TWI779167B - Processing method of plate - Google Patents

Processing method of plate Download PDF

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Publication number
TWI779167B
TWI779167B TW108105466A TW108105466A TWI779167B TW I779167 B TWI779167 B TW I779167B TW 108105466 A TW108105466 A TW 108105466A TW 108105466 A TW108105466 A TW 108105466A TW I779167 B TWI779167 B TW I779167B
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plate
remaining
cutting
area
cut
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TW108105466A
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Chinese (zh)
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TW201936348A (en
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大前卷子
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日商迪思科股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D11/00Combinations of several similar cutting apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/143Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
    • B26D1/15Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with vertical cutting member
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/157Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
    • B26D1/18Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
    • B26D1/185Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage for thin material, e.g. for sheets, strips or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/0006Means for guiding the cutter
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work
    • B26D7/015Means for holding or positioning work for sheet material or piles of sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0004Cutting, tearing or severing, e.g. bursting; Cutter details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D2007/0012Details, accessories or auxiliary or special operations not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D11/00Combinations of several similar cutting apparatus
    • B26D2011/005Combinations of several similar cutting apparatus in combination with different kind of cutters, e.g. two serial slitters in combination with a transversal cutter

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Laser Beam Processing (AREA)

Abstract

[課題]進行成即使板狀物為包含柔軟層的複合材,也可以防止在切割加工中的一個個的條狀片的傾倒。 [解決手段]本發明是從具有製品區域之剩餘尺寸板狀物形成成為條狀片的工件的加工方法。將在製品區域的外周具有剩餘區域之剩餘尺寸板狀物貼附於保持構件。之後,以切割刀片從剩餘尺寸板狀物的上方於一側的剩餘區域切入到保持構件的中途,並沿著第1方向的分割預定線來切割製品區域。並且,在另一側的剩餘區域中讓切割刀片上升,藉此在一側及另一側的剩餘區域中殘存非切割部並且沿著第1方向的分割預定線來切割製品區域。之後,將垂直於第1方向的第2方向的剩餘區域切割並去除,而分割成一個個的成為條狀片之工件。[Problem] Even if the plate-shaped object is a composite material including a soft layer, it is possible to prevent individual strip-shaped pieces from falling during the cutting process. [Solution] The present invention is a processing method for forming a strip-shaped workpiece from a plate-shaped object having a product region with an excess size. A remaining size plate having a remaining area on the outer periphery of the WIP area is attached to the holding member. Afterwards, a cutting blade is used to cut into the halfway of the holding member from the remaining area above and on one side of the plate with the remaining size, and cut the product area along the planned division line in the first direction. Then, by raising the cutting blade in the remaining area on the other side, the non-cutting portion remains in the remaining area on the one side and the other side, and the product area is cut along the planned dividing line in the first direction. Afterwards, the remaining area in the second direction perpendicular to the first direction is cut and removed, and divided into strip-shaped pieces one by one.

Description

板狀物的加工方法Processing method of plate

發明領域 本發明是有關於一種將板狀物分割成複數個條狀片之板狀物的加工方法。field of invention The invention relates to a processing method for dividing a plate into a plurality of strips.

發明背景 有時會藉由切割刀片等加工機構切割由異材料,例如金屬板及樹脂板的複合材所形成的板狀物。所述之切割會如例如專利文獻1中所揭示地以熱熔型的蠟來使板狀物的背面側貼附於支撐構件而成為強固地保持的狀態。 先前技術文獻 專利文獻Background of the invention Sometimes, a plate-shaped object formed of a composite material of a different material, such as a metal plate and a resin plate, is cut by a processing mechanism such as a cutting blade. In such cutting, as disclosed in, for example, Patent Document 1, the back side of the plate-like object is attached to the supporting member with a hot-melt type wax, and the state is firmly held. prior art literature patent documents

專利文獻1:日本專利特開2013-129024號公報Patent Document 1: Japanese Patent Laid-Open No. 2013-129024

發明概要 發明欲解決之課題 在複合材中,是例如由相對於薄的金屬板積層有相對較柔軟且較厚的樹脂板的複合材成為切割對象。由於在切割此種複合材時,即使將背面以蠟強固地固定,複合材整體仍然是剛性變低,因此會有下述問題:在切割加工中於單片化之工件上產生傾倒。Summary of the invention The problem to be solved by the invention Among the composite materials, for example, a composite material in which a relatively soft and thick resin plate is laminated with respect to a thin metal plate is used as an object of cutting. When such a composite material is cut, even if the backside is firmly fixed with wax, the rigidity of the composite material as a whole is still low, so there is a problem that it falls over the singulated workpiece during the cutting process.

