CN101009978A - Method for manufacturing electronic device - Google Patents
Method for manufacturing electronic device Download PDFInfo
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- CN101009978A CN101009978A CN 200710002031 CN200710002031A CN101009978A CN 101009978 A CN101009978 A CN 101009978A CN 200710002031 CN200710002031 CN 200710002031 CN 200710002031 A CN200710002031 A CN 200710002031A CN 101009978 A CN101009978 A CN 101009978A
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- electronic equipment
- assembly substrate
- manufacture method
- marking groove
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Abstract
The invention provides a method for manufacturing an electronic device whose electrical characteristics can be easily measured, that is superior in productivity and is low-priced. In the method for manufacturing the electronic device; the electrical characteristics can be measured, without having to exfoliate the electronic device 5 from an adhesive tape 11, workability is high, and productivity is satisfactory, because the tape 11 is affixed to the backside of a cover 4 and the side of a circuit substrate 1 of each device 5 is open. In addition, since an aggregate substrate 6 is formed easily into individual circuit substrates, productivity is satisfactory, and a low-price circuit substrate can be obtained, because the aggregate substrate is designed to be fractured along a scribe groove 7 by the bending stress.
Description
Technical field
The present invention relates to be fit to be used in the manufacture method of electronic equipment of the electronic equipment etc. of the transmitting-receiving usefulness of in mobile phone, using.
Background technology
Explanation is relevant for the accompanying drawing of the manufacture method of existing electronic equipment, Fig. 9 is the major part profile of electronic equipment in the past, Figure 10 is the vertical view that is used to illustrate the manufacture method of electronic equipment in the past, and Figure 11 is the profile of major part that is used to illustrate the manufacture method of electronic equipment in the past.
Then, structure based on Fig. 9 explanation electronic equipment in the past, upper surface at the circuit substrate 51 that is made of ceramic material is equipped with the electronic equipment 52 that is connected with wiring pattern (not shown), and be set on the circuit substrate 51 in the state lower seal resin portion 53 that has covered electronic unit 52, the wiring pattern that is arranged at the upper surface of circuit substrate 51 is derived at the lower surface of circuit substrate 51 as pad (land) portion (not shown), thereby forms electronic equipment 54 in the past.
Then, explanation has the manufacture method of the electronic equipment in the past of said structure based on Figure 10, Figure 11, at first, preparation is used to form the assembly substrate 55 that is made of ceramic material of a plurality of circuit substrates 51, then, upper surface at this assembly substrate 55, corresponding with circuit substrate 51 and after having carried electronic unit 52, upper surface at assembly substrate 55, under the state that has covered electronic unit 52, utilize multistation model (transfer mould) to form sealing resin section 53, be pasted with splicing tape 56 at the back side of assembly substrate 55 then.
Then, the cut-out portion 57 that is cut the device cutting under this state is set to sealing resin section 53, assembly substrate 55 and splicing tape 56 along cut-off rule 58, forms each electronic equipment 54 (for example with reference to patent documentation 1) thus.
And so the electronic equipment in the past that is in connecting state by splicing tape 56 constitutes: each electronic equipment is peeled off from splicing tape 56, and the electronic equipment after being separated from each other is measured electrical characteristic by determinator (not shown) respectively.
Patent documentation 1: TOHKEMY 2001-267458 communique (second page, Fig. 7, Fig. 9, Figure 10)
But, the manufacture method of electronic equipment in the past, because splicing tape 56 is glued to the back side of assembly substrate 55, therefore when measuring the electrical characteristic of each electronic equipment 54, have following problem: electronic equipment 54 need be peeled off from splicing tape 56, its operation is trouble, the productivity ratio variation, and the cut-out portion 57 of cutter need be set in sealing resin section 53, and its operation is trouble, and cost raises.
Summary of the invention
The present invention proposes in view of the actual conditions of such prior art, and its purpose is to provide a kind of mensuration of electrical characteristic easy, productivity ratio good and the manufacture method of the electronic equipment of cheapness.
