion and moisture resistance of both is further provided, and a passivation B layer is further provided. The anti-static layer 21 is formed between the abrasion resistant layer and the abrasion resistant layer.

[0005] Here, 14 is a polyimide resin coating, 1
5 is formed by applying an epoxy resin, and 22 is 50
The microsheet glass having a thickness of about μm, and the antistatic layer 21 are a translucent conductive layer such as ITO formed on the back surface of 22 by vapor deposition or the like. This transparent conductive layer is held at a constant potential by disposing a conductive material between the transparent conductive layer and the ground electrode on the transparent substrate 11.

The transparent substrate 11 is originally a large glass substrate having a size of about 300 mm square, and after adhering the microsheet glass 22 having the translucent conductive layer 21 formed thereon to the glass substrate 10 having the element formed thereon, it is 3 mm or more. It is cut into the following strip sizes. A plan view of the glass substrate on which the element before cutting is formed is shown in FIG. Since the element has a capacitance and may be electrostatically charged and electrostatically destroyed, the shunt wiring 13 holds the input / output terminal and the power supply terminal of the photoelectric conversion element section 12 at the same potential. The shunt wiring 13 is cut off when the glass substrate is cut.

As a glass substrate cutting method, a conventional method of separating a semiconductor wafer into individual chips can be used. That is, there are a dicing method in which a wafer is cut by a sword (blade) whose main material is diamond powder to form a groove, and a scribing method in which the wafer surface is scratched by a diamond needle along the cleavage of the wafer and the cleavage is used. Of course, the glass substrate does not cleave, but the same effect can be obtained. Specifically, the following methods have been proposed. (1) The transparent conductive layer 2 on the glass substrate 10 on which the element is formed.
After adhering the microsheet glass 22 formed with 1,
FIG. 7 shows a flow chart of a substrate cutting method that has been conventionally adopted by our company as a method for cutting a strip size of 3 mm or less. The cross-sectional structure of the substrate to be cut is shown in FIG.
It shows in (A). This cross-sectional structure corresponds to the plan view of the glass substrate in FIG. Half cut by dicing is performed along the shunt wirings of FIGS. 7A and 8A as shown in FIG. 7B. At this time, the alignment is 30
The alignment mark is provided on a 0 mm square glass substrate. The half-cut eliminates the part of the shunt wiring. The width of the part to be cut varies depending on the dicing blade, but is about 100 to 200 μm.
Since the shunt wiring is separated by (B), in (C), adhesion of glass residue generated at the time of half-cutting to the surface of the glass substrate is cleaned by an automatic cleaning device such as spin cleaning or shower cleaning, and then an electrical inspection is performed. Next (D)
In, the adhesive sheet 16 is attached to the back surface of the glass substrate, and full cutting is performed from the front surface of the glass substrate by dicing. The reason why the adhesive sheet 16 is attached is that the fully cut strip-shaped substrate does not fall apart, the substrate is completely full-cut, and the stage of the dicing saw is protected from being scratched. Since the dicing blade is worn by dicing, the depth required for dicing changes when full cutting is performed. For this reason, a perfectly scratchable sheet is required to completely cut the sheet. Finally, when the adhesive sheet 16 is peeled from the substrate in (E), it is separated into a strip-shaped substrate having a cross section as shown in FIG. 8 (B). After separation, the strip-shaped glass substrate is washed manually. The adhesive sheet 16 is a UV sheet that loses its adhesiveness when irradiated with UV light, so that the adhesive sheet 16 can be easily removed from the substrate. (2) As disclosed in Japanese Patent Laid-Open No. 2-33948, after forming a groove 209 of about 100 μm from the back surface side of a wafer 120 having a thickness of 250 μm by dicing, scratches are scribed on the front surface side 210 of the wafer. A method of attaching and cleaving to separate into chips. (See FIG. 9) (3) As disclosed in JP-A-1-290237, a resin sheet 111 having an adhesive is attached to the front surface side of the glass substrate 102, and the back surface of the glass substrate 102 is half-cut. To do. (See FIG. 10A) Next, a method in which the adhesive sheet 16 is attached to the back surface of the glass substrate 102, and then the front surface of the glass substrate 102 is diced and full cut. (See FIGS. 10B and 10C.) (4) As shown in JP-A-1-186646, the front side of the wafer 120 of the semiconductor substrate is half-cut (see FIG. 11A), A method of fixing the front surface with a fixing material 121, polishing or etching from the back surface side of the wafer 120 of the semiconductor substrate, and removing the uncut portion by half-cutting. (See FIG. 11 (B)) (5) As shown in Japanese Patent Laid-Open No. 61-67243, an adhesive sheet 16 is attached to the back surface side of a semiconductor wafer 120 on which a circuit is formed, and the wafer is diced. After being set on the stage, full cutting or half cutting is performed from the front surface side of the wafer as shown in FIG. After that, a method for etching the portion 114 for selective etching shown in FIG. The adhesive sheet 16 is for completely cutting the wafer 120, and for protecting the stage of the dicing saw from scratches. The adhesive sheet 16 is not always necessary when full cutting is not performed in the step of cutting from the surface. (6) As shown in Japanese Patent Laid-Open No. 60-157236, an adhesive sheet 16 is attached to the back side of a semiconductor wafer 120 on which circuits are formed, and the wafer is set on the stage of a dicing saw. ) As shown in (), a full cut or a half cut is performed from the wafer surface. After that, the adhesive sheet 16 is attached to the surface, the chips that are full-cut or half-cut are fixed, the substrate is turned over, and set on the stage of the dicing saw. Next, as shown in FIG. 13B, a method of cutting from the back surface with a blade 115 wider than the blade used in the first step.