本發明是有鑒於所述的問題點而作成的發明,其目的在於提供一種即使板狀物為包含柔軟層的複合材,也可以防止在切割加工中的一個個的條狀片的傾倒的板狀物的加工方法。 用以解決課題之手段The present invention was made in view of the above-mentioned problems, and an object of the present invention is to provide a board that can prevent individual strip-shaped pieces from falling during cutting even if the board-shaped object is a composite material including a soft layer. The processing method of the shape. means to solve problems

本發明之板狀物的加工方法,是具有製品區域之板狀物的加工方法,其特徵在於是由下述步驟所構成: 貼附步驟,將在製品區域的外周具有剩餘區域的剩餘尺寸板狀物貼附於保持構件; 製品區域切割步驟,在實施貼附步驟後,以加工機構從剩餘尺寸板狀物的上方於一側的剩餘區域切入到保持構件的中途,並沿著第1方向的分割預定線切割製品區域,且在另一側的剩餘區域中讓加工機構上升,藉此在一側及另一側的剩餘區域中殘存非切割部並且沿著第1方向的分割預定線來切割製品區域;及 分割步驟,在實施製品區域切割步驟後,以加工機構將垂直於第1方向的第2方向的剩餘區域切割並去除而分割成一個個的條狀片。The processing method of the plate-shaped object of the present invention is a processing method of a plate-shaped object having a product area, and is characterized in that it is composed of the following steps: an attaching step, attaching a plate of remaining size having a remaining area on the outer periphery of the work-in-progress area to the holding member; In the step of cutting the product area, after the attaching step is carried out, the processing mechanism is used to cut into the middle of the holding member from the remaining area on one side above the remaining size of the plate, and cut the product area along the predetermined dividing line in the first direction, And raising the processing mechanism in the remaining area on the other side, thereby leaving the non-cutting part in the remaining area on one side and the other side and cutting the product area along the planned dividing line in the first direction; and In the dividing step, after the product area cutting step is performed, the remaining area in the second direction perpendicular to the first direction is cut and removed by a processing mechanism to be divided into individual strips.

根據此方法,由於在沿著分割預定線的切割中,使非切割部殘存於位於分割預定線的延伸方向兩側的剩餘區域,因此變得可透過剩餘區域來連結各條狀片。從而,即使板狀物為包含柔軟層之複合材且剛性變低,仍然可以防止在製品區域切割步驟中的條狀片的傾倒。藉此,在藉由去除剩餘區域的切割來分割成一個個的條狀片時,可以預防條狀片的端面成為梯形或平行四邊形之情形而成為精度良好的方形,且可以謀求加工品質的安定化。 發明效果According to this method, since non-cut portions remain in the remaining regions located on both sides of the extending direction of the planned dividing line during cutting along the planned dividing line, it becomes possible to connect the strip-shaped sheets through the remaining regions. Thus, even if the board is a composite material including a soft layer and the rigidity becomes low, it is possible to prevent the strip-like sheet from falling down in the product region cutting step. This prevents the end faces of the strips from becoming trapezoidal or parallelogram-shaped when the strips are divided into individual strips by cutting to remove the excess area, and becomes a square with good precision, and can achieve stable processing quality. change. Invention effect

根據本發明,即使是板狀物為包含柔軟層之複合材,也可以防止在切割加工中的一個個的條狀片的傾倒。According to the present invention, even if the plate-shaped object is a composite material including a soft layer, it is possible to prevent individual strip-shaped pieces from falling during cutting.

用以實施發明之形態 以下,參照附圖,針對實施形態之板狀物的加工方法,參照圖1至圖7來說明。圖1是貼附步驟的說明圖,圖2至圖5是製品區域切割步驟的說明圖,圖6及圖7是分割步驟的說明圖。再者,上述的各圖所示的步驟僅為一例,並非限定於此構成。form for carrying out the invention Hereinafter, with reference to the accompanying drawings, the processing method of the plate-shaped object according to the embodiment will be described with reference to FIGS. 1 to 7 . FIG. 1 is an explanatory view of the attaching step, FIGS. 2 to 5 are explanatory views of the product region cutting step, and FIGS. 6 and 7 are explanatory views of the dividing step. In addition, the procedure shown in each figure mentioned above is an example only, and is not limited to this structure.

