CN111916356A - Breaking method of metal laminated ceramic substrate - Google Patents
Breaking method of metal laminated ceramic substrate Download PDFInfo
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- CN111916356A CN111916356A CN202010581467.5A CN202010581467A CN111916356A CN 111916356 A CN111916356 A CN 111916356A CN 202010581467 A CN202010581467 A CN 202010581467A CN 111916356 A CN111916356 A CN 111916356A
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- ceramic substrate
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- laminated
- groove
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- 239000000758 substrate Substances 0.000 title claims abstract description 126
- 239000000919 ceramic Substances 0.000 title claims abstract description 110
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 68
- 239000002184 metal Substances 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000000059 patterning Methods 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000010408 film Substances 0.000 description 45
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Abstract
The present invention relates to a method for dividing a metal laminated ceramic substrate, which is a method for dividing a laminated ceramic substrate in which a metal film is laminated on the entire surface of one surface of a ceramic substrate. Used for dividing a laminated ceramic substrate laminated with a metal film on a ceramic substrate. The breaking method comprises the following steps: processing a groove on the metal film by using a patterning tool along the scribing predetermined line of the laminated ceramic substrate without scribing the ceramic substrate; scribing from the surface of the ceramic substrate along the groove from which the metal film is removed; and breaking the laminated ceramic substrate by aligning the scribe lines. By the method, the laminated ceramic substrate can be completely broken.
Description
The present application is a divisional application of an invention patent application entitled "method for dividing a multilayer ceramic substrate and a tool for processing a groove" having application No. 201310381702.4, and the filing date of the original application is 26/08/2013.
Technical Field
The present invention relates to a method for dividing a multilayer ceramic substrate having a metal film laminated on a ceramic substrate, and a tool for processing a groove.
Background
Conventionally, when a laminated ceramic substrate having a metal film laminated on a ceramic substrate is divided, the division is often performed by using a dicing saw or the like. Patent document 1 proposes a method for manufacturing a ceramic bonded substrate in which a metal layer is bonded after a ceramic substrate is scribed, and the scribed metal layer is removed by etching and then broken.
The above patent document 1 has the following problems: the metal thin film must be scribed before the ceramic substrate is laminated, and the laminated ceramic substrate cannot be divided.
In order to divide the laminated multilayer ceramic substrate, as shown in fig. 1(a), a case will be described in which a multilayer substrate 100 having a ceramic substrate 101 and a metal film 102 laminated thereon is cut and then broken. First, as shown in fig. 1(b), the surface of the ceramic substrate 101 is scribed by a scribing wheel 103, and as shown in fig. 1(c), the ceramic substrate 101 is pressed by a breaking bar 104 from the side to be broken. In this case, since the metal film 102 is not separated even if the ceramic substrate 101 is separated, there is a problem that complete separation cannot be performed because the metal film 102 is not separated even if breaking is performed, as shown in fig. 1 (d).
As another method, as shown in fig. 2(a) and 2(b), the surface of the metal film 102 of the multilayer ceramic substrate 100 is scribed by using a scribing wheel 103. Then, as shown in fig. 2(c), even if the multilayer ceramic substrate is to be divided by the breaking bar 104, a sufficient vertical crack is not formed in the metal film 102, and a vertical crack is not generated on the ceramic substrate 101 side. Therefore, there is a problem that the sheet is difficult to break and cannot be separated, or cannot be separated by a scribe line as shown in fig. 2 (d).
