JP5356791B2 - Manufacturing method for laminated products - Google Patents

Manufacturing method for laminated products Download PDF

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JP5356791B2
JP5356791B2 JP2008315345A JP2008315345A JP5356791B2 JP 5356791 B2 JP5356791 B2 JP 5356791B2 JP 2008315345 A JP2008315345 A JP 2008315345A JP 2008315345 A JP2008315345 A JP 2008315345A JP 5356791 B2 JP5356791 B2 JP 5356791B2
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洋平 五木田
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Disco Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminate product, in which the laminate product including a hard brittle material can be excellently divided without causing quality deterioration such as cracking. <P>SOLUTION: The method of manufacturing the laminate product includes steps of: forming a groove (17) having a depth which corresponds to a product dimension and larger than a predetermined thickness on one surface (10) of a first raw material (8) as the hard brittle material; sticking the one surface (10) on a second raw material (20); thinning the first raw material (8) up to a predetermined thickness from the side of another surface (12) and dividing it; and cutting the second raw material (8) between first plate-like pieces (14) having been divided. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

本発明は、硬脆性材料から形成された所定厚さの板状片を有す積層製品を製造する製造方法に関する。   The present invention relates to a manufacturing method for manufacturing a laminated product having a plate-like piece having a predetermined thickness formed from a hard and brittle material.

様々な半導体製品乃至電子デバイスは、セラミック又はシリコン等の硬脆性材料を他の材料に積層させて形成される。従来は、脆性材料を研削装置や研磨装置等で薄化した後専用の接着剤等で他の材料に貼着し、その後ダイシング装置等の分割装置にて各デバイスに分割される（特許文献１参照）。   Various semiconductor products and electronic devices are formed by stacking a hard and brittle material such as ceramic or silicon on another material. Conventionally, after a brittle material is thinned with a grinding apparatus or a polishing apparatus, it is attached to another material with a dedicated adhesive or the like, and then divided into devices by a dividing apparatus such as a dicing apparatus (Patent Document 1). reference).

特開２００８−７２４５６号公報JP 2008-72456 A

デバイス特性を向上させる等の種々の目的により、積層製品の主要構成要素である硬脆性材料を例えば10μm以下に薄化する要請がある。セラミックス等の硬脆性材料は薄化するほど反りやすくなる等に起因して、従来の製造方法では薄化された硬脆性材料に他の材料を貼着する時点で硬脆性材料に割れが発生し、また貼着後のダイシング等の分割時に割れや欠けが発生する傾向がある。   For various purposes such as improving device characteristics, there is a demand for thinning hard and brittle materials, which are the main constituent elements of laminated products, to 10 μm or less, for example. Due to the fact that hard brittle materials such as ceramics tend to warp as they are thinned, cracks occur in the hard brittle materials when pasting other materials on the thin hard brittle materials in the conventional manufacturing method. In addition, there is a tendency that cracks and chips occur during division such as dicing after sticking.

本発明は、上記事実に鑑みてなされたものであって、その技術的課題は、例えば10μm以下である薄化された硬脆性材料を含む積層製品を割れ等の問題を発生させることなく、良好に製造することができる積層製品の製造方法を提供することである。   The present invention has been made in view of the above-mentioned facts, and its technical problem is good without causing problems such as cracking in a laminated product including a thin hard brittle material that is 10 μm or less, for example. It is providing the manufacturing method of the laminated | multilayer product which can be manufactured in a short time.