首先,如圖1所示,實施貼附步驟。在貼附步驟中,首先是準備剩餘尺寸板狀物(板狀物)10。剩餘尺寸板狀物10是預備比其平面尺寸更大的尺寸的基板(圖未示),並藉由將所述之基板切成矩形而形成。剩餘尺寸板狀物10在本實施形態中,是成為在由金屬板所形成之金屬層10a的厚度方向兩側積層有由樹脂板所形成之樹脂層10b的複合材。雖然並非特別限定,但樹脂層10b是相對於金屬層10a而形成得相對較厚,並且,由相對較柔軟的材質所形成。First, as shown in Fig. 1, the attaching step is carried out. In the attaching step, first, the remaining size plate (plate) 10 is prepared. The remaining size plate 10 is prepared by preparing a substrate (not shown) of a size larger than its planar size, and is formed by cutting said substrate into a rectangle. In the present embodiment, the plate-shaped object 10 of the remaining size is a composite material in which the resin layer 10b formed of a resin plate is laminated on both sides in the thickness direction of the metal layer 10a formed of a metal plate. Although not particularly limited, the resin layer 10b is formed relatively thicker than the metal layer 10a, and is formed of a relatively soft material.

剩餘尺寸板狀物10具有製品區域12、及位於製品區域12的外周的剩餘區域14。又,剩餘尺寸板狀物10具有按每個規定間隔而形成複數條的分割預定線16,在圖1中,是為了方便說明而將分割預定線16以虛線來圖示。在此,在剩餘尺寸板狀物10中,是將在上表面視角下分割預定線16的延伸方向設為第1方向,將垂直(正交)於第1方向的方向設為第2方向。在剩餘尺寸板狀物10中,將沿著第1方向兩端之規定寬度區域(以網點圖示之區域)設為剩餘區域14,並將各剩餘區域14之間的區域設為製品區域12。The remaining size plate 10 has a product region 12 and a remaining region 14 located on the outer periphery of the product region 12 . In addition, the remaining size plate 10 has a plurality of dividing lines 16 formed at predetermined intervals. In FIG. 1 , the dividing lines 16 are shown as dotted lines for convenience of description. Here, in the remaining size plate 10, the extending direction of the planned dividing line 16 in the view of the upper surface is defined as the first direction, and the direction perpendicular (orthogonal) to the first direction is defined as the second direction. In the remaining size plate 10, the predetermined width region (area shown in halftone dots) along both ends of the first direction is defined as the remaining region 14, and the region between the remaining regions 14 is defined as the product region 12. .

再者,在圖1以後的圖式中所顯示之網點是為方便起見而繪製成可以區別並目視辨識製品區域12與剩餘區域14。在本實施形態中,雖然是將製品區域12與剩餘區域14的材質或構造設為相同,但並非限定於此,亦可將其設為相異的構成。Furthermore, the dots shown in the drawings after FIG. 1 are drawn for convenience so that the area 12 and the remaining area 14 of the product can be distinguished and visually recognized. In this embodiment, although the material and structure of the product area|region 12 and the remainder area|region 14 were made the same, it is not limited to this, You may make it a different structure.

在貼附步驟中,是透過熱熔型的蠟18將所準備的剩餘尺寸板狀物10貼附於由基材所構成之板狀的保持構件19,而成為將剩餘尺寸板狀物10保持於保持構件19的狀態。作為保持構件19,只要是可將剩餘尺寸板狀物10以平坦狀態來保持的構件即可,可使用例如碳板、矽板、玻璃板、金屬板。又,取代蠟18,只要是可藉由外部刺激而使黏著性降低之物即可,亦可使用例如紫外線硬化性樹脂、分散有發泡材的熱剝離性膠帶。In the attaching step, the prepared plate-shaped object 10 of the remaining size is attached to the plate-shaped holding member 19 made of the base material through the hot-melt wax 18, so as to hold the plate-shaped object 10 of the remaining size In the state of holding member 19. As the holding member 19 , any member can be used as long as it can hold the plate-shaped object 10 with an excess size in a flat state, and for example, a carbon plate, a silicon plate, a glass plate, or a metal plate can be used. In addition, instead of the wax 18, as long as the adhesiveness can be reduced by external stimulation, it is also possible to use, for example, an ultraviolet curable resin or a thermally peelable adhesive tape in which a foam material is dispersed.