[ Prior Art document ]
[ patent document ]
[ patent document 1] Japanese patent laid-open No. 2009-252971
Disclosure of Invention
The invention provides a method for dividing a metal laminated ceramic substrate and a tool for processing a groove, which can completely divide and individualize a laminated ceramic substrate laminated with a metal film on a ceramic substrate.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. The method for dividing the laminated ceramic substrate is a method for dividing the laminated ceramic substrate with a metal film laminated on the ceramic substrate, wherein the metal film is processed by a patterning tool along a scribing prearranged line of the laminated ceramic substrate, and the groove from which the metal film is removed is scribed from the surface of the ceramic substrate, so that the laminated ceramic substrate is consistent with the scribing line and is broken.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. The method for dividing a laminated ceramic substrate having a ceramic substrate laminated with a metal film includes scribing a surface of the ceramic substrate along a planned scribing line of the laminated ceramic substrate, and performing groove processing on the metal film from the surface of the metal film along the scribing line of the ceramic substrate by using a patterning tool to make the laminated ceramic substrate consistent with the scribing line and break the laminated ceramic substrate.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. The invention provides a method for dividing a laminated ceramic substrate having a metal film laminated on a ceramic substrate, which comprises performing groove processing on the metal film along a predetermined scribing line of the ceramic substrate by using a patterning tool, scribing the ceramic substrate along a groove without the metal film from the surface of the metal film by rotating a scribing wheel, and breaking the ceramic substrate in accordance with the scribing line of the laminated ceramic substrate.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. The groove processing tool of the present invention is a groove processing tool for performing groove processing by removing a part of a metal film laminated ceramic substrate, which can be used in the method for dividing a laminated ceramic substrate as described above, and has a cutting edge in any one of a truncated cone shape, a corner column shape, and a shape obtained by cutting right and left corner column shapes.
Here, the scribing of the ceramic substrate may be performed by using a scribing wheel.
By the technical scheme, the breaking method of the metal laminated ceramic substrate and the tool for processing the groove at least have the following advantages and beneficial effects: according to the present invention having such a feature, the metal film is removed in a band-like manner by performing groove processing along a scribe line on the multilayer ceramic substrate in which the metal film is laminated on the ceramic substrate. Then, the ceramic substrate is scribed from the surface of the ceramic substrate or from the groove from which the metal film is removed, and then the laminated ceramic substrate is reversed and broken. Therefore, the metal film can be prevented from peeling off, and the metal film can be completely divided into desired shapes and individualized, and the end face precision can be improved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIGS. 1(a), (b), (c) and (d) are diagrams showing the dividing process in the case of scribing and breaking from the ceramic substrate side of the multilayer ceramic substrate.
Fig. 2(a), (b), (c), and (d) show the state when the multilayer ceramic substrate is broken by scribing from the metal film side.
Fig. 3(a), (b), (c) and (d) are views showing the dividing process (groove processing and scribing) of the multilayer ceramic substrate according to embodiment 1 of the present invention.
Fig. 4(e) and (f) are views showing the dividing process (breaking) of the multilayer ceramic substrate according to embodiment 1 of the present invention.
Fig. 5(a), (b), (c) and (d) are views showing the dividing process (groove processing and scribing) of the multilayer ceramic substrate according to embodiment 2 of the present invention.
Fig. 6(e) and (f) are views showing the dividing process (breaking) of the multilayer ceramic substrate according to embodiment 2 of the present invention.
Fig. 7(a), 7(b), and 7(c) are diagrams of a patterning tool used for groove processing of the metal film used in this embodiment.
[ description of main element symbols ]
10: multilayer ceramic substrate 11: ceramic substrate
12: metal film 12 a: groove
13. 14: scoring wheels 15, 16: supporting member
17: adhesive tape 18: breaking rod
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be made with reference to the accompanying drawings and preferred embodiments of the present invention for describing the specific embodiments, structures, features and effects of the method for dividing a metal laminated ceramic substrate and the tool for processing a groove according to the present invention.
< embodiment 1 >
Fig. 3(a) shows a multilayer ceramic substrate 10 to be divided (hereinafter simply referred to as "multilayer substrate") having a metal film 12 formed on a ceramic substrate 11. Here, the Ceramic substrate 11 may be an LTCC (Low-Temperature Co-fired Ceramic) substrate, or a Ceramic substrate of alumina, aluminum nitride, barium titanate, silicon nitride, or the like. The metal film 12 is a thin film of nickel, silver, gold, copper, platinum, or the like, and has a thickness of, for example, 10 to 20 μm. In this case, the metal film 12 may be formed with some patterns. When the laminated substrate 10 is divided into pieces in a specific pattern, first, as shown in fig. 3(b), the metal film 12 is removed from the ceramic substrate 11 side along a scribe line by a patterning tool. The metal film is removed by linearly removing a part of the metal film 12 using the patterning tool 13 using, for example, a scribing apparatus used as a groove processing tool of a solar cell, for example, a scribing apparatus of japanese patent laid-open publication No. 2011-216646. The cross-sectional view at this time is shown in fig. 3 (c). The width of the trench 12a is, for example, 25 to 200 μm. The patterning tool 13 in this case may be a truncated cone shaped tool as shown in fig. 7 (a). Further, as shown in fig. 7(b), a tool having a cutting edge in a shape of a rectangular column may be used, and as shown in fig. 7(c), a tool having a shape in which a rectangular column is cut in the left and right directions may be used. Further, not only the tip of the tool but also the entire tool may be in a shape of a horn.