In order to reach above-mentioned purpose, the present invention is the manufacture method of electronic equipment, and this electronic equipment has: electronic unit, and it is equipped on the wiring pattern of the upper surface setting of the circuit substrate that is made of ceramic material; And cover, it is installed in circuit substrate under the state that has covered this electronic unit, and the manufacture method of this electronic equipment is characterised in that to possess: assembly substrate, it is made of the ceramic material that is used to form a plurality of circuit substrates; Electronic unit, it is corresponding with each circuit substrate and be equipped on the upper surface of assembly substrate; And cover, it is corresponding with each circuit substrate and be installed in the upper surface of assembly substrate, on the smooth end face of a plurality of covers, splicing tape is installed, and be installed at splicing tape under the state of cover, the pair set substrate applies bending stress, at the back side of assembly substrate along the marking groove that on the position of zoning, is provided with for each circuit substrate by after disrumpent feelings, a plurality of electronic equipments are measured electrical characteristic under the state that has been linked by splicing tape.
So the present invention who constitutes, because splicing tape is installed in the end face of cover, the circuit substrate side of each electronic equipment becomes open state, therefore need not electronic equipment is peeled off from splicing tape, just can measure electrical characteristic, its operation is easy, productivity ratio is good, in addition and since assembly substrate because of bending stress along marking groove by disrumpent feelings, the manufacture method of the electronic equipment that therefore can be formed on each circuit substrate easily, productivity ratio is good, cheap.
In addition, the invention is characterized in foregoing invention, to have a plurality of welding disks at the back side of assembly substrate, the corresponding setting of these a plurality of welding disks with circuit substrate, and be connected with wiring pattern, the electrical characteristic of each electronic equipment is measured via welding disk.
So the present invention who constitutes, the welding disk of the lower surface of circuit substrate becomes open state from splicing tape, measures electrical characteristic easily, and can measure a plurality of electronic equipments simultaneously, therefore can obtain good productivity ratio.
In addition, the invention is characterized in, in foregoing invention, after electronic unit and cover are installed on the assembly substrate, on assembly substrate, formed marking groove.
So the present invention who constitutes even at the installation procedure of electronic unit or cover pressure is put on the assembly substrate, also is difficult to produce fracture in marking groove.
In addition, the invention is characterized in that in foregoing invention, cover is configured to clathrate, and marking groove is formed clathrate.
So the present invention who constitutes is suitable for obtaining a plurality of electronic equipments.
In addition, the invention is characterized in foregoing invention, to possess: push anchor clamps, it is to pushing on the splicing tape; And support fixture, it supports the rear side of assembly substrate, by support fixture with push under the state at the back side that the non-relative position of anchor clamps supports assembly substrate, push the anchor clamps contraposition and on the splicing tape between the adjacent cover, push, assembly substrate along marking groove by disrumpent feelings.
So the present invention who constitutes, splicing tape becomes the fender of pushing anchor clamps, the distortion of cover is few, and by support fixture with push under the state at the back side that the non-relative position of anchor clamps supports assembly substrate, pushing the anchor clamps contraposition pushes on the splicing tape between the adjacent cover, therefore assembly substrate, can make the disrumpent feelings easy and reliable of assembly substrate along marking groove and by disrumpent feelings.
In addition, the invention is characterized in, in foregoing invention, support fixture has two convex strip portions that dispose across a marking groove, the back side of assembly substrate is supported by convex strip portions, and dispose the camera of the position that is used to discern marking groove in the rear side of assembly substrate, after the position of having adjusted by the marking groove of camera identification, assembly substrate along marking groove by disrumpent feelings.
So the present invention who constitutes after having discerned the position of marking groove by camera, adjusts to the position of marking groove on the suitable position, then can disrumpent feelings assembly substrate, thus assembly substrate can be realized good disrumpent feelings of precision.