本発明によれば、上記技術的課題を達成する積層製品を製造するための製造方法として、硬脆性材料から形成された所定厚さの第一の板状片と第二の板状片とが積層された積層製品を製造するための製造方法であって、
硬脆性材料から形成された第一の素材の片面に切削ブレードを使用して該第一の板状片の寸法に対応して格子状に配列され且つ該所定厚さ以上の深さを有する溝を形成する溝形成工程と、
該溝形成工程の後に、該第一の素材の該片面に反りの発生を回避するのに充分な剛性を有する第二の素材を貼着する貼着工程と、
該貼着工程の後に、該第一の素材の他面を研削して該第一の素材を該所定厚さに研削し、該溝に沿って該第一の素材を複数個の第一の板状片に分割する研削工程と、
該研削工程の後に、該複数個の第一の板状片間を通して、該溝形成工程における該溝の形成に使用した該切削ブレードの厚さより薄い切削ブレードを該第二の素材に作用せしめて、該第二の素材を切削して、該第二の素材を複数個の第二の板状片に分割する切削工程と、
を含むことを特徴とする積層製品の製造方法が提供される。 According to the present invention, as a manufacturing method for manufacturing a laminated product that achieves the above technical problem, a first plate-like piece and a second plate-like piece having a predetermined thickness formed from a hard and brittle material are provided. A production method for producing a laminated product, comprising:
Groove having a first using a single-sided cutting blade material is arranged to correspond to the dimensions of said first plate-like pieces in a grid and the predetermined thickness or more depth formed of a hard brittle material Forming a groove;
After the groove forming step, a sticking step of sticking a second material having sufficient rigidity to avoid occurrence of warping on the one surface of the first material;
After the attaching step, the other surface of the first material is ground to grind the first material to the predetermined thickness, and the first material is moved along the groove to a plurality of first materials. Grinding process to divide into plate-shaped pieces;
After the grinding step, a cutting blade thinner than the thickness of the cutting blade used for forming the groove in the groove forming step is applied to the second material through the plurality of first plate-like pieces . , by cutting the said second material, and a cutting step of dividing said second material into a plurality of second plate-shaped pieces,
A method for producing a laminated product is provided.

本発明の製造方法においては、硬脆性材料を薄化前に他の材料を硬脆性材料に貼着し、その後に硬脆性材料を薄化するので、薄化された硬脆性材料の反りを充分に回避することができ、薄化された硬脆性材料を含む積層製品を割れ等の問題を発生させることなく充分良好に製造することができる。   In the production method of the present invention, the hard brittle material is pasted to the hard brittle material before thinning, and then the hard brittle material is thinned. Therefore, a laminated product including a thin hard brittle material can be manufactured sufficiently satisfactorily without causing problems such as cracking.

以下、本発明に従って構成された積層製品の製造方法の好適実施形態を図示している添付図面を参照して更に詳述する。   Hereinafter, a preferred embodiment of a method for manufacturing a laminated product constructed according to the present invention will be described in more detail with reference to the accompanying drawings.

図１には本発明の積層製品の製造方法により製造された積層製品２の典型例を示している。例えばセラミックス等である硬脆性材料から形成された第一の板状片４とシリコン等の半導体基板で形成された第二の板状片６とが接着剤で貼着されて形成されている。第一の板状片４は例えば５μmである所定厚Ｔに薄化されており、第二の板状片６は例えば300μmの厚さである。   FIG. 1 shows a typical example of a laminated product 2 produced by the method for producing a laminated product of the present invention. For example, a first plate-like piece 4 formed of a hard and brittle material such as ceramics and a second plate-like piece 6 formed of a semiconductor substrate such as silicon are adhered and formed with an adhesive. The first plate-like piece 4 is thinned to a predetermined thickness T, for example, 5 μm, and the second plate-like piece 6 is, for example, 300 μm thick.