於實施貼附步驟後,如圖2所示,實施以切割刀片(加工機構)20切入剩餘尺寸板狀物10之製品區域12的製品區域切割步驟。切割刀片20是設置於可旋轉的主軸22的前端。在製品區域切割步驟中,是隔著保持構件19將剩餘尺寸板狀物10吸引保持在工作夾台(圖未示)上。工作夾台是藉由進給機構而朝X方向移動,並且可旋轉地設置。After the attaching step is carried out, as shown in FIG. 2 , the product region cutting step is carried out in which a cutting blade (processing mechanism) 20 is used to cut into the product region 12 of the plate-like object 10 with the remaining size. The cutting blade 20 is disposed on the front end of the rotatable main shaft 22 . In the step of cutting the product area, the remaining size plate 10 is sucked and held on the work clamp (not shown) via the holding member 19 . The work clamping table is moved in the X direction by the feed mechanism, and is rotatably arranged.

在吸引保持剩餘尺寸板狀物10後,對剩餘尺寸板狀物10進行對位。此對位是將剩餘尺寸板狀物10定位成使成為分割預定線16之延伸方向的第1方向(參照圖1)成為切割進給方向(X方向)。此時,在本實施形態中,為在剩餘尺寸板狀物10上將剩餘區域14配置於X方向兩側。After sucking and holding the plate 10 of the remaining size, the plate 10 of the remaining size is aligned. This alignment is to position the plate-shaped object 10 with the remaining size so that the first direction (refer to FIG. 1 ) which is the extending direction of the planned dividing line 16 becomes the cutting feeding direction (X direction). At this time, in the present embodiment, the remaining regions 14 are arranged on both sides in the X direction on the plate-shaped object 10 having an remaining size.

如圖3之兩點鏈線所示,將切割刀片20定位於-X方向側(一側)之剩餘區域14的正上方且分割預定線16的正上方。接著,從剩餘尺寸板狀物10的上方將高速旋轉的切割刀片20的下端下降至保持構件19的厚度方向中途,而切入剩餘尺寸板狀物10的厚度方向全部。此時,在切割進給的開始側(-X方向側)上,是藉由切割刀片20從剩餘區域14(剩餘尺寸板狀物10)的外緣的內側切入,而在切入的位置的-X方向側上殘存未形成切割溝26的非切割部25。As shown by the two-dot chain line in FIG. 3 , the cutting blade 20 is positioned directly above the remaining region 14 on the −X direction side (one side) and directly above the dividing line 16 . Next, the lower end of the cutting blade 20 rotating at high speed is lowered from above the plate-shaped object 10 of the remaining size to halfway in the thickness direction of the holding member 19 to cut into the entire thickness direction of the plate-shaped object 10 of the remaining size. At this time, on the starting side (-X direction side) of the cutting feed, the cutting blade 20 cuts in from the inner side of the outer edge of the remaining area 14 (the remaining size plate 10), and at the cutting position - The non-cut portion 25 in which the cut groove 26 is not formed remains on the X direction side.

在維持切割刀片20切入的高度位置的狀態下,藉由將剩餘尺寸板狀物10相對於切割刀片20來朝X方向切割進給,以沿著製品區域12的分割預定線16切割並形成切割溝26。在切割溝26的結束側(+X方向側)上,如圖4所示,在剩餘尺寸板狀物10的靠近外緣這一側,也就是+X方向側(另一側)的剩餘區域14內使切割刀片20上升而從剩餘尺寸板狀物10離開。如此進行,以形成切割溝26,並且在剩餘區域14中於切割溝26的結束側(+X方向側)殘存未形成切割溝26的非切割部27。In the state of maintaining the height position where the cutting blade 20 cuts in, by cutting and feeding the remaining size plate 10 in the X direction relative to the cutting blade 20, it is cut along the planned dividing line 16 of the product area 12 and forms a cut. Ditch 26. On the end side (+X direction side) of the cutting groove 26, as shown in Figure 4, on the side near the outer edge of the remaining size plate 10, that is, the remaining area on the +X direction side (the other side) 14, the cutting blade 20 is raised to leave the remaining size plate 10. In this way, the dicing groove 26 is formed, and the non-cutting portion 27 where the dicing groove 26 is not formed remains in the remaining region 14 on the end side (+X direction side) of the dicing groove 26 .

