TWI632040B - Apparatus and method for breaking brittle substrate - Google Patents

Abstract

The invention discloses a brittle material substrate chipping device, which is characterized by using a pre-cut The cutting device forms a pre-cut track with a depth less than the thickness of the brittle material substrate at a predetermined position on the brittle material substrate, and then uses a linear split device to move toward the surface of the brittle material substrate, so that the brittle material substrate is in the linear shape. When the slicing device contacts the pre-cutting path, the tension sliver of the linear slicing device is used to form a sub-fragile material substrate with a smaller area. Using the sliver of the present invention can improve the utilization rate of the brittle material substrate.

Description

Fragmentation device for brittle material substrate and sharding method using same

The invention relates to a fragile material substrate chipping device and a chipping method using the same.

At present, after the semiconductor industry and the panel industry are completed, the substrate must be split into smaller substrates with a smaller area after further cutting and splitting procedures. Among them, the common method of splitting is to first form a pre-cut lane on the substrate, and then use the impact ear area or apply instant stress from the front or back of the pre-cut lane to make the original substrate split into a smaller area. . However, these sliver processes suffer from wasted ear material, uneven cutting edges, and even contamination of components on the substrate. In view of this, the industry is eagerly looking forward to developing a chip device suitable for the semiconductor industry or the panel industry and a chip method using the chip device to improve the shortcomings of the current chip device and the chip method using the chip device.

In view of this, the present invention discloses a brittle material substrate chipping device, which is characterized in that a pre-cut device is used to form a pre-cut track at a predetermined position on the brittle material substrate at a depth less than the thickness of the brittle material substrate, and then a line is used. The type split device moves toward the surface of the brittle material substrate, so that when the linear split device contacts the pre-cut lane, the tension of the linear split device is used to split the substrate into a less brittle material substrate with a smaller area. The invention of the split sheet can improve the utilization rate of the brittle material substrate.

One feature of the present invention is to disclose a fragile material substrate chip device, comprising: a platform for carrying a fragile material substrate having opposite upper and lower surfaces, the platform including a plurality of protruding structures, and the fragile material substrate is The lower surface is placed on the protruding structures on the platform; a pre-cutting device is disposed above the platform, and the pre-cutting device can be performed at a predetermined position on the upper surface of the brittle material substrate Pre-cut and form a pre-cut track with a depth less than the thickness of the brittle material substrate; and a linear split device arranged above the platform, and the linear split device can be directed toward the brittle material substrate after being aligned with the pre-cut lane The movement of the upper surface causes the brittle material substrate to be split into a less brittle material substrate with a smaller area by the tension of the linear split device when the linear split device contacts the pre-cut lane.

Another feature of the present invention is to disclose another fragile material substrate chipping device, including: a carrier for carrying a fragile material substrate having opposite upper and lower surfaces, the carrier including a first platform and a second platform and a A connecting structure connecting the first platform and the second platform, the first platform and the second platform have a first gap therebetween, and the first platform and the second platform are located at the same horizontal plane, wherein the first A platform and the second platform each include a plurality of protruding structures, and the brittle material substrate is placed on the protruding structures on the first platform and the second platform through the lower surface; a pre-cut device Is disposed above the carrier, and the pre-cut device can pre-cut at one of the upper surfaces of the brittle material substrate at a predetermined position at the first interval, and form a depth smaller than the thickness of the brittle material substrate A pre-cut line; and a linear sliver device disposed above the first interval of the carrier, and the linear sliver device can be directed toward the brittle material after being aligned with the pre-cut line. The upper surface of the moving plate, the brittle material substrate so that the line segments to the pre-contacting means when scribe line segments by means of the tension of the lobes having an area of less times brittle material substrate.

Another feature of the present invention is to disclose another fragile material substrate chipping device, including: a carrier for carrying a fragile material substrate having opposite upper and lower surfaces, the carrier including a first platform and a second platform and a A connecting structure connecting the first platform and the second platform, the first platform and the second platform have a first gap therebetween, and the first platform and the second platform are located at the same horizontal plane, wherein the first A platform and the second platform each include a plurality of protruding structures, and the brittle material substrate is placed on the protruding structures on the first platform and the second platform through the lower surface; a pre-cut device Is disposed above the carrier, and the pre-cut device can pre-cut at one of the upper surfaces of the brittle material substrate at a predetermined position at the first interval, and form a depth smaller than the thickness of the brittle material substrate A pre-cutting path; and a linear lobing device, which can be moved up and down on the connecting structure aligned below the first interval of the carrier, and between the pre-cutting path and the After the linear split device is aligned, the linear split device moves upward toward the lower surface of the brittle material substrate, so that the brittle material substrate is stretched by the tension of the linear split device when the linear split device contacts the pre-cut lane. Sub-brittle material substrate with smaller area.

Another feature of the present invention is to disclose another fragile material substrate chipping device, including: a conveying system for conveying a fragile material substrate with opposite upper and lower surfaces, the conveying system comprising a plurality of parallel extending along the first direction Aligned rollers with a second interval between adjacent rollers; a pre-cut device is placed above the conveying system, and the pre-cut device can be on one of the upper surfaces of the brittle material substrate Pre-cutting at a predetermined position, and forming a pre-cutting path with a depth less than the thickness of the brittle material substrate; and a linear sliver device, which is arranged above or below one of the second intervals of the conveying system, and at the brittle material When the pre-cut track on the substrate is at the second interval, after the linear split device is aligned with the pre-cut track, it moves toward the upper surface or the lower surface of the brittle material substrate, so that the brittle material substrate After the linear splitting device contacts the pre-cut lane, the linear splitting device is used to rupture the substrate into a less brittle material substrate with a smaller area by the tension of the linear splitting device.

Another feature of the present invention is to disclose another fragile material substrate chipping device, including: a conveying system for conveying a fragile material substrate having opposite upper and lower surfaces, the conveying system including a first conveying mechanism and a second A conveying mechanism with a third interval between the first and second conveying mechanisms; a pre-cutting device disposed above the conveying system, and the pre-cutting device may be predetermined on one of the upper surfaces of the brittle material substrate Pre-cut at a position, and a pre-cutting path having a depth smaller than the thickness of the brittle material substrate is formed; and a linear split device is disposed above the third interval between the first conveying mechanism and the second conveying mechanism Or below, when the brittle material substrate spans between the first conveying mechanism and the second conveying mechanism and the pre-cutting path is located at the third interval between the first and second conveying mechanisms, the line type After the split device is aligned with the pre-cutting track, it moves toward the upper surface or the lower surface of the brittle material substrate, so that the brittle material substrate is in contact with the linear split device. After the scribe line segments by means of the tension of the lobes having an area of less times brittle material substrate.

