CN103786269A - Device and method for fracturing fragile-material substrate - Google Patents
Device and method for fracturing fragile-material substrate Download PDFInfo
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- CN103786269A CN103786269A CN201310331803.0A CN201310331803A CN103786269A CN 103786269 A CN103786269 A CN 103786269A CN 201310331803 A CN201310331803 A CN 201310331803A CN 103786269 A CN103786269 A CN 103786269A
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Abstract
The invention relates to a device and method for fracturing a fragile-material substrate. A substrate (100) is adsorbed to be maintained on an elastic slice member (101) in virtue of exhaust between the substrate (100) and the elastic slice member (101) through an adsorption groove (72) and an adsorption opening (71) under the effect of an exhaust portion (74). If a fracturing rod (14) presses the substrate (100) in this state, bending stress is generated on the substrate (100) by means of the elastic force of the elastic slice member (101). Thus, the substrate (100) is fractured at a position corresponding to a marking line (99). The device and the method for fracturing a fragile-material substrate may fracture the substrate even when an adhesive film is not used such that adhesive film cost is decreased.
Description
Technical field
The invention relates to a kind of by brisement device and the breaking method thereof of the brittle substrate of brittle substrate brisement.
Background technology
Semiconductor element be by by the element area that is formed at substrate in the boundary position brisement (cutting off) in this region and manufacture.While cutting off substrate in this way, use brisement device.This kind of brisement device becomes following formation: by being formed with from utilizing brisement rod to press on an interarea in Z direction with the interarea that is formed with the interarea opposition side of delineating line the substrate of delineating line, and by this substrate in the delineation line brisement towards directions X, and an interarea in this substrate is formed with the delineation line forming by utilizing scribe wheel to delineate line to substrate surface, by the cutting instruments such as diamond cutter by substrate surface wire the delineation wire casing that reams, by laser substrate surface is melted and wire remove melt processing line, or make by utilizing laser to make substrate surface partial melting substrate structure wire the processing line that goes bad etc. (in this description, those are generically and collectively referred to as to " delineation line ").And in the time of substrate brisement, substrate is by being called as that supporting cutter equals in Y-direction space slight distance only and a pair of supporting member that configures and butt supporting (for example, with reference to patent documentation 1).
Fig. 8 represents by this kind of previous brisement device the synoptic diagram of the situation of substrate brisement.
In the circular open portion that is formed at annular component 43 central authorities, be adhesive with and be called as the tackness film 42 that cuts protective tapes so that it sticks together ventricumbent state.And the substrate 100 of brisement object sticks in the face that sticks together of tackness film 42.The annular component 43 that is adhesive with substrate 100 every tackness film 42 of being situated between is arranged at the rotating member 11 of brisement device.Under this state, substrate 100 is situated between every diaphragm 44, by a pair of supporting member 61,62 of supporting device 10 and support.
Be formed with delineation line 99 in the interarea of substrate 100 downsides.This delineation line 99 is taken from the gap of 61,62 of a pair of supporting members by CCD camera 35, according to the image of taking by this CCD camera 35, carried out the location of substrate 100.Then, press substrate 100 by brisement rod 14 with the interarea of interarea opposition side that is formed with delineation line, and by substrate 100 along 99 brisements of delineation line.
[prior art document]
[patent documentation]
[patent documentation 1] TOHKEMY 2004-39931 communique
Summary of the invention
When the situation of the formation of brisement, there is the problem that can consume tackness film 42 in the time carrying out brisement in substrate 100 being sticked in to tackness film 42 as adopting as mentioned above.Therefore, can improve for the cost of substrate brisement the amount that is equivalent to consume tackness film 42.Again, must be in order to substrate 100 be fitted in to the operation of tackness film 42.
The present invention forms for solving above-mentioned problem, even if its object is to provide a kind of tackness film that do not use also can be by substrate brisement, and can realize the brisement device of brittle substrate of the high efficiency of operation and the cost cutting of tackness film and the breaking method thereof of brittle substrate.