In addition, the invention is characterized in that in foregoing invention, camera is configured between two convex strip portions, in order to discern the position of a marking groove between convex strip portions, and have devices spaced apart and first, second camera of disposing.
So the present invention who constitutes is clipped in two marking groove between the convex strip portions for each, can discern the position of marking groove by camera, and assembly substrate can be realized good disrumpent feelings of flawless precision.
In addition, the invention is characterized in, in foregoing invention, possesses load device, this load device has actuator and load sensor, and load sensor is configured in actuator and pushes between the anchor clamps, and the load of actuator is applied on the assembly substrate with pushing anchor clamps via load sensor.
So the present invention who constitutes can measure push the pushing of anchor clamps of assembly substrate when disrumpent feelings by load device and increase the weight of, and can eliminate push anchor clamps unnecessary and be pressed into action.
In addition, the invention is characterized in foregoing invention, on load device, to have controller, this controller utilization can detect assembly substrate along marking groove by the signal of disrumpent feelings load sensor, stop to push the push action of anchor clamps.
So the present invention who constitutes can eliminate push anchor clamps unnecessary and be pressed into action, can prevent the defective of assembly substrate.
The present invention need not electronic equipment is peeled off from splicing tape, just can measure electrical characteristic, its operation is easy, productivity ratio is good, in addition, since assembly substrate because of bending stress along marking groove by disrumpent feelings, the manufacture method of the electronic equipment that therefore can be formed on each circuit substrate easily, productivity ratio is good, cheap.
Description of drawings
Fig. 1 is the major part profile of electronic equipment of the present invention;
Fig. 2 is the front view of first operation of the manufacture method of expression electronic equipment of the present invention;
Fig. 3 is the vertical view of first operation of the manufacture method of expression electronic equipment of the present invention;
Fig. 4 is the front view of second operation of the manufacture method of expression electronic equipment of the present invention;
Fig. 5 is the vertical view of second operation of the manufacture method of expression electronic equipment of the present invention;
Fig. 6 is the stereogram of summary of disrumpent feelings operation of the manufacture method of expression electronic equipment of the present invention;
Fig. 7 is the amplification profile of major part of disrumpent feelings operation of the manufacture method of electronic equipment of the present invention;
Fig. 8 relates to the stereogram other embodiment, that represent the summary of manufacturing installation of the manufacture method of electronic equipment of the present invention;
Fig. 9 is the major part profile of electronic equipment in the past;
Figure 10 is the vertical view that is used to illustrate the manufacture method of electronic equipment in the past;
Figure 11 is the profile of major part that is used to illustrate the manufacture method of electronic equipment in the past.
Description of drawings:
The 1-circuit substrate; The 2-wiring pattern; The 2a-welding disk; The 3-electronic unit; The 4-cover; The 5-electronic equipment; The 6-assembly substrate; The 7-marking groove; The 8-support fixture; The 8a-convex strip portions; 9-pushes anchor clamps; The 10-framework; The 10a-hole; The 11-splicing tape; The 12-workbench; 13a-first camera; 13b-second camera; The 14-load device; The 15-actuator; The 16-load sensor; The 17-controller; The 18-servomotor; The 19-ball-screw; The 20-supporter.
Embodiment
With reference to description of drawings working of an invention mode, Fig. 1 is the major part profile of electronic equipment of the present invention, Fig. 2 is the front view of first operation of the manufacture method of expression electronic equipment of the present invention, Fig. 3 is the vertical view of first operation of the manufacture method of expression electronic equipment of the present invention, Fig. 4 is the front view of second operation of the manufacture method of expression electronic equipment of the present invention, Fig. 5 is the vertical view of second operation of the manufacture method of expression electronic equipment of the present invention, Fig. 6 is the stereogram of summary of disrumpent feelings operation of the manufacture method of expression electronic equipment of the present invention, Fig. 7 is the amplification profile of major part of disrumpent feelings operation of the manufacture method of electronic equipment of the present invention, and Fig. 8 relates to another embodiment of the manufacture method of electronic equipment of the present invention, the stereogram of the summary of expression manufacturing installation.