Another feature of the present invention is to disclose a brittle material substrate splitting device as described above, and the brittle material substrate is a glass substrate or a semiconductor substrate.

Another feature of the present invention is to disclose a brittle material substrate split device as described above, and the pre-cut device is an optical pre-cut device or a mechanical pre-cut device.

Another feature of the present invention is to disclose a brittle material substrate chipping device as described above, and the optical pre-cutting device is a laser cutter.

Another feature of the present invention is to disclose a brittle material substrate chipping device as described above, and the mechanical pre-cutting device is a cutter wheel cutter or a cutter blade cutter.

Another feature of the present invention is to disclose a brittle material substrate split device as described above, and the linear split device is a metal wire, a metal composite wire or an insulating wire.

Another feature of the present invention is to disclose a brittle material substrate chipping method using the brittle material substrate chipping device described above. The steps include: providing a brittle material substrate chipping device as described in paragraph [0004]; The brittle material substrate on the lower surface, and the brittle material substrate is placed on the protruding structures on the platform through the lower surface; the pre-cut device in the brittle material substrate splitting device is used on the brittle material substrate Pre-cut at a predetermined position on the upper surface to form a pre-cut track having a depth less than the thickness of the brittle material substrate; and moving the linear split device in the brittle material substrate split device to be aligned with the pre-cut lane The brittle material substrate is moved upward and then towards the upper surface of the brittle material substrate, so that the brittle material substrate is ruptured by the tension of the linear sliver device into a sub-brittle material substrate with a smaller area when the linear sliver device contacts the pre-cut lane.

Another feature of the present invention is to disclose a fragile material substrate fracturing method using the fragile material substrate fracturing device described above. The steps include: providing a fragile material substrate fracturing device as described in paragraph [0005]; A brittle material substrate on the lower surface, and the brittle material substrate is placed on the protruding structures on the first platform and the second platform through the lower surface; using the pre-cut device in the brittle material substrate splitting device Pre-cutting is performed on one of the upper surfaces of the brittle material substrate at a predetermined position at the first interval, and a pre-cutting track having a depth less than the thickness of the brittle material substrate is formed; The linear split device is moved to be aligned above the pre-cut lane, and then moved toward the upper surface of the brittle material substrate, so that the brittle material substrate is contacted by the linear split device when the linear split device contacts the pre-cut lane. The tension lobes form a substrate of less brittle material with a smaller area.

Another feature of the present invention is to disclose a fragile material substrate fracturing method using the fragile material substrate fracturing device described above. The steps include: providing a fragile material substrate fracturing device as described in paragraph [0006]; A brittle material substrate on the lower surface, and the brittle material substrate is placed on the first platform and the second platform through the lower surface. Out of the structure; using the pre-cutting device in the brittle material substrate split device to pre-cut at one of the upper surfaces of the brittle material substrate at a predetermined position at the first interval, and forming a depth less than the brittleness A pre-cut path for the thickness of the material substrate; and aligning the pre-cut path with the linear split device in the brittle material substrate split device, and then moving the linear split device upward toward the lower surface of the brittle material substrate to make the brittleness When the linear sliver device contacts the pre-cut lane, the material substrate is ruptured by the tension of the linear sliver device into a less brittle material substrate with a smaller area.

Another feature of the present invention is to disclose a fragile material substrate fracturing method using the fragile material substrate fracturing device described above. The steps include: providing a fragile material substrate fracturing device as described in paragraph [0007]; providing a fragile material substrate fracturing device; A brittle material substrate on the lower surface, and placing the brittle material substrate on the conveying system; using the pre-cutting device in the brittle material substrate splitting device to pre-cut at a predetermined place on the upper surface of the brittle material substrate, And forming a pre-cut track with a depth less than the thickness of the brittle material substrate; and using the conveying system to transport the brittle material substrate so that the pre-cut track is aligned with one of the second intervals; After the linear split device is aligned with the pre-cutting path, the linear split device is moved toward the upper or lower surface of the brittle material substrate, so that the brittle material substrate is tensioned by the linear split device when the linear split device contacts the pre-cut line. The splits form a substrate of less brittle material with a smaller area.

Another feature of the present invention is to disclose a fragile material substrate fracturing method using the fragile material substrate fracturing device described above. The steps include: providing a fragile material substrate fracturing device as described in paragraph [0008]; The brittle material substrate on the lower surface, and the brittle material substrate is placed on the first transport mechanism of the transport system; a pre-cut device in the brittle material substrate splitting device is used on a portion of the upper surface of the brittle material substrate. Pre-cutting at a predetermined place, and forming a pre-cutting path with a depth less than the thickness of the brittle material substrate; and using the first and second conveying mechanisms to transport the brittle material substrate so that it crosses the first conveyor Between the structure and the second conveying mechanism, and aligning the pre-cut lane with the third interval between the first and second conveying mechanisms; aligning the linear sliver device in the brittle material substrate sliver device After the pre-cutting track, move toward the upper surface or the lower surface of the brittle material substrate, so that the brittle material substrate is made smaller by the tension of the linear splitting device when the linear splitting device contacts the pre-cutting slot. Sub-brittle material substrate.

Another feature of the present invention is to disclose a method for splitting a brittle material substrate as described above, and the brittle material substrate is a glass substrate or a semiconductor substrate.

Another feature of the present invention is to disclose a method for splitting a brittle material substrate as described above, and the pre-cut device is an optical pre-cut device or a mechanical pre-cut device.

Another feature of the present invention is to disclose a method for splitting a brittle material substrate as described above, and the optical pre-cutting device is a laser cutter.

Another feature of the present invention is to disclose a method for splitting a brittle material substrate as described above, and the mechanical pre-cutting device is a cutter wheel cutter or a cutter blade cutter.

Another feature of the present invention is to disclose a chipping method for a brittle material substrate as described above, and the linear chipping device is a metal wire, a metal composite wire or an insulating wire.

