JP6817854B2 - How to divide the resin package substrate - Google Patents

Description

The present invention relates to a method for dividing a resin package substrate.

Resin package substrates on which semiconductor device chips and various device chips are mounted and molded are widely manufactured. The resin package substrate is cut with a cutting blade along a planned division line and divided into individual device chips (see, for example, Patent Document 1).

The resin package substrate may have a metal layer as an electrode on the planned division line, or a thin resin film may be laminated. When cutting with a circular cutting blade in which abrasive grains are bonded with a bond material, metal needles, etc. Burr may occur or the resin film may peel off. In particular, when cutting with a thick cutting blade, burrs and peeling tend to occur easily.

JP-A-09-055573

A super steel saw blade with a plurality of saw blades on the outer circumference (for example, a metal saw manufactured by MRT Co., Ltd.) has the effect of suppressing the above-mentioned burrs and peeling, and is selected as a cutting blade. There is. However, unlike a cutting blade formed of abrasive grains and bonds, a super steel saw blade does not cause a spontaneous blade action due to wear. Therefore, when a dicing tape is cut, a glue layer adheres to the saw blade and the sharpness is reduced. There is a problem that it gradually decreases.

An object of the present invention is to solve the above-mentioned problems and to provide a method for dividing a resin package substrate capable of suppressing the occurrence of burrs during division into a device chip while suppressing a decrease in sharpness of a blade.

In order to solve the above-mentioned problems and achieve the object, the method for dividing the resin package substrate of the present invention is the method of dividing the resin package substrate in which devices are provided in a plurality of regions divided into scheduled division lines formed in a grid pattern. A method of dividing a resin package substrate into individual device chips while removing a planned division line by a predetermined width, wherein the first adhesive tape is attached to the back surface of the resin package substrate. , A super steel saw blade with a thickness of 150 μm or more is cut from the surface of the resin package substrate to a depth that does not reach the first adhesive tape, and a half-cut groove is formed along the planned division line. The groove forming step to be formed and the abrasive grains are bonded by a bond, and a cutting blade having a thickness of 15 μm or more and 70 μm or less is cut to a depth from the surface of the resin package substrate to the first adhesive tape. After forming the first dividing groove along one side wall of the half-cut groove, a second dividing groove is formed along the other side wall of the half-cut groove, and along the half-cut groove. A split step for forming a pair of split grooves, a second sticking step for sticking a second adhesive tape to the surface of the resin package substrate after performing the groove forming step and the split step, and the first sticking step. A peeling step of peeling the first adhesive tape from the back surface of the resin package substrate to which the adhesive tape of 2 is attached together with the uncut portion of the half-cut groove sandwiched between the pair of dividing grooves. It is characterized by being prepared.

In the method of dividing the resin package substrate, the division step may be performed after the groove formation step.

In the method of dividing the resin package substrate, a resin film may be laminated on the surface of the resin package substrate.

Therefore, the method for dividing the resin package substrate of the present invention has the effect of suppressing the occurrence of burrs on the device chip during division while suppressing the decrease in sharpness of the blade.

FIG. 1 is a perspective view showing a resin package substrate to be processed in the method of dividing the resin package substrate according to the first embodiment. FIG. 2 is a perspective view showing a device chip divided from the resin package substrate by the method for dividing the resin package substrate according to the first embodiment. FIG. 3 is a plan view showing a main part of the resin package substrate shown in FIG. FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. FIG. 5 is a flowchart showing a flow of a method of dividing the resin package substrate according to the first embodiment. FIG. 6 is a perspective view showing the resin package substrate after the first attachment step of the method of dividing the resin package substrate shown in FIG. FIG. 7 is a side sectional view showing a groove forming step of the method of dividing the resin package substrate shown in FIG. FIG. 8 is another side sectional view showing a groove forming step of the method of dividing the resin package substrate shown in FIG. FIG. 9 is a plan view of a main part of the resin package substrate after the groove forming step of the method of dividing the resin package substrate shown in FIG. FIG. 10 is a side sectional view showing a division step of the division method of the resin package substrate shown in FIG. FIG. 11 is a plan view of a main part of the workpiece after the division step of the method of dividing the resin package substrate shown in FIG. FIG. 12 is a perspective view showing a second attachment step of the method for dividing the resin package substrate shown in FIG. FIG. 13 is a cross-sectional view showing the resin package substrate and the like after the second attachment step of the method for dividing the resin package substrate shown in FIG. FIG. 14 is a plan view showing the resin package substrate and the like after the second attachment step of the method for dividing the resin package substrate shown in FIG. FIG. 15 is a cross-sectional view showing a peeling step of the method of dividing the resin package substrate shown in FIG. FIG. 16 is a plan view showing the resin package substrate and the like after the peeling step of the method of dividing the resin package substrate shown in FIG.