The object of the invention to solve the technical problems realizes by the following technical solutions.
The invention of technical scheme 1 is a kind of brisement device of brittle substrate, and it is by the brittle substrate that is formed with delineation line at an interarea is pressed to brisement rod along above-mentioned delineation line, and by above-mentioned brittle substrate brisement; It possesses: elastic component, and it has light transmission, at this brittle substrate of state lower support connecting with the interarea of the above-mentioned delineation line of being formed with of above-mentioned brittle substrate; Fixed component, it is in order to be fixed on above-mentioned brittle substrate on the surface of above-mentioned elastic component; Platform, it has light transmission, from supporting above-mentioned elastic component with above-mentioned brittle substrate opposition side; Brisement rod, it is from pressing with the interarea of the interarea opposition side that is formed with above-mentioned delineation line the brittle substrate that is fixed on above-mentioned elastic component; Camera, it is taken above-mentioned delineation line via above-mentioned platform and above-mentioned elastic component; And travel mechanism, it,, according to the image of taking by above-mentioned camera, relatively moves above-mentioned platform and above-mentioned brisement rod.
The invention of technical scheme 2 is as the invention of technical scheme 1, wherein above-mentioned fixed component is by carrying out exhaust between above-mentioned brittle substrate and above-mentioned elastic component, and above-mentioned brittle substrate absorption is held in to the absorption maintaining body on above-mentioned elastic component surface.
The invention of technical scheme 3 is as the invention of technical scheme 2, wherein above-mentioned absorption maintaining body possesses adsorption orifice, this adsorption orifice is formed at the bearing surface of above-mentioned elastic component and above-mentioned brittle substrate, keep by each element that above-mentioned brittle substrate brisement is made in order to absorption, and answer with above-mentioned each elements relative.
The invention of technical scheme 4 is if technical scheme 1 is to the invention of any one in technical scheme 3, and wherein above-mentioned elastic component is the flat member of transparent rubber (for example, transparent polysiloxane rubber) system.
The invention of technical scheme 5 is breaking method thereofs of a kind of brittle substrate, and it is by the brittle substrate that is formed with delineation line at an interarea is pressed to brisement rod along above-mentioned delineation line, and by above-mentioned brittle substrate brisement; It possesses: mounting step, it is to make to be formed with under the state of the interarea of above-mentioned delineation line and the surperficial butt of elastic component, the brittle substrate that is formed with above-mentioned delineation line is loaded to the surface of the above-mentioned elastic component of the light transmission on the platform that is disposed in light transmission; Absorption keeps step, and it is the surface that the interarea absorption of above-mentioned being formed with of above-mentioned brittle substrate delineation line is held in to above-mentioned elastic component; Take step, it is above-mentioned delineation line to be taken via above-mentioned platform and above-mentioned elastic component by camera; Mobile step, it is according to the image of taking by above-mentioned camera, and above-mentioned platform and above-mentioned brisement rod are relatively moved; And press step, it is by above-mentioned brisement rod, from pressing absorption and be held in the brittle substrate of above-mentioned elastic component with the interarea of interarea opposition side that is formed with above-mentioned delineation line.
By technique scheme, the brisement device of brittle substrate of the present invention and the breaking method thereof of brittle substrate at least have following advantages and beneficial effect:
According to the invention of technical scheme 1 and technical scheme 5, under the effect of elastic component, even if do not use the tackness film also can be by substrate brisement, can omit baseplate-laminating in the operation of tackness film, and can cut down the cost of tackness film.Now, because elastic component and platform have light transmission, so can own elasticity member and platform side carry out the shooting in order to the delineation line of positioning baseplate and brisement rod.
According to the invention of technical scheme 2, substrate adsorption can be held in to the surface of elastic component and fix.
According to the invention of technical scheme 3, each element absorption of making by brisement can be held in to the surface of elastic component.
According to the invention of technical scheme 4, can obtain the elasticity and the light transmission that are applicable to substrate brisement.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, and for above and other object of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the stereogram of the brisement device of brittle substrate of the present invention.
