TW201416202A - Breaking device of brittle material substrate and breaking method of brittle material substrate - Google Patents

Abstract

The present invention provides a breaking device of a brittle material substrate and a breaking method of a brittle material substrate, which break a substrate without using an adhesive film, so as to reduce the cost of adhesive film. A substrate 100 is sucked and held on the elastic sheet member 101 through evacuation of gas between the substrate 100 and an elastic sheet member 101 by means of the operation of a gas evacuation section 74 through a suction slot 72 and a suction port 71. Under this condition, if the substrate 100 is pressed down by a breaking rod 14, a bending stress is induced in the substrate 100 due to the elastic force of the elastic sheet member 101, thus causing the substrate 100 to break at the position corresponding to a scribe line 99. The breaking device according to the present invention comprises: a light-transmitting elastic member for supporting the brittle material substrate; a fixing means for fixing the brittle material substrate to the surface of the elastic member; a light-transmitting platform for supporting the elastic member from the opposite side of the brittle material substrate; a breaking rod for pressing, from the main surface opposite to the main surface formed with the scribe lines, the brittle material substrate which is supported by the elastic member; a camera for photographing the scribe lines through the platform and the elastic member; a moving mechanism, based on the images photographed by the camera, for moving the platform relative to the breaking rod.

Description

Cracking device for brittle material substrate and cracking method for brittle material substrate

The present invention relates to a cracking device and a breaking method for a brittle material substrate in which a brittle material substrate is broken.

The semiconductor element is manufactured by breaking (cutting) the element region formed on the substrate at a boundary position of the region. When the substrate is cut in this way, a breaking device is used. The breaking device has a configuration in which a base plate on which a scribe line is formed on one main surface by a split rod in a Z direction from a main surface opposite to a main surface on which a scribe line is formed is used. The substrate is broken by a scribe line in the X direction, and a scribe line formed by scribe the surface of the substrate by using the scribe wheel is formed on one main surface of the substrate, and a cutting tool such as a diamond cutter is formed on the main surface of the substrate. a scribed groove in which the surface of the substrate is linearly removed, an ablation line that is linearly removed by ablation of the surface of the substrate by laser light, or a partial melting of the surface of the substrate by using laser light to form a linear structure of the substrate Processing lines for ground deterioration (in the present specification, these are collectively referred to as "scribe lines"). In addition, when the substrate is broken, the substrate is placed in contact with the support member by a distance of a predetermined distance in the Y direction, which is called a support blade or the like (see, for example, Patent Document 1).

Fig. 8 is a schematic view showing a state in which the substrate is broken by such a prior breaking device.

a circular opening formed in the center of the annular member 43 to adhere thereto An adhesive film 42 called a cut-off protective tape is adhered in a face-down state. Further, the substrate 100 of the fractured object is adhered to the adhesive surface of the adhesive film 42. The annular member 43 to which the substrate 100 is adhered via the adhesive film 42 is provided to the rotating member 11 of the breaking device. In this state, the substrate 100 is interposed between the protective members 44 and supported by the support members 61 and 62 by one of the support mechanisms 10.

A scribe line 99 is formed on the main surface of the lower side of the substrate 100. The scribe line 99 is imaged by the CCD camera 35 from the gap between the pair of support members 61, 62, and the substrate 100 is positioned based on the image captured by the CCD camera 35. Then, the main surface of the substrate 100 opposite to the main surface on which the scribe line is formed is pressed by the rupture rod 14, and the substrate 100 is broken along the scribe line 99.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-39931

In the case where the substrate 100 is adhered to the adhesive film 42 and cracked as described above, there is a problem that the adhesive film 42 is consumed every time the crack is performed. Therefore, the cost for the cracking of the substrate is increased by the amount equivalent to the consumption of the adhesive film 42. Moreover, it is necessary to perform the work of bonding the substrate 100 to the adhesive film 42.

The present invention has been made to solve the above problems, and an object of the invention is to provide a method for breaking a substrate without using an adhesive film, and to achieve high efficiency of work and cost reduction of an adhesive film. The device and the method of breaking the substrate of the brittle material.