An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
The method of dividing the resin package substrate according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a resin package substrate to be processed in the method of dividing the resin package substrate according to the first embodiment. FIG. 2 is a perspective view showing a device chip divided from the resin package substrate by the method for dividing the resin package substrate according to the first embodiment. FIG. 3 is a plan view showing a main part of the resin package substrate shown in FIG. FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. FIG. 5 is a flowchart showing a flow of a method of dividing the resin package substrate according to the first embodiment.

The method for dividing the resin package substrate according to the first embodiment is a method for dividing the resin package substrate 201 shown in FIG. 1 into the device chip 202 shown in FIG. 2, and is also a method for manufacturing the device chip 202. The resin package substrate 201 is a processing target of the method for dividing the resin package substrate according to the first embodiment, and is formed in a flat plate shape having a rectangular planar shape. As shown in FIGS. 1 and 2, the resin package substrate 201 includes the device 204 shown in FIG. 2 in each of a plurality of regions partitioned by the grid-shaped scheduled division lines 203.

As shown in FIG. 4, the resin package substrate 201 includes a package substrate 207, a device 204 provided on the surface 206 of the package substrate 207, and a resin film 205 laminated on the surface 206 of the package substrate 207. That is, in the resin package substrate 201, the resin film 205 is laminated on the surface 206 of the package substrate 207.

The resin film 205 and the package substrate 207 are made of a synthetic resin having insulating properties and flexibility. The resin package substrate 201 is flexible as a whole because the resin film 205 and the package substrate 207 are flexible. As shown in FIG. 4, the width 203-1 of the planned division lines 203 formed in a grid pattern on the resin package substrate 201 is narrower than the distance between the devices 204 adjacent to each other.

In the resin package substrate 201, the resin film 205 and the package substrate 207 in the region 208 (indicated by parallel diagonal lines in FIG. 3 and hereinafter referred to as a removal region) of the predetermined width 208-1 of the planned division line 203 are removed. As a result, it is divided into individual device chips 202. The predetermined width 208-1, which is the width of the removal area 208, is narrower than the width 203-1 of the planned division line 203. Further, in the first embodiment, the removal region 208 is arranged at the center in the width direction of the planned division line 203. Therefore, in the first embodiment, the device chip 202 covers the device 204 with the resin film 205 and the package substrate 207.

The method for dividing the resin package substrate according to the first embodiment (hereinafter, simply referred to as a division method) is a method of dividing the resin package substrate 201 into individual device chips 202 while removing the planned division line 203 with a predetermined width 208-1. Is. As shown in FIG. 5, the division method according to the first embodiment includes a first attachment step ST1, a groove formation step ST2, a division step ST3, a second attachment step ST4, and a peeling step ST5.

(1st sticking step)
The first sticking step ST1 is a step of sticking the first adhesive tape 210 to the package substrate 207 which is the back surface of the resin package substrate 201. FIG. 6 is a perspective view showing the resin package substrate after the first attachment step of the method of dividing the resin package substrate shown in FIG.