Fig. 2 is the stereogram of the brisement device of brittle substrate of the present invention.
Fig. 3 represents substrate 100 to be disposed on printing opacity platform 102 and elastic sheet member 101 and the schematic diagram of the state of brisement.
Fig. 4 is the partial enlarged drawing of Fig. 3.
Fig. 5 represents in the lump substrate 100 and is formed at the key diagram of the configuration of the adsorption orifice 71 of elastic sheet member 101.
Fig. 6 represents the key diagram of the formation of the adsorption tank 72 that is formed at printing opacity platform 102.
Fig. 7 represents the flow chart of brisement action.
Fig. 8 represents by previous brisement device the synoptic diagram of the situation of substrate brisement.
10: supporting device 11: rotating member
12:Y platform 13: supporting station
14: brisement rod 15: hang a member
16: lifting platform
23,31,34,36: stepper motor
25,32,33,38: ball screw
35:CCD camera 37: guide rail
71: adsorption orifice 72: adsorption tank
74: exhaust portion 99: delineation line
100: substrate 101: elastic sheet member
102: printing opacity platform P: element
The specific embodiment
Technological means and effect of taking for reaching predetermined goal of the invention for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to the brisement device of brittle substrate and its specific embodiment of breaking method thereof, structure, method, step, feature and effect thereof of brittle substrate of proposing according to the present invention, be described in detail as follows.
Fig. 1 and Fig. 2 are the stereograms of the brisement device of brittle substrate of the present invention.
The brisement device of this brittle substrate will be in order to will use LTCC (Low Temperature Co-fired Ceramic, LTCC) or HTCC (Low Temperature Co-fired Ceramic, HTCC) etc. pottery, glass or other fragile material and the brittle substrate that forms (following, referred to as " substrate ") brisement (cutting off).The brisement device of this substrate has and substrate adsorption is held on the elastic sheet member 101 of the transparent polysiloxane rubber system on the printing opacity platform 102 of the glass system of being disposed in and brisement forms.The brisement device of this substrate possesses: rotating member 11, and it rotates printing opacity platform 102 so that be formed at the mode towards aiming at required direction of delineation line that absorption is held in the substrate on elastic sheet member 101; Y platform 12, it supports rotating member 11; Supporting station 13, it supports this Y platform 12; And lifting platform 16, it is with respect to rotating member 11 liftings.Supporting station 13 is arranged on ground via 4 axles 18, base station 17 and shank 19.
In the upper surface of supporting station 13,4 column lifting guide members 24 are erect the position that is arranged at rotating member 11 outsides, are fixed with pedestal 21 with frame across the mode of those column lifting guide member 24 upper ends.Between supporting station 13 and pedestal 21, be provided with the lifting platform 16 of liftably guiding by column lifting guide member 24 again.
On pedestal 21, be situated between and be provided with stepper motor 23 every supporting member 22.Be linked with the ball screw 25 that connects pedestal 21 under state freely in rotating in the rotating shaft of this stepper motor 23, this ball screw 25 is screwed together in the box thread portion that is formed at lifting platform 16.Therefore, lifting platform 16 is by the driving of stepper motor 23 and lifting in Z direction.
As shown in Figure 2, in the lower surface of this lifting platform 16, be situated between, every hanging a member 15, brisement rod 14 be installed.This brisement rod 14 is also called as blade or brisement cutter, while being used to substrate brisement, by pressing substrate along the delineation line that is formed at substrate, and will make the power of substrate brisement give substrate.
As shown in Figure 2, Y platform 12 receives the driving of the ball screw 32 rotating by the driving of stepper motor 31, and on supporting station 13, in Y-direction, comes and goes mobile.Again, the rotary angle position of rotating member 11 can be by utilizing stepper motor 34 ball screw 33 is rotated and adjust.
