JP2011060985A - Method of manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component capable of simplifying a process. <P>SOLUTION: A collective substrate 10 wherein a resin layer 14 is formed on one principal surface 12b of a substrate 12 and division grooves 13 are formed from the other principal surface 12a side is prepared. First tools 32, 34 are arranged on the substrate 12 side and on both sides of the division groove 13x of the collective substrate 10, and a second tool 30 is arranged on the resin layer 14 side of the collective substrate 10 to face the division groove 13x, thereafter the first tools 32, 34 and the second tool 30 are relatively moved to press both sides of the division groove 13x of the substrate 12 toward the resin layer 14 by the first tools 32, 34, the resin layer 14 is pressed toward the substrate 12 along the division groove 13x by the second tool 30, thereby the substrate 12 and the resin layer 14 are bent, a crack 16 is advanced from the substrate 12 to the resin layer 14 along the division groove 13x to divide the substrate 12 and the resin layer 14, and thereby individual pieces of electronic components are formed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic component, and more particularly to a method for manufacturing an electronic component in which a resin layer is formed on a substrate.

  Conventionally, various electronic components having a resin layer formed on a substrate have been provided. As a method for manufacturing such an electronic component, a method is known in which a plurality of pieces are collectively formed on one substrate (collected substrate) and then divided into pieces of electronic components.

  For example, as shown in the cross-sectional view of FIG. 4, after the circuit components 111 and 112 are mounted on the front surface 121 of the ceramic substrate 102 in which the dividing grooves 104 are formed from the back surface 122 side, the ceramic on which the circuit components 111 and 112 are mounted. The surface of the substrate 102 is covered with a sealing resin to form the resin layer 103, and then the divided grooves 105 are formed in the resin layer 103 along the divided grooves 104 of the ceramic substrate 102. It divides | segments into the piece of the component 101 (for example, refer patent document 1).

JP 2007-129109 A

  Specifically, for example, individual pieces of the electronic component 11 are formed from the collective substrate 10 by the steps shown in the cross-sectional views of FIGS.

  That is, as shown in FIG. 3A, the division grooves 13 are formed on the lower surface 12a of the substrate 12 using a scribing device. Next, as illustrated in FIG. 3B, the dicing device 15 is used to form the division grooves 15 penetrating the resin layer 14, and the upper surface 12 b of the substrate 12 is exposed from the division grooves 15. Next, as shown in FIG. 3C, the substrate is bent using a break device, and the substrate 12 is divided along the dividing grooves 13 of the substrate 12 to form individual pieces of the electronic component 11.

  However, since the material is removed from the resin layer 14 by the width of the dicing blade 80 when the dividing grooves 15 are formed in the resin layer 14 as shown in FIG. It is necessary to form it, and the manufacturing cost increases.

  In addition, two steps, a scribing process for forming the dividing grooves 13 in the substrate 12 and a dicing process for forming the dividing grooves 15 in the resin layer 14 are required, which increases the number of processes and increases the manufacturing cost.

  In view of such circumstances, the present invention intends to provide a method of manufacturing an electronic component that can simplify the process.

  In order to solve the above problems, the present invention provides a method of manufacturing an electronic component configured as follows.

  The method of manufacturing an electronic component includes: (i) a first step of preparing an aggregate substrate in which a resin layer is formed on one main surface of a substrate and a dividing groove is formed from the other main surface side of the substrate; ) A first jig is disposed on the substrate side of the collective substrate and on both sides of the dividing groove of the substrate, and the second jig is opposed to the dividing groove of the substrate on the resin layer side of the collective substrate. After the jig is arranged, the first jig and the second jig are moved relative to each other in the thickness direction of the substrate and the resin layer so as to approach each other, and the first jig is moved. By pressing both sides of the dividing groove of the substrate to the resin layer side with a jig, and pressing the resin layer to the substrate side along the dividing groove of the substrate with the second jig The substrate and the resin layer are bent and the substrate is bent along the dividing groove of the substrate. By dividing the substrate and the resin layer by development of cracks in the resin layer, to form one or more pieces of electronic components, and a second step.