In the first embodiment, as shown in FIG. 6, in the first attachment step ST1, the package substrate 207 of the resin package substrate 201 is attached to the first adhesive tape 210 to which the annular frame 211 is attached to the outer periphery. As shown in FIG. 7, the first adhesive tape 210 includes a resin layer 212 made of a synthetic resin and a glue layer 213 having an adhesive force provided on the resin layer 212. In the first adhesive tape 210, the glue layer 213 is attached to the resin package substrate 201 and the annular frame 211.

(Groove formation step)
In the groove forming step ST2, the super steel saw blade 1 having a thickness of 150 μm or more and thinner than the predetermined width 208-1 reaches the first adhesive tape 210 from the resin film 205 which is the surface of the resin package substrate 201. This is a step of forming a half-cut groove 214 (shown in FIG. 8) along the planned division line 203 by cutting at a depth that does not occur. FIG. 7 is a side sectional view showing a groove forming step of the method of dividing the resin package substrate shown in FIG. FIG. 8 is another side sectional view showing a groove forming step of the method of dividing the resin package substrate shown in FIG. FIG. 9 is a plan view of a main part of the resin package substrate after the groove forming step of the method of dividing the resin package substrate shown in FIG.

In the groove forming step ST2, the super steel saw blade 1 is attached to the spindle 3 of the cutting device 2. The super steel saw blade 1 is made of a metal such as a super steel alloy, and is formed in a circular shape having a saw blade 4 on the outer edge. In the first embodiment, the super steel saw blade 1 is a so-called hubless blade having no base, but in the present invention, a hub blade provided with a base may be used. In the groove forming step ST2, as shown in FIG. 7, the resin package substrate 201 is sucked and held on the holding surface 6 of the chuck table 5 of the cutting device 2 via the first adhesive tape 210, and the clamp 7 of the cutting device 2 is used. Clamp the annular frame 211.

In the groove forming step ST2, the resin package substrate 201 is imaged by an imaging unit (not shown), and alignment is performed to align the super steel saw blade 1 and the resin package substrate 201. In the groove forming step ST2, the chuck table 5 is moved in the X-axis direction parallel to the horizontal direction by an X-axis moving unit (not shown) according to the alignment result, and the super steel saw blade 1 mounted on the spindle 3 is not shown. The Y-axis moving unit moves the super steel saw blade 1 mounted on the spindle 3 in the Y-axis direction parallel to the horizontal direction and orthogonal to the X-axis direction, and the Z-axis moving unit (not shown) parallels the vertical direction. As shown in FIGS. 7 and 8, a half-cut groove 214 is formed in each planned division line 203 of the resin package substrate 201 by moving in the Z-axis direction.

In the first embodiment, as shown in FIG. 8, the groove forming step ST2 forms the half-cut groove 214 along each scheduled division line 203 and forms the half-cut groove 214 in the center in the width direction of the removal region 208. To do. For this reason, as shown in FIG. 9, the removal regions 208-2 and 208-3 (parallel chain lines in FIG. 9) are formed at both ends of the half-cut groove 214 in the width direction on the planned division lines 203 of the resin package substrate 201. (Indicated by) remains. In the first embodiment, the thickness of the super steel saw blade 1 is 0.2 mm.

(Split step)
The split step ST3 is performed after the groove forming step ST2. In the division step ST3, the abrasive grains are bonded by a bond, and the cutting blade 10 having a thickness of 15 μm or more and 70 μm or less is cut to a depth from the resin film 205 of the resin package substrate 201 to the first adhesive tape 210. After forming the first dividing groove 215 along one side wall of the half-cut groove 214, the second dividing groove 216 is formed along the other side wall of the half-cut groove 214 to form a half-cut. This is a step of forming a pair of dividing grooves 215 and 216 along the groove 214. FIG. 10 is a side sectional view showing a division step of the division method of the resin package substrate shown in FIG. FIG. 11 is a plan view of a main part of the workpiece after the division step of the method of dividing the resin package substrate shown in FIG.