10, 20, 30, 40, 50, 60, 70‧‧‧ Brittle material substrate split device

100‧‧‧platform

100A, 121A, 122A‧‧‧ Front

121‧‧‧First Platform

122‧‧‧Second Platform

123‧‧‧link structure

124‧‧‧ the first interval

125‧‧‧ carrier

150‧‧‧ protruding structure

200‧‧‧ Brittle material substrate

200A, 200B ‧‧‧ times brittle material substrate

201‧‧‧ Top surface

202‧‧‧ lower surface

250‧‧‧ pre-cut device

300‧‧‧Linear Split Device

350‧‧‧ Transmission mechanism

370, 380‧‧‧ Conveying System

375‧‧‧Roller

378‧‧‧Second interval

380A‧‧‧The first conveying mechanism

380B‧‧‧Second conveying mechanism

383A‧‧‧The first conveyor belt

383B‧‧‧Second conveyor belt

384A‧‧‧The first roller

384B‧‧‧Second Roller

388‧‧‧third interval

SL‧‧‧Pre-cut

1A to 1D are partial schematic diagrams of a brittle material substrate chipping device and a chipping method using the device according to the first embodiment of the present invention.

Figures 2A to 2D are partial schematic diagrams of a brittle material substrate chipping device and a chipping method using the same according to a second embodiment of the present invention.

3A to 3E are partial schematic diagrams of a brittle material substrate chipping device and a chipping method using the device according to a third embodiment of the present invention.

Figures 4A to 4D are partial schematic diagrams of a brittle material substrate chipping device and a chipping method using the device according to a fourth embodiment of the present invention.

5A to 5D are partial schematic diagrams of a brittle material substrate chipping device and a chipping method using the device according to a fifth embodiment of the present invention.

6A to 6D are partial schematic diagrams of a brittle material substrate chipping device and a chipping method using the same according to a sixth embodiment of the present invention.

7A to 7D are partial schematic diagrams of a brittle material substrate split device and a split method using the device according to a seventh embodiment of the present invention.

In order to make the features, contents, and advantages of the present invention and the effects that can be achieved easier to understand, the present invention is described in detail in conjunction with the accompanying drawings in the form of embodiments, and the schematics used therein are the main purpose It is only for the purpose of illustration and supplementary description. It may not be the actual proportion and precise configuration after the implementation of the invention. Therefore, the relationship between the proportion and configuration of the attached drawings should not be interpreted and limited to the scope of rights of the present invention in actual implementation. Let me explain first.

Hereinafter, embodiments of the brittle material substrate cutting split device and the method using the same according to the present invention will be described with reference to related drawings. In order to facilitate understanding, the same elements in the following embodiments are described with the same symbols.

Example one

First, please refer to FIG. 1A, which shows a partial schematic diagram of a brittle material substrate chipping device 10, which includes a platform 100, a pre-cutting device 250, and a linear chipping device 300 as shown in FIGS. 1B to 1C. . The platform 100 is used to carry a brittle material substrate 200 having an upper surface 201 and a lower surface 202. The platform 100 has a front surface 100A and a A back surface (not labeled) opposite to the front surface 100A, and the front surface 100A includes a plurality of protruding structures 150, wherein the brittle material substrate 200 is the protruding structures placed on the platform 100 through its lower surface 202. 150 on.

The brittle material substrate 200 in this embodiment is a glass substrate, but in other embodiments according to the present invention, the brittle material substrate may also be a semiconductor substrate, such as a silicon wafer, a sapphire substrate, a quartz substrate, a silicon carbide substrate, and an oxide. Aluminum substrate, gallium arsenide substrate, gallium nitride substrate, III-V substrate, etc. In addition, in this embodiment, the height of the protruding structures 150 above the front side 100A of the platform 100 is between 1 and 5 cm. However, the heights of the protruding structures 150 may be adjusted as needed. The above-mentioned height range is only It is used for illustration and explanation and is not intended to limit the patent scope of the present invention.

Secondly, please continue to refer to FIG. 1A, using a pre-cutting device 250 in the brittle material substrate chipping device 10 to pre-cut at a predetermined position on an upper surface 201 of the brittle material substrate 200, and form a depth less than the brittle material substrate Thick pre-cut (SL). In this embodiment, the pre-cutting device 250 is an optical pre-cutting device, such as a gaseous laser cutting machine or a solid-state laser cutting machine. The gaseous laser cutting machine can be selected from a carbon dioxide laser cutting machine, for example. The solid-state laser cutting machine may be selected from picosecond laser cutting machines such as yttrium-doped yttrium garnet laser (Nd: YAG Laser) cutting machines, UV laser cutting machines, nanosecond laser cutting machines, or Femtosecond laser cutter and so on. In addition, in other embodiments according to the present invention, the pre-cutting device 250 may also be a mechanical pre-cutting device, such as a cutter wheel cutter or a cutter blade cutter.

Next, referring to FIGS. 1B to 1D, first, the linear split device 300 in the brittle material substrate split device 10 is moved above the pre-cut line (SL) as shown in FIG. 1B. In this embodiment, this linear type The split device 300 is a metal wire, a metal composite wire or an insulated wire. The transmission mechanism 350 on both sides of the linear split device 300 can be driven to move up and down. After the linear split device 300 is aligned with the pre-cut line (SL), as shown in FIG. 1C, the linear split device 300 is driven downward by the transmission mechanism 350 to move the linear split device 300 toward the upper surface 201 of the brittle material substrate 200. When the brittle material substrate 200 is brought into contact with the pre-cut line (SL) of the linear sliver device 300, the tension of the linear sliver device 300 is used to form a sub-brittle material substrate 200A with a smaller area as shown in FIG. 1D. 200B.

Example two

First, please refer to FIG. 2A, which shows a partial schematic view of another brittle material substrate splitting device 20, which includes a carrier 125, a pre-cutting device 250, and a linear splitting device as shown in FIGS. 2A-2B. 300. The carrier 125 is used to carry a brittle material substrate 200 having an opposite upper surface 201 and a lower surface 202. The carrier 125 includes a first platform 121 and a second platform 122 and a connection between the first platform 121 and the second platform. The connection structure 123 of 122, the first platform 121 and the second platform 122 have a first gap 124 therebetween, and the first platform 121 and the second platform 122 are located on the same horizontal plane, wherein the first platform 121 The second platform 122 includes a plurality of protruding structures 150, and the brittle material substrate 200 is placed on the protruding structures 150 on the first platform 121 and the second platform 122 through the lower surface 202. .

The brittle material substrate 200 in this embodiment is a glass substrate, but in other embodiments according to the present invention, the brittle material substrate may also be a semiconductor substrate, such as a silicon wafer, a sapphire substrate, a quartz substrate, a silicon carbide substrate, and an oxide. Aluminum substrate, gallium arsenide substrate, gallium nitride substrate, III-V substrate, etc. In addition, in the embodiment, the height of the protruding structures 150 protruding from the front 100A of the platform 100 is between 1 and 5 cm. The height can be adjusted as needed. The above-mentioned height range is only for illustration and not for limiting the patent scope of the present invention.