[0008]

However, when a large-sized substrate such as a thin film image sensor as shown in FIGS. 8A and 8B is cut by the above method, there are the following problems. In the method (1), the pressure-sensitive adhesive sheet 16 needs to have adhesiveness because the fully cut substrate does not fall apart.
In addition, it is necessary to peel it off from the substrate after full cutting, so the adhesive sheet loses its adhesiveness by UV light.
Expensive materials such as V-sheet) are required. At the same time, a new UV irradiation step is required to peel off the UV sheet from the glass substrate. Since the glass dust generated during dicing of the glass substrate adheres to the glass substrate,
Although it is necessary to clean the glass substrate after half-cut and full-cut, automatic cleaning equipment such as spin cleaning and shower cleaning can be used for large-sized substrates, but automatic cleaning is performed for glass substrates separated into strips. Since the equipment cannot be used, manual cleaning is required, which requires man-hours. When a glass substrate with a UV sheet attached is fully cut, the dicing blade adheres to the UV sheet dust and causes clogging, and the dicing blade wears due to UV.
It is accelerated by the sheet, and as a result, the chipping of the glass substrate is increased. In order to perform full cutting, it is necessary to dice the glass substrate to be separated into a thickness of about 1 mm, which takes a dicing time. In the method (2), since the dicing is performed from the back side of the wafer, the microsheet glass 304 and the shunt wiring 1 are used.
I can't cut 10. Since there is a shunt wiring 110,
It cannot be inspected in a large-sized substrate after dicing. Since the microsheet glass 304 is not cut, it is not possible to separate the substrate by damaging it by scribing from the surface side. In the method (3), since the dicing is performed from the back surface side of the glass substrate, the microsheet glass 304 and the shunt wiring 110 cannot be cut. Because of the shunt wiring 110, it is impossible to inspect in a large-sized substrate state after half-cutting. The adhesive sheet 16 used at the time of full cutting needs to have adhesiveness so that the fully cut substrate does not come apart, and needs to be easily peeled off from the substrate after the full cutting, so an expensive material such as a UV sheet is required. Become. At the same time, a new UV irradiation step is required to peel off the UV sheet from the glass substrate. Since the glass substrate separated into strips cannot be used for cleaning the glass substrate after full-cutting, an automatic cleaning device cannot be used, and manual cleaning is required, which requires man-hours. When the glass substrate to which the UV sheet is attached is fully cut, the dicing blade causes clogging of the UV sheet to cause clogging, and the abrasion of the dicing blade is accelerated by the UV sheet, resulting in large chipping of the glass substrate. In order to perform full cutting, it is necessary to dice the glass substrate to be separated into a thickness of about 1 mm, which takes a dicing time. In the method (4), since the fixing agent 121 is used for fixing, a new step and material costs for the fixing agent 121 are required. A step for removing the fixative 121 is also required. A new process of polishing or etching is required. In the method of (5), since a new step of etching is included, the number of steps is increased and the retention is deteriorated. In the method (6), since the adhesive sheet 16 is required at least in the second step, an expensive material such as a UV sheet is needed. At the same time, a new UV irradiation step is required to peel off the UV sheet from the glass substrate. Since the glass substrate separated into strips cannot be used for cleaning the glass substrate after full-cutting, an automatic cleaning device cannot be used, and manual cleaning is required, which requires man-hours. When the glass substrate to which the UV sheet is attached is fully cut, the dicing blade causes clogging of the UV sheet to cause clogging, and the abrasion of the dicing blade is accelerated by the UV sheet, resulting in large chipping of the glass substrate. In order to perform full cutting, it is necessary to dice the glass substrate to be separated into a thickness of about 1 mm, which takes a dicing time.