當形成1條切割溝26時,會對應於分割預定線16的間隔來將切割刀片20朝分度方向(+Y方向)進給,而將切割刀片20對位至相鄰之分割預定線16。依序重複此切割進給與分度進給,以在剩餘尺寸板狀物10上依序切割形成複數條切割溝26。製品區域切割步驟完成後,是如圖5所示,藉由X方向兩側的剩餘區域14連結後述之成為條狀片的工件W而形成為一體。When one cutting groove 26 is formed, the cutting blade 20 will be fed in the indexing direction (+Y direction) corresponding to the interval of the planned dividing line 16, and the cutting blade 20 will be aligned to the adjacent planned dividing line 16 . The cutting feeding and indexing feeding are repeated in sequence to sequentially cut and form a plurality of cutting grooves 26 on the plate 10 of remaining size. After the product region cutting step is completed, as shown in FIG. 5 , the remaining regions 14 on both sides in the X direction are connected to the workpiece W which will be described later as a strip sheet to form an integral body.

於實施製品區域切割步驟後,如圖6所示,實施分割步驟。在分割步驟中,是將剩餘尺寸板狀物10定位成使製品區域12及剩餘區域14的交界位置30、31的延伸方向(第2方向)成為切割進給方向(X方向)。接著,於將切割刀片20定位到比剩餘尺寸板狀物10的-X方向側的外緣更外側後,將切割刀片20降下,將切割刀片20定位在可將保持構件19以規定深度切入的高度位置。在此定位後,將剩餘尺寸板狀物10相對於高速旋轉的切割刀片20朝X方向切割進給,以在一邊的交界位置30上切斷而將剩餘尺寸板狀物10在Y方向上分割為二。After the product area cutting step is carried out, as shown in FIG. 6 , the segmentation step is carried out. In the dividing step, the remaining size plate 10 is positioned so that the extending direction (second direction) of the boundary positions 30, 31 between the product region 12 and the remaining region 14 becomes the cutting feeding direction (X direction). Next, after the cutting blade 20 is positioned outside the outer edge of the -X direction side of the remaining size plate 10, the cutting blade 20 is lowered, and the cutting blade 20 is positioned so that the holding member 19 can be cut into a predetermined depth. height position. After this positioning, the remaining size plate 10 is cut and fed in the X direction relative to the cutting blade 20 rotating at high speed, so as to cut off at the junction position 30 on one side and divide the remaining size plate 10 in the Y direction for two.

之後,對應於2處的交界位置30、31的間隔來將切割刀片20朝分度進給方向(+Y方向)進給,而將切割刀片20對位至未切割的交界位置31。並且,與上述同樣地進行而在未切割的交界位置31上切斷,而分割剩餘尺寸板狀物10。藉此,可從製品區域12去除剩餘區域14,並如圖7所示,分割成一個個的成為條狀片的工件W。Thereafter, the cutting blade 20 is fed in the index feeding direction (+Y direction) corresponding to the interval between the two boundary positions 30 and 31 , and the cutting blade 20 is aligned to the non-cut boundary position 31 . Then, in the same manner as above, the uncut boundary position 31 is cut to divide the plate-shaped object 10 with an excess size. Thereby, the remaining area 14 can be removed from the product area 12, and as shown in FIG. 7, it can be divided into each work W which becomes a strip-shaped piece.