Next, please continue to refer to FIG. 2A, using a pre-cutting device 250 in the brittle material substrate chipping device 20 to pre-cut one of the upper surfaces 201 of the brittle material substrate 200 at a predetermined position of the first space A pre-cut track (SL) having a depth less than the thickness of the brittle material substrate is formed. In this embodiment, the pre-cutting device 250 is an optical pre-cutting device, such as a gaseous laser cutting machine or a solid-state laser cutting machine. The gaseous laser cutting machine can be selected from a carbon dioxide laser cutting machine, for example. The solid-state laser cutting machine may be selected from picosecond laser cutting machines such as yttrium-doped yttrium garnet laser (Nd: YAG Laser) cutting machines, UV laser cutting machines, nanosecond laser cutting machines, or Femtosecond laser cutter and so on. In addition, in other embodiments according to the present invention, the pre-cutting device 250 may also be a mechanical pre-cutting device, such as a cutter wheel cutter or a cutter blade cutter.

Next, referring to FIGS. 2B to 2D, firstly, the linear split device 300 in the brittle material substrate split device 20 is moved above the pre-cut line (SL) as shown in FIG. 2B. In this embodiment, this linear type The sliver device 300 is a metal wire, a metal composite wire or an insulated wire, which can be driven up and down by the transmission mechanisms 350 located on both sides of the linear sliver device 300. After the linear split device 300 is aligned with the pre-cut line (SL), as shown in FIG. 2C, the linear split device 300 is driven downward by the transmission mechanism 350 to move the linear split device 300 toward the upper surface 201 of the brittle material substrate 200. When the brittle material substrate 200 is brought into contact with the pre-cut line (SL) of the linear sliver device 300, the tension of the linear sliver device 300 is used to form a sub-brittle material substrate 200A having a smaller area as shown in FIG. 2D. 200B.

Example three

First, please refer to FIG. 3A, which shows a partial schematic view of another brittle material substrate splitting device 30, which includes a carrier 125, a pre-cutting device 250, and a linear splitting device 300. The carrier 125 is used to carry a brittle material substrate 200 having an opposite upper surface 201 and a lower surface 202. The carrier 125 includes a first platform 121 and a second platform 122 and a connection between the first platform 121 and the second platform. The connection structure 123 of 122, the first platform 121 and the second platform 122 have a first gap 124 therebetween, and the first platform 121 and the second platform 122 are located on the same horizontal plane, wherein the first platform 121 The second platform 122 includes a plurality of protruding structures 150, and the brittle material substrate 200 is placed on the protruding structures 150 on the first platform 121 and the second platform 122 through the lower surface 202. . In this embodiment, the linear sliver device 300 is a metal wire, a metal composite wire, or an insulated wire, and the linear sliver device 300 is a connection structure that can be movably arranged up and down and aligned below the first interval 124. On 123, the transmission mechanism 350 located on both sides of the linear split device 300 can be driven to move up and down in the first interval 124. In addition, the transmission mechanism 350 in this embodiment can be driven by another external mechanism (not shown) or by the internal design (not shown) of the transmission mechanism 350 itself to achieve the purpose of driving the linear split device 300 to move up and down.

Then, as shown in FIG. 3B, a brittle material substrate 200 is placed on the protruding structures 150 on the first platform 121 and the second platform 122. The brittle material substrate 200 in this embodiment is a glass substrate, but in other embodiments according to the present invention, the brittle material substrate may also be a semiconductor substrate, such as a silicon wafer, a sapphire substrate, a quartz substrate, a silicon carbide substrate, and an oxide. Aluminum substrate, gallium arsenide substrate, gallium nitride substrate, III-V substrate, etc. In addition, in the embodiment, the above protruding structures 150 have a height protruding from the front side 100A of the platform 100 between 1 ~ 5 cm, but the height of the above-mentioned protruding structures 150 can be adjusted according to need. The above-mentioned height range is only for illustration and is not intended to limit the patent scope of the present invention.

Next, please continue to refer to FIG. 3B, using a pre-cutting device 250 in the brittle material substrate chipping device 30 to pre-cut one of the upper surface 201 of the brittle material substrate 200 at a predetermined position of the first space A pre-cut track (SL) having a depth less than the thickness of the brittle material substrate is formed. In this embodiment, the pre-cutting device 250 is an optical pre-cutting device, such as a gaseous laser cutting machine or a solid-state laser cutting machine. The gaseous laser cutting machine can be selected from a carbon dioxide laser cutting machine, for example. The solid-state laser cutting machine may be selected from picosecond laser cutting machines such as yttrium-doped yttrium garnet laser (Nd: YAG Laser) cutting machines, UV laser cutting machines, nanosecond laser cutting machines, or Femtosecond laser cutter and so on. In addition, in other embodiments according to the present invention, the pre-cutting device 250 may also be a mechanical pre-cutting device, such as a cutter wheel cutter or a cutter blade cutter.

Next, referring to FIGS. 3C to 3E, first align the pre-cut track (SL) with the linear split device 300 as shown in FIG. 3C, and then use the transmission mechanism 350 to drive as shown in FIG. 3D. When the linear sliver device 300 moves upward toward the lower surface 202 of the brittle material substrate 200, and the brittle material substrate 200 is brought into contact with the pre-cut line (SL), the tension sliver of the linear sliver device 300 becomes the first Subarea brittle material substrates 200A and 200B with smaller areas shown in FIG. 3E.

Embodiment 4

First, please refer to FIGS. 4A to 4B, which show a partial schematic view of another brittle material substrate chipping device 40, which includes a conveying system 370, a pre-cutting device 250, and a position as shown in FIGS. 4B to 4C. A linear lobing device 300 above the transport system 370. delivery The system 370 is used for conveying a brittle material substrate 200 having an upper surface 201 and a lower surface 202 opposite to each other. The conveying system 370 includes a plurality of rollers 375 extending parallel to each other in a first direction, and the adjacent first rollers There is a second space 378 between 375, wherein the brittle material substrate 200 is placed on the rollers 375 by its lower surface 202. In this embodiment, the linear sliver device 300 is a metal wire, a metal composite wire, or an insulated wire, which can be driven by one of the second intervals in one of the second spaces by the transmission mechanisms 350 located on both sides of the linear sliver device 300. 378 up and down movement. The brittle material substrate 200 in this embodiment is a glass substrate, but in other embodiments according to the present invention, the brittle material substrate may also be a semiconductor substrate, such as a silicon wafer, a sapphire substrate, a quartz substrate, a silicon carbide substrate, and an oxide. Aluminum substrate, gallium arsenide substrate, gallium nitride substrate, III-V substrate, etc.