Then, the structure of electronic equipment of the present invention is described with reference to Fig. 1, upper surface at the circuit substrate 1 that is made of ceramic material is provided with wiring pattern 2, on this wiring pattern 2, be equipped with various electronic units 3, form desirable electric circuit, this electric circuit is connected with the wiring pattern 2 of upper surface, the welding disk 2a of the lower surface by being arranged at circuit substrate 1 is connected with external equipment, and the cover 4 of the box-shaped that is made of metallic plate is being installed on the circuit substrate 1 under the state that has covered electronic unit, thereby forms electronic equipment 5 of the present invention.
Then, an embodiment of the manufacture method of the electronic equipment of the present invention with said structure is described with reference to Fig. 2～Fig. 7, at first, preparation is used to form the assembly substrate 6 that is made of ceramic material of a plurality of circuit substrates 1, then, as Fig. 2, shown in Figure 3, upper surface at this assembly substrate 6, corresponding with each circuit substrate 1 and carry electronic unit 3, and after cover 4 has been installed with clathrate, as Fig. 4, shown in Figure 5, at the back side of assembly substrate 6, with adjacent cover 4 between by laser the marking groove 7 of V-arrangement is formed clathrate on the relative position.
This marking groove 7 also can form by pushing the V-arrangement sharp weapon in the operation before the firing ceramics material.
Then, as Fig. 6, shown in Figure 7,, prepare: be separated by predetermined distance and a pair of support fixture 8 that disposes as cutting off operation; Configuration pushes anchor clamps 9 above between this a pair of support fixture 8; At support fixture 8 with push the tabular framework 10 that the position between the anchor clamps 9 flatly disposes with hole 10a; With the splicing tape 11 of the upper surface that sticks on framework 10 in the mode of blocking hole 10a, in the 10a of hole, be inserted in the cover 4 that assembly substrate 6 is installed then, the smooth end face of cover 4 is glued to splicing tape 11.
Under this state, as Fig. 6, shown in Figure 7, a pair of support fixture 8 at butt under the state of a marking groove 7, be supported in the back side of assembly substrate 6, push by pushing 9 pairs of the anchor clamps splicing tape 11 of (position relative) between adjacent cover 4 with marking groove 7, if pair set substrate 6 applies bending stress, then assembly substrate 6a along marking groove 7 by disrumpent feelings (cutting).
Then, if finish this disrumpent feelings operation, then make each electronic equipment 5, and under the state opened of each electronic equipment 5 side below circuit substrate 1, become cover 4 sides and linked by splicing tape 11 and be the state of one.
Then, utilize determinator (not shown),, afterwards,, then finish the manufacturing of electronic equipment of the present invention if each electronic equipment 5 is peeled off from splicing tape 11 via the electrical characteristic that the welding disk 2a of the lower surface of circuit substrate 1 measures each electronic equipment 5.
In addition, in the above-described embodiments, a plurality of electronic equipments 5 are configured to cancellate situation are illustrated on assembly substrate 6, but a plurality of electronic equipments 5 also can be configured to a row shape on assembly substrate 6.
In addition, Fig. 8 represents other embodiment of the manufacture method of electronic equipment of the present invention, these other embodiment are described, the framework 10 that assembly substrate 6 has been installed is installed on the rotatable workbench 12, and is separated by on the rear side of assembly substrate 6 and disposes at interval first, second camera 13a, 13b.
This first, second camera 13a, 13b are configured in across a marking groove 7 and between two convex strip portions 8a of the support fixture 8 of configuration, discern the both ends side of the marking groove 7 between these two convex strip portions 8a.
