CN103786271A - Breaking apparatus and breaking method for multi-layered fragile material substrate - Google Patents
Breaking apparatus and breaking method for multi-layered fragile material substrate Download PDFInfo
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- CN103786271A CN103786271A CN201310331804.5A CN201310331804A CN103786271A CN 103786271 A CN103786271 A CN 103786271A CN 201310331804 A CN201310331804 A CN 201310331804A CN 103786271 A CN103786271 A CN 103786271A
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- substrate
- brisement
- resin
- lamination
- brittle substrate
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Abstract
The invention provides a breaking apparatus and breaking method for a multi-layered fragile material substrate. The apparatus and the method can really together break a layer made from resin or metal and a multi-layered fragile material substrate. The part of a breaking rod (14), abutting against a substrate (100), has a cutter-shaped body with an angle [theta] of below 45 degrees. The angle of the front end of the breaking rod 14 is preferably below 35 degrees and further preferably below 25 degrees. When the substrate (100) is breaking, the breaking rod (14) is pressed along a marking line (99) by means of a main surface of one side of a layer (103) made from resin or metal, such that the layer (103) made from resin or metal is broken and the substrate (100) is broken.
Description
Technical field
The invention relates to and a kind ofly will set up brisement device and the breaking method thereof thereof of lamination brittle substrate of lamination brittle substrate brisement of the layer being formed by resin or metal.
Background technology
Semiconductor element be by by the element area that is formed at substrate in the boundary position brisement (cutting off) in this region and manufacture.When brisement substrate, be to use brisement device in this way.This kind of brisement device forms as follows: by from the interarea of interarea opposition side that is formed with delineation line utilize brisement rod in Z direction by the substrate that is pressed in interarea and is formed with delineation line, and by this substrate in the delineation line brisement towards directions X, and be formed with the delineation line forming by utilizing scribe wheel to delineate substrate surface at the interarea of this substrate, by the cutting instruments such as diamond cutter by substrate surface wire the delineation wire casing that reams, by laser substrate surface is melted and wire remove melt processing line, or make by utilizing laser to make substrate surface partial melting substrate structure wire the processing line that goes bad etc. (in this manual, these are generically and collectively referred to as to " delineation line ").And in the time of substrate brisement, substrate is by only space slight distance and a pair of supporting member that configures and the butt supporting (for example, with reference to patent documentation 1) in the Y direction that is called as supporting cutter etc.
In this kind of brittle substrate, to there is the circuit etc. that is formed at interarea in order protecting, and the thermosetting resins such as expoxy glass to be attached to interarea or metal level is attached to interarea.By said method during by the situation of this kind of substrate brisement, due to resin or metal different from the material of substrate, even and if exist in the time of substrate brisement, a part for the layer being made up of resin or metal is not also completely severed and residual problem.
Therefore, in patent documentation 2, disclose the dividing method that has a kind of brittle substrate with resin, its be by be attached with at the interarea of brittle substrate the brittle substrate with resin that resin forms perpendicular to interarea the method cut apart, and possess: slot part forms step, it is to form slot part in the precalculated position of cutting apart of the resin side of the brittle substrate with resin; Delineation line forms step, and it is to form delineation line in the precalculated position of cutting apart of the brittle substrate side of the brittle substrate with resin; And brisement step, it is to cut apart the brittle substrate with resin along delineation line.
The dividing method with the brittle substrate of resin of recording in patent documentation 2 is can be by the brittle substrate with resin with respect to vertical the cutting apart precalculated position positively and cut apart with excellent dimensional accuracy of its interarea, but form step owing to must carrying out slot part before the brisement step at substrate, so exist job step to increase, cannot carry out efficiently the problem of brisement operation.
[prior art document]
[patent documentation]
[patent documentation 1] TOHKEMY 2004-39931 communique
[patent documentation 2] TOHKEMY 2012-66479 communique
Summary of the invention
The object of the present invention is to provide a kind of lamination brittle substrate for setting up the layer being formed by resin or metal, without through special step, just brisement device and the breaking method thereof thereof with the lamination brittle substrate of this lamination brittle substrate in the lump brisement by the layer being formed by resin or metal positively.
The object of the invention to solve the technical problems realizes by the following technical solutions.The present invention be by set up at an interarea formed by resin or metal layer, another interarea be formed with delineation line lamination brittle substrate, the interarea of the side of the layer being made up of above-mentioned resin or metal from setting up of above-mentioned lamination brittle substrate compresses brisement rod along above-mentioned delineation line, and by the brisement device of the lamination brittle substrate of above-mentioned lamination brittle substrate brisement, wherein: above-mentioned brisement rod and the abutting part of above-mentioned lamination brittle substrate have following by 65 degree, be preferably the knife-edge shape that the angle below 45 degree forms.