In view of the above-mentioned problems of the prior art, the present invention provides a high-quality dicing method for a large-sized substrate such as a thin-film image sensor and having high mass productivity.

[0010]

The method for separating a glass substrate according to the present invention comprises a first step of performing a half-cut by dashing from the surface side of a glass substrate having a large number of elements formed on the surface of the glass substrate; It comprises a second step of forming a sliver line from the back surface side of the substrate to the position of the half cut, and a third step of separating the glass substrate by breaking. Further, the method for separating a glass substrate according to the present invention includes a step of performing a half-cut by dicing from the surface side of the glass substrate on which the electrostatic protection shunt wiring is formed on the surface of the glass substrate, along the shunt wiring. It is characterized in that half-cutting is performed to separate the shunt wiring, and after the first step, electrical inspection is performed in a large-sized substrate. Further, in the method for separating a glass substrate according to the present invention, in the second step of forming a scribe line from the back surface side of the glass substrate, a weakly sticky pressure sensitive adhesive sheet is attached to the front surface side of the glass substrate, and the glass substrate is broken. The feature is that the substrate is separated. or,
The method for separating a glass substrate according to the present invention is characterized by using a glass substrate in which a second glass substrate is bonded to the surface of a glass substrate having a large number of elements formed on the surface of the glass substrate.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a flow chart of the glass substrate separating method of the present invention. Figure 1 shows the cross-sectional structure of the substrate to be cut.
It shows in (A). This is the same as FIG. 7 (A). This cross-sectional structure corresponds to the plan view of the glass substrate in FIG.
1 along the shunt wiring of FIG. 1A and FIG.
As shown in (B), half cutting is performed by dicing from the front surface side of the glass substrate. At this time, the alignment is 3
It is carried out by an alignment marker provided on a glass substrate of 00 mm square. The half-cut eliminates the part of the shunt wiring. The width of the part to be cut varies depending on the dicing blade, but is about 100 to 200 μm.
Since the shunt wiring is separated by (B), in (C), the adhesion of the glass dust generated at the time of half-cutting to the glass substrate surface is cleaned by an automated cleaning device such as spin cleaning or shower cleaning, and then an electrical inspection is performed. . Next, as shown in (D), a scribe line 23 is provided at a position on the back side half-cut from the back surface of the glass substrate, and a roll portion 35 of a super steel roll used for cutting glass as shown in FIG. It has a disk shape having a sharp portion, and breaks along the scribe line 23 as shown by the rotation of the roll portion 35.

This break method will be described with reference to FIGS. 4 (B) and 4 (C). First, a weakly sticky adhesive sheet 24 is attached to the surface of the glass substrate. In the case of full cut, the position accuracy is lost when the glass substrate moves, so an adhesive sheet with high adhesiveness is required, but in the case of break it does not require position accuracy because it breaks along the scribe line. Therefore, the weakly sticky adhesive sheet 24 can be used. As shown in FIG. 4 (B), a rubber blade 25 is arranged on the scribe line 23 on the back surface of the glass substrate on which the weakly sticky pressure-sensitive adhesive sheet is attached, and the rubber blade 25 is pressed to apply a load to the glass substrate. Along the line 23. The second embodiment of the breaking method uses a rubber conveying roller as shown in FIG. As shown in the figure, the glass substrate carrying the rubber substrate 26 for carrying the glass substrate is carried in the direction of the arrow on the glass substrate on which the weakly sticky adhesive sheet 24 is stuck, and while being carried, a bending pressure is applied to the glass substrate to scribe the glass substrate. Split along line 23. In any case, after the glass substrate is broken, the adhesive sheet 24 having weak adhesiveness is peeled off and separated into strip-shaped glass substrates. Unlike the case of FIG. 7, the pressure-sensitive adhesive sheet 24 has a weak adhesive property and thus can be easily peeled off. FIG. 2 is a cross-sectional view of the glass substrate separated into strips.

FIG. 3 is a block diagram of an image reading apparatus assembled using the substrates separated by the glass substrate separating method according to the first embodiment of the present invention. The separated glass substrate shown in FIG. 2 is fixed to a base plate 33 made of A1 or the like. The base plate 33 has a light source 34 partially
An illumination window 36 for passing the illumination light L from is provided. The light source 34 includes an LED array in which a plurality of light emitting sources each including an LED chip are arranged in a straight line. 31
Is a conveyance roller that conveys the original P by directly contacting it with the microsheet glass 22.