As shown in Figure 2, be provided with CCD camera 35 in supporting station 13 belows.This CCD camera 35 can move along being supported on the pair of guide rails 37 of the support plate 39 on base station 17 on directions X.Again, the ball screw 38 that the support 41 of CCD camera 35 rotates with driving by stepper motor 36 screws togather.Therefore, CCD camera 35 receives the driving of stepper motor 36, and on directions X, comes and goes mobile.Moreover this CCD camera 35 is in order to observe and to be formed at the delineation line of substrate and the position relationship of brisement rod 14 via printing opacity platform 102 and elastic sheet member 101.
Fig. 3 represents substrate 100 to be disposed on printing opacity platform 102 and elastic sheet member 101 and carries out the schematic diagram of the state of brisement, and Fig. 4 is its partial enlarged drawing.
As shown in Figures 3 and 4, be equipped with the adsorption orifice (exhaust outlet) 71 in order to substrate 100 absorption are held in to this elastic sheet member 101 in elastic sheet member 101.Again, in printing opacity platform 102 relative with adsorption orifice 71 to position be formed with adsorption tank (air discharge duct) 72.This adsorption tank 72 is connected with the exhaust portion such as vavuum pump or exhaust fan 74.Therefore, the substrate 100 loading on elastic sheet member 101 carries out exhaust via adsorption tank 72 and adsorption orifice 71 under the effect in exhaust portion 74 between substrate 100 and elastic sheet member 101, is held on elastic sheet member 101 and be adsorbed.
Moreover, even under this state, because printing opacity platform 102 and elastic sheet member 101 all have light transmission, so as also can be as shown in Figure 3, observe by CCD camera 35 the delineation line 99 that is formed at substrate 100 via printing opacity platform 102 and elastic sheet member 101.
Fig. 5 represents in the lump substrate 100 and is formed at the key diagram of the configuration of the adsorption orifice 71 of elastic sheet member 101.
In the example shown in Fig. 5, substrate 100 is by being divided into 42 element P to indulge delineation line 99 brisements of 5, horizontal 6.Therefore, to keep by each element P that substrate 100 brisements are made in order adsorbing, and to be formed with 42 adsorption orifices 71 corresponding with each element P in elastic sheet member 101.Moreover, in this example, for convenience of explanation, indicate substrate 100 to be divided into the situation of 42 element P, but in fact, substrate 100 can and then be divided into multiple element P.
Fig. 6 represents the key diagram of the formation of the adsorption tank 72 that is formed at printing opacity platform 102.
In printing opacity platform 102, be formed with the adsorption tank 72 being formed by the slot part of vertical 6, horizontal 7.Therefore, become in relative with all above-mentioned 42 adsorption orifices 71 to position configuration have the situation of adsorption tank 72.Moreover this adsorption tank 72, also can be only by indulging or being only made up of horizontal slot part without being made up of longitudinal and transverse slot part.In a word, if in relative with all adsorption orifices 71 to position configuration adsorption tank 72.
Secondly, the brisement action that utilizes brisement device of aforesaid substrate 100 is described.Fig. 7 represents the flow chart of brisement action.
In the time carrying out brisement action, first, substrate 100 is loaded on the elastic sheet member 101 of brisement device (step S1).Then, under the effect of exhaust portion 74, via be formed at the adsorption tank 72 of printing opacity platform 102 and be arranged in elastic sheet member 101 adsorption orifice 71 and to carrying out exhaust between substrate 100 and elastic sheet member 101, whereby, substrate 100 absorption are held in to (step S2) on elastic sheet member 101.
Secondly, by CCD camera 35, and the delineation line 99 that is formed at substrate 100 is taken to (step S3).Now, because printing opacity platform 102 and elastic sheet member 101 have light transmission, so can be by CCD camera 35 below from substrate 100, via printing opacity platform 102 and elastic sheet member 101, the image of the delineation line 99 that is formed at substrate is taken.In the time of the shooting of this delineation line 99, by the driving of stepper motor 36, CCD camera 35 is moved on directions X, be directed to the delineation line 99 extending on directions X, in its universe, image is taken.