The object of the invention to solve the technical problems also realizes by the following technical solutions.The present invention will set up the layer being made up of resin or metal, the breaking method thereof that is formed with the lamination brittle substrate of the lamination brittle substrate brisement of delineation line at another interarea at an interarea, it possesses: support step, support the interarea of the above-mentioned delineation line of being formed with of above-mentioned lamination brittle substrate; And brisement step, by the interarea of side of the layer being formed by above-mentioned resin or metal from setting up of above-mentioned lamination brittle substrate along above-mentioned delineation line, compress the brisement rod that its front end has the knife-edge shape being made up of the angle below 45 degree, and the layer being made up of above-mentioned resin or metal is cut off, and by the brisement of above-mentioned lamination brittle substrate.
By technique scheme, brisement device and the breaking method thereof thereof of lamination brittle substrate of the present invention at least have following advantages and beneficial effect: according to the present invention, even if when setting up the situation of lamination brittle substrate brisement of the layer being formed by resin or metal, also can be without the special step such as the formation of slot part, and positively by lamination brittle substrate and the layer brisement in the lump being formed by resin or metal.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, and for above and other object of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1: the stereogram of the brisement device of brittle substrate of the present invention.
Fig. 2: the stereogram of the brisement device of brittle substrate of the present invention.
Fig. 3: the top view that represents the annular component 4 of the brisement device in order to substrate is arranged to aforesaid substrate.
Fig. 4: represent the enlarged drawing of the state of substrate brisement.
[main element symbol description]
10: supporting member 11: rotating member
12:Y platform 13: supporting station
14: brisement rod 15: hang a member
16: lifting platform
23,31,34,36: stepper motor
25,32,33,38: ball screw
35:CCD camera 37: guide rail
42: tackness film 43: annular component
61,62: supporting cutter 99: delineation line
100: substrate
103: the layer being formed by resin or metal
The specific embodiment
Technological means and effect of taking for reaching predetermined goal of the invention for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to a kind of brisement device of lamination brittle substrate and the specific embodiment, structure, feature and effect thereof of breaking method thereof of proposing according to the present invention, be described in detail as follows.
Below, according to graphic, embodiments of the invention are described.Fig. 1 and Fig. 2 are the stereograms of the brisement device of brittle substrate of the present invention.
The brisement device of this brittle substrate is in order to will use LTCC (Low Temperature Co-fired Ceramic, LTCC) or HTCC (Low Temperature Co-fired Ceramic, HTCC) etc. pottery, glass or other fragile materials and the brittle substrate that forms (following, referred to as " substrate ") brisement (cutting off).
The brisement device of this substrate possesses: supporting member 10 (with reference to Fig. 1); Rotating member 11, supports following annular component 43 so that be formed at the mode towards aiming at required direction of the delineation line of substrate, and it is rotated with respect to this supporting member 10; Y platform 12, supporting rotating member 11; Supporting station 13, supports this Y platform 12; And lifting platform 16, with respect to rotating member 11 and lifting.Supporting station 13 is arranged at ground via 4 axles 18, base station 17 and shank 19.
At the upper surface of supporting station 13,4 column lifting guide members 24 are erect the position in the outside that is arranged at rotating member 11, are fixed with pedestal 21 with frame across the mode of the upper end of described column lifting guide member 24.Between supporting station 13 and pedestal 21, be provided with the lifting platform 16 of liftably guiding by column lifting guide member 24 again.
On pedestal 21, be situated between and be provided with stepper motor 23 every supporting member 22.The rotating shaft of this stepper motor 23 is linked with the ball screw 25 that connects pedestal 21 under rotation state freely, and this ball screw 25 is screwed together in the box thread portion that is formed at lifting platform 16.Therefore, lifting platform 16 is by the driving of stepper motor 23 and lifting in Z direction.
As shown in Figure 2, at the lower surface of this lifting platform 16, be situated between, every hanging a member 15, brisement rod 14 be installed.This brisement rod 14 is also called as blade or brisement cutter, in order to when the substrate brisement, by pressing substrate along the delineation line that is formed at substrate, and gives substrate by the power that makes substrate brisement.
As shown in Figure 2, Y platform 12 receives the driving of the ball screw 32 rotating by the driving of stepper motor 31, and on supporting station 13, in Y-direction, comes and goes mobile.Again, the rotary angle position of rotating member 11 can be by utilizing stepper motor 34 ball screw 33 is rotated and adjust.