Illumination light L emitted from the light source 34 passes through the illumination window 36 of the base plate 33 and the transparent substrate 10 on which the element is formed, illuminates the original P, and the light reflected from the original P is formed on the element to be transparent. Photoelectric conversion element section 12 of substrate 10
When incident on (see FIG. 8A), an image signal is output from the photoelectric conversion element.

Light-shielding guide means 32 is provided as a guide means for conveying the originals on the original feeding side and the original side of the glass substrate. The light-shielding guide means 32 can be fixed to the end surface of the glass substrate 10 on which the element is formed and the microsheet glass 22 on which the translucent conductive layer 21 is formed by forming a resin by injection or potting. Further, there is no step between the surface of the light-shielding guide means for conveying the original and the surface of the micro sheet glass 22, and the height of the original conveying surface is higher in the order of the original feeding side guide, the quill sheet glass, and the original side guide. Must be configured to be low. With this configuration, it is possible to prevent the document from being jammed due to a step or a gap on the document transport surface. Further, the photoelectric conversion element portion 12 is irradiated from the end surface of the glass substrate 10 on which elements are formed and the microsheet glass 22 on which the translucent conductive layer 21 is formed by irradiating the photoelectric conversion element section 12 from the paper feed side and the side of the original sheet. Light L _x
Can be reduced and the S / N can be secured more effectively. Further, a part of such illumination light L is reflected by the end surface of the transparent substrate 10 on which the element is formed, and the stray light L _y that irradiates the photoelectric conversion element portion is also reduced, which also has the effect of suppressing a decrease in S / N. are doing. On the other hand, as shown in FIG. 3, in the present cutting method, since the step 27 is formed on the transparent substrate 10 on which the element is formed, when the light-shielding guide means 32 is formed by molding a resin by injection or potting, the element is not formed. Since the transparent substrate 10 on which is formed is fixed by the step 27 and the base plate 33, it is possible to secure a strength sufficient to withstand the pressing of the transport roller 31.

FIG. 5 is a sectional view of a color contact image sensor in a second embodiment of the present invention and a sectional view after cutting. FIG. 5A is a plan view of the glass substrate on which the element before cutting is formed, and the photoelectric conversion unit 1 is similar to FIG. 8A.
2 and shunt wiring 13. Figure 5 (A)
The difference is that the photoelectric conversion unit 12 has a three-column configuration for color, and corresponds to R, G, and B from the left. Figure 5
(B) is a transparent substrate 40 on which a color filter is formed, and includes a red (R) color filter portion 41, a green (G) color filter 42, and a blue (B) color filter 4.
3 and a light shielding unit 44. A transparent substrate 40 having a color filter formed thereon is adhered to the glass substrate 10 on which the element before cutting is formed. The alignment at the time of adhesion is performed by the alignment marker provided on each transparent substrate. The method of separating the adhered glass substrates is the same as in the flow chart of FIG. As a result, the cross section of the substrate after cutting is shown in FIG.
become that way.

In this embodiment, as shown in FIG. 5 (A), the photoelectric conversion elements are vertically arranged in three rows like S1 to S3, S4 to S6, and S7 to S9. Are arranged side by side. In other words, each row is vertically extended and three rows are vertically aligned. On the upper surface of the photoelectric conversion elements S1 to S3 in the first row, a red color filter 4 extending vertically in FIG.
1 is provided. Second row photoelectric conversion elements S4 to S
Similarly, on the upper surface of 6, a green color filter 42 extending vertically in FIG. 5B is provided. Similarly, a blue color filter 43 extending vertically in FIG. 5B is provided on the upper surfaces of the photoelectric conversion elements S7 to S9 in the third row. The light-shielding portion 44 is formed by the transparent substrate 40 on which the color filter is formed and the transparent substrate 10 on which the element is formed, even if they are slightly misaligned.
This is to prevent light from adjacent color filters from entering the photoelectric conversion element or becoming stray light.

FIG. 6 is a block diagram of an image reading apparatus assembled using the substrate after cutting shown in FIG. 5 (C). The transparent substrate 10 on which the elements are formed is fixed to the support glass 54. The document is placed on the platen glass 51, and is transported by the transport roller 31 in the direction of the arrow. In this image reading apparatus, a white light source 52 (which employs a white xenon cold cathode tube in the present embodiment) for irradiating a document is illuminated in a direction perpendicular to the document conveyance direction and at an angle of about 45 degrees. It is arranged from the base 56 so as to do so. A rod lens (SLA12 manufactured by Nippon Sheet Glass Co., Ltd. is used in this embodiment, which is a one-to-one optical system for forming an image of reflected light from a document between the platen glass 51 and the transparent substrate 10 on which elements are formed. ) Has been placed. Furthermore, a transparent substrate 10 on which elements are formed
A drive circuit board 55 that drives the photoelectric conversion element and that inputs the electric signal from the photoelectric conversion element and outputs the electric signal to the outside is also arranged along the base 56 under the support glass for fixing the. There is. Although not shown in FIG. 6, a flexible cable is used to electrically connect the transparent substrate 10 on which the elements are formed and the drive circuit substrate 55.