  According to the above method, the dividing groove may be formed only on the substrate, and the step of forming the dividing groove in the resin layer is unnecessary.

  Further, since the resin layer of the collective substrate can be divided by substantially extending lines of the dividing grooves, it is possible to reduce the occurrence of burrs and distortions in the resin layer compared to the case where the dividing grooves are formed in the resin layer.

  Preferably, the dividing groove extends from the other main surface of the substrate to a position before the one main surface of the substrate.

  In this case, the dividing groove may be formed halfway in the thickness direction of the substrate. Therefore, compared with the case where the dividing groove is formed so as to reach one main surface of the substrate, the occurrence of defects during the process of forming the dividing groove on the substrate can be reduced, and the process can be simplified.

  Preferably, before the second step, a stretchable sheet member is bonded to the resin layer so as to cover the resin layer. In the second step, the second jig is disposed on the opposite side of the collective substrate with respect to the sheet member, and presses the resin layer via the sheet member.

  In this case, the collective substrate is held by the sheet member even if the substrate and the resin layer are divided, so that it can be divided efficiently, and the pieces of the divided electronic components are kept in alignment by the sheet member, The position can be grasped. Further, the sheet member can prevent scratches on the surface of the resin layer.

  Preferably, before the second step, a holder including a frame-shaped frame member and a stretchable sheet member having an outer periphery fixed to the frame member is prepared, and the frame member of the holder The main surface of the resin layer opposite to the substrate is bonded to the sheet member. In the second step, the second jig is disposed on the opposite side of the collective substrate with respect to the sheet member of the holder, and presses the resin layer via the sheet member.

  In this case, since the collective substrate can be flowed to the process while being held by the holder, it is easy to handle the collective substrate, and damage to the collective substrate during the process can be prevented.

  In addition, since the aggregate substrate is held by the sheet member even if the substrate and the resin layer are divided, it can be divided efficiently, and the divided pieces of the electronic components are kept aligned by the sheet member, It becomes possible to grasp. Furthermore, the sheet member can prevent scratches on the surface of the resin layer.

  According to the present invention, the process can be simplified.

It is the (a) principal part top view of the break apparatus used for manufacture of an electronic component, (b) principal part sectional drawing. (Example) It is a principal part expanded sectional view of a break device. (Example) It is sectional drawing which shows the manufacturing process of an electronic component. (Comparative example) It is sectional drawing which shows the manufacturing process of an electronic component. (Conventional example)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2.

  The method of manufacturing an electronic component generally includes a first step of preparing a collective substrate and a second step of dividing the collective substrate to form an electronic component.

  In the second step, the aggregate substrate 10 is divided using the break device 2 shown in FIGS. 1 and 2. FIG. 1A is a plan view of the main part of the breaking device 2. FIG.1 (b) is principal part sectional drawing cut | disconnected along line AA of Fig.1 (a). FIG. 2 is an enlarged cross-sectional view of a main part of the breaking device 2.

  As shown in FIGS. 1 and 2, the breaking device 2 divides the aggregate substrate 10 held by the holder 20 along the dividing grooves 13.

  As shown in FIG. 1, the aggregate substrate 10 has a resin layer 14 formed on a substrate 12 and has a rectangular shape. As shown in FIG. 2, the division grooves 13 are formed from the lower surface 12 a side of the substrate 12 opposite to the resin layer 14. The dividing grooves 13 are formed in a lattice shape along dividing lines (not shown) that divide the aggregate substrate 10 into a lattice shape.

  The dividing groove 13 can be formed so as to reach the upper surface 12b of the substrate 12 on the resin layer 14 side, that is, to penetrate the substrate 12, but extends to the front of the upper surface 12b of the substrate 12 and is divided. If the tip 13 s of the groove 13 does not reach the upper surface 12 b of the substrate 12, defects such as cracking or chipping of the substrate during the process of forming the divided groove 13 in the substrate 12 and between the divided groove forming process and the collective substrate dividing process. Since generation | occurrence | production can be reduced and a process becomes simple, it is preferable.

