TW201515801A - Elastic support plate, breaking device, and splitting method - Google Patents

Abstract

An object of the present invention is to break a resin layer of a composite substrate along breaking lines. The composite substrate comprises a resin layer coated on a substrate having a surface on which a plurality of functional areas are neatly lined up in a longitudinal direction and a lateral direction. The substrate is partly broken in advance. The composite substrate 10 is disposed on an elastic support plate 40. The elastic support plate 40 comprises a frame-like section 42 that is slightly larger than the composite substrate and formed on a circumference thereof. When expansion bars 32 are lowered down, the installation of the frame-like section 42 allows the chips on an outermost circumferential edge to be pressed into the frame-like section 42 in a manner exactly the same as the remaining chips and the elastic support plate 40 is deformed to proceed with breaking.

Description

Elastic support plate, breaking device and breaking method

The present invention relates to an elastic support plate, a breaking device, and a breaking method for breaking a composite substrate obtained by coating a resin layer on a brittle material substrate such as a semiconductor substrate or a ceramic substrate.

A semiconductor wafer is manufactured by dividing an element region formed on a semiconductor wafer at a boundary position of the element region. Previously, in the case where the wafer was broken into wafers, the cutting blade was rotated by the cutting device, thereby cutting the semiconductor wafer to be small by cutting.

However, in the case of using a cutting device, it is necessary to have water to discharge the discharged debris due to the cutting, and in order not to adversely affect the performance of the semiconductor wafer by the water or the discharged debris, it is necessary to protect the semiconductor wafer and The steps before cleaning off the water or discharging the debris. Therefore, the steps become complicated, and it is impossible to reduce the cost or shorten the processing time. Moreover, since cutting is performed using a dicing blade, problems such as film peeling or chipping occur. Moreover, in a MEMS (Micro-Electro-Mechanical Systems) substrate having a micro-mechanical structure, the structure is broken due to the surface tension of water, so that water cannot be used, and there is a problem that the cutting cannot be performed by cutting. .

Further, Patent Documents 1 and 2 propose a substrate cracking device which is formed by pressing a semiconductor wafer on which a scribe line is formed from a back surface of a surface on which a scribe line is formed, along a scribe line perpendicularly to the surface And break it. The outline of the cracking by such a breaking device is shown below. Forming a plurality of functional areas neatly arranged on a semiconductor wafer to be a cracked object area. In the case of performing the breaking, first, on the semiconductor wafer, scribe lines are formed in the longitudinal direction and the lateral direction at equal intervals between the functional regions. Then, the breaking is performed along the scribe line by means of a breaking device. Fig. 1(a) is a cross-sectional view showing a semiconductor wafer placed on a cracking device before breaking. As shown in the figure, functional regions 101a and 101b are formed on the composite substrate 101, and scribe lines S1, S2, S3, ... are formed between the functional regions 101a and 101b. In the case of breaking, the tape 102 is attached to the back surface of the composite substrate 101, and the protective film 103 is attached to the front surface. Then, when the crack is broken, as shown in Fig. 1(b), a scribe line to be broken is disposed in the middle of the support knives 105, 106, in this case, a scribe line S2, so that the blade 104 is aligned from the upper portion thereof. The scribing is lowered to press the composite substrate 101. In this way, the three-point bending of the pair of support blades 105, 106 and the blade 104 is used to break.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-39931

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-149495

In the cracking device having such a configuration, when the blade 104 is pressed down and pressed at the time of cracking, the composite substrate 101 is slightly bent, and therefore stress is concentrated on the composite substrate 101 and the support blade 105. , 106 part of the front edge contact. Therefore, if the portions of the support blades 105 and 106 of the breaking device contact the functional regions 101a and 101b as shown in Fig. 1(a), a force is applied to the functional region at the time of the breakage. Therefore, there is a problem that it is possible to damage a functional area on a semiconductor wafer.

