JP2006281324A - Splitting method of plate-like body and method for manufacturing plate-like split body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a splitting method of a plate-like body, which can prevent an installation face, on which an electronic component is installed after splitting, from being contaminated and blemished, and a method for manufacturing a plate-like split body. <P>SOLUTION: In the splitting method of the plate-like body, the plate-like body 6, in which a splitting groove 7 for splitting is formed to a splitting scheduled part beforehand, is split along the splitting groove 7. After the plate-like body 6 is placed on a plate-like body placing die 11 on which the plate-like body 6 can be placed in a state of being deflected into an arcuate curved face shape, the plate-like body 6 is split by deflecting the plate-like body 6 into a curved face shape by pressing the splitting scheduled part from the upper face of the plate-like body 6. Consequently, insulating substrates 1 can be formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for dividing a plate-like body that is an assembly of substrates on which electronic components such as semiconductor elements are mounted, and a method for manufacturing a plate-like divided body obtained by dividing the plate-like body.

In general, a substrate for mounting an electronic component such as a semiconductor element on an upper surface is formed by dividing a large-area plate-like body along divided grooves formed in advance on the plate-like body at predetermined intervals. ing. As a method for dividing the plate-like body in which the division grooves for division are formed in this way, various division methods have been proposed in order to divide the plate-like body in a short time (for example, Patent Document 1). 2).
The former dividing method is to divide the plate-like body along the dividing groove by sandwiching and pressing the plate-like body with a clamping member composed of a lower mold having a concave curved surface and an upper mold having a convex curved surface. ing.
Moreover, the latter division | segmentation method uses a plate-shaped body division | segmentation apparatus provided with a pair of endless belts by which a plate-shaped object is opposingly arranged, and the press roller which urges | biases from one endless belt toward the other endless belt. It is divided.
JP-A-8-206999 JP 2002-18830 A

  However, the following problems remain in the conventional method for dividing a plate-like body. That is, in the conventional dividing method, when the plate-like body is divided, both the upper and lower surfaces of the plate-like body are sandwiched. In addition, an electronic component such as a semiconductor element may be mounted on one surface of the substrate formed by dividing the plate-like body after this, so that both upper and lower surfaces of the plate-like body are sandwiched. As a result, the surface of the substrate may be contaminated or scratched. In addition, there is a problem that the yield when electronic components are mounted may decrease due to contamination or scratches on the mounting surface of the substrate.

  The present invention has been made in view of the above-described conventional problems, and provides a plate-like body dividing method and a plate-like divided body manufacturing method that suppresses contamination and scratches on a mounting surface on which electronic components are mounted after division. The purpose is to do.

  The present invention employs the following means in order to solve the above problems. That is, the plate-like body dividing method according to the present invention is the plate-like body dividing method in which the plate-like body in which the division grooves for division are formed in advance in the portion to be divided is divided along the division grooves. After placing the plate-like body on a plate-like body mounting mold that can be placed in a state where the plate-like body is curved in a curved shape, the plate-like body is pressed from the upper surface of the plate-like body to press the divided portion A plate-like divided body is formed by dividing the plate-like body while curving the body in a curved shape.

According to this invention, the plate-like body in which the dividing grooves are formed is divided into curved surfaces by pressing the plate-like bodies along the dividing grooves of the plate-like bodies. Here, since only the portion to be divided of the plate-like body is pressed, the upper surface of the plate-like divided body formed by dividing from the plate-like body so as not to contact the mounting surface on which electronic components such as semiconductor elements are mounted It is divided into. Therefore, since the mounting surface is prevented from being contaminated or damaged, it is possible to satisfactorily mount electronic components and the like on the divided plate-like divided body.
In addition, since the force pressed against the planned division portion is concentrated, the plate-like body can be more reliably divided along the division grooves without causing unnecessary bending force in places other than the planned division portion. . Thereby, dimensional variation is suppressed and the flatness of the divided section is improved, and the yield of the divided plate-like divided bodies is improved.