Secondly, please continue to refer to FIG. 4A, using the pre-cutting device 250 in the brittle material substrate splitting device 40 to pre-cut at a predetermined position on the upper surface 201 of the brittle material substrate 200, and form a depth less than the brittle material substrate Thick pre-cut (SL). In this embodiment, the pre-cutting device 250 is an optical pre-cutting device, such as a gaseous laser cutting machine or a solid-state laser cutting machine. The gaseous laser cutting machine can be selected from a carbon dioxide laser cutting machine, for example. The solid-state laser cutting machine may be selected from picosecond laser cutting machines such as yttrium-doped yttrium garnet laser (Nd: YAG Laser) cutting machines, UV laser cutting machines, nanosecond laser cutting machines, or Femtosecond laser cutter and so on. In addition, in other embodiments according to the present invention, the pre-cutting device 250 may also be a mechanical pre-cutting device, such as a cutter wheel cutter or a cutter blade cutter.

Next, referring to FIGS. 4B to 4D, first use the conveying system 370 to transport the brittle material substrate 200 as shown in FIG. 4B, and align the pre-cut line (SL) with one of the second intervals 378, and then Align the linear split device 300 in the brittle material substrate split device 40 with the preliminary After cutting the path, then as shown in FIG. 4C, the transmission mechanism 350 is used to drive the linear split device 300 downward, so that the linear split device 300 is moved toward the upper surface 201 of the brittle material substrate 200, and the brittle material substrate 200 is linearly split. When the device 300 comes into contact with the pre-cut line (SL), the tension lobes of the linear sliver device 300 are formed into sub-brittle material substrates 200A and 200B with smaller areas as shown in FIG. 4D.

Example 5

First, please refer to FIGS. 5A to 5B, which show a partial schematic view of another brittle material substrate chipping device 50, which includes a conveying system 370, a pre-cutting device 250, and a position as shown in FIGS. 5B to 5C. A linear sliver device 300 below the transport system 370. The conveying system 370 is used for conveying a brittle material substrate 200 having an upper surface 201 and a lower surface 202 opposite to each other. The conveying system 370 includes a plurality of rollers 375 arranged in parallel with each other and extending in a first direction. There is a second interval 378 between the rollers 375, wherein the brittle material substrate 200 is placed on the rollers 375 by its lower surface 202. In this embodiment, the linear sliver device 300 is a metal wire, a metal composite wire, or an insulated wire, which can be driven by one of the second intervals in one of the second spaces by the transmission mechanisms 350 located on both sides of the linear sliver device 300. 378 up and down movement. The brittle material substrate 200 in this embodiment is a glass substrate, but in other embodiments according to the present invention, the brittle material substrate may also be a semiconductor substrate, such as a silicon wafer, a sapphire substrate, a quartz substrate, a silicon carbide substrate, and an oxide. Aluminum substrate, gallium arsenide substrate, gallium nitride substrate, III-V substrate, etc.

Secondly, please continue to refer to FIG. 5A, using a pre-cutting device 250 in the brittle material substrate chipping device 50 to pre-cut at a predetermined position on an upper surface 201 of the brittle material substrate 200 and form a depth less than the brittle material substrate Thick pre-cut (SL). In this implementation For example, the pre-cutting device 250 is an optical pre-cutting device, such as a gaseous laser cutting machine or a solid-state laser cutting machine, wherein the gaseous laser cutting machine can be selected from a carbon dioxide laser cutting machine, and a solid-state laser The cutting machine can be selected, for example, from picosecond laser cutting machines such as yttrium-doped yttrium garnet laser (Nd: YAG Laser) cutting machines, UV laser cutting machines, nanosecond laser cutting machines, or femtosecond lasers. Shot cutting machine and so on. In addition, in other embodiments according to the present invention, the pre-cutting device 250 may also be a mechanical pre-cutting device, such as a cutter wheel cutter or a cutter blade cutter.

Next, referring to FIGS. 5B to 5D, first use the conveying system 370 to transport the brittle material substrate 200 as shown in FIG. 5B, so that the pre-cut line (SL) is aligned with one of the second intervals 378, and then After aligning the linear split device 300 in the brittle material substrate split device 50 with the pre-cut lane, as shown in FIG. 5C, the linear split device 300 is driven upward by the transmission mechanism 350, so that the linear split device 300 is directed toward the brittle material. When the lower surface 202 of the substrate 200 is moved and the brittle material substrate 200 is brought into contact with the pre-cut line (SL) by the linear sliver device 300, the area of the linear sliver device 300 is reduced to a smaller area as shown in FIG. 5D. Substrates 200A and 200B.

Example Six

First, please refer to FIGS. 6A to 6B, which show a partial schematic view of another brittle material substrate chipping device 60, which includes a conveying system 380, a pre-cutting device 250, and a device as shown in FIGS. 6B to 6C.线 式 裂片 装置 300。 Linear sliver device 300. The conveying system 380 is used for conveying a brittle material substrate 200 having opposite upper and lower surfaces. The conveying system 380 includes a first conveying mechanism 380A and a second conveying mechanism 380B. The first conveying mechanism 380A includes a first conveying mechanism 380A. A conveyor belt 383A and a plurality of first rollers 384A driving the first conveyor belt 383A. The second conveyor mechanism 380B includes a second conveyor belt 383B and a plurality of second conveyor belts 383B. The roller 384B has a third interval 388 between the first and second conveying mechanisms 380A and 380B. The above-mentioned pre-cutting device 250 is disposed above the conveying system 380. The pre-cutting device 250 of this embodiment is disposed above the first conveyor belt 383A. In other embodiments according to the present invention, the pre-cutting device 250 may also be provided. It is disposed above the second conveyor belt 383B. As shown in FIG. 6A, the brittle material substrate 200 is first placed on the first conveyor belt 383A on the first conveyor mechanism 380A via its lower surface 202. The brittle material substrate 200 in this embodiment is a glass substrate, but in other embodiments according to the present invention, the brittle material substrate may also be a semiconductor substrate, such as a silicon wafer, a sapphire substrate, a quartz substrate, a silicon carbide substrate, and an oxide. Aluminum substrate, gallium arsenide substrate, gallium nitride substrate, III-V substrate, etc. In addition, the linear sliver device 300 is disposed above the conveying system 380. In this embodiment, the linear sliver device 300 is a metal wire, a metal composite wire, or an insulated wire, which can be located in the linear sliver device 300. The transmission mechanisms 350 on both sides are driven to move up and down in the third interval 388.