Moreover, as a board|substrate which isolate|separated using a cracking device, the composite substrate which apply|coated the enamel resin on the ceramic substrate is used. The composite substrate also has a functional region such as a lens protruding from the resin layer in each functional region. In such a composite substrate, after the ceramic substrate is cracked, the resin layer is directly pressed by the split rod, and in this case, the resin layer is deformed easily. The problem of being damaged. Further, if it is desired to use a laser to break in order to solve the above problem, there is a problem that the laser is damaged by the influence of the heat of the laser or the spatter is attached to the periphery after the laser is irradiated.

The present invention has been made in view of such a problem, and an object thereof is to enable the entire surface of a composite substrate in which a brittle material substrate has been broken to be broken without damage.

In order to solve the problem, the elastic supporting plate of the present invention supports the composite substrate when the resin layer of the composite substrate is fractured, and the composite substrate is bonded to a brittle material substrate having a plurality of functional regions formed in a longitudinal direction and a lateral direction. Coating a resin, and comprising a broken line formed in a lattice shape to break the functional area; the elastic support plate comprises: a flat plate including an elastic member having a shape larger than the composite substrate; and a frame portion disposed on the flat plate The upper layer is larger than the composite substrate and has a thickness corresponding to the composite substrate.

In order to solve the problem, the breaking device of the present invention is a breaking device for breaking a resin layer of a composite substrate, the composite substrate is coated with a resin on a brittle material substrate having a functional region on one side, and a crack is formed on the brittle material substrate. The wire breaking device comprises: a working table; an elastic supporting plate comprising a flat plate and a frame portion, wherein the flat plate comprises an elastic member, wherein the frame portion is disposed on the flat plate, larger than the composite substrate, and Having a thickness corresponding to the composite substrate, the elastic support plate is disposed on the table, the surface on which the break line is formed is the upper surface, and the composite substrate is held in the frame portion; and the expander includes the expansion rod a moving mechanism that moves the table along the surface thereof, and a lifting mechanism that raises and lowers the expander toward the surface of the composite substrate on the elastic support plate while holding the composite substrate and the expansion rod.

In order to solve the problem, the breaking method of the present invention is a method for breaking a resin layer of a composite substrate which is coated with a resin on a brittle material substrate having a functional region on one side, and is formed with a broken line to divide Disconnecting the functional area; and arranging the composite substrate in a frame portion of the elastic support plate, by going down the line that has been broken The expansion rod is pressed to break the resin layer.

Here, the cross section of the lower end of the expansion rod may be formed in an arc shape.

According to the invention having such a feature, the composite substrate is placed on the elastic support plate such that the frame portion is located on the outer peripheral portion of the composite substrate. Then, the lowermost end line of the strip-shaped extension rod is aligned in such a manner as to correspond to the break line, thereby performing fracture. Therefore, the same force as the inner wafer is applied to the end portion of the functional region, and the effect of breaking the resin layer along the fracture line without damaging the functional region can be obtained.

10‧‧‧Composite substrate

11‧‧‧Ceramic substrate

12‧‧‧矽 resin

13‧‧‧ functional area

14‧‧‧Buildings

20‧‧‧Fracture device

21‧‧‧Workbench

22, 25‧‧‧ horizontal fixed members

23‧‧‧Servo motor

24‧‧‧Ball screw

26, 29‧‧‧ moving components

27‧‧‧Female thread

28a‧‧‧Support shaft

28b‧‧‧Support shaft

30‧‧‧Expander

31‧‧‧Base

32a~32n‧‧‧Extension stick

40‧‧‧Flexible support plate

41‧‧‧Protection hole

42‧‧‧ Frame Department

50‧‧‧marking wheel

51‧‧‧Break

101‧‧‧Composite substrate

101a‧‧‧ functional area

101b‧‧‧ functional area

102‧‧‧ Tape

103‧‧‧Protective film

104‧‧‧blade

105‧‧‧Support knife

106‧‧‧Support knife

B _x1 ‧‧‧crack line

S1‧‧‧

S2‧‧‧ scribing

S3‧‧‧

S _x1 ~S _xm ‧‧‧Scratch line

S _y1 ~S _yn ‧‧‧Scratch line

1(a) and 1(b) are cross-sectional views showing the state of the prior semiconductor wafer at the time of cracking.