In the plate-like body dividing method of the present invention, it is preferable that the plate-like body mounting mold can be placed in a state where the plate-like body is bent into an arcuate curved surface.
According to the present invention, the plate-like body is placed on the plate-like body placing mold, and the plate-like body is divided while being bent in an arc shape by pressing the part to be divided.

In the plate-like body dividing method according to the present invention, the plate-like body mounting mold has higher flexibility than the plate-like body, and the plate-like body is pressed when the division-scheduled portion is pressed. Is preferably supported in a curved shape.
According to this invention, when the division | segmentation scheduled part is pressed, it divides | segments, curving the applicable location of the pressed plate-shaped object in the shape of a curved surface.

Further, in the method for dividing a plate-like body according to the present invention, after the plate-like body is placed on the plate-like body placing mold, the upper side comb teeth which are a plurality of protrusions are scheduled to be divided into the plate-like body. It is preferable to divide the plate-like body by abutting against the portion and pressing.
According to the present invention, the plate-like body is divided into curved surfaces by pressing the upper-side comb teeth on the upper surface of the plate-like body so as to be in contact with the portion to be divided. Therefore, similarly to the above, contamination and damage of the mounting surface are suppressed.

Further, in the plate-like body dividing method of the present invention, after placing the plate-like body on the plate-like body placing mold,
A plurality of ridges projecting radially from the peripheral surface are circumferentially spaced from each other, and the divided portions of the plate-like body are pressed by the ridges while rotating the roller on the plate-like body. Thus, the plate-like body may be divided, and at the time of the division, the two ridges adjacent in the circumferential direction may be in contact with the scheduled division portion of the plate-like body.
According to this invention, the roller is rotated and moved on the plate-like body, and the protrusion is brought into contact with the upper surface of the plate-like body along the planned division portion and pressed to make the plate-like body curved. And split. Therefore, similarly to the above, contamination and damage of the mounting surface are suppressed. And since two protrusions contact | abut the division | segmentation planned part at the time of a division | segmentation, it is suppressed that a plate-shaped division body jumps by reaction of division.

Further, in the plate-like body dividing method of the present invention, the plate-like body mounting mold includes a mounting base and lower surface side comb teeth that are a plurality of protrusions formed on the mounting base, When placing the plate-like body and curving it into a curved surface, it is preferable that the tips of the lower surface side comb teeth come into contact with the scheduled division portion.
According to the present invention, when the plate-shaped body is placed on the plate-shaped body mounting mold, the lower surface side comb teeth come into contact with only the planned division portion of the plate-shaped body. Reduce backside contamination.
Further, after the plate-like divided body is divided and formed, the plate-like divided body is supported by lower surface side comb teeth located on both sides of the substrate. Accordingly, it is possible to prevent the plate-like divided bodies from coming into contact with each other and being damaged.

Moreover, the manufacturing method of the plate-shaped divided body of the present invention includes the step of forming a dividing groove for dividing in a portion to be divided of the plate-shaped body and the plate-shaped divided method described above, And a step of sequentially dividing along the dividing groove.
According to the present invention, since the plate-like body is divided by the above-described dividing method after the dividing groove is formed, the plate-like divided body in which contamination and damage on the mounting surface are suppressed can be easily manufactured.

  According to the plate-like body dividing method and the plate-like divided body manufacturing method according to the present invention, the substrate is divided and formed by being held and pressed so as to contact only the portion to be divided in the plate-like body. It is possible to suppress the mounting surface from being contaminated or damaged. Therefore, an electronic component or the like can be stably mounted on the plate-like divided body.