另外,在以往的加工方法中,在板狀物的分割預定線的切割中,是進行成在未形成上述之剩餘區域的情形下以切割刀片從板狀物之-X方向的外緣的外側切入,並從板狀物之+X方向的外緣拔出來切割。因此,如圖8所示,當板狀物100為複合材,且相對於中間的金屬層100a,厚度方向兩側之樹脂層100b較柔軟而板狀物100整體剛性較低時,會導致在切割加工中成為條狀片的工件W0傾倒或傾斜。其結果,有下述問題:如圖8中所放大顯示地,從第1方向側觀看,工件W0未成為長方形而是成為梯形、或平行四邊形,因而降低加工精度。In addition, in the conventional processing method, in the cutting of the planned division line of the plate-shaped object, it is carried out in such a way that the cutting blade is cut from the outer edge of the -X direction of the plate-shaped object from the outer side of the -X direction when the above-mentioned remaining area is not formed. Cut in and pull out from the outer edge of the plate in the +X direction. Therefore, as shown in FIG. 8, when the plate-like object 100 is a composite material, and compared with the middle metal layer 100a, the resin layers 100b on both sides in the thickness direction are softer and the overall rigidity of the plate-like object 100 is lower, resulting in The workpiece W0 that becomes a strip during the cutting process falls or tilts. As a result, there is a problem that the workpiece W0 is not a rectangle but a trapezoid or a parallelogram when viewed from the first direction side as enlargedly shown in FIG. 8 , thereby reducing machining accuracy.

這一點,在本實施形態之加工方法中,由於形成剩餘區域14並使非切割部25、27殘存於切割溝26的兩端側,因此可限制下述情形:於製品區域切割步驟的實施中相鄰的切割溝26之間的成為工件W的部分傾倒或傾斜。藉此,即使以柔軟的樹脂層10b等為起因而使剩餘尺寸板狀物10的剛性變低,仍然可以在分割步驟中去除剩餘區域14後,將一個個的成為條狀片之工件W的第1方向中的兩側的端面精度良好地形成長方形狀。其結果,即使是在將剩餘尺寸板狀物10形成為複合材的情況下,也可以良好地保持切出之工件W的加工精度。In this regard, in the processing method of this embodiment, since the remaining region 14 is formed and the non-cutting portions 25, 27 remain on both ends of the cutting groove 26, the following situations can be limited: During the implementation of the product region cutting step The portion to be the workpiece W between adjacent dicing grooves 26 falls or inclines. In this way, even if the rigidity of the plate-shaped object 10 of the remaining size is lowered due to the soft resin layer 10b, etc., it is still possible to remove the remaining area 14 in the dividing step, and then separate the pieces of the workpiece W into strip-shaped pieces one by one. The end faces on both sides in the first direction are formed in a rectangular shape with good accuracy. As a result, even when the plate-like object 10 with the excess size is formed as a composite material, the machining accuracy of the cut-out workpiece W can be maintained well.

在此,在上述之以往的加工方法中,切割刀片的X方向上之切割進給速度愈高,會變得愈容易發生工件W0的傾倒。相對於此,在本實施形態中,即使X方向的切割進給速度較高,由於藉由剩餘區域14而限制工件W的傾倒,因此可以提高切割進給速度並謀求處理量(throughput)的提升。又,在本實施形態中,在第2處的交界位置31以外的切割中,是以至少一邊的剩餘區域14來限控工件W的傾倒。從而,若在第2處的交界位置31以外的切割中將切割進給速度設為高速,並將在第2處的交界位置31的切割中的切割進給速度設得相對較慢,則可以既良好地保持加工精度並且謀求剩餘尺寸板狀物10整體的切斷中的處理量提升。Here, in the above-mentioned conventional processing method, the higher the cutting feed rate in the X direction of the cutting blade, the easier it is for the workpiece W0 to fall. On the other hand, in this embodiment, even if the cutting feed speed in the X direction is high, since the fall of the workpiece W is restricted by the remaining area 14, the cutting feed speed can be increased and the throughput can be improved. . In addition, in the present embodiment, in cutting other than the second boundary position 31 , the fall of the workpiece W is regulated by the remaining area 14 on at least one side. Therefore, if the cutting feed speed is set to a high speed for cutting other than the second border position 31, and the cutting feed speed for cutting at the second border position 31 is set to be relatively slow, then it is possible to While keeping the processing accuracy well, the throughput in cutting the entire plate-like object 10 with excess dimensions is improved.

再者,在上述實施之形態中,雖然是將切割機構設成切割刀片20,但並非限定於此構成。加工機構只要與實施形態同樣地可以形成切割溝26且可在交界位置30、31切割即可,亦可設成例如藉由雷射燒蝕來實施加工的構成。In addition, in the form of the above-mentioned embodiment, although the cutting mechanism is set as the cutting blade 20, it is not limited to this structure. The processing mechanism only needs to be able to form the cutting groove 26 and cut at the boundary positions 30 and 31 similarly to the embodiment, and may also be configured to perform processing by, for example, laser ablation.