In the division step ST3, the super steel saw blade 1 is removed from the spindle 3 of the cutting device 2, and the cutting blade 10 is attached to the spindle 3. In the first embodiment, the cutting blade 10 is a so-called hubless blade having no base, but in the present invention, a hub blade provided with a base may be used.

In the division step ST3, the chuck table 5 is moved in the X-axis direction parallel to the horizontal direction by an X-axis moving unit (not shown) according to the alignment result, and the cutting blade 10 mounted on the spindle 3 is moved by a Y-axis moving unit (not shown). The cutting blade 10 mounted on the spindle 3 is moved in the Z-axis direction parallel to the vertical direction by a Z-axis moving unit (not shown) while moving in the Y-axis direction parallel to the horizontal direction and orthogonal to the X-axis direction. The cutting blade 10 is cut into the remaining width direction one removal region 208-2, which is one side wall of each planned division line 203 of the resin package substrate 201, to a depth reaching the resin layer 212 of the first adhesive tape 210. A first dividing groove 215 is formed in one of the removal regions 208-2.

In the division step ST3, after forming the first division groove 215, the cutting blade 10 is placed in the other removal region 208-3 in the remaining width direction, which is the other side wall of each planned division line 203 of the resin package substrate 201. A second dividing groove 216 is formed in the other removal region 208-3 by cutting to a depth reaching the resin layer 212 of the adhesive tape 210 of 1. In this way, as shown in FIGS. 10 and 11, the division step ST3 forms a pair of division grooves 215 and 216 along the half-cut grooves 214 at both ends in the width direction of the removal region 208 of each planned division line 203. In the first embodiment, the thickness of the cutting blade 10 is 0.03 mm or more and 0.05 mm or less. The resin package substrate 201 after the division step ST3 is divided into individual device chips 202, and an uncut portion 217 composed of the package substrate 207 remains between the device chips 202 that are in contact with each other.

(2nd sticking step)
The second sticking step ST4 is a step of sticking the second adhesive tape 220 to the resin film 205 of the resin package substrate 201 after performing the groove forming step ST2 and the dividing step ST3. Since the configuration of the second adhesive tape 220 is the same as that of the first adhesive tape 210, the same parts will be designated by the same reference numerals and description thereof will be omitted. FIG. 12 is a perspective view showing a second attachment step of the method for dividing the resin package substrate shown in FIG. FIG. 13 is a cross-sectional view showing the resin package substrate and the like after the second attachment step of the method for dividing the resin package substrate shown in FIG. FIG. 14 is a plan view showing the resin package substrate and the like after the second attachment step of the method for dividing the resin package substrate shown in FIG.

In the first embodiment, in the second attachment step ST4, the resin package substrate 201 is removed from the chuck table 5 of the cutting device 2, and as shown in FIG. 12, the adhesive layer 213 having the adhesive force of the second adhesive tape 220 is attached. It is attached to the resin film 205 of the annular frame 211 and the resin package substrate 201. Then, as shown in FIG. 13, the resin package substrate 201 is sandwiched between the first adhesive tape 210 and the second adhesive tape 220. Further, as shown in FIGS. 13 and 14, an uncut portion 217 formed of the package substrate 207 remains between the device chips 202 that are in contact with each other. The uncut portion 217 is attached only to the first adhesive tape 210 of the adhesive tapes 210 and 220 because it corresponds to the groove bottom of the half-cut groove 214 formed in the groove forming step ST2.

(Peeling step)
In the peeling step ST5, the first adhesive tape 210 is cut from the package substrate 207 of the resin package substrate 201 to which the second adhesive tape 220 is attached by cutting the half-cut grooves 214 sandwiched between the pair of dividing grooves 215 and 216. This is a step of peeling together with the remaining portion 217. FIG. 15 is a cross-sectional view showing a peeling step of the method of dividing the resin package substrate shown in FIG. FIG. 16 is a plan view showing the resin package substrate and the like after the peeling step of the method of dividing the resin package substrate shown in FIG.