DESCRIPTION OF EMBODIMENTS Hereinafter, a first embodiment of a plate-like body dividing method and a plate-like divided body manufacturing method according to the present invention will be described with reference to the drawings.
The plate-like body dividing method in the present embodiment is a method of dividing and forming an insulating substrate (plate-like divided body) 1 as shown in FIGS.
As shown in FIG. 1, the insulating substrate 1 includes a plate-like ceramic 3 such as AlN (aluminum nitride) and a high heat such as Al (aluminum) disposed by brazing on both upper and lower surfaces of the plate-like ceramic 3. Conductor layers 4 and 5 are provided. In the present embodiment, the plate-like ceramic 3 has a vertical dimension L1 of, for example, 33 mm and a horizontal dimension L2 of, for example, 21.5 mm. Further, the vertical dimension L3 of the high thermal conductor layers 4 and 5 is, for example, 30 mm, and the horizontal dimension L4 is, for example, 20 mm.

  And this insulating substrate 1 is manufactured by dividing | segmenting along the division | segmentation groove | channel 7 formed in the plate-shaped body 6 in which the some insulating substrate 1 is formed. The dividing grooves 7 are formed on the one surface of the plate-like body 6 at regular intervals in two directions in the surface. In the present embodiment, the dividing groove 7 has a depth L5 of, for example, 0.1 mm. In addition, you may change suitably the dimension of the insulated substrate 1, and the depth of the division | segmentation groove | channel 7 according to design.

As shown in FIG. 2, the dividing device 10 includes a plate-like body placing mold 11 and a plate-like body pressing mold 12 that sandwich the plate-like body 6.
The plate-like body mounting die 11 includes a mounting base 13 and lower surface side comb teeth 14 which are a plurality of protrusions formed in a direction perpendicular to the mounting base 13 from one surface of the mounting base 13. Has been.
The lower side comb teeth 14 have the same distance as the dividing grooves 7 so that the tips thereof come into contact with the dividing grooves 7 of the plate-like body 6 when the plate-like body 6 is placed on the plate-like body placing mold 11. Is provided. And the envelope surface formed by connecting the front-end | tip of the lower surface side comb-tooth 14 is a concave curved surface which has a predetermined curvature radius. Here, the curvature radius R <b> 1 of the curved surface formed by connecting the tips of the lower surface side comb teeth 14 is set according to the bending curvature of the plate-like body 6. In the present embodiment, the radius of curvature R1 is 1000 mm.

The plate-like body pressing die 12 is a plurality of protrusions formed in a direction perpendicular to the pressing base 15 from one surface of the pressing base 15 and the pressing base 15, similarly to the plate-like body mounting die 11. The upper surface side comb teeth 16 are included.
Similarly to the lower surface side comb teeth 14, the upper surface side comb teeth 16 are configured such that, when the plate body 6 is sandwiched between the plate body mounting molds 11, the tips of the upper surface side comb teeth 16 come into contact with the planned division portions of the plate body 6. , Provided at the same interval as the dividing groove 7. And the envelope surface formed by connecting the front-end | tip of the upper surface side comb tooth 16 is a convex curved surface which has a predetermined curvature radius. Here, the curvature radius R2 of the curved surface formed by connecting the tips of the upper surface side comb teeth 16 is set according to the bending curvature of the plate-like body 6 as described above. In the present embodiment, the radius of curvature R2 is 1000 mm as in the case of the plate-like body mounting die 11.

Next, a method for manufacturing the insulating substrate 1 will be described.
First, the dividing grooves 7 are formed in the planned dividing portion at predetermined intervals on the upper and lower surfaces of the plate-like ceramic 3. Next, while the divided grooves 7 are formed, a plurality of rectangular Al plates are brazed to form the high thermal conductor layers 4 and 5. In this way, the plate-like body 6 is manufactured. Thereafter, the insulating substrate 1 is manufactured by dividing the plate-like body 6 using the dividing apparatus 10 having the above-described configuration.