Next, please continue to refer to FIG. 6A to provide a brittle material substrate 200 having an upper surface 201 and a lower surface 202 opposite to each other, and place the brittle material substrate 200 on the first conveyor belt 383A of the first conveyance mechanism 380A of the conveyance system 380. Then, the pre-cutting device 250 in the brittle material substrate splitting device 60 is used to pre-cut at a predetermined position on the upper surface 201 of the brittle material substrate 200 to form a pre-cut having a depth smaller than the thickness of the brittle material substrate 200. Road (SL). In this embodiment, the pre-cutting device 250 is an optical pre-cutting device, such as a gaseous laser cutting machine or a solid-state laser cutting machine. The gaseous laser cutting machine can be selected from a carbon dioxide laser cutting machine, for example. The solid-state laser cutting machine may be selected from picosecond laser cutting machines such as yttrium-doped yttrium garnet laser (Nd: YAG Laser) cutting machines, UV laser cutting machines, nanosecond laser cutting machines, or Femtosecond laser cutter and so on. Moreover, in other embodiments according to the present invention, In the embodiment, the pre-cutting device 250 may also be a mechanical pre-cutting device, such as a cutter wheel cutter or a cutter blade cutter.

Next, please refer to Figs. 6B to 6D. As shown in Fig. 6B, firstly, the first and second conveying mechanisms 380A and 380B are used to convey the brittle material substrate 200 so as to cross the first conveying mechanism 380A and the second The transport mechanism 380B is aligned with the pre-cut line (SL) at the third interval 388 between the first and second transport mechanisms 380A and 380B. Next, the linear split device 300 in the brittle material substrate split device 60 is aligned with the pre-cut line (SL), and as shown in FIG. 6C, it is driven by the transmission mechanisms 350 located on both sides of the linear split device 300. The linear sliver device 300 is moved downward to move the linear sliver device 300 toward the upper surface 201 of the brittle material substrate 200 and cause the brittle material substrate 200 to contact the pre-cut line (SL) when the linear sliver device 300 contacts the pre-cut line (SL), such as As shown in FIG. 6D, the tension lobes of the linear lobing device 300 are used to form sub-brittle material substrates 200A and 200B with smaller areas.

Example Seven

First, please refer to Figs. 7A to 7B, which show a partial schematic diagram of another brittle material substrate chipping device 70, which includes a conveying system 380, a pre-cutting device 250, and a device as shown in Figs. 6B to 6C.线 式 裂片 装置 300。 Linear sliver device 300. The conveying system 380 is used for conveying a brittle material substrate 200 having opposite upper and lower surfaces. The conveying system 380 includes a first conveying mechanism 380A and a second conveying mechanism 380B. The first conveying mechanism 380A includes a first conveying mechanism 380A. A conveyor belt 383A and a plurality of first rollers 384A driving the first conveyor belt 383A. The second conveyor mechanism 380B includes a second conveyor belt 383B and a plurality of second rollers 384B driving the second conveyor belt 383B. There is a third interval 388 between the first and second conveying mechanisms 380A and 380B. The pre-cutting device 250 is disposed above the conveying system 380. The pre-cutting device of this embodiment is The device is disposed above the first conveyor belt 383A. In other embodiments according to the present invention, the pre-cutting device 250 may be disposed above the second conveyor belt 383B. As shown in FIG. 6A, the brittle material substrate 200 is first placed on the first conveyor belt 383A on the first conveyor mechanism 380A via its lower surface 202. The brittle material substrate 200 in this embodiment is a glass substrate, but in other embodiments according to the present invention, the brittle material substrate may also be a semiconductor substrate, such as a silicon wafer, a sapphire substrate, a quartz substrate, a silicon carbide substrate, and an oxide. Aluminum substrate, gallium arsenide substrate, gallium nitride substrate, III-V substrate, etc. In addition, the linear sliver device 300 is disposed below the conveying system 380, and in this embodiment, the linear sliver device 300 is a metal wire, a metal composite wire, or an insulated wire, which can be located in the linear sliver device 300. The transmission mechanisms 350 on both sides are driven to move up and down in the third interval 388.

Next, please continue to refer to FIG. 7A to provide a brittle material substrate 200 having an upper surface 201 and a lower surface 202 opposite to each other, and place the brittle material substrate 200 on the first conveyor belt 383A of the first conveyance mechanism 380A of the conveyance system 380. Then, the pre-cutting device 250 in the brittle material substrate splitting device 70 is used to perform pre-cutting at a predetermined position on the upper surface 201 of the brittle material substrate 200 and form a pre-cutting depth less than the thickness of the brittle material substrate 200. Road (SL). In this embodiment, the pre-cutting device 250 is an optical pre-cutting device, such as a gaseous laser cutting machine or a solid-state laser cutting machine. The gaseous laser cutting machine can be selected from a carbon dioxide laser cutting machine, for example. The solid-state laser cutting machine may be selected from picosecond laser cutting machines such as yttrium-doped yttrium garnet laser (Nd: YAG Laser) cutting machines, UV laser cutting machines, nanosecond laser cutting machines, or Femtosecond laser cutter and so on. In addition, in other embodiments according to the present invention, the pre-cutting device 250 may also be a mechanical pre-cutting device, such as a cutter wheel cutter or a cutter blade cutter.

Next, please refer to Figs. 7B to 7D. As shown in Fig. 7B, first, the first and second conveying mechanisms 380A and 380B are used to convey the brittle material substrate 200 so as to cross the first conveying mechanism 380A and the second The transport mechanism 380B is aligned with the pre-cut line (SL) at the third interval 388 between the first and second transport mechanisms 380A and 380B. Next, the linear sliver device 300 located below the conveying system 380 is aligned with the pre-cut line (SL), and then as shown in FIG. 7C, the linear sliver device 300 on both sides of the linear sliver device 300 is used to drive the linear shape. The sliver device 300 moves upward to move the linear sliver device 300 toward the lower surface 201 of the brittle material substrate 200, and causes the brittle material substrate 200 to contact the pre-cut line (SL) when the linear sliver device 300 contacts the pre-cut line (SL), as in section 7D. As shown in the figure, the tension lobes of the linear lobing device 300 are formed into sub-brittle material substrates 200A and 200B with smaller areas.

Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can change and combine the above various implementations without departing from the spirit and scope of the present invention. example.

Claims (36)

A fragile material substrate chipping device includes a platform for carrying a fragile material substrate having opposite upper and lower surfaces, the platform includes a plurality of protruding structures, and the fragile material substrate is placed through the lower surface. On the protruding structures on the platform; a pre-cutting device is disposed above the platform, and the pre-cutting device can pre-cut at a predetermined position on the upper surface of the brittle material substrate and form a depth A pre-cutting path smaller than the thickness of the brittle material substrate; and a linear split device arranged above the platform, and the linear split device can be moved toward the upper surface of the brittle material substrate after being aligned with the pre-cutting channel, so that When the linear fracturing device contacts the pre-cut lane, the fragile material substrate is ruptured by the tension of the linear fracturing device into a less brittle material substrate with a smaller area. According to the brittle material substrate splitting device described in item 1 of the scope of patent application, the brittle material substrate is a glass substrate or a semiconductor substrate. According to the brittle material substrate splitting device described in item 2 of the patent application scope, the pre-cutting device is an optical pre-cutting device or a mechanical pre-cutting device. According to the brittle material substrate splitting device described in item 3 of the patent application scope, the optical pre-cutting device is a laser cutting machine. According to the brittle material substrate chipping device described in item 3 of the scope of patent application, the mechanical pre-cutting device is a cutter wheel cutter or a cutter blade cutter. According to the brittle material substrate split device according to item 2 of the scope of the patent application, the linear split device is a metal wire, a metal composite wire or an insulating wire. A method for chipping a brittle material substrate, comprising the steps of: providing a chipping device for a brittle material substrate as described in any one of items 1 to 6 of the scope of application for a patent; providing a brittle material substrate having opposite upper and lower surfaces, and The brittle material substrate is placed on the protruding structures on the platform through the lower surface; the pre-cut device in the brittle material substrate splitting device is used to perform a predetermined position on one of the upper surfaces of the brittle material substrate. Pre-cutting and forming a pre-cut track having a depth less than the thickness of the brittle material substrate; and moving the linear split device in the brittle material substrate split device to be aligned above the pre-cut lane, and then toward the brittle material substrate The upper surface moves so that the brittle material substrate is broken into a sub-brittle material substrate with a smaller area by the tension of the linear split device when the linear split device contacts the pre-cutting path. A fragile material substrate chipping device includes a carrier for carrying a fragile material substrate having opposite upper and lower surfaces. The carrier includes a first platform and a second platform and a connection between the first platform and the second platform. The connection structure of the platform, there is a first gap between the first platform and the second platform, and the first platform and the second platform are at the same horizontal plane, wherein both the first platform and the second platform are on the same level. It includes a plurality of protruding structures, and the brittle material substrate is placed on the protruding structures on the first platform and the second platform through the lower surface; a pre-cut device is disposed above the carrier, and The pre-cutting device can pre-cut at one of the upper surfaces of the brittle material substrate aligned with a predetermined position at the first interval, and form a pre-cutting track with a depth less than the thickness of the brittle material substrate; and a linear split The device is disposed above the first interval of the carrier, and the linear sliver device can be moved toward the upper surface of the brittle material substrate after being aligned with the pre-cut lane, so that the Linear material substrate in which the pre-contact breaking apparatus when the scribe line, the tension line segments are segments of the device into a smaller area views brittle material substrate. According to the brittle material substrate splitting device described in item 8 of the scope of patent application, the brittle material substrate is a glass substrate or a semiconductor substrate. According to the brittle material substrate chipping device described in item 9 of the scope of patent application, the pre-cutting device is an optical pre-cutting device or a mechanical pre-cutting device. According to the brittle material substrate splitting device described in item 10 of the scope of the patent application, the optical pre-cutting device is a laser cutting machine. According to the brittle material substrate splitting device described in item 10 of the patent application scope, the mechanical pre-cutting device is a cutter wheel cutter or a cutter blade cutter. According to the brittle material substrate split device according to item 9 of the scope of patent application, the linear split device is a metal wire, a metal composite wire or an insulated wire. A method for chipping a brittle material substrate, comprising the steps of: providing a chipping device for a brittle material substrate as described in any one of items 8 to 13 of the scope of application for a patent; providing a brittle material substrate having opposite upper and lower surfaces, and The brittle material substrate is placed on the protruding structures on the first platform and the second platform through the lower surface; the pre-cut device in the brittle material substrate split device is used on the brittle material substrate. One of the surfaces is aligned at a predetermined position at the first interval for pre-cutting, and a pre-cutting path is formed with a depth less than the thickness of the brittle material substrate; and the linear split device in the brittle material substrate split device is moved to the opposite position. Aligned above the pre-cut road, and then moved toward the upper surface of the brittle material substrate, so that the brittle material substrate was split into smaller areas by the tension of the linear split device when the linear split device contacted the pre-cut lane. Sub-fragile material substrate. A fragile material substrate chipping device includes a carrier for carrying a fragile material substrate having opposite upper and lower surfaces. The carrier includes a first platform and a second platform and a connection between the first platform and the second platform. The connection structure of the platform, there is a first gap between the first platform and the second platform, and the first platform and the second platform are at the same horizontal plane, wherein both the first platform and the second platform are on the same level. It includes a plurality of protruding structures, and the brittle material substrate is placed on the protruding structures on the first platform and the second platform through the lower surface; a pre-cut device is disposed above the carrier, and The pre-cutting device can pre-cut at one of the upper surfaces of the brittle material substrate aligned with a predetermined position at the first interval, and form a pre-cutting track with a depth less than the thickness of the brittle material substrate; and a linear split The device can be moved up and down on the connecting structure aligned below the first interval of the carrier, and after the pre-cutting track is aligned with the linear split device, the device The type split device moves upward toward the lower surface of the brittle material substrate, so that when the linear split device contacts the pre-cutting path, the tension split of the linear split device becomes a less brittle material with a smaller area. Substrate. The brittle material substrate splitting device according to item 15 of the scope of application for a patent, the brittle material substrate is a glass substrate or a semiconductor substrate. According to the brittle material substrate splitting device described in item 16 of the patent application scope, the pre-cutting device is an optical pre-cutting device or a mechanical pre-cutting device. According to the brittle material substrate splitting device described in claim 17 of the scope of patent application, the optical pre-cutting device is a laser cutting machine. According to the brittle