Then, the multilayer substrate 10 with the grooves formed thereon is reversed as shown in fig. 3(d) to scribe the ceramic substrate 11 along the scribe lines. The scribing is performed by pressing the scribing wheel 14 with a fixed load by a not-shown scribing device and rotating it to vertically penetrate the crack to form the scribing line S1. Preferably, the scoring wheel used for scoring is one that is capable of high penetration scoring. For example, as shown in japanese patent document No. 3074143, a scribing wheel having a large number of grooves formed at a predetermined interval on the circumferential surface and formed as a protrusion therebetween is proposed.
Then, as shown in fig. 4(e), the laminated substrate 10 is inverted, the tape 17 is disposed on the upper surfaces of the pair of support members 15 and 16 of the breaking device, and the laminated substrate 10 is disposed so that the scribe line is positioned between the support members 15 and 16. Then, the breaking bar 18 is pressed from the upper portion thereof along the scribe line S1 and broken. In this way, as shown in fig. 4(f), the laminated substrate can be completely cut along the scribe line, and the end face accuracy can be improved. The laminated ceramic substrate is divided into individual laminated substrate chips in a lattice-like manner.
Further, in this embodiment, the scribing is performed by rotating the scribing wheel using the scribing device in the step of fig. 3(d), but the scribing may be performed by a laser scribing device. In the step of fig. 4(e), the chips are broken by using a breaking device, but instead of this, when the shape of the divided chips is relatively large, the operator may directly divide the chips by hand. In which case the adhesive tape 17 is not required.
In this embodiment, as shown in fig. 3(b) and (c), the metal film is subjected to the groove processing, and then the ceramic surface is scribed by reversing the groove processing.
< embodiment 2 >
Fig. 5(a) shows a multilayer ceramic substrate 10 to be divided (hereinafter simply referred to as "multilayer substrate") having a metal film 12 formed on a ceramic substrate 11. Here, the ceramic substrate 11 may be an LTCC substrate, or may be a ceramic substrate of alumina, aluminum nitride, barium titanate, silicon nitride, or the like. The metal film 12 is a thin film of nickel, silver, gold, copper, platinum, or the like, and has a thickness of, for example, 10 to 20 μm. In this case, the metal film 12 may be formed with some patterns. When the laminated substrate 10 is divided into pieces in a specific pattern, first, as shown in fig. 5(b), the metal film 12 is removed from the ceramic substrate 11 side along a scribe line with a constant width by a patterning tool. The metal film is removed by linearly removing a part of the metal film 12 using the patterning tool 13 using, for example, a scribing apparatus used as a groove processing tool of a solar cell, for example, a scribing apparatus of japanese patent laid-open publication No. 2011-216646. The cross-sectional view at this time is shown in fig. 5 (c). The width of the trench 12a is, for example, 25 to 200 μm. The patterning tool 13 in this case may be a truncated cone shaped tool as shown in fig. 7 (a). Further, as shown in fig. 7(b), a tool having a cutting edge in a shape of a rectangular column may be used, and as shown in fig. 7(c), a tool having a shape in which a rectangular column is cut in the left and right directions may be used. Further, not only the tip of the tool but also the entire tool may be in a shape of a horn.