Here, a method for dividing the plate-like body 6 using the dividing device 10 will be described. First, the plate-like body 6 is formed so that the surface on which the dividing grooves 7 are formed is the lower surface, and the plate-like body 6 is such that the planned division portion thereof coincides with each of the lower surface side comb teeth 14 of the plate-like body mounting die 11. Deploy. Next, the plate-like body pressing mold 12 is arranged so that the upper surface side comb teeth 16 face the lower surface side comb teeth 14 of the plate body mounting mold 11 with the plate body 6 interposed therebetween.
When the plate-like body 6 is pressed by the plate-like body placing die 11 and the plate-like body pressing die 12, the plate-like body 6 is brought into contact with the lower surface side comb teeth 14 or the upper surface side comb teeth 16 to be mounted on the plate body. It warps in a convex curved surface shape toward the mold 11. When further pressed, the plate-like body 6 is cut along the dividing groove 7 by warping in a curved shape exceeding the amount of bending that can elastically return. As described above, the insulating substrate 1 is divided and formed from the plate-like body 6. Here, the pressure applied to the plate-like body 6 by the plate-like body placing die 11 and the plate-like body pressing die 12 is the depth of the divided grooves 7 formed in the plate-like body 6, the elastic force of the plate-like body 6, and the like. However, the pressure required for the plate-like body 6 to follow the lower surface side comb teeth 14 and the upper surface side comb teeth 16 may be sufficient.

  At this time, the lower surface side comb teeth 14 and the upper surface side comb teeth 16 are in contact with the scheduled division portions of the plate-like body 6 to be sandwiched, and the high thermal conductor layers 4 formed on both surfaces of the plate-like ceramic 3 at the time of division, 5 and no contact. Further, when the plate-like body 6 sandwiched and pressed by the plate-like body placing die 11 and the plate-like body pressing die 12 is divided, the divided insulating substrate 1 is positioned on both sides of the insulating substrate 1 on the lower surface side comb. It is held by teeth 14. Therefore, the high thermal conductor layer 4 on the lower side of the insulating substrate 1 is not in contact with the mounting base 13.

  The insulating substrate 1 manufactured in this way is mounted with a heating element such as a semiconductor element on the surface of one high thermal conductor layer 4 and a heat sink on the surface of the other high thermal conductor layer 4. A power module structure is formed.

As described above, according to the method for dividing the plate-like body 6 and the method for manufacturing the insulating substrate 1 according to the present embodiment, the lower surface side comb teeth 14 and the upper surface side comb teeth 16 are in contact with the plate-shaped ceramics 3 at the time of division. Since the high thermal conductor layers 4 and 5 are not in contact with each other, the high thermal conductor layers 4 and 5 are not contaminated or damaged by the division. Therefore, when an electronic component such as a semiconductor element is mounted on the upper surface of the high thermal conductor layer 4 after the insulating substrate 1 is dividedly formed, the cleanliness of the high thermal conductor layer 4 is maintained so that the electronic component is good. Can be mounted on.
In addition, the insulating substrate 1 formed in a divided manner is held by lower surface side comb teeth 14 located on both sides of the insulating substrate 1, and the high thermal conductor layer 4 on the lower side of the insulating substrate 1 divided into the mounting base 13 is formed. The high thermal conductor layer 5 is also prevented from being contaminated because it does not contact. Furthermore, since the divided insulating substrates 1 are respectively held by the lower surface side comb teeth 14, the divided insulating substrates 1 are prevented from coming into contact with each other to damage the high thermal conductor layers 4 and 5.

  Next, a second embodiment of the plate-like body dividing method according to the present invention will be described with reference to FIG. The basic configuration of the embodiment described here is the same as that of the first embodiment described above, and another element is added to the first embodiment described above. Therefore, in FIG. 4, the same components as those in FIG.