In the peeling step ST5, as shown in FIG. 15, the first adhesive tape 210 is removed from the resin package substrate 201 and the annular frame 211. Then, since the uncut portion 217 is attached only to the first adhesive tape 210, it is removed together with the first adhesive tape 210 from between the device chips 202 adjacent to each other. Then, as shown in FIG. 16, the device chip 202 from which the uncut portion 217 has been removed from between each other remains attached to the second adhesive tape 220. Then, the device chip 202 is conveyed to the next step while being attached to the annular frame 211 via the second adhesive tape 220, and is peeled off from the second adhesive tape 220 by a vacuum pad or the like (not shown). Become. In the present invention, in the dividing step ST3, the side walls of the dividing grooves 215 and 216 may be aligned with the side walls of the half-cut groove 214 without protruding from the half-cut groove 214.

As described above, according to the division method according to the first embodiment, in the groove forming step ST2, the circular super steel saw blade 1 cuts the resin package substrate 201 at a depth that does not reach the first adhesive tape 210. Since it is embedded, it is possible to suppress the occurrence of burrs in the groove forming step ST2, and it is possible to prevent the glue layer 213 of the first adhesive tape 210 from adhering to the super steel saw blade 1. Further, in the dividing method, since the half-cut groove 214 is formed by the circular super steel saw blade 1 in the groove forming step ST2, it is possible to prevent the resin film 205 and the package substrate 207 of the resin package substrate 201 from peeling off. can do.

Further, in the division method according to the first embodiment, after the half-cut groove 214 is formed in the groove formation step ST2, the abrasive grains are bonded to both ends of the half-cut groove 214 with a bond and the blade is more than the super steel saw blade 1. A thin cutting blade 10 is used to cut the first adhesive tape 210 to a depth that reaches the resin layer 212. As described above, in the dividing method, in the dividing step ST3, the dividing grooves 215 and 216 are formed in the resin package substrate 201 by using the cutting blade 10 thinner than the super steel saw blade 1, so that the resin package substrate 201 has burrs. And peeling are unlikely to occur. Further, since the cutting blade 10 that cuts the glue layer 213 of the first adhesive tape 210 is formed by bonding abrasive grains with a bond, even if the glue layer 213 adheres, a spontaneous blade generation action is generated.

As a result, in the dividing method, the glue layer 213 does not adhere to the super steel saw blade 1 used in the groove forming step ST2, and the cutting blade 10 used in the dividing step ST3 spontaneously generates a blade. It is possible to suppress a decrease in sharpness of the saw blade 1 and the cutting blade 10. Therefore, the division method can suppress the occurrence of burrs on the device chip 202 at the time of division while suppressing the decrease in sharpness of the blades 1 and 10.

Further, in the dividing method, after the dividing step ST3, the second adhesive tape 220 is attached to the resin package substrate 201 and the first adhesive tape 210 is peeled off, so that the uncut portion remaining between the dividing grooves 215 and 216 is removed. 217 can be removed. As a result, the dividing method can prevent the uncut portion 217 from remaining between the adjacent device chips 202, and can easily separate the device chip 202 from the second adhesive tape 220 in the next step.

Next, the inventor of the present invention confirmed the effect of the cutting blade 10 used in the dividing step ST3 by performing the dividing step ST3 using a plurality of cutting blades 10 having different thicknesses. The confirmed results are shown in Table 1.

In the confirmation, the ratio (%) of the planned division line 203 in which at least one of burrs and peeling occurred when the division step ST3 was performed with the cutting blades 10 having thicknesses of 15 μm, 50 μm, 70 μm, and 100 μm was measured. According to Table 1, when the division step ST3 is performed on the cutting blade 10 having a thickness of 15 μm or more and 70 μm or less, the ratio of the planned division line 203 in which at least one of burrs and peeling occurs is 10% or less. It was clarified that when the division step ST3 was performed with the cutting blade 10 having a thickness of 50 μm, the ratio of the planned division line 203 in which at least one of burrs and peeling occurred could be set to 0%.