[0020]

As described above, in the method for separating a glass substrate according to the present invention, half-cutting is performed by dicing from the front surface side of the glass substrate to separate the shunt wiring, so that the inspection is performed in a large-sized substrate state. You can
Further, since the substrate is separated from the back surface side of the glass substrate by the scribing method, there is no need for full cutting by dicing, and throughput can be improved. Also,
Since the UV sheet is not required, the cost can be reduced, and the clogging and abrasion of the die sink blade can be reduced, so that the life of the dicing blade can be extended and the chipping of the glass substrate can be suppressed. Since the UV irradiation process and the manual cleaning process are unnecessary, the number of steps can be reduced. Furthermore, since a step is formed on the cut surface of the separated glass substrate, the separated glass substrate is fixed to the base plate, and an image reading device made by molding the resin with light-shielding guide means by injection or potting. Is fixed by the step and the base plate, so that the mechanical strength can be improved.

[Brief description of drawings]

FIG. 1 is a flowchart of a substrate cutting method according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the substrate after being cut by the substrate cutting method according to the first embodiment of the present invention.

FIG. 3 is a configuration diagram of an image reading apparatus assembled using a substrate cut by the substrate cutting method according to the first embodiment of the present invention.

FIG. 4 is an explanatory diagram of a super steel roll for forming a scribe groove in an example of the present invention.

FIG. 5 is a cross-sectional view of the substrate cutting method and the substrate after cutting according to the second embodiment of the present invention.

FIG. 6 is a configuration diagram of an image reading apparatus assembled using a substrate cut by a substrate cutting method according to a second embodiment of the present invention.

FIG. 7 is a flowchart of a substrate cutting method according to a first conventional example.

FIG. 8 is an explanatory view of a substrate cutting method in a first conventional example and a cross-sectional view of the substrate after cutting.

FIG. 9 is an explanatory diagram of a substrate cutting method in a second conventional example.

FIG. 10 is a flowchart of a substrate cutting method according to a third conventional example.

FIG. 11 is a flowchart of a substrate cutting method in a fourth conventional example.

FIG. 12 is an explanatory diagram of a substrate cutting method in a fifth conventional example.

FIG. 13 is an explanatory diagram of a substrate cutting method in a sixth conventional example.

FIG. 14 is a configuration diagram of a conventional image reading device.

[Explanation of symbols]

 10 Transparent Substrate on which Elements are Formed 11 Transparent Substrate 12 Photoelectric Conversion Element Section 13 Shunt Wiring 14 Passivation A Layer 15 Passivation B Layer 16 Adhesive Sheet 17 Upper Adhesive 18 Nontranslucent Layer 19 Window 21 Translucent Conductive Layer 22 Micro sheet glass 23 Scribing line 24 Weakly adhesive sheet 25 Rubber blade 26 Glass substrate transport roller 27 Step 31 Transport roller 32 Translucent guide means 33 Base plate 34 Light source 35 Roll part 36 Illumination window 40 Transparent with color filter formed Substrate 41 Red (R) color filter section 42 Green (G) color filter section 43 Blue (B) color filter section 44 Light-shielding section 51 Original plate glass 52 White light source 53 Rod lens 54 Support glass 55 Drive circuit board 56 units Stand

Claims (5)

[Claims] 1. A method for separating a glass substrate in which a large number of elements are formed on the surface of a glass substrate, the first step of performing a half cut by dicing from the front surface side of the glass substrate, and the back surface side of the glass substrate A method of separating a glass substrate, comprising a second step of forming a scribe line at a half-cut position and a third step of separating the glass substrate by breaking. 2. The electrostatic protection shunt wiring is formed on the surface of the glass substrate, and in the first step,
The method for separating a glass substrate according to claim 1, wherein half-cutting is performed along the shunt wiring to separate the shunt wiring. 3. The method for separating a glass substrate according to claim 1, wherein a second glass substrate is adhered to the surface of the glass substrate. 4. The method for separating a glass substrate according to claim 1, wherein after the first step, electrical inspection is performed on the large-sized substrate. 5. The low-adhesive pressure-sensitive adhesive sheet is attached to the front surface side of the glass substrate in the second step, and the glass substrate is separated in the third step. A method for separating a glass substrate as described above.