  The difference between the second embodiment and the first embodiment is that, in the first embodiment, the plate-like body 6 is sandwiched and pressed by the plate-like body placing die 11 and the plate-like body pressing die 12 so as to be plate-like. Although the body 6 is divided along the dividing groove 7, in this embodiment, the plate-like body 6 is sandwiched between the plate-like body placing die 11 and the plate-like body pressing die 12 and then pressed using the roller 21. It is a point which divides the plate-like body 6 by.

That is, as shown in FIG. 4, the dividing device 22 in the present embodiment includes a plate-like body placing mold 11 and a plate-like body pressing mold 12, and a roller 21 that rotates and moves on the plate-like body pressing mold 12. Yes.
The roller 21 is configured such that its rotational axis moves in parallel along a curved surface formed by connecting the tips of the lower surface side comb teeth 14 of the plate-like object mounting die 11.
In order to divide the plate-like body 6 using this dividing device 22, the dividing grooves 7 are made to coincide with the lower surface side comb teeth 14 of the plate-like object mounting die 11 as in the first embodiment described above. The plate-like body 6 is disposed on the surface. Next, the plate-like body pressing die 12 is similarly arranged. Thereafter, the roller 21 is rotated and moved in contact with the plate-like body pressing die 12, and the plate-like body 6 is sandwiched and pressed by the plate-like body placing die 11 and the plate-like body pressing die 12. As described above, the insulating substrate 1 is dividedly formed from the plate-like body 6.

  As described above, the method for dividing the plate-like body 6 of the present embodiment can have the same operations and effects as those of the first embodiment described above.

  Next, a third embodiment of the plate-like body dividing method according to the present invention will be described with reference to FIG. The basic configuration of the embodiment described here is the same as that of the first embodiment described above, and another element is added to the first embodiment described above. Therefore, in FIG. 5, the same components as those in FIG.

  The difference between the third embodiment and the first embodiment is that, in the first embodiment, the plate-like body 6 is sandwiched and pressed by the plate-like body placing die 11 and the plate-like body pressing die 12 so as to be plate-like. Although the body 6 is divided along the dividing groove 7, in this embodiment, after the plate-like body 6 is placed on the plate-like body placing mold 11, the protrusions 31 are formed from the upper surface of the plate-like body 6. It is a point which divides | segments the plate-shaped body 6 by pressing using the roller 32 which has it.

That is, as shown in FIG. 5, the dividing device 33 in the present embodiment includes a plate-like body mounting mold 11 and a roller 32 that rotates on the plate-like body 6.
The roller 32 is rotatable on the plate-like body 6 and includes a columnar base 34 and ridges 31 provided radially on the peripheral surface of the base 34 with respect to the base 34. The protrusions 31 are provided so that the distance in the circumferential direction of the base body 34 at the tip thereof coincides with the distance between the divided grooves 7 formed in the plate-like body 6.

  In order to divide the plate-like body 6 using this dividing device 33, the dividing groove 7 coincides with the respective tips of the lower surface side comb teeth 14 of the plate-like object mounting die 11 as in the first embodiment described above. The plate-like body 6 is arranged as described above. Next, the roller 32 is moved while rotating along a concave curved surface formed by connecting the tips of the lower surface side comb teeth 14 on the upper surface of the plate-like body 6. Of the plurality of protrusions 31 provided on the peripheral surface of the roller 32, two adjacent in the circumferential direction of the base body 34 abut against the dividing groove 7 of the plate-like body 6. The plate-like body 6 is divided along the dividing grooves 7 by sandwiching and pressing the plate-like body 6 between the lower surface side comb teeth 14 and the protrusions 31. At this time, since the two protrusions 31 are in contact with the planned division portion, the insulating substrate 1 divided and formed due to the reaction of the division is prevented from jumping. Thereafter, the roller 32 is rotated on the upper surface of the plate-like body 6, and the protrusions 31 are sequentially brought into contact with the dividing grooves 7 of the plate-like body 6 to divide the plate-like body 6.

  As described above, the method for dividing the plate-like body 6 of the present embodiment can have the same operations and effects as those of the first embodiment described above.