As shown in Figure 2, below supporting station 13, be provided with CCD (Charge Coup1ed Device, charge-coupled image sensor) camera 35.This CCD camera 35 can move along the pair of guide rails 37 that is supported on the support plate 39 on base station 17 on directions X.Again, the ball screw 38 that the support 41 of CCD camera 35 rotates with driving by stepper motor 36 screws togather.Therefore, CCD camera 35 receives the driving of stepper motor 36, and on directions X, comes and goes mobile.Moreover this CCD camera 35 is in order to observe and to be formed at the delineation line of substrate and the position relationship of brisement rod 14 via the peristome that is formed at supporting station 13.
Fig. 3 represents the top view in order to substrate 100 is arranged to the annular component 43 of the brisement device of aforesaid substrate.
Being formed at the central circular open portion of annular component 43, it is sticked together under the state facing to annular component 43 sides, be adhesive with and be called as the tackness film 42 that cuts protective tapes.And the substrate 100 of brisement sticks in the face that sticks together of tackness film 42.Now, the following layer 103 being made up of resin or metal is disposed at and tackness film 42 opposition sides.The annular component 43 that is adhesive with substrate 100 via tackness film 42 is arranged at the rotating member 11 shown in Fig. 1.
Fig. 4 represents the enlarged drawing of the state of substrate 100 brisements.Moreover in the figure, only diagram has in the multiple delineation lines 99 that are formed at substrate 100.
This brisement rod 14 is in order to the layer being made up of resin or metal 103 is cut off, and by substrate 100 brisement own, its front end forms by having the supersteel alloy of the knife-edge shape being made up of the angle below 45 degree.
,, in previous common brisement rod, its front end becomes the angle of 90 degree left and right.Therefore, find to utilize this kind of brisement rod in employing, by the substrate 100 of setting up the layer 103 being made up of resin or metal is compressed to brisement rod from the interarea of the side of setting up this layer 103 being made up of resin or metal, and during by the situation of the formation of substrate brisement, can produce following problem: even if in the time of substrate 100 brisement, a part for the layer 103 being made up of resin or metal is not also completely severed and residual problem.Therefore, in the brisement device of substrate of the present invention, as expression that Fig. 4 amplifies, by use with the abutting part of substrate 100 have by 65 degree below, be preferably knife-edge shape that the angle θ below 45 degree forms as brisement rod 14, and elimination the problems referred to above.
The angle θ of the front end of this brisement rod 14 is preferably below 35 degree, and then is preferably below 25 degree.θ is less for this angle, more the layer 103 being made up of resin or metal can be cut off well, if but processing and the durability of consideration brisement rod 14, more than this angle θ is preferably 10 degree.Previously, be formed with the arc angle (circular-arc processing/R0.1mm) of 0.1mm left and right at the leading section of common brisement rod 14, but in this brisement rod 14, only formed the necessary minimum arc angle of front end of promising protection brisement rod 14 again.
At the brisement device of substrate by having this kind of formation during by substrate 100 brisement, by being situated between, the annular component 43 that the substrate 100 of answering brisement is installed every tackness film 42 is arranged at rotating member 11.Under this state, as shown in Figure 4, stick together and have the tackness of substrate 100 film 42 by a pair of supporting cutter 61,62 in supporting member 10 and support.
Then, by CCD camera 35, the delineation line 99 that is formed at substrate 100 is taken.In the time of the shooting of this delineation line 99, by the driving of stepper motor 36 and CCD camera 35 is moved on directions X, be directed to the delineation line 99 extending on directions X, at its universe photographic images.
Secondly, according to the image of taking by CCD camera 35, substrate 100 and brisement rod 14 are relatively moved, carry out whereby delineation line 99 in substrate 100 and the location of brisement rod 14.More specifically, according to the image of the delineation line 99 of taking by CCD camera 35, identification is formed at angle and the position of the delineation line 99 of substrate 100.; by the driving of stepper motor 31 and Y platform 12 is moved in Y-direction; and by the driving of stepper motor 34 and adjust the rotary angle position of rotating member 11; whereby; substrate 100 is moved up in Y-direction and θ side, and substrate 100 is disposed at the delineation line 99 that makes to be disposed at end and brisement rod 14 exactly relative to position.
Then, press substrate 100 by brisement rod 14, and by substrate 100 brisements.That is, by the driving of stepper motor 23, lifting platform 16 is declined, brisement rod 14 is connected to after substrate 100 and interareas delineation line 99 opposition sides, further make this brisement rod 14 decline.Now, owing to using its front end to there is the knife-edge shape being formed by the angle θ below 45 degree as brisement rod 14, so can the layer being made up of resin or metal 103 be cut off by this brisement rod 14, and by substrate 100 brisement own.
By the number of times that repeats this kind of action necessity, if all finish the brisement operation of substrate 100 in the region corresponding with all delineation lines 99, substrate 100 taken out of and finish operation.