In addition, load device 14 is by the servomotor 18 that is installed on supporter 20, the ball-screw 19 that combines with servomotor 18, the actuator 15 that slides with respect to supporter 20 by the rotation of ball-screw 19, at actuator 15 with push the load sensor 16 of configuration between the anchor clamps 9; With the controller 17 of controlling the action of servomotor 18 based on the detection signal of load sensor 16.
The actuator 15 of this load device 14 makes to be pushed anchor clamps 9 and moves downwards, be connected to splicing tape 11 up to pushing anchor clamps 9, after butt, by actuator 15 moving downwards, 16 pairs of load sensors are pushed anchor clamps 9 and are pushed, and by this pressing force (push and increase the weight of), load sensor 16 produces deflection, sends this deflection to controller 17 as signal.
Other structures have structure same as the previously described embodiments, to the identical identical numbering of parts mark, omit its explanation at this.
Then, the manufacture method of another embodiment is described, at first, by the both ends side of the marking groove 7 of first, second camera 13a, 13b identification between two convex strip portions 8a, thus, whether identification marking groove 7 is positioned at suitable position.
Then, when marking groove 7 is not positioned at suitable position, makes workbench 12 rotation or on the Y-Y direction, move by drive unit (not shown), adjust to marking groove 7 on the appropriate location after, support the back side of assembly substrates 6 by two convex strip portions 8a.
Then, the actuator 15 of load device 14 is moved downwards with pushing anchor clamps 9 via load sensor 16, make and push anchor clamps 9 and be connected on the splicing tape 11 of (position relative) between the adjacent cover 4 with marking groove 7, and then, push anchor clamps 9 and move downwards if make, then load sensor 16 produces the deflection signal, and pair set substrate 6 applies load.
And, if assembly substrate 6 by pushing pushing of anchor clamps 9 along marking groove 7 disrumpent feelings (cutting), the then train slewing a little less than the pressing force of pushing anchor clamps 9, the deflection of load sensor 16 sharply reduces, by this deflection signal that has sharply changed, the signal that slave controller 17 transmissions stop the action of servomotor 18 makes and pushes anchor clamps 9 (actuator 15) mobile stopping downwards.
Then, by the method identical,, measure after the electrical characteristic of each electronic equipment 5 by the welding disk 2a of determinator (not shown) via the lower surface of circuit substrate 1 with described embodiment, if each electronic equipment 5 is peeled off from splicing tape 11, then finish the manufacturing of electronic equipment of the present invention.
Claims (9)
1. the manufacture method of an electronic equipment, this electronic equipment has: electronic unit, it is equipped on the wiring pattern that the upper surface at the circuit substrate that is made of ceramic material is provided with; And cover, it is installed in described circuit substrate under the state that has covered this electronic unit, and the manufacture method of this electronic equipment is characterised in that,
Possess:
Assembly substrate, it is made of the ceramic material that is used to form a plurality of described circuit substrates;
Described electronic unit, it is corresponding with each described circuit substrate and be equipped on the upper surface of described assembly substrate; And
Described cover, it is corresponding with each described circuit substrate and be installed in the upper surface of described assembly substrate,
On the smooth end face of a plurality of described covers, splicing tape is installed, and be installed at described splicing tape under the state of described cover, described assembly substrate is applied bending stress, at the back side of described assembly substrate along in zoning being the marking groove that is provided with on the position of described each circuit substrate and by after disrumpent feelings, under the state that has linked by described splicing tape, a plurality of described electronic equipments are measured electrical characteristics.
2, the manufacture method of electronic equipment according to claim 1 is characterized in that,
Have a plurality of welding disks at the back side of described assembly substrate, the corresponding setting of these a plurality of welding disks with described circuit substrate, and be connected with described wiring pattern,
The electrical characteristic of each described electronic equipment is measured via described welding disk.
3, the manufacture method of electronic equipment according to claim 1 and 2 is characterized in that,
After described electronic unit and described cover are installed on the described assembly substrate, on described assembly substrate, formed described marking groove.