又,剩餘尺寸板狀物10並不限定於如上述的複合材,亦可使用其他的複合材或無機材料基板等的各種板狀物。作為無機材料基板,亦可使用藍寶石、陶瓷、玻璃等的各種基板。無機材料基板可形成有元件,亦可為未形成有元件。又,作為板狀物,亦可以使用未燒結陶瓷、壓電素材。In addition, the excess size plate 10 is not limited to the above-mentioned composite material, and various plate-shaped objects such as other composite materials or inorganic material substrates may be used. Various substrates such as sapphire, ceramics, and glass can also be used as the inorganic material substrate. The inorganic material substrate may or may not be formed with elements. In addition, green ceramics and piezoelectric materials can also be used as the plate-shaped object.

又,本發明之實施形態並不限定於上述之實施形態,且亦可在不脫離本發明之技術思想的主旨的範圍內進行各種變更、置換、變形。此外,若能經由技術之進步或衍生之其他技術而以其他的方式來實現本發明之技術思想的話,亦可使用該方法來實施。從而,申請專利範圍涵蓋了可包含在本發明之技術思想的範圍內的所有的實施形態。 產業上之可利用性In addition, the embodiments of the present invention are not limited to the above-mentioned embodiments, and various changes, substitutions, and deformations can be made without departing from the scope of the technical idea of the present invention. In addition, if the technical idea of the present invention can be realized in other ways through technological progress or other derived technologies, this method can also be used for implementation. Therefore, the scope of claims covers all the embodiments that can be included in the scope of the technical idea of the present invention. Industrial availability

如以上所說明,本發明在將因柔軟層等而剛性較低的複合材所形成的板狀物分割成條狀片的加工方法上是有用的。As described above, the present invention is useful in a processing method for dividing a plate-shaped object formed of a composite material having low rigidity due to a soft layer or the like into strip-shaped pieces.

10‧‧‧剩餘尺寸板狀物(板狀物) 10a‧‧‧金屬層 10b‧‧‧樹脂層 12‧‧‧製品區域 14‧‧‧剩餘區域 16‧‧‧分割預定線 18‧‧‧蠟 19‧‧‧保持構件 20‧‧‧切割刀片(加工機構) 22‧‧‧主軸 25、27‧‧‧非切割部 26‧‧‧切割溝 30、31‧‧‧交界位置 100‧‧‧板狀物 100a‧‧‧金屬層 100b‧‧‧樹脂層 W、W0‧‧‧工件(條狀片) +X、-X、+Y、-Y‧‧‧方向10‧‧‧Remaining size plate (plate) 10a‧‧‧Metal layer 10b‧‧‧resin layer 12‧‧‧Product area 14‧‧‧Remaining area 16‧‧‧Splitting scheduled lines 18‧‧‧wax 19‧‧‧Retaining components 20‧‧‧Cutting Blade (Processing Mechanism) 22‧‧‧Spindle 25, 27‧‧‧non-cutting part 26‧‧‧cutting groove 30, 31‧‧‧Junction position 100‧‧‧plate 100a‧‧‧Metal layer 100b‧‧‧resin layer W, W0‧‧‧workpiece (strip sheet) +X, -X, +Y, -Y‧‧‧direction

圖1是實施形態之貼附步驟的說明圖。 圖2是實施形態之製品區域切割步驟的說明圖。 圖3是實施形態之製品區域切割步驟的說明圖。 圖4是實施形態之製品區域切割步驟的說明圖。 圖5是實施形態之製品區域切割步驟的說明圖。 圖6是實施形態之分割步驟的說明圖。 圖7是實施形態之分割步驟的說明圖。 圖8是顯示用以往的加工方法所加工之狀態的說明圖。Fig. 1 is an explanatory diagram of the sticking step of the embodiment. Fig. 2 is an explanatory diagram of a product region cutting step according to the embodiment. Fig. 3 is an explanatory diagram of a product region cutting step according to the embodiment. Fig. 4 is an explanatory diagram of a product region cutting step in the embodiment. Fig. 5 is an explanatory diagram of a product region cutting step according to the embodiment. Fig. 6 is an explanatory diagram of the division procedure of the embodiment. Fig. 7 is an explanatory diagram of the division procedure of the embodiment. Fig. 8 is an explanatory view showing the state of processing by a conventional processing method.