2(a) and 2(b) are a front view and a side view of a substrate to be separated in accordance with an embodiment of the present invention.

Fig. 3 is a perspective view showing an example of a breaking device of the resin layer of the embodiment.

Fig. 4 is a perspective view showing an example of an expander for breaking at the time of the embodiment.

Fig. 5 is a perspective view showing an elastic support plate according to an embodiment of the present invention.

6(a) to 6(d) are schematic views showing the breaking process of the composite substrate of the embodiment.

Fig. 7 (a) to (d) are schematic views showing the breaking process of the resin layer of the embodiment.

8(a) and 8(b) are cross-sectional views showing the process of breaking from different directions when the elastic supporting plate 40 does not have the frame portion 42.

Fig. 9 (a) and (b) are schematic views seen from a direction different from Fig. 7 showing a fracture process of the resin layer of the embodiment.

Next, an embodiment of the present invention will be described. 2 is a front view and a side view showing a composite substrate 10 in which a semiconductor element is formed in a rectangular shape as an example of such a substrate. In the embodiment, the composite substrate 10 to be separated is a composite substrate 10 obtained by coating a resin layer, for example, a resin 12 on a ceramic substrate 11. Here, the division of only the ceramic substrate 11 of the composite substrate 10 causes the scribe to extend vertically to the substrate to be separated at one time, so that the division is expressed as "cracking" and the breaking of the enamel resin layer 12 is performed. Since the crack of the resin layer is gradually expanded by the application of force, the breaking is expressed as "fracture". Further, the division of the entire composite substrate 10 is expressed as "breaking". In the manufacturing step of the composite substrate 10, a plurality of functional regions 13 are formed in a lattice shape along a line parallel to the x-axis and the y-axis. This functional area 13 is, for example, an LED (Light-Emitting Diode). Each functional region includes a structure 14 such as a lens that protrudes from the surface of the composite substrate 10. Further, in order to form a semiconductor wafer for each functional region, as shown by a one-dot chain line, the longitudinally equally spaced lines are set as the scribed lines S _y1 to S _yn , and the horizontally equally spaced lines are set. To score the predetermined lines S _x1 ~S _xm , the parts of the functional area are located in the center of the square surrounded by the scribed lines.

Next, the breaking device 20 for breaking the resin layer of the embodiment will be described. As shown in FIG. 3, the breaking device 20 includes a table 21 that is movable and rotatable in the y direction. In the breaking device 20, a moving mechanism is provided below the table 21, and the moving mechanism moves the table 21 along the surface thereof in the y-axis direction, thereby rotating the table 21 along the surface thereof. Further, the composite substrate 10 to be separated is placed on the table 21 via the elastic support plate 40 described below. On the top of the workbench 21, there is The horizontal fixing member 22 has a servo motor 23 held on the upper portion of the horizontal fixing member 22. A ball screw 24 is directly coupled to the rotating shaft of the servo motor 23. The lower end of the ball screw 24 is supported by another horizontal fixing member 25, and the ball screw 24 is rotatable. The upper moving member 26 includes a female screw 27 that is screwed to the ball screw 24 at the center portion, and support shafts 28a and 28b are provided downward from both end portions of the upper moving member 26. The support shafts 28a and 28b pass through one of the horizontal fixing members 25 to the through holes and are coupled to the lower moving member 29. The expander 30 described below is attached to the lower surface of the lower moving member 29 in parallel with the surface of the table 21. As a result, when the ball screw 24 is rotated by the servo motor 23, the upper moving member 26 and the lower moving member 29 are integrally moved up and down, and the expander 30 is simultaneously moved up and down. Here, the servo motor 23, the horizontal fixing members 22 and 25, and the upper and lower moving members 26 and 29 constitute an elevating mechanism for moving the expander 30 up and down.