4, the manufacture method of electronic equipment according to claim 1 is characterized in that,
Described cover is configured to clathrate, and described marking groove is formed clathrate.
5, the manufacture method of electronic equipment according to claim 1 is characterized in that,
Possess:
Push anchor clamps, it is to pushing on the described splicing tape; With
Support fixture, it supports the rear side of described assembly substrate,
Pushing under the state at the back side that the non-relative position of anchor clamps supports described assembly substrate with described by described support fixture, describedly push the anchor clamps contraposition and on the described splicing tape between the adjacent described cover, push, described assembly substrate along described marking groove by disrumpent feelings.
6, the manufacture method of electronic equipment according to claim 5 is characterized in that,
Described support fixture has two convex strip portions that dispose across a described marking groove, the back side of described assembly substrate is supported by described convex strip portions, and dispose the camera of the position that is used to discern described marking groove in the rear side of described assembly substrate, after the position of having adjusted the described marking groove of having discerned by described camera, described assembly substrate along described marking groove by disrumpent feelings.
7, the manufacture method of electronic equipment according to claim 6 is characterized in that,
Described camera is configured between two described convex strip portions, in order to discern the position of a described marking groove between described convex strip portions, and has devices spaced apart and first, second camera of disposing.
8, according to the manufacture method of any described electronic equipment in the claim 5～7, it is characterized in that,
Possess load device, this load device has actuator and load sensor,
Described load sensor is configured in described actuator and described pushing between the anchor clamps, and the load of described actuator is via described load sensor and describedly push anchor clamps and be applied on the described assembly substrate.
9, the manufacture method of electronic equipment according to claim 8 is characterized in that,
On described load device, have controller, this controller utilization can detect described assembly substrate along described marking groove by the signal of the described load sensor of disrumpent feelings situation, stop described push action of pushing anchor clamps.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006014068 | 2006-01-23 | ||
| JP2006014068A JP2007067365A (en) | 2005-08-05 | 2006-01-23 | Method for manufacturing electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101009978A true CN101009978A (en) | 2007-08-01 |
Family
ID=38698004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710002031 Pending CN101009978A (en) | 2006-01-23 | 2007-01-18 | Method for manufacturing electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101009978A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103786271A (en) * | 2012-10-29 | 2014-05-14 | 三星钻石工业股份有限公司 | Breaking apparatus and breaking method for multi-layered fragile material substrate |
| CN104108119A (en) * | 2013-04-02 | 2014-10-22 | 三星钻石工业股份有限公司 | Breaking apparatus |
| CN104339462A (en) * | 2013-08-09 | 2015-02-11 | 三星钻石工业股份有限公司 | Method for cutting off laminated ceramic substrate |
| CN104552622A (en) * | 2013-10-25 | 2015-04-29 | 三星钻石工业股份有限公司 | Breaking apparatus |
| CN111508868A (en) * | 2019-01-31 | 2020-08-07 | 三菱电机株式会社 | Method and jig for separating semiconductor substrate |
-
2007
- 2007-01-18 CN CN 200710002031 patent/CN101009978A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103786271A (en) * | 2012-10-29 | 2014-05-14 | 三星钻石工业股份有限公司 | Breaking apparatus and breaking method for multi-layered fragile material substrate |
| CN104108119A (en) * | 2013-04-02 | 2014-10-22 | 三星钻石工业股份有限公司 | Breaking apparatus |
| CN104339462A (en) * | 2013-08-09 | 2015-02-11 | 三星钻石工业股份有限公司 | Method for cutting off laminated ceramic substrate |
| CN104552622A (en) * | 2013-10-25 | 2015-04-29 | 三星钻石工业股份有限公司 | Breaking apparatus |
| CN104552622B (en) * | 2013-10-25 | 2018-04-10 | 三星钻石工业股份有限公司 | Shearing device |
| CN111508868A (en) * | 2019-01-31 | 2020-08-07 | 三菱电机株式会社 | Method and jig for separating semiconductor substrate |
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