10‧‧‧剩餘尺寸板狀物(板狀物) 10‧‧‧Remaining size plate (plate)

12‧‧‧製品區域 12‧‧‧Product area

14‧‧‧剩餘區域 14‧‧‧Remaining area

16‧‧‧分割預定線 16‧‧‧Splitting scheduled lines

19‧‧‧保持構件 19‧‧‧Retaining components

20‧‧‧切割刀片(加工機構) 20‧‧‧Cutting Blade (Processing Mechanism)

22‧‧‧主軸 22‧‧‧Spindle

25、27‧‧‧非切割部 25, 27‧‧‧non-cutting part

26‧‧‧切割溝 26‧‧‧cutting groove

30、31‧‧‧交界位置 30, 31‧‧‧Junction position

+X、-X、+Y、-Y‧‧‧方向 +X, -X, +Y, -Y‧‧‧direction

Claims (1)

一種板狀物的加工方法,前述板狀物具有製品區域,前述板狀物的加工方法是由下述步驟所構成:貼附步驟,將在該製品區域的外周具有剩餘區域的剩餘尺寸板狀物貼附於保持構件;製品區域切割步驟,在實施該貼附步驟後,以加工機構從該剩餘尺寸板狀物的上方於一側的剩餘區域切入到該保持構件的中途,並沿著第1方向的分割預定線切割該製品區域,且在另一側的剩餘區域中讓該加工機構上升,藉此在該一側及另一側的剩餘區域中殘存非切割部並且沿著該第1方向的分割預定線來切割該製品區域;及分割步驟,在實施該製品區域切割步驟後,在以該加工機構將垂直於該第1方向的第2方向的該一側及另一側的剩餘區域之其中一方切割後,以該加工機構將該一側及另一側的剩餘區域之其中另一方切割並去除而分割成一個個的條狀片,並且使該製品區域切割步驟的該加工機構的切割進給速度、以及該一側及另一側的剩餘區域之其中一方的該加工機構的切割進給速度,對於該一側及另一側的剩餘區域之其中另一方的該加工機構的切割進給速度相對地高速。 A method of processing a plate-shaped object, the aforementioned plate-shaped object has a product area, and the processing method of the aforementioned plate-shaped object is composed of the following steps: a step of attaching a plate-shaped object with a remaining size on the outer periphery of the product area. The object is attached to the holding member; the product area cutting step, after implementing the attaching step, use the processing mechanism to cut into the middle of the holding member from the remaining area above the plate with remaining size on one side, and along the first The planned division line in one direction cuts the product area, and raises the processing mechanism in the remaining area on the other side, whereby non-cutting parts remain in the remaining area on the one side and the other side and along the first The product area is cut along the predetermined dividing line in the direction; and the dividing step is, after implementing the product area cutting step, using the processing mechanism to make the remaining parts on the side and the other side of the second direction perpendicular to the first direction After one of the regions is cut, use the processing mechanism to cut and remove the other one of the remaining regions on the one side and the other side to be divided into strips one by one, and make the processing mechanism in the region cutting step of the product and the cutting feed speed of the processing mechanism in one of the remaining areas on the one side and the other side, for the processing mechanism in the other of the remaining areas on the one side and the other side The cutting feed rate is relatively high.
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CN114789477B (en) * 2022-03-22 2022-10-21 江苏乐彩印刷材料有限公司 Continuous processing device for thermosensitive CTP (computer to plate) plates

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107017336A (en) * 2015-10-23 2017-08-04 株式会社迪思科 Processing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5722156A (en) * 1995-05-22 1998-03-03 Balfrey; Brian D. Method for processing ceramic wafers comprising plural magnetic head forming units
JP2002075919A (en) * 2000-08-30 2002-03-15 Sharp Corp Dicing method of semiconductor wafer
JP2004146487A (en) * 2002-10-23 2004-05-20 Renesas Technology Corp Method for manufacturing semiconductor device
JP5837815B2 (en) 2011-12-21 2015-12-24 株式会社ディスコ Workpiece division method
JP6071041B2 (en) * 2012-03-30 2017-02-01 日立金属株式会社 Manufacturing method of scintillator array and manufacturing method of radiation detector
JP2017220532A (en) * 2016-06-06 2017-12-14 株式会社ディスコ Cutting method of wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107017336A (en) * 2015-10-23 2017-08-04 株式会社迪思科 Processing method

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