The invention of claim 1 is a cracking device for a brittle material substrate, which is obtained by pressing a cracking material along a scribed line on a brittle material substrate having a scribed line on one main surface to crack the brittle material substrate An elastic member having a light transmissive property and supporting the brittle material substrate in contact with a main surface of the brittle material substrate on which the scribe line is formed; and a fixing means for The brittle material substrate is fixed to a surface of the elastic member; the platform has translucency, and the elastic member is supported from a side opposite to the brittle material substrate; and the split rod is opposite to a main surface on which the scribe line is formed The main surface of the side presses the substrate of the brittle material fixed to the elastic member; the camera photographs the scribing line via the platform and the elastic member; and the moving mechanism that makes the platform according to the image captured by the camera Move relative to the above-mentioned split rod.

According to the invention of claim 1, the fixing means is characterized in that the brittle material substrate is adsorbed and held on the surface of the elastic member by exhausting the brittle material substrate and the elastic member. Keep the organization.

According to the invention of claim 2, the adsorption holding mechanism includes a suction port formed on an abutting surface of the elastic member and the brittle material substrate for adsorbing and holding the brittle material Each element is formed by breaking the substrate and corresponding to each of the above elements.

The invention of any one of Claims 1 to 3, wherein the elastic member is a sheet member made of a transparent rubber (for example, a transparent polyoxyethylene rubber).

The invention of claim 5 is a method for breaking a substrate of a brittle material, which is The brittle material substrate is crushed by pressing the crack bar along the scribe line on the brittle material substrate having the scribe line formed on one main surface, and is characterized in that: the mounting step is performed to form the above-mentioned The surface of the elastic member on which the above-mentioned scribed line is placed and placed on a translucent platform is disposed in a state in which the main surface of the scribe line is in contact with the surface of the elastic member. And an adsorption holding step of adsorbing and holding the main surface of the brittle material substrate on which the scribe line is formed on the surface of the elastic member; and a photographing step of sculpting the image by the camera via the platform and the elastic member The line is photographed; the moving step is to move the platform relative to the split rod according to the image captured by the camera; and the pressing step is performed by the above-mentioned broken line The main surface on the opposite side of the main surface presses the brittle material substrate adsorbed and held by the elastic member.

According to the inventions of the first aspect and the fifth aspect, the substrate can be broken by the elastic member without using the adhesive film, and the operation of bonding the substrate to the adhesive film can be omitted, and the adhesive film can be reduced. The cost. At this time, since the elastic member and the platform are translucent, the photographing of the scribe line for positioning the substrate and the split rod can be performed from the elastic member and the platform side.

According to the invention of claim 2, the substrate can be adsorbed and held on the surface of the elastic member to be fixed.

According to the invention of claim 3, each element made by the rupture can be adsorbed and held on the surface of the elastic member.

According to the invention of claim 4, the elasticity and light transmittance suitable for the fracture of the substrate can be obtained.

10‧‧‧Support mechanism

11‧‧‧Rotating components

12‧‧‧Y platform

13‧‧‧Support table

14‧‧‧Break

15‧‧‧ Hanging member

16‧‧‧Elevator

23, 31, 34, 36‧‧‧ stepper motor

25, 32, 33, 38‧‧‧ ball screw

35‧‧‧CCD camera

37‧‧‧rails

71‧‧‧Adsorption port

72‧‧‧Adsorption tank

74‧‧‧Exhaust department

99‧‧•marking

100‧‧‧Substrate

101‧‧‧Elastic sheet member

102‧‧‧Lighting table

P‧‧‧ components

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a breaking device for a brittle material substrate of the present invention.

Figure 2 is a perspective view of a breaking device for a brittle material substrate of the present invention.

FIG. 3 is a schematic view showing a state in which the substrate 100 is placed on the light-transmissive stage 102 and the elastic sheet member 101 and is broken.

Figure 4 is a partial enlarged view of Figure 3.

FIG. 5 is an explanatory view showing the arrangement of the substrate 100 and the adsorption port 71 formed in the elastic sheet member 101.

FIG. 6 is an explanatory view showing a configuration of the adsorption groove 72 formed in the light transmission table 102.

Fig. 7 is a flow chart showing the breaking operation.

Fig. 8 is a schematic view showing a state in which a substrate is broken by a previous breaking device.