Next, the expander 30 for breaking the resin layer 12 will be described. For example, as shown in the perspective view of FIG. 4, the expander 30 is formed with a plurality of parallel strip-shaped expansion bars 32a to 32n side by side in a planar base 31. All of the ridges of each of the expanders form a plane. Further, the interval between the rods may be fixed and is an integral multiple of 2 or more of the interval between the planned lines, and is doubled in the present embodiment. In addition, the cross section of each of the expandable rods is not particularly limited as long as it has a shape capable of being pressed along the fracture line, but is preferably an arc shape that is curved as described below. In FIG. 4, in order to clearly show the extension bars 32a to 32n, the extension bars 32a to 32n are shown as the upper surface, but in the case of use, the extension bars 32a to 32n are attached to the lower movement member 29 so as to be downward. .

In the present embodiment, the elastic support plate 40 is used when the resin layer of the composite substrate 10 is broken. As shown in the perspective view of Fig. 5, the elastic supporting plate 40 is an elastic jig made of rubber such as a rectangular flat plate, and has a size larger than that of the composite substrate 10, for example, a thickness of about several mm. The elastic supporting plate 40 has a plurality of circular protective holes 41 aligned in the longitudinal direction of the x-direction and the y-direction in a position corresponding to a region including the functional regions of the composite substrate 10. The distance between the protective holes 41 and the scribed lines S _x1 to S _xm , S _y1 to S _yn of the composite substrate 10 to be ruptured is accurately matched in advance, and the respective protective holes 41 are located at the scribe It is formed in such a manner that the centers of the regions surrounded by the lines S _x1 to S _xm and S _y1 to S _yn are formed. The protective hole 41 is for not applying a force to the structural body 14 such as a lens of the composite substrate 10 at the time of fracture, and the through hole is larger than the structural body 14 here.

Further, the elastic supporting plate 40 is formed with a frame portion 42 on the outer side of the region where the plurality of protective holes are formed. The thickness of the frame portion 42 is set to be equal to the thickness of the composite substrate 10 to be broken, and is sized such that the composite substrate 10 can be directly embedded inside the frame.

Next, a method of breaking the composite substrate 10 will be described. Fig. 6 is a view showing a breaking process, and Fig. 6(a) shows a part of the composite substrate 10. First, as shown in Fig. 6(b), the surface of the ceramic substrate 11 is used as the upper surface, and the scribing wheel 50 is moved by a scribing device (not shown) to perform scribing along the line to be scored. Therefore, as shown in FIG. 2(a), the scribe lines S _x1 to S _xm in the x direction and the scribe lines S _y1 to S _{yn in the} y direction are formed.

Then, in the cracking step, as shown in FIG. 6(c), the composite substrate 10 is first inverted. Then, using a breaking device (not shown), the split rod 51 is positioned directly above the already formed scribe line, and only the ceramic substrate 11 is broken by pressing the split rod 51 downward.

Thereby, only the ceramic substrate 11 is broken along the scribe lines S _x1 to S _xm and S _y1 to S _yn . Fig. 6(d) shows a portion of the composite substrate 10 after the respective scribe lines are broken along the x direction and the y direction. Further, since the scribe lines S _x1 to S _xm and S _y1 to S _yn are all broken, they are hereinafter referred to as break lines B _x1 to B _xm and B _y1 to B _yn .

