JPS5219067A - Breakaway separator of semiconductor wafer - Google Patents
Breakaway separator of semiconductor waferInfo
- Publication number
- JPS5219067A JPS5219067A JP9559375A JP9559375A JPS5219067A JP S5219067 A JPS5219067 A JP S5219067A JP 9559375 A JP9559375 A JP 9559375A JP 9559375 A JP9559375 A JP 9559375A JP S5219067 A JPS5219067 A JP S5219067A
- Authority
- JP
- Japan
- Prior art keywords
- breakaway
- separator
- semiconductor wafer
- wafer
- extensibility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: In order to obtain a wafer-breakaway separator which can perform the breakaway separation with the state of constantly applying the extensibility on the surface of wafer from the surroundings and its automatic production is easy.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9559375A JPS5219067A (en) | 1975-08-06 | 1975-08-06 | Breakaway separator of semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9559375A JPS5219067A (en) | 1975-08-06 | 1975-08-06 | Breakaway separator of semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5219067A true JPS5219067A (en) | 1977-01-14 |
Family
ID=14141860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9559375A Pending JPS5219067A (en) | 1975-08-06 | 1975-08-06 | Breakaway separator of semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5219067A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5681938A (en) * | 1979-10-05 | 1981-07-04 | Shinkawa Ltd | Limit detecting device of die-bonder |
CN103786271A (en) * | 2012-10-29 | 2014-05-14 | 三星钻石工业股份有限公司 | Breaking apparatus and breaking method for multi-layered fragile material substrate |
-
1975
- 1975-08-06 JP JP9559375A patent/JPS5219067A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5681938A (en) * | 1979-10-05 | 1981-07-04 | Shinkawa Ltd | Limit detecting device of die-bonder |
JPS5746211B2 (en) * | 1979-10-05 | 1982-10-01 | ||
CN103786271A (en) * | 2012-10-29 | 2014-05-14 | 三星钻石工业股份有限公司 | Breaking apparatus and breaking method for multi-layered fragile material substrate |
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