Secondly, according to the image of taking by CCD camera 35, substrate 100 and brisement rod 14 are relatively moved, carry out whereby the location (step S4) of delineation line 99 in substrate 100 and brisement rod 14.More specifically, according to the image of the delineation line 99 of taking by CCD camera 35, identification is formed at angle and the position of the delineation line 99 of substrate 100.Then, by the driving of stepper motor 31 and Y platform 12 is moved in Y-direction, and by the driving of stepper motor 34 and adjust the rotary angle position of rotating member 11, whereby, substrate 100 is moved up in Y-direction and θ side, and substrate 100 is disposed at the delineation line 99 that makes to be disposed at end and brisement rod 14 exactly relative to position.
Then, press substrate 100 by brisement rod 14, and by substrate 100 brisements.That is, by the driving of stepper motor 23, lifting platform 16 is declined, brisement rod 14 is connected to after substrate 100 and interareas delineation line 99 opposition sides, further make this brisement rod 14 decline.Under this state, because substrate 100 is supported by elastic sheet member 101, so substrate 100 is produced to bending stress by the elastic force of this elastic sheet member 101.Then, if further make brisement rod 14 decline, substrate 100 is so that delineation line 99 mode consistent with brisement rod 14 and configuring, with its interaction, and make substrate 100 in the position corresponding with delineating line 99 by brisement.
So that by preferably brisement of substrate 100, must suitably select thickness and the hardness of elastic sheet member 101 in order to make substrate 100 produce suitable bending stress.The thickness of this elastic sheet member 101 also depends on hardness and the thickness of substrate 100, but is preferably 1mm to 5mm left and right.Again, the hardness of this elastic sheet member 101 also depends on hardness and the thickness of substrate 100, but is preferably 30 degree to 70 degree (A50 to A70 of JIS K 6253) left and right.
If the brisement along the initial delineation line 99 of substrate 100 finishes, one side is taken substrate 100 by CCD camera 35, one side makes Y platform 12 mobile being equivalent to after the distance of the spacing of delineating line 99 in Y-direction by the driving of stepper motor 31, again make brisement rod 14 decline, make substrate 100 brisements in the position that is equivalent to next delineation line 99.Moreover, in making Y platform 12 mobile while being equivalent to the situation of distance of the spacing of delineating line 99 exactly, also can omit the shooting of CCD camera 35 to substrate 100.
Moreover, when when carrying out brisement with the delineation line 99 of delineation line 99 orthogonal directions that finishes brisement, make after rotating member 11 90-degree rotations by the driving of stepper motor 34, repeat above-mentioned steps S3, step S4, step S5.In the time of this situation, even in the brisement operation along with substrate 100, and while making substrate 100 become the situation of the element P shown in Fig. 5, owing to keeping by each element P that substrate 100 brisements are made in order to adsorb, and be formed with 42 adsorption orifices 71 corresponding with each element P in elastic sheet member 101, so substrate 100 also can not come off by own elasticity sheet members 101.
If all finish the brisement operation (step S6) of substrate 100 in the region corresponding with all delineation lines 99, substrate 100 (each element P) taken out of and finish operation (step S7).
Moreover, in above-mentioned example, be to use to possess adsorption orifice 71 and adsorption tank 72 and the surperficial absorption maintaining body that substrate 100 absorption are held in elastic sheet member 101 is used as to the surperficial fixed component in order to substrate 100 is fixed on to elastic sheet member 101, but also can use other fixed component.For example, also can adopt following formation: formed the surface of the elastic sheet member 101 with light transmission by micro-adhesion material, and substrate 100 is sticked together to the surface that is held in this elastic sheet member 101.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the method for above-mentioned announcement and technology contents to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solution of the present invention, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (5)
1. a brisement device for brittle substrate, it is by the brittle substrate that is formed with delineation line at an interarea is pressed to brisement rod along this delineation line, and by this brittle substrate brisement; It is characterized in that it possesses:
Elastic component, it has light transmission, at this brittle substrate of state lower support connecting with the interarea that is formed with this delineation line of this brittle substrate;
Fixed component, it is in order to be fixed on this brittle substrate on the surface of this elastic component;
Platform, it has light transmission, from supporting this elastic component with this brittle substrate opposition side;
Brisement rod, it is from pressing with the interarea of the interarea opposition side that is formed with this delineation line the brittle substrate that is fixed on this elastic component;
Camera, it is via this platform and this elastic component and this delineation line is taken; And
Travel mechanism, it,, according to the image of taking by this camera, relatively moves this platform and this brisement rod.