（溝形成工程）
本発明の積層製品２の製造方法においては、最初に溝形成工程が遂行される。この溝形成工程においては、図３に図示するように、第一の板状片４を形成するための例えば矩形形状のセラミックス等である硬脆性材料から形成された第一の素材８に切削ブレード１６により切削溝７が形成される。図２（a）に断面で図示するように、最初に第一の素材８の片面１０を表出させた状態で第一の素材８の他面１２を周知構造の切削装置の保持テーブル１４に保持させる。次いで、切削装置の切削ブレード１６を用いて片面１０に切削溝７を形成していく。 (Groove formation process)
In the manufacturing method of the laminated product 2 of the present invention, a groove forming step is first performed. In this groove forming step, as shown in FIG. 3, a cutting blade is applied to the first material 8 formed from a hard and brittle material such as a rectangular ceramic for forming the first plate-like piece 4. The cutting groove 7 is formed by 16. As shown in cross section in FIG. 2A, the other surface 12 of the first material 8 is first placed on the holding table 14 of the cutting device having a known structure in a state where the one surface 10 of the first material 8 is exposed. Hold. Next, the cutting groove 7 is formed on one surface 10 using the cutting blade 16 of the cutting device.

切削ブレード１６は保持テーブル１４の保持面に平行な回転軸を中心に高速回転しながら第一の素材８の表面からＤmmまで切り込み、図２（a）の紙面に垂直な方向に保持テーブル１４が移動することで切削溝７が形成される。第一の板状片４の寸法に対応した分割予定ラインに沿って切削ブレード１６は割り出し送りされ（図２(a)では左右方向）、所定厚Ｔ5μm以上の深さであるＤmm（例えば10μm）の深さの溝７が複数ライン形成される。複数ラインの溝７が形成されたら、続いて保持テーブル１４が９０°回転し最初の形成された複数の溝７と直交する方向に第一の板状片１４の寸法通りに複数の溝７が形成される。このようにして、所定厚Ｔ5μm以上の深さＤμmの溝７が図３に図示するように第一の素材８の表面に格子状に形成される。   The cutting blade 16 cuts from the surface of the first material 8 to Dmm while rotating at a high speed around a rotation axis parallel to the holding surface of the holding table 14, and the holding table 14 moves in a direction perpendicular to the paper surface of FIG. The cutting groove 7 is formed by moving. The cutting blade 16 is indexed and fed along the planned dividing line corresponding to the dimension of the first plate-like piece 4 (left and right in FIG. 2 (a)), and Dmm (for example, 10 μm) having a predetermined thickness T5 μm or more. A plurality of grooves 7 having a depth of 5 are formed. After the grooves 7 having a plurality of lines are formed, the holding table 14 is subsequently rotated by 90 °, and the plurality of grooves 7 are formed according to the dimensions of the first plate-like piece 14 in a direction orthogonal to the plurality of grooves 7 that are formed first. It is formed. In this way, grooves 7 having a depth D μm of a predetermined thickness T5 μm or more are formed in a lattice pattern on the surface of the first material 8 as shown in FIG.

本実施形態においては、切削ブレード１６は厚さｔ１が60μmの電鋳ブレードである。切削ブレード１６では第一の素材８のみの加工を行うので、第一の素材８に適した切削ブレード１６を使用することができ、より良好な品質での加工を行うことができる。かかる溝形成工程は、例えば特開平１１−３４０３９号公報に開示されている切削装置を使用することによって好都合に遂行することができる。   In the present embodiment, the cutting blade 16 is an electroformed blade having a thickness t1 of 60 μm. Since the cutting blade 16 processes only the first material 8, the cutting blade 16 suitable for the first material 8 can be used, and processing with better quality can be performed. Such a groove forming step can be conveniently performed by using, for example, a cutting device disclosed in JP-A-11-34039.

（貼着工程）
格子状の溝７が形成された第一の素材８は、図４に図示するように溝７が形成された片面１０側に接着剤１８によりシリコン基板である第二の素材２０が貼着される（図２（b）貼着工程）。貼着工程では、適宜製造される製品に適した接合方法で第一の素材８と第二の素材２０を貼着すれば良い。第二の素材２０は、反りが発生しない程度の充分な剛性が維持出来る厚みで形成されている。 (Attaching process)
As shown in FIG. 4, the first material 8 in which the lattice-like grooves 7 are formed has a second material 20, which is a silicon substrate, attached to one side 10 side where the grooves 7 are formed by an adhesive 18. (FIG. 2 (b) sticking step). In the attaching step, the first material 8 and the second material 20 may be attached by a joining method suitable for a product that is appropriately manufactured. The second material 20 is formed with a thickness that can maintain sufficient rigidity to prevent warping.