material substrate splitting device described in claim 17 of the scope of patent application, the mechanical pre-cutting device is a cutter wheel cutter or a cutter blade cutter. According to the brittle material substrate split device according to item 16 of the scope of application for a patent, the linear split device is a metal wire, a metal composite wire or an insulating wire. A method for chipping a brittle material substrate, comprising the steps of: providing a chipping device for a brittle material substrate as described in any one of items 15 to 20 of the scope of patent application; providing a brittle material substrate having opposite upper and lower surfaces, and The brittle material substrate is placed on the protruding structures on the first platform and the second platform through the lower surface; the pre-cut device in the brittle material substrate split device is used on the brittle material substrate. One of the surfaces is aligned with a predetermined position at the first interval to perform pre-cutting, and a pre-cutting track having a depth smaller than the thickness of the brittle material substrate is formed; and the line shape of the pre-cutting track and the brittle material substrate chip device is formed. The split device is aligned, and then the linear split device is moved upward toward the lower surface of the brittle material substrate, so that the brittle material substrate is formed into an area by the tension of the linear split device when the linear split device contacts the pre-cut lane. Smaller less brittle material substrate. A fragile material substrate chipping device includes a conveying system for conveying a fragile material substrate having opposite upper and lower surfaces. The conveying system includes a plurality of rollers arranged parallel to each other and extending in a first direction. There is a second interval between the drums; a pre-cutting device is disposed above the conveying system, and the pre-cutting device can pre-cut at a predetermined position on the upper surface of the brittle material substrate and form a A pre-cutting path having a depth less than the thickness of the brittle material substrate; and a linear split device arranged above or below one of the second intervals of the conveying system, and the pre-cutting path on the brittle material substrate is located at At the second interval, after the linear split device is aligned with the pre-cut lane, it moves toward the upper surface or the lower surface of the brittle material substrate, so that the brittle material substrate contacts the pre-cut lane after the linear split device contacts the pre-cut lane. By the tension of the linear split device, the substrate is made of a less brittle material with a smaller area. According to the brittle material substrate splitting device described in item 22 of the scope of application for a patent, the brittle material substrate is a glass substrate or a semiconductor substrate. According to the brittle material substrate splitting device described in item 23 of the scope of the patent application, the pre-cutting device is an optical pre-cutting device or a mechanical pre-cutting device. According to the brittle material substrate splitting device described in item 24 of the patent application scope, the optical pre-cutting device is a laser cutting machine. According to the brittle material substrate splitting device described in item 24 of the patent application scope, the mechanical pre-cutting device is a cutter wheel cutter or a cutter blade cutter. For example, the brittle material substrate split device according to item 23 of the scope of application for a patent, the linear split device is a metal wire, a metal composite wire or an insulating wire. A method for chipping a brittle material substrate, the steps include: providing a chipping device for a brittle material substrate as described in any one of items 22 to 27 of the scope of patent application; providing a brittle material substrate having opposite upper and lower surfaces, and The fragile material substrate is placed on the conveying system; the pre-cutting device in the fragile material substrate splitting device is used to pre-cut at a predetermined place on the upper surface of the fragile material substrate and form a depth less than the brittle material A pre-cutting path for the substrate thickness; and using the conveying system to transport the brittle material substrate so that the pre-cutting path is aligned with one of the second intervals; aligning the linear split device in the brittle material substrate split device with the pre-cut After cutting the track, the brittle material substrate is moved toward the upper surface or the lower surface of the brittle material substrate, so that the brittle material substrate is made into a sub-fragility with a smaller area by the tension of the linear split device when the linear split device contacts the pre-cut lane. Material substrate. A fragile material substrate chipping device includes: a conveying system for conveying a fragile material substrate having opposite upper and lower surfaces, the conveying system including a first conveying mechanism and a second conveying mechanism, and the first, There is a third interval between the two conveying mechanisms; a pre-cutting device is disposed above the conveying system, and the pre-cutting device can pre-cut at a predetermined position on the upper surface of the brittle material substrate and form a A pre-cutting path having a depth less than the thickness of the brittle material substrate; and a linear split device arranged above or below the third space between the first conveying mechanism and the second conveying mechanism, and crossing the brittle material substrate When the pre-cutting path is located between the first conveying mechanism and the second conveying mechanism and at the third interval between the first and second conveying mechanisms, the linear split device is aligned after the pre-cutting path Moving towards the upper or lower surface of the brittle material substrate, so that the brittle material substrate is contacted by the linear sliver after the linear sliver device contacts the pre-cutting path The tension is set to a smaller area of the lobes views brittle material substrate. According to the brittle material substrate splitting device described in claim 29 of the patent application scope, the first conveying mechanism includes a first conveying belt and a plurality of first rollers driving the first conveying belt, and the second conveying mechanism includes a second The conveyor belt and the plurality of rollers drive the second roller of the second conveyor belt. According to the brittle material substrate splitting device described in item 30 of the scope of patent application, the brittle material substrate is a glass substrate or a semiconductor substrate. According to the brittle material substrate splitting device described in item 31 of the scope of patent application, the pre-cutting device is an optical pre-cutting device or a mechanical pre-cutting device. According to the brittle material substrate splitting device described in the patent application No. 32, the optical pre-cutting device is a laser cutting machine. According to the brittle material substrate splitting device described in the patent application No. 32, the mechanical pre-cutting device is a cutter wheel cutter or a cutter blade cutter. According to the brittle material substrate split device according to item 31 of the scope of patent application, the linear split device is a metal wire, a metal composite wire or an insulating wire. A method for chipping a brittle material substrate, comprising the steps of: providing a chipping device for a brittle material substrate as described in any one of items 29 to 35 of the scope of application for a patent; providing a brittle material substrate having opposite upper and lower surfaces, and The fragile material substrate is placed on the first conveying mechanism of the conveying system; the pre-cutting device in the fragile material substrate splitting device is used to pre-cut at a predetermined place on the upper surface of the fragile material substrate and form A pre-cutting path having a depth less than the thickness of the brittle material substrate; and using the first and second transport mechanisms to transport the brittle material substrate so that it crosses between the first transport mechanism and the second transport mechanism, and makes the A pre-cut line is aligned with the third space between the first and second conveying mechanisms; after the linear split device in the brittle material substrate split device is aligned with the pre-cut line, it is directed toward the top of the brittle material substrate. The surface or the lower surface moves, so that the brittle material substrate is touched by the tension lobes of the linear sliver device when the linear sliver device contacts the pre-cut lane. Sub-brittle material substrate with smaller area.