Hereinafter, embodiments of the present invention will be described based on the drawings. 1 and 2 are perspective views of a breaking device for a brittle material substrate of the present invention.

The brittle material substrate cracking device is used for ceramics, glass, or other brittleness such as LTCC (Low Temperature Co-fired Ceramic) or HTCC (Low Temperature Co-fired Ceramic). The brittle material substrate (hereinafter simply referred to as "substrate") formed of the material is broken (cut). The substrate breaking device has a configuration in which the substrate is adsorbed and held on the elastic sheet member 101 made of transparent polyoxyethylene rubber disposed on the glass-made light-transmitting table 102, and is broken. The cracking device of the substrate includes: a rotating member 11 that scribes a line formed on a substrate that is adsorbed and held on the elastic sheet member 101 The light transmissive table 102 is rotated in a manner aligned with a desired direction; a Y platform 12 supporting the rotating member 11; a support table 13 supporting the Y platform 12; and a lifting platform 16 which is raised and lowered with respect to the rotating member 11 . The support base 13 is provided on the floor via the four shafts 18, the base 17 and the leg portions 19.

On the upper surface of the support table 13, four columnar lifting guides 24 are erected on the outer side of the rotating member 11, and the pedestal 21 is fixed so as to span the upper ends of the columnar lifting guides 24. Further, between the support base 13 and the pedestal 21, an elevating table 16 that can be lifted and lowered by the columnar elevating guide 24 is provided.

A stepping motor 23 is provided on the pedestal 21 with the support member 22 interposed therebetween. A ball screw 25 that passes through the pedestal 21 is rotatably coupled to a rotating shaft of the stepping motor 23, and the ball screw 25 is screwed to a female screw portion formed on the lifting table 16. Therefore, the lifting table 16 is raised and lowered in the Z direction by the driving of the stepping motor 23.

As shown in FIG. 2, a split rod 14 is attached to the lower surface of the lifting platform 16 via the hanging member 15. The split rod 14 is also referred to as a blade or a split cutter for imparting a force to break the substrate to the substrate by pressing the substrate along the scribe line formed on the substrate when the substrate is broken. .

As shown in FIG. 2, the Y stage 12 receives the driving of the ball screw 32 which is rotated by the driving of the stepping motor 31, and reciprocates in the Y direction on the support table 13. Further, the rotational angle position of the rotating member 11 can be adjusted by rotating the ball screw 33 by the stepping motor 34.

As shown in FIG. 2, a CCD camera 35 is disposed below the support table 13. The CCD camera 35 is movable in the X direction along one of the support plates 39 supported on the base 17 to the guide rails 37. Further, the support portion 41 of the CCD camera 35 is screwed to the ball screw 38 that is rotated by the driving of the stepping motor 36. Therefore, the CCD camera 35 receives the driving of the stepping motor 36, and on the X side. Move back and forth. Further, the CCD camera 35 is configured to observe the positional relationship between the score line formed on the substrate and the splitting bar 14 via the light transmitting table 102 and the elastic sheet member 101.

3 is a schematic view showing a state in which the substrate 100 is placed on the light-transmissive stage 102 and the elastic sheet member 101 to be broken, and FIG. 4 is a partially enlarged view thereof.

As shown in FIGS. 3 and 4, a suction port (exhaust port) 71 for sucking and holding the substrate 100 on the elastic sheet member 101 is formed in the elastic sheet member 101. Further, an adsorption groove (exhaust groove) 72 is formed at a position facing the adsorption port 71 of the light transmission table 102. The adsorption tank 72 is connected to an exhaust unit 74 such as a vacuum pump or an exhaust fan. Therefore, the substrate 100 placed on the elastic sheet member 101 is adsorbed and held by the exhaust portion 74 through the adsorption groove 72 and the adsorption port 71 between the substrate 100 and the elastic sheet member 101. On the elastic sheet member 101.

Further, even in this state, since both of the light-transmissive stage 102 and the elastic sheet member 101 have light transmissivity, the CCD camera 35 can be passed through the light-transmissive stage 102 and the elastic sheet member 101 as shown in FIG. The scribe line 99 formed on the substrate 100 is observed.