2. the brisement device of brittle substrate as claimed in claim 1, it is characterized in that this fixed component is by carrying out exhaust between this brittle substrate and this elastic component, and this brittle substrate absorption is held in to the absorption maintaining body on this elastic component surface.
3. the brisement device of brittle substrate as claimed in claim 2, it is characterized in that this absorption maintaining body possesses adsorption orifice, this adsorption orifice is formed at the bearing surface of this elastic component and this brittle substrate, keep by each element that this brittle substrate brisement is made in order to absorption, and answer with this each elements relative.
4. the brisement device of the brittle substrate as described in claims 1 to 3 any one claim, is characterized in that:
This elastic component is the flat member of transparent rubber system.
5. a breaking method thereof for brittle substrate, it is by the brittle substrate that is formed with delineation line at an interarea is pressed to brisement rod along this delineation line, and by this brittle substrate brisement; It is characterized in that it possesses:
Mounting step, it is to make to be formed with under the state of the interarea of this delineation line and the surperficial butt of elastic component, the brittle substrate that is formed with this delineation line is loaded to the surface of this elastic component of the light transmission on the platform that is disposed in light transmission;
Absorption keeps step, and it is the surface that the interarea absorption that is formed with this delineation line of this brittle substrate is held in to this elastic component;
Take step, it is this delineation line to be taken via this platform and this elastic component by camera;
Mobile step, it is according to the image of taking by this camera, and this platform and this brisement rod are relatively moved; And
Press step, it is by this brisement rod, from pressing absorption and be held in the brittle substrate of this elastic component with the interarea of interarea opposition side that is formed with this delineation line.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012237683A JP6043149B2 (en) | 2012-10-29 | 2012-10-29 | Breaking device for brittle material substrate and method for breaking brittle material substrate |
| JP2012-237683 | 2012-10-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103786269A true CN103786269A (en) | 2014-05-14 |
| CN103786269B CN103786269B (en) | 2017-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310331803.0A Expired - Fee Related CN103786269B (en) | 2012-10-29 | 2013-07-29 | The brisement device and the breaking method thereof of brittle substrate of brittle substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6043149B2 (en) |
| CN (1) | CN103786269B (en) |
| TW (1) | TWI581930B (en) |
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| CN105374708A (en) * | 2014-08-13 | 2016-03-02 | 株式会社迪思科 | Breaking device |
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| CN106773152A (en) * | 2015-11-20 | 2017-05-31 | 三星钻石工业株式会社 | Substrate segmenting device |
| CN107311440A (en) * | 2016-04-26 | 2017-11-03 | 三星钻石工业股份有限公司 | Delineate head unit |
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| JP6520466B2 (en) * | 2015-06-29 | 2019-05-29 | 三星ダイヤモンド工業株式会社 | Break device |
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| JP6212580B2 (en) * | 2016-02-29 | 2017-10-11 | 三星ダイヤモンド工業株式会社 | Fragment material substrate cutting device |
| TWI632040B (en) * | 2017-07-10 | 2018-08-11 | 煜峰投資顧問有限公司 | Apparatus and method for breaking brittle substrate |
| JP2019177694A (en) * | 2019-04-10 | 2019-10-17 | 三星ダイヤモンド工業株式会社 | Breaking device |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201416202A (en) | 2014-05-01 |
| CN103786269B (en) | 2017-09-22 |
| TWI581930B (en) | 2017-05-11 |
| JP2014087936A (en) | 2014-05-15 |
| JP6043149B2 (en) | 2016-12-14 |
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