  Next, a fourth embodiment of the plate-like body dividing method according to the present invention will be described with reference to FIG. The basic configuration of the embodiment described here is the same as that of the above-described second embodiment, and another element is added to the above-described second embodiment. Therefore, in FIG. 6, the same components as those in FIG. 4 are denoted by the same reference numerals, and the description thereof is omitted.

  The difference between the fourth embodiment and the second embodiment is that, in the second embodiment, the plate-like body 6 is clamped while being bent in an arc shape by the plate-like placement die 11 and the plate-like body pressing die 12. However, in this embodiment, the dividing device 40 is provided with a plate-like body mounting die 41 and a plate-like body pressing die 42 having higher flexibility than the plate-like body 6.

That is, as shown in FIG. 6, the dividing device 40 in the present embodiment includes a plate-like body mounting die 41, a plate-like member pressing die 42, and the roller 21.
The plate-like body mounting mold 41 is made of a material having higher flexibility than the plate-like body 6, and is perpendicular to the mounting base 43 from one surface of the mounting base 43 and the mounting base 43. It is comprised with the lower surface side comb-tooth 44 formed in the direction. And the lower surface side comb-tooth 44 is formed so that the envelope surface formed by connecting the front-end | tip may become a plane. Note that the plate-like body mounting mold 41 is placed on the elastic floor 45.
The plate-like body pressing die 42 is formed of a material having higher flexibility than the plate-like body 6, similarly to the plate-like body mounting die 41, and includes a pressing base 46, upper surface side comb teeth 47, and the like. It consists of And the upper surface side comb-tooth 47 is formed so that the envelope surface formed by connecting the front-end | tip may become a plane.

In order to divide the plate-like body 6 using the dividing device 40, the dividing groove 7 is brought into contact with each of the lower surface side comb teeth 44 of the plate-like body placing mold 41 as in the second embodiment. To place. Next, the plate-like body pressing die 42 is similarly arranged. Thereafter, the roller 21 is rotated while applying pressure to the plate-like body pressing die 42 in a state where the roller 21 is in contact with the plate-like body pressing die 42, and the plate-like body placing die 41 and the plate-like body pressing die 42 form a plate shape. The body 6 is pinched and pressed.
At this time, since the plate-like body mounting mold 41 and the plate-like body pressing die 42 have higher flexibility than the plate-like body 6, the plate-like body pressed by the roller 21 as shown in FIG. The corresponding portions of the mounting die 41 and the plate-like body pressing die 42 are deformed into a curved surface. Further, since the corresponding part of the plate-like body 6 is also curved in a curved shape, the plate-like body 6 is divided along the dividing grooves 7. Thereafter, the plate 21 is divided by rotating the roller 21 to sequentially warp the plate 6 in a curved surface. As described above, the insulating substrate 1 is dividedly formed from the plate-like body 6.

As described above, the method for dividing the plate-like body 6 of the present embodiment can have the same operations and effects as those of the second embodiment described above.
In the present embodiment, as shown in FIG. 8, the plate-like body 6 is divided using the dividing device 50 including the plate-like body placement mold 41 and the roller 32, as in the third embodiment described above. Also good. Even if it does in this way, it can have the effect | action and effect similar to 3rd Embodiment mentioned above.

In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, in the above-described embodiment, the insulating substrate has a structure in which Al is bonded to both surfaces of AlN. However, the insulating substrate is not limited to AlN, and is not limited to Al ₂ O ₃ (aluminum oxide) or Si ₃ N ₄ (silicon nitride). Other ceramic materials may be used, and not only Al but also other metal materials such as Cu (copper) may be used.
Moreover, in the said embodiment, although it has the structure which has arrange | positioned six insulating substrates in one direction which is the transversal direction of an insulating substrate, other plurality may be sufficient and as shown in FIG. It is good also as a structure arrange | positioned in the two directions which are the transversal direction of this, and a longitudinal direction, ie, the arrow A direction shown in FIG.
Further, the dividing grooves may be formed not only on one surface of the plate-like body but also on both surfaces.