  As shown in FIG. 1, the holder 20 has an outer periphery 22 s of a sheet member 22 having elasticity that is fixed between two frame-shaped frame members 21. FIG. 1A illustrates a state in which the upper frame member 21 is removed. The collective substrate 10 is disposed on the inner side of the inner peripheral surface 21 s of the frame member 21, and is opposite to the substrate 12 of the resin layer 14 of the collective substrate 10 on the lower surface 22 b on the frame member 21 side of the adhesive sheet member 22. The side upper surface 14a is bonded.

  When the thickness of the frame member 21 is larger than the thickness of the collective substrate 10 and the holder 20 is placed on a flat surface, and the lower surface 21b of the frame member 21 is in contact with the flat surface, the collective substrate held inside the retainer 20 It is preferable that 10 is held in a floating state on a plane.

  By flowing the collective substrate 10 to the process while being held by the holder 20, the collective substrate 10 can be easily handled, and the collective substrate 10 can be prevented from being damaged during the process.

  As shown in FIG. 1B, the holder 20 that holds the collective substrate 10 is fixed to the attachment portion 4 of the breaking device 2. In the breaking device 2, a breaking blade 30 that is a second jig is disposed above the holder 20 fixed to the mounting portion 4. A pair of cradles 32 and 34 as a first jig and a camera 36 are disposed below the holder 20 fixed to the mounting portion 4.

  A break mechanism portion 38 is formed by the break blade 30 surrounded by a chain line, the cradle 32, 34, and the camera 36. The break mechanism portion 38 moves integrally with the collective substrate 10 held by the holder 20 fixed to the attachment portion 4 as indicated by an arrow 39. That is, although not shown, it includes an X-axis and Y-axis rectilinear drive unit that moves the break mechanism unit 38 in the horizontal direction, and a rotation drive unit around the θ-axis that rotates the break mechanism unit 38 in a horizontal plane. Yes.

  Since the break mechanism unit 38 and the collective substrate 10 need only be relatively moved to change the dividing position, the break mechanism unit 38 may be fixed even if the break mechanism unit 38 is fixed and the attachment unit 4 is moved. Both 38 and the attachment portion 4 may move.

  The break blade 30 is moved up and down as indicated by an arrow 31 so as to come into contact with and separate from the sheet member 22 of the holder 20 fixed to the mounting portion 4.

  The upper surfaces 32 a and 34 a of the cradle 32 and 34 are opposed to and in contact with the lower surface 12 a of the substrate 12 of the collective substrate 10.

  Note that when the break blade 30 is lowered in the dividing step of the collective substrate 10, the upper surfaces 32a, 34a of the cradles 32, 34 and the lower surface 12a of the substrate 12 of the collective substrate 10 need to be in contact with each other. When in position, a gap may be formed between the upper surfaces 32 a and 34 a of the cradle 32 and 34 and the lower surface 12 a of the substrate 12 of the collective substrate 10.

  The positions of the cradles 32 and 34 can be adjusted as indicated by arrows 33 and 35, and the width between the cradles 32 and 34 can be set according to the pitch of the dividing groove 13.

  The camera 36 photographs the lower surface 12a of the substrate 12 from the gap 40 between the cradles 32 and 34, and detects the dividing grooves 13. The break device controls the position of the break mechanism unit 38 so that the dividing groove 13 detected by the camera 36 is arranged in the center between the cradles 32 and 34.

  A second process of dividing the collective substrate using the break device 2 will be described.

  As shown in FIG. 2, cradles 32 and 34 are arranged in parallel with the split groove 13 x on both sides of the split groove 13 x at the split position, and the upper surfaces 32 a and 34 a of the cradle 32 and 34 are in contact with the lower surface 12 a of the substrate 12. In addition, the break blade 30 is disposed along the dividing groove 13x at the dividing position immediately above the dividing groove 13x at the dividing position.