FIG. 5 is an explanatory view showing the arrangement of the substrate 100 and the adsorption port 71 formed in the elastic sheet member 101.

In the embodiment shown in FIG. 5, the substrate 100 is divided into 42 elements P by being cut by five straight lines and six horizontal lines. Therefore, in order to adsorb and hold the respective elements P which are formed by breaking the substrate 100, 42 adsorption ports 71 corresponding to the respective elements P are formed in the elastic sheet member 101. In the embodiment, for the sake of convenience of explanation, the case where the substrate 100 is divided into 42 elements P is shown. However, the substrate 100 may be further divided into a plurality of elements P.

FIG. 6 is an explanatory view showing a configuration of the adsorption groove 72 formed in the light transmission table 102.

In the light transmission table 102, an adsorption groove 72 composed of six vertical and seven horizontal groove portions is formed. Therefore, the adsorption groove 72 is disposed at a position facing each of the 42 adsorption ports 71. Further, the adsorption groove 72 does not need to be constituted by the vertical and horizontal groove portions, and may be formed only by the vertical direction or only the horizontal groove portion. In short, it is only necessary to arrange the adsorption grooves 72 at positions facing the adsorption ports 71.

Next, the cracking operation of the substrate 100 using the cracking device will be described. Fig. 7 is a flow chart showing the breaking operation.

When the severing operation is performed, first, the substrate 100 is placed on the elastic sheet member 101 of the rupturing device (step S1). Then, under the action of the exhaust portion 74, the substrate 100 and the elastic sheet member 101 are exhausted via the adsorption groove 72 formed in the light transmission table 102 and the adsorption port 71 penetrating the elastic sheet member 101. Thereby, the substrate 100 is adsorbed and held on the elastic sheet member 101 (step S2).

Next, the scribe line 99 formed on the substrate 100 is imaged by the CCD camera 35 (step S3). At this time, since the light-transmissive stage 102 and the elastic sheet member 101 have light transmissivity, the CCD camera 35 can be used to scribe the substrate from the lower side of the substrate 100 via the light-transmissive stage 102 and the elastic sheet member 101. The image of 99 is taken. At the time of the photographing of the scribe line 99, the CCD camera 35 is moved in the X direction by the driving of the stepping motor 36, and the image is photographed in its entirety for the scribe line 99 extending in the X direction.

Next, the substrate 100 and the splitting bar 14 are relatively moved in accordance with the image captured by the CCD camera 35, whereby the positioning of the score line 99 and the split bar 14 in the substrate 100 is performed (step S4). More specifically, the angle and position of the score line 99 formed on the substrate 100 are identified based on the image of the score line 99 taken by the CCD camera 35. Then, driven by the stepper motor 31 The Y stage 12 is moved in the Y direction, and the rotational angle position of the rotating member 11 is adjusted by the driving of the stepping motor 34, whereby the substrate 100 is moved in the Y direction and the θ direction, and the substrate 100 is moved. It is disposed at a position where the score line 99 disposed at the end portion and the split rod 14 are accurately opposed to each other.

Then, the substrate 100 is pressed by the split bar 14, and the substrate 100 is broken. That is, the lift table 16 is lowered by the driving of the stepping motor 23, and the split rod 14 is brought into contact with the main surface of the substrate 100 on the side opposite to the score line 99, and then the split rod 14 is further lowered. In this state, since the substrate 100 is supported by the elastic sheet member 101, the substrate 100 is subjected to bending stress by the elastic force of the elastic sheet member 101. Then, when the split rod 14 is further lowered, the substrate 100 is disposed such that the score line 99 coincides with the split rod 14 and interacts therewith, so that the substrate 100 is positioned at a position corresponding to the score line 99. Broken.

In order to cause the substrate 100 to generate appropriate bending stress to preferably break the substrate 100, the thickness and hardness of the elastic sheet member 101 must be appropriately selected. The thickness of the elastic sheet member 101 also depends on the hardness and thickness of the substrate 100, but is preferably about 1 mm to 5 mm. Further, the hardness of the elastic sheet member 101 depends on the hardness and thickness of the substrate 100, but is preferably about 30 to 70 degrees (A50 to A70 of JIS K 6253).