（研削工程）
次いで、研削工程が遂行される(図２（ｃ）)。第二の素材２０が積層されていない面２１に研削用の保護テープ２２が貼着される。第一の素材８及び第二の素材２０の積層品は他面１２を露呈させた状態で周知構造である研削装置の保持テーブル２４に吸引保持される。そして、周知構造である研削装置の研削工具２６により薄化研削される。第一の素材８は他面１２の面から研削工具２６により徐々に薄化されていき、所定厚さＴ５μmまで研削される。その結果、第一の素材８にはあらかじめ所定厚Ｔ（μm）以上の深さＤ(μm)の溝７が形成されているので、かかる溝７に沿って第一の素材８は複数個の第一の板状片４に分割される。この際、硬脆性材料である第一の素材８に溝７を形成した後に第二の素材２０に貼着し、第一の素材８は薄化されるので第一の素材８の反りの影響を充分に回避することができ、割れや欠けの発生を抑え、加工品質が良好に第一の板状片４に分割することができる。 (Grinding process)
Next, a grinding process is performed (FIG. 2C). A protective tape 22 for grinding is attached to a surface 21 on which the second material 20 is not laminated. The laminated product of the first material 8 and the second material 20 is sucked and held by a holding table 24 of a grinding device having a known structure with the other surface 12 exposed. Then, it is thinned and ground by a grinding tool 26 of a grinding apparatus having a known structure. The first material 8 is gradually thinned from the surface of the other surface 12 by the grinding tool 26, and is ground to a predetermined thickness T5 μm. As a result, a groove 7 having a depth D (μm) greater than or equal to a predetermined thickness T (μm) is formed in the first material 8 in advance, so that the first material 8 includes a plurality of first materials 8 along the groove 7. It is divided into first plate-like pieces 4. At this time, after the groove 7 is formed in the first material 8 which is a hard and brittle material, the groove is pasted on the second material 20 and the first material 8 is thinned. Can be sufficiently avoided, generation of cracks and chips can be suppressed, and processing quality can be divided into the first plate-like pieces 4 with good quality.

（切削工程）
上記研削工程の後には切削工程が遂行される（図２（e））。保護テープ２２を介して第二の素材２は切削装置の保持テーブル１４上に吸引保持される。そして、格子状に形成された第一の板状片４間において切削ブレード２８を保護テープ２２の途中まで切り込み第二の素材２０が分割される。格子状に形成された全ての第一の板状片４間の第二の素材８の切削が遂行されると、第二の素材８は複数の第二の板状片６に分割される。切削ブレード２８の厚さｔ２は、溝切削工程で使用した切削ブレード１６の厚さｔ１よりも薄い厚さに形成されており、例えば50μmである。切削ブレード２８の厚さｔ２は５０μmであり、溝形成工程における溝７の形成に使用する切削ブレード１６の厚さｔ１の６０μmよりも薄い厚さにすることで、切削ブレード２８が第一の板状片４に触れることがなく、ゆえに第一の板状片４にダメージを与えることなく切削を行うことができる。また、切削ブレード２８は第二の素材８のみを切削するため、第二の素材８に適した種類のブレードを使用することができ、第二の素材８もチッピングや欠けを極力小さく切削を行うことができる。したがって、加工品質が良好な積層製品２を製造することができる。 (Cutting process)
After the grinding step, a cutting step is performed (FIG. 2 (e)). The second material 2 is sucked and held on the holding table 14 of the cutting device via the protective tape 22. Then, the cutting blade 28 is cut partway along the protective tape 22 between the first plate-like pieces 4 formed in a lattice shape, and the second material 20 is divided. When the cutting of the second material 8 between all the first plate-like pieces 4 formed in a lattice shape is performed, the second material 8 is divided into a plurality of second plate-like pieces 6. The thickness t2 of the cutting blade 28 is formed to be thinner than the thickness t1 of the cutting blade 16 used in the groove cutting process, and is 50 μm, for example. The thickness t2 of the cutting blade 28 is 50 μm. By making the thickness less than 60 μm of the thickness t1 of the cutting blade 16 used for forming the groove 7 in the groove forming step, the cutting blade 28 becomes the first plate. Cutting can be performed without touching the strip 4 and thus without damaging the first plate 4. Further, since the cutting blade 28 cuts only the second material 8, a blade of a type suitable for the second material 8 can be used, and the second material 8 also cuts chipping and chipping as much as possible. be able to. Therefore, the laminated product 2 with good processing quality can be manufactured.