  At this time, the upper surfaces 32a, 34a of the cradle 32, 34 are arranged so as to enter inside the split grooves 13y, 13z adjacent to the split groove 13x at the split position, and the split groove 13x at the split position and the base 32, The distances S1 and S2 between the upper surfaces 32a and 34a of 34 are smaller than the distances L1 and L2 between the dividing groove 13x at the dividing position and the dividing grooves 13y and 13z adjacent to the dividing groove 13x at the dividing position. To. For example, S1 = 0.9 × L1 and S2 = 0.9 × L2.

  Further, the upper surfaces 32a, 34a of the receiving bases 32, 34 are made to be equal to the dividing grooves 13x at the dividing position so that the distances S1, S2 between the dividing groove 13x at the dividing position and the upper surfaces 32a, 34a of the receiving bases 32, 34 are equal. Separate evenly from

  Next, by lowering the break blade 30, the tip 30 t of the break blade 30 moves on the extension line of the dividing groove 13 x so that the tip 30 t of the break blade 30 pushes down the upper surface 22 a of the sheet member 22 of the holder 20. .

  By moving the break blade 30 and the pedestals 32 and 34 relative to each other in the thickness direction of the substrate 12 and the resin layer 14 so as to approach each other, the assembly substrate 10 has a sheet above the dividing groove 13x at the dividing position. It is pushed down by the tip 13t of the break blade 30 through the member 22, and the two sides on both sides of the dividing groove 13x at the dividing position are pushed up by the reaction force from the receiving bases 32 and 34. Since the substrate 12 and the resin layer 14 of the collective substrate 10 are bent by three-point bending, from the tip 13t of the dividing groove 13x at the dividing position along the dividing groove 13x at the dividing position, inside the substrate 12 and the resin layer 14 A crack 16 develops from the substrate 12 to the resin layer 14. As a result, the substrate 12 and the resin layer 14 are divided along the dividing groove 13x at the dividing position.

  The collective substrate 10 is bonded to the sheet member 22 and is held by the sheet member 22 after being divided. Therefore, the collective substrate 10 can be efficiently divided along each divided groove 13, and the divided pieces of the electronic components are kept in alignment by the sheet member 22, and the position of the electronic components can be grasped. Further, the sheet member 22 can prevent the upper surface 14a of the resin layer 14 from being scratched.

  Next, after raising the break blade 30, the entire break mechanism 38 is moved to another adjacent division groove 13 (for example, the division groove 13 y adjacent to the divided division groove 13), and along the other division groove 13. By repeating the same operation, individual pieces of electronic components are formed from the collective substrate 10.

  Next, a specific example will be described.

  In the collective substrate, circuit elements for a plurality of electronic components are integrally formed vertically and horizontally inside a ceramic multilayer substrate. A dividing groove (scribe groove) is formed along the boundary line of the electronic component from the back side of the ceramic multilayer substrate using a scribing device. A mounting component is mounted on the upper surface of the ceramic multilayer substrate, and a resin layer is formed on the upper surface of the ceramic multilayer substrate so that the mounting component is molded with resin.

  A wafer ring is used for the frame member of the holder. A dicing tape is used for the sheet member of the holder, and the collective substrate is fixed by the adhesive force of the dicing tape.

  The break device has a mechanism unit that can vary the width between the cradles from 0 to 50 mm in accordance with the size of the electronic components divided from the collective substrate. The break blade is moved up and down by a servo motor.

  Lower the break blade, set the height at which the cutting edge of the break blade is in contact with the workpiece (specifically, the upper surface of the sheet member of the holder) as the zero point, and set the amount of indentation from the zero point necessary for the break processing, Set according to the workpiece.

  The break device detects the position of the scribe groove at the break position with a camera and performs break processing while correcting the position of the break mechanism portion with respect to the scribe groove.

  That is, after adjusting the position of the break mechanism so that the position of the scribing groove detected by the camera and the cutting edge of the break blade coincide with each other, the break blade is lowered, and the cradle and break blade at two places, A three-point bending load is applied to the collective substrate, and the collective substrate is divided along the scribe grooves.

  The break blade is then raised to remove the 3-point bending load.

  Thereafter, the break mechanism is moved to the next scribe groove, and the same operation is repeated to divide the collective substrate along each scribe groove to form individual pieces of electronic components.