When the crack of the scribe line 99 is completed along the first line of the substrate 100, the substrate 100 is imaged by the CCD camera 35, and the Y stage 12 is moved in the Y direction by the driving of the stepping motor 31. After the distance between the score lines 99, the split rod 14 is again lowered, and the substrate 100 is broken at a position corresponding to the next score line 99. Furthermore, when the Y stage 12 can be accurately moved by a distance equivalent to the distance between the score lines 99, the photographing of the substrate 100 by the CCD camera 35 can be omitted.

Furthermore, when the line is 99 along the direction orthogonal to the line 99 at the end of the break, When the splitting is performed, the rotating member 11 is rotated by 90 degrees by the driving of the stepping motor 34, and then the above-described steps S3, S4, and S5 are repeated. In this case, even when the substrate 100 is brought into the element P shown in FIG. 5 as the substrate 100 is broken, the respective elements P formed by breaking the substrate 100 for adsorption are held. On the other hand, the elastic sheet member 101 is formed with 42 adsorption ports 71 corresponding to the respective elements P, so that the substrate 100 does not fall off from the elastic sheet member 101.

When the cracking operation of the substrate 100 is completed in the region corresponding to all the scribe lines 99 (step S6), the substrate 100 (each element P) is carried out to complete the work (step S7).

In the above embodiment, the adsorption holding mechanism including the adsorption port 71 and the adsorption groove 72 and the substrate 100 is adsorbed and held on the surface of the elastic sheet member 101 is used as the substrate 100 for fixing the substrate 100 to the elastic sheet member 101. The means of fixing the surface, but other fixing means can also be used. For example, a configuration may be adopted in which the surface of the translucent elastic sheet member 101 is made of a microadhesive material, and the substrate 100 is adhered and held on the surface of the elastic sheet member 101.

14‧‧‧Break

35‧‧‧CCD camera

71‧‧‧Adsorption port

72‧‧‧Adsorption tank

99‧‧•marking

100‧‧‧Substrate

101‧‧‧Elastic sheet member

102‧‧‧Lighting table

Claims (5)

A cracking device for a brittle material substrate, wherein the brittle material substrate is broken by pressing a cracking bar along the scribe line on a main surface of a brittle material substrate; An elastic member that is translucent and supports the brittle material substrate in a state in which the main surface of the brittle material substrate is in contact with the scribe line; and a fixing means for fixing the brittle material substrate to a surface of the elastic member; a platform having light transmissivity, supporting the elastic member from a side opposite to the brittle material substrate; and a split rod pressed and fixed from a main surface opposite to a main surface on which the score line is formed a substrate for a brittle material of the elastic member; a camera for photographing the score line via the platform and the elastic member; and a moving mechanism for causing the platform and the split rod according to an image captured by the camera Relative movement. The cracking device for a brittle material substrate according to claim 1, wherein the fixing means adsorbs and holds the brittle material substrate at the elastic state by exhausting the brittle material substrate and the elastic member. The adsorption holding mechanism of the surface of the member. The cracking device for a brittle material substrate according to claim 2, wherein the adsorption holding mechanism has an adsorption port formed on an abutting surface of the elastic member and the brittle material substrate for adsorbing and holding Each element made by breaking the brittle material substrate corresponds to each element. A breaking device for a brittle material substrate according to any one of claims 1 to 3, wherein The elastic member is a sheet member made of transparent rubber. A method for cracking a substrate of a brittle material, wherein the brittle material substrate is fractured by pressing a cracked rod along the scribe line on a substrate having a scribed line on one main surface; a placing step of placing a brittle material substrate on which the scribe line is formed in a state of being disposed in a state in which the main surface on which the scribe line is formed is brought into contact with the surface of the elastic member. a surface of the elastic member on the platform; an adsorption holding step of adsorbing and holding the main surface of the brittle material substrate on which the score line is formed on the surface of the elastic member; and the photographing step is performed by The camera photographs the score line via the platform and the elastic member; the moving step is to move the platform relative to the split rod according to the image captured by the camera; and the pressing step is performed by the The split rod is pressed against the brittle material substrate adsorbed and held by the elastic member from the main surface opposite to the main surface on which the score line is formed.