本発明の製造方法で製造される積層製品の斜視図。The perspective view of the laminated product manufactured with the manufacturing method of this invention. 本発明の積層製品の製造方法を示す概略図。Schematic which shows the manufacturing method of the laminated product of this invention. 溝形成工程実施後の第一の素材を示す斜視図。The perspective view which shows the 1st raw material after groove formation process implementation. 貼着工程実施後の貼り合わされた第一の素材及び第二の素材を示す斜視図。The perspective view which shows the 1st raw material and the 2nd raw material which were bonded together after the sticking process implementation.

符号の説明Explanation of symbols

２ 積層製品
４ 第一の板状片
６ 第二の板状片
７ 溝
８ 第一の素材
１６,２８ 切削ブレード
２０ 第二の素材
２６ 研削砥石 2 Laminated product 4 First plate-like piece 6 Second plate-like piece 7 Groove 8 First material 16,28 Cutting blade 20 Second material 26 Grinding wheel

Claims (1)

硬脆性材料から形成された所定厚さの第一の板状片と第二の板状片とが積層された積層製品を製造するための製造方法であって、
硬脆性材料から形成された第一の素材の片面に切削ブレードを使用して該第一の板状片の寸法に対応して格子状に配列され且つ該所定厚さ以上の深さを有する溝を形成する溝形成工程と、
該溝形成工程の後に、該第一の素材の該片面に反りの発生を回避するのに充分な剛性を有する第二の素材を貼着する貼着工程と、
該貼着工程の後に、該第一の素材の他面を研削して該第一の素材を該所定厚さに研削し、該溝に沿って該第一の素材を複数個の第一の板状片に分割する研削工程と、
該研削工程の後に、該複数個の第一の板状片間を通して、該溝形成工程における該溝の形成に使用した該切削ブレードの厚さより薄い切削ブレードを該第二の素材に作用せしめて、該第二の素材を切削して、該第二の素材を複数個の第二の板状片に分割する切削工程と、
を含むことを特徴とする積層製品の製造方法。 A manufacturing method for manufacturing a laminated product in which a first plate-like piece and a second plate-like piece having a predetermined thickness formed from a hard and brittle material are laminated,
Groove having a first using a single-sided cutting blade material is arranged to correspond to the dimensions of said first plate-like pieces in a grid and the predetermined thickness or more depth formed of a hard brittle material Forming a groove;
After the groove forming step, a sticking step of sticking a second material having sufficient rigidity to avoid occurrence of warping on the one surface of the first material;
After the attaching step, the other surface of the first material is ground to grind the first material to the predetermined thickness, and the first material is moved along the groove to a plurality of first materials. Grinding process to divide into plate-shaped pieces;
After the grinding step, a cutting blade thinner than the thickness of the cutting blade used for forming the groove in the groove forming step is applied to the second material through the plurality of first plate-like pieces . , by cutting the said second material, and a cutting step of dividing said second material into a plurality of second plate-shaped pieces,
The manufacturing method of the laminated product characterized by including.
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JP4719042B2 (en) * 2006-03-16 2011-07-06 株式会社東芝 Manufacturing method of semiconductor device

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