Next, as shown in FIG. 7, a method of extending the rupture line formed on the ceramic substrate 11 to the enamel resin layer and ending the division of the substrate 10 will be described. Fig. 7 is a view showing a fracture process of the resin layer 12, and Fig. 7(a) shows a part of the composite substrate. First, the elastic supporting plate 40 is placed on the table 21 of the breaking device 20, and the composite substrate 10 is placed on the upper surface of the elastic supporting plate 40. At this time, the composite substrate 10 is disposed such that the structure 14 of the functional region 13 of the composite substrate 10 is completely contained in the protective hole 41 of the elastic support plate 40. Then, as shown in FIG. 7( a ), the resin layer 12 is placed in contact with the elastic support plate 40 . As such, all of the structures 14 are positioned corresponding to the protective holes 41 and are not in direct contact with the elastic support plate 40.

The rupture line of the ceramic substrate 11, for example, S _{x1 is} the upper surface. Then, the ridge line of the lowermost one of the expander 30, for example, 32a, is positioned to be aligned with the broken line.

Then, the servo motor 23 is driven to lower the upper moving member 26 and the lower moving member 29 at the same time, and the expanding rod side of the expander 30 is gradually lowered while being kept parallel with respect to the table 21. Then, as shown in FIG. 7(b), the expanded rod 32a is pressed against the ceramic substrate 11 from directly above the break line _Bx1 . As described above, as shown in FIG. 7(c), the ceramic substrate 11 is pressed and deformed by the expansion bar 32a, and is sunk to deform the elastic support plate 40 into a V shape. At this time, as shown in FIG. 7(b), the composite substrate 10 is slightly sunk when the expansion rod 32a is pressed in. However, since the protective hole 41 is provided at a portion of the left and right corresponding to the functional region 13, the functional region may not be provided. The protruding structure 14 of 13 is directly in contact with the elastic supporting plate 40, and the resin layer 12 of the composite substrate 10 is broken. At this time, since the right and left sides of the ceramic substrate are uniformly deformed by the press-fitting of the expansion rod 32a, the crack can be extended downward along the fracture line. Here, the cross-sectional shape of the underside of the expansion rod is not particularly limited. However, in the case of, for example, a triangular shape, the necessity of accurately positioning the apex alignment break line is relatively high. Therefore, in order to deform the ceramic substrate 11 and the resin 12 in a balanced manner in this manner, the cross section below each of the expanded rods is formed in an arc shape. Thereby, the allowable range of the accuracy of positioning the ridge line of the expansion rod aligned with the broken line is relatively wide. Further, by sufficiently lowering the expansion rod, the crack in the resin progresses and the pushing force is applied to the right and left, thereby terminating the fracture. When the break is completed, the servo motor 23 is reversed and the expander 30 is raised.

At this time, a plurality of expansion rods are formed side by side in the expander 30, and the interval is twice as long as the scribe line, so that the expansion rod can simultaneously break the enamel resin 12 along the plurality of rupture lines every other broken line. .

8 and 9 are side views seen from different axes, FIG. 8 shows a case where no frame is formed, and FIG. 9 shows a case where the frame portion 42 is provided. If there is no frame-like portion, when the expansion rod 32a is pressed downward as shown in Fig. 8(a), the elastic support plate 40 is deformed, but a different force is applied to the outermost portion thereof, and the accuracy of the fracture is deteriorated. On the other hand, in the present embodiment, as shown in FIG. 9(a), the frame-like portion 42 of the elastic supporting plate having the same thickness as that of the composite substrate 10 is formed on the outer side of the wafer on the outermost periphery of the composite substrate 10. Therefore, as shown in FIG. 9(b), when the expander 32a is pressed downward, the frame-like portion 42 is also pressed in the same manner as the composite substrate 10, and the lower elastic support plate 40 is deformed. Therefore, the outermost peripheral wafer is also subjected to the same force as the inner wafer, so that the fracture accuracy of the peripheral portion is not deteriorated.

Further, in FIG. 9, a gap is provided between the end portion of the composite substrate 10 and the frame portion 42, but the frame portion 42 can be disposed in contact with the end portion of the composite substrate 10.