  When dividing the aggregate substrate, a load is equally applied to the left and right sides of the scribe groove on the aggregate substrate, and a crack formed from the tip of the scribe groove extends at right angles to the lower surface of the ceramic multilayer substrate. From the scribe groove with good linearity, a crack with a high perpendicularity to the lower surface extends in the ceramic multilayer substrate and divides the ceramic multilayer substrate.

  By extending the cracks in the ceramic multilayer substrate, cracks are also formed in the resin layer, and the resin layer is divided. Since the crack in the ceramic multilayer substrate has a high perpendicularity to the lower surface, the crack distortion in the resin layer is small.

  Thus, high quality division can be achieved by combining scribing and breaking.

  For example, regarding an assembly board having a ceramic substrate thickness of 0.3 mm and a resin layer thickness of 0.25 mm, and an assembly board having a ceramic substrate thickness of 0.1 mm and a resin layer thickness of 0.13 mm, It could be divided into high quality pieces.

  In the comparative example shown in FIG. 3, each of the dividing steps for resin and ceramics is required, whereas in the example, the dividing steps for resin and ceramics can be combined, and divided by material. No process is required. Therefore, it is possible to shorten the machining process and the work time.

  Moreover, since the resin layer can be divided by substantially extending lines of the scribe grooves, it is possible to reduce the occurrence of burrs and distortions in the resin layer as compared with the comparative example in which the divided grooves are formed in the resin layer.

  Further, since the assembled substrate is maintained in the aligned state by the sheet member even after the division, the work does not need to be realigned, and the process is not complicated.

  <Summary> When the electronic component is manufactured as described above, the dividing groove may be formed only on the substrate, and the process of forming the dividing groove in the resin layer becomes unnecessary, and the process can be simplified.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, the aggregate substrate may be a multilayer substrate or a single-layer substrate. Moreover, the board | substrate of materials other than a ceramic, for example, a resin substrate, may be sufficient.

10 Collective substrate 12 Substrate 12a Lower surface (the other main surface)
12b Upper surface (one main surface)
13, 13x, 13y, 13z Dividing groove 14 Resin layer 16 Crack 20 Holder 21 Frame member 22 Sheet member

Claims (4)

A first step of preparing a collective substrate in which a resin layer is formed on one main surface of the substrate and a dividing groove is formed from the other main surface side of the substrate;
A first jig is disposed on the substrate side of the collective substrate and on both sides of the dividing groove of the substrate, and a second jig is disposed on the resin layer side of the collective substrate so as to face the dividing groove of the substrate. After the jig is arranged, the first jig and the second jig are moved relative to each other in the thickness direction of the substrate and the resin layer so as to approach each other, thereby the first jig. By pressing the both sides of the dividing groove of the substrate to the resin layer side by a tool, and pressing the resin layer to the substrate side along the dividing groove of the substrate by the second jig One or more pieces of an electronic component are formed by bending the substrate and the resin layer, dividing cracks from the substrate to the resin layer along the dividing grooves of the substrate, and dividing the substrate and the resin layer. A second step of forming
A method for producing an electronic component, comprising:   2. The method of manufacturing an electronic component according to claim 1, wherein the dividing groove extends from the other main surface of the substrate to a position before the one main surface of the substrate. Before the second step, a stretchable sheet member is adhered to the resin layer so as to cover the resin layer,
The said 2nd jig | tool is arrange | positioned with respect to the said sheet | seat member on the opposite side to the said collective board in the said 2nd process, The said resin layer is pressed via the said sheet | seat member, A method for manufacturing an electronic component according to 1 or 2. Before the second step, a holder having a frame-shaped frame member and a stretchable sheet member having an outer periphery fixed to the frame member is prepared, and inside the frame member of the holder Adhering the main surface of the resin layer opposite to the substrate to the sheet member,
In the second step, the second jig is disposed on the opposite side of the collective substrate with respect to the sheet member of the holder, and presses the resin layer via the sheet member. The manufacturing method of the electronic component of Claim 1 or 2.

Images