As mentioned above, in the brisement device of substrate of the present invention, especially use with the abutting part of substrate 100 and there is the knife-edge shape that is acute angle as brisement rod 14, even if so set up layer 103 the substrate 100 that formed by resin or metal and during by the situation of its brisement pressing from this layer 103 side, also can be without the special step such as the formation of slot part, and by substrate 100 and the layer 103 positively brisement in the lump that formed by resin or metal.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, but not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solution of the present invention, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (2)
1. the brisement device of a lamination brittle substrate, its be by set up at an interarea formed by resin or metal layer, another interarea be formed with delineation line lamination brittle substrate, the interarea of the side of the layer being made up of this resin or metal from setting up of this lamination brittle substrate compresses brisement rod along this delineation line, and by this lamination brittle substrate brisement; It is characterized in that:
This brisement rod has with the abutting part of this lamination brittle substrate the knife-edge shape being made up of the angle below 65 degree.
2. a breaking method thereof for lamination brittle substrate, it is to set up the layer being made up of resin or metal, the lamination brittle substrate brisement that is formed with delineation line at another interarea at an interarea; It is characterized in that possessing following steps:
Support step, support the interarea that is formed with this delineation line of this lamination brittle substrate; And
Brisement step, the interarea of the side of the layer being formed by this resin or metal by setting up of this lamination brittle substrate certainly, compress its front end and have the brisement rod of the knife-edge shape being formed by the angle below 45 degree along this delineation line, and the layer being made up of this resin or metal is cut off, and by this lamination brittle substrate brisement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910522859.1A CN110405963A (en) | 2012-10-29 | 2013-07-29 | The brisement device and its breaking method thereof of lamination brittle material substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-237684 | 2012-10-29 | ||
| JP2012237684A JP6043150B2 (en) | 2012-10-29 | 2012-10-29 | Breaking apparatus for laminated brittle material substrate and method for breaking laminated brittle material substrate |
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| CN201910522859.1A Division CN110405963A (en) | 2012-10-29 | 2013-07-29 | The brisement device and its breaking method thereof of lamination brittle material substrate |
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| CN103786271A true CN103786271A (en) | 2014-05-14 |
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| CN201310331804.5A Pending CN103786271A (en) | 2012-10-29 | 2013-07-29 | Breaking apparatus and breaking method for multi-layered fragile material substrate |
| CN201910522859.1A Pending CN110405963A (en) | 2012-10-29 | 2013-07-29 | The brisement device and its breaking method thereof of lamination brittle material substrate |
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| JP (1) | JP6043150B2 (en) |
| CN (2) | CN103786271A (en) |
| TW (1) | TWI583521B (en) |
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| CN105365060A (en) * | 2014-08-12 | 2016-03-02 | 三星钻石工业股份有限公司 | Method and device for dividing brittle material substrate |
| CN105365052A (en) * | 2014-08-28 | 2016-03-02 | 三星钻石工业股份有限公司 | Cutting device and cutting method of brittle material substrate of the cutting device |
| CN105390444A (en) * | 2014-08-20 | 2016-03-09 | 三星钻石工业股份有限公司 | Breaking method for brittle material substrate and breaking device |
| CN106272997A (en) * | 2015-06-29 | 2017-01-04 | 三星钻石工业株式会社 | Shearing device |
| CN107009524A (en) * | 2015-09-29 | 2017-08-04 | 三星钻石工业股份有限公司 | The method for cutting of brittle base |
| CN109421179A (en) * | 2017-08-21 | 2019-03-05 | 株式会社迪思科 | Processing method |
| CN110000936A (en) * | 2017-12-28 | 2019-07-12 | 三星钻石工业股份有限公司 | Break-up device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105365060A (en) * | 2014-08-12 | 2016-03-02 | 三星钻石工业股份有限公司 | Method and device for dividing brittle material substrate |
| CN105365060B (en) * | 2014-08-12 | 2020-01-10 | 三星钻石工业股份有限公司 | Method and apparatus for dividing brittle material substrate |
| CN105390444A (en) * | 2014-08-20 | 2016-03-09 | 三星钻石工业股份有限公司 | Breaking method for brittle material substrate and breaking device |
| CN105365052A (en) * | 2014-08-28 | 2016-03-02 | 三星钻石工业股份有限公司 | Cutting device and cutting method of brittle material substrate of the cutting device |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6043150B2 (en) | 2016-12-14 |
| CN110405963A (en) | 2019-11-05 |
| TWI583521B (en) | 2017-05-21 |
| TW201416203A (en) | 2014-05-01 |
| JP2014087937A (en) | 2014-05-15 |
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Application publication date: 20140514 |