Then, the table 21 is moved in the y-axis direction by an amount corresponding to the distance between the break lines, and the expander 30 is similarly lowered, whereby the breakage of the resin layer can be ended for the other adjacent broken lines. Here, since the interval between the extension bars is twice the distance between the scribe lines, the fracture of all the x-axis directions of the composite substrate 10 can be terminated by breaking the table 21 once. Further, when the interval between the extension bars is three times the distance between the scribe lines, the fracture in the x-axis direction can be terminated by breaking the table 21 twice.

Then, the table 21 is rotated by 90°, and the expander 30 is similarly lowered for the y-axis breakage line to break the resin layer. Then, the table 21 is moved in the y-axis direction by an amount corresponding to the distance between the broken lines, and the expander 30 is similarly lowered. In this way, the entire surface is broken, and the resin is broken along each fracture line to break the square functional region, thereby forming a plurality of LED wafers.

In the embodiment, the ceramic substrate has been described as the substrate to be the base. However, the present invention is also applicable to various brittle material substrates such as a semiconductor substrate or a glass substrate.

Further, in the embodiment, the enamel resin is described as a resin applied to the ceramic substrate, but may be a layer of other various materials, for example, a layer such as a polarizing plate laminated on the glass substrate.

Further, in this embodiment, the frame-shaped portion 42 is formed on the outer peripheral portion of the elastic support plate 40. However, the frame-shaped portion may be formed as a different member, and the frame-shaped portion may be disposed on the elastic support plate. Perform a fracture. In this case, various frame-shaped portions can be prepared in advance according to the thickness or shape of the composite substrate 10 to be broken, and can be appropriately selected and used. In this case, the frame portion may have elasticity, or may be a member having the same hardness as the composite substrate.

Further, in this embodiment, the composite substrate 10 has a structure protruding from the functional region, but the structure is not essential, and the structure protruding from the front surface of the composite substrate may not be provided. In this case, the protective hole of the elastic support plate is not required.

[Industrial availability]

When the brittle material substrate having the region to be protected is broken, the present invention can be broken without damaging the region to be protected. Therefore, the present invention can be effectively applied to a fracture device for forming a substrate having a functional region.

11‧‧‧Ceramic substrate

12‧‧‧矽 resin

32a‧‧‧Extension stick

40‧‧‧Flexible support plate

42‧‧‧ Frame Department

Claims (5)

An elastic support plate that supports the composite substrate when the resin layer of the composite substrate is fractured, the composite substrate being coated with a resin on a brittle material substrate having a plurality of functional regions formed in a longitudinal direction and a lateral direction. The elastic support plate includes: a flat plate including an elastic member having a shape larger than the composite substrate; and a frame portion disposed on the flat plate, which is larger than the composite The substrate has a thickness corresponding to the composite substrate. A breaking device for breaking a resin layer of a composite substrate, the composite substrate is coated with a resin on a brittle material substrate having a functional region, and a crack line is formed on the brittle material substrate to break the above The rupture device includes: a table; an elastic support plate, comprising: a flat plate and a frame portion, wherein the flat plate comprises an elastic member, wherein the frame portion is disposed on the flat plate, larger than the composite substrate, and has a corresponding composite substrate a thickness, wherein the elastic support plate is disposed on the table, the surface on which the break line is formed is an upper surface, and the composite substrate is held in the frame portion; the expander includes an expansion rod; and a moving mechanism enables The table moves along the surface thereof, and the lifting mechanism holds the expander and the expansion bar in parallel while moving the expander toward the surface of the composite substrate on the elastic support plate. The breaking device of claim 2, wherein the cross section of the lower end of the expander of the expander is formed in an arc shape. A breaking method for breaking a resin layer of a composite substrate, the composite substrate is coated with a resin on a brittle material substrate having a functional region on one side, and a crack line is formed to break the functional region; The above-described breaking method is to arrange the composite substrate in the frame portion of the elastic support plate of claim 1, and to break the resin layer by pressing the expansion rod down the line that has been broken. The breaking method of claim 4, wherein the cross section of the lower end of the expansion rod is formed in an arc shape.