Then, the ceramic substrate 11 inside the band-shaped groove 12a from which the metal film is removed from the surface of the formed metal film 12 is scribed. The scribing is performed by pressing the scribing wheel 14 with a fixed load by a not-shown scribing device and rotating it to vertically penetrate the crack to form the scribing line S1. Preferably, the scoring wheel used for scoring is one that is capable of high penetration scoring. For example, as shown in japanese patent document No. 3074143, a scribing wheel having a large number of grooves formed at a predetermined interval on the circumferential surface and formed as a protrusion therebetween is proposed.
Then, as shown in fig. 6(e), the laminated substrate 10 is inverted, the tape 17 is disposed on the upper surfaces of the pair of support members 15 and 16 of the breaking device, and the laminated substrate 10 is disposed so that the scribe line is positioned between the support members 15 and 16. Then, the breaking bar 18 is pressed from the upper portion thereof along the scribe line S1 and broken. In this way, as shown in fig. 6(f), the laminated substrate can be completely cut along the scribe line, and the end face accuracy can be improved. The laminated ceramic substrate is divided into individual laminated substrate chips in a lattice-like manner. In this embodiment, since the groove processing is performed on the metal film and the ceramic surface is scribed from the groove of the metal film as shown in fig. 5(b) and (c), the laminated substrate does not need to be inverted during this period, and the operation efficiency can be improved.
Further, in this embodiment, the scribing is performed by rotating the scribing wheel using the scribing device in the step of fig. 5(d), but the scribing may be performed by a laser scribing device. In the step of fig. 6(e), the chips are broken by using a breaking device, but instead of this, when the shape of the divided chips is relatively large, the operator may directly divide the chips by hand. In which case the adhesive tape 17 is not required.
[ industrial applicability ]
The present invention can easily divide a laminated substrate in which a metal film is laminated on a ceramic substrate by using a patterning tool and a scribing device, and is effective for manufacturing a minute laminated substrate.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A method for dividing a multilayer ceramic substrate having a metal film laminated on the entire surface of one surface of a ceramic substrate, the method comprising:
processing a groove on the metal film by using a patterning tool along the scribing predetermined line of the laminated ceramic substrate without scribing the ceramic substrate;
scribing from the surface of the ceramic substrate along the groove from which the metal film is removed; and
the laminated ceramic substrate is aligned with the scribe line and broken.
2. A cutting method according to claim 1, wherein the scribing of the ceramic substrate is scribing using a scribing wheel.
3. A method for dividing a multilayer ceramic substrate having a metal film laminated on the entire surface of one surface of a ceramic substrate, the method comprising:
scribing from the surface of the ceramic substrate along a scribing predetermined line of the laminated ceramic substrate;
performing groove processing on the metal film from the surface of the metal film along the scribe line of the ceramic substrate by using a patterning tool without scribing the ceramic substrate; and
the laminated ceramic substrate is aligned with the scribe line and broken.
4. A cutting method according to claim 3, wherein the scribing of the ceramic substrate is scribing using a scribing wheel.
5. A method for dividing a multilayer ceramic substrate having a metal film laminated on the entire surface of one surface of a ceramic substrate, the method comprising:
processing the groove of the metal film by using a patterning tool along the scribing preset line of the ceramic substrate without scribing the ceramic substrate;
scribing the ceramic substrate by rotating a scribing wheel along the groove from which the metal film is removed from the surface of the metal film; and
and breaking the laminated ceramic substrate in accordance with the scribing line.
6. A dividing method according to claim 5, wherein the scribing of the ceramic substrate is scribing using a scribing wheel.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-212191 | 2012-09-26 | ||
| JP2012212191A JP6191108B2 (en) | 2012-09-26 | 2012-09-26 | Method for dividing laminated ceramic substrate |
| JP2012-212193 | 2012-09-26 | ||
| JP2012212193A JP6191109B2 (en) | 2012-09-26 | 2012-09-26 | Method for dividing laminated ceramic substrate |
| CN201310381702.4A CN103681295A (en) | 2012-09-26 | 2013-08-26 | Lamination ceramic substrate breaking method and groove processing tool |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310381702.4A Division CN103681295A (en) | 2012-09-26 | 2013-08-26 | Lamination ceramic substrate breaking method and groove processing tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111916356A true CN111916356A (en) | 2020-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