Moreover, you may change suitably the arrangement | positioning space | interval of a lower surface side comb tooth, an upper surface side comb tooth, and a protrusion according to the space | interval of the division | segmentation groove | channel currently formed in the plate-shaped body. And you may change a curvature radius suitably according to the bending curvature of a plate-shaped object.
Moreover, the lower surface side comb teeth, the upper surface side comb teeth, or the protrusions may be made of a resin that can be deformed in accordance with the curved surface shape of the plate-like body in contact therewith.

The plate-shaped body in the 1st Embodiment of this invention is shown, (a) is a perspective view, (b) is the elements on larger scale. It is a front view which shows the division | segmentation apparatus in the 1st Embodiment of this invention. It is explanatory drawing which shows the division | segmentation method using the division | segmentation apparatus of FIG. It is a front view which shows the division | segmentation apparatus in the 2nd Embodiment of this invention. It is a front view which shows the division | segmentation apparatus in the 3rd Embodiment of this invention. It is a front view which shows the division | segmentation apparatus in the 4th Embodiment of this invention. It is explanatory drawing which shows the division | segmentation method using the division | segmentation apparatus of FIG. It is a front view which shows the division | segmentation apparatus which can apply this invention other than the 4th Embodiment of this invention. It is a perspective view which shows the other plate-shaped object which can apply this invention.

Explanation of symbols

1 Insulating substrate (plate-shaped divided body)
6 Plate-like body 7 Divided grooves 11 and 41 Plate-like body placing molds 14 and 44 Lower surface side comb teeth 16 and 47 Upper surface side comb teeth 31 ridge 32 Roller

Claims (7)

In the plate-like body dividing method for dividing the plate-like body in which the division grooves for division are formed in the planned division portion in advance along the division grooves,
After placing the plate-like body on a plate-like body placing mold that can be placed in a state where the plate-like body is curved in a curved shape,
Dividing the plate-like body by forming the plate-like divided body by dividing the plate-like body while pressing the planned division portion from the upper surface of the plate-like body and curving the plate-like body into a curved shape Method.   2. The plate-like body dividing method according to claim 1, wherein the plate-like body placing mold can be placed in a state where the plate-like body is bent into an arcuate curved surface.   The plate-like body mounting mold has higher flexibility than the plate-like body, and supports the plate-like body in a curved shape when the division-scheduled portion is pressed. 2. A method for dividing a plate-like body according to 1. After placing the plate-like body on the plate-like body placing mold,
4. The plate-like body is divided by pressing upper surface side comb teeth, which are a plurality of ridges, into contact with the division-scheduled portion of the plate-like body and pressing it. 5. The method for dividing a plate-like body according to Item. After placing the plate-like body on the plate-like body placing mold,
A plurality of ridges projecting radially from the peripheral surface are circumferentially spaced from each other, and the divided portions of the plate-like body are pressed by the ridges while rotating the roller on the plate-like body. Thus, the plate-like body is divided, and at the time of the division, the two protrusions adjacent in the circumferential direction are in contact with the scheduled division portion of the plate-like body. The division method of the plate-shaped body of any one of Claim 1 to 3. The plate-like body mounting mold includes a mounting base and lower surface side comb teeth that are a plurality of protrusions formed on the mounting base;
The plate according to any one of claims 1 to 5, wherein when the plate-like body is placed and bent into a curved shape, a tip of the lower surface side comb teeth comes into contact with the scheduled division portion. How to divide the object. A step of forming a dividing groove for division in a division portion of the plate-like body;
A method for producing a plate-like divided body, comprising the step of sequentially dividing the plate-like body along the dividing groove by the method for dividing a plate-like body according to any one of claims 1 to 6. Method.

Images