Therefore, according to Table 1, by performing the division step ST3 with the cutting blade 10 having a thickness of 15 μm or more and 70 μm or less, the occurrence of burrs and peeling can be suppressed, and the cutting blade 10 having a thickness of 50 μm can be suppressed. It was clarified that the occurrence of burrs and peeling can be prevented by carrying out the division step ST3.

According to the first embodiment, the following device chip manufacturing method can be obtained.

(Additional Note) A method for manufacturing a device chip that divides a resin package substrate having devices in a plurality of regions divided into grid-shaped scheduled division lines into individual device chips while removing the planned division lines by a predetermined width. And
The first sticking step of sticking the first adhesive tape to the back surface of the resin package substrate, and
A super steel saw blade with a thickness of 150 μm or more is cut from the surface of the resin package substrate to a depth that does not reach the first adhesive tape, and a half-cut groove is formed along the planned division line. Grooving step and
Abrasive grains are bonded by a bond, and a cutting blade having a thickness of 15 μm or more and 70 μm or less is cut into a depth from the surface of the resin package substrate to the first adhesive tape to form a half-cut groove. After forming the first dividing groove along one side wall, the second dividing groove is formed along the other side wall of the half-cut groove, and a pair of dividing grooves are formed along the half-cut groove. The split steps to form and
After performing the groove forming step and the dividing step, a second sticking step of sticking a second adhesive tape to the surface of the resin package substrate, and a second sticking step.
A peeling step of peeling the first adhesive tape from the back surface of the resin package substrate to which the second adhesive tape is attached together with the uncut portion of the half-cut groove sandwiched between the pair of dividing grooves. A method of manufacturing a device chip comprising.

The present invention is not limited to the above embodiment. That is, it can be modified in various ways without departing from the gist of the present invention.

1 Super steel saw blade 10 Cutting blade 201 Resin package substrate 202 Device chip 203 Scheduled division line 204 Device 205 Resin film (surface)
207 Package board (back side)
208-1 Predetermined width 208-2 Removal area (one side wall)
208-3 Removal area (other side wall)
210 1st Adhesive Tape 214 Half Cut Groove 215 1st Dividing Groove 216 2nd Dividing Groove 217 Uncut Part 220 2nd Adhesive Tape ST1 1st Adhesive Step ST2 Groove Formation Step ST3 Dividing Step ST4 2nd Adhesive Step ST5 Peeling step

Claims (3)

It is a method of dividing a resin package substrate in which devices are provided in a plurality of regions divided into grid-shaped planned division lines and the resin package substrate is divided into individual device chips while removing the planned division lines by a predetermined width. hand,
The first sticking step of sticking the first adhesive tape to the back surface of the resin package substrate, and
A super steel saw blade with a thickness of 150 μm or more is cut from the surface of the resin package substrate to a depth that does not reach the first adhesive tape, and a half-cut groove is formed along the planned division line. Grooving step and
Abrasive grains are bonded by a bond, and a cutting blade having a thickness of 15 μm or more and 70 μm or less is cut into a depth from the surface of the resin package substrate to the first adhesive tape to form a half-cut groove. After forming the first dividing groove along one side wall, the second dividing groove is formed along the other side wall of the half-cut groove, and a pair of dividing grooves are formed along the half-cut groove. The split steps to form and
After performing the groove forming step and the dividing step, a second sticking step of sticking a second adhesive tape to the surface of the resin package substrate, and a second sticking step.
A peeling step of peeling the first adhesive tape from the back surface of the resin package substrate to which the second adhesive tape is attached together with the uncut portion of the half-cut groove sandwiched between the pair of dividing grooves. A method of dividing a resin package substrate comprising. The method for dividing a resin package substrate according to claim 1, wherein the division step is performed after the groove formation step. The method for dividing a resin package substrate according to claim 1, wherein the resin package substrate has a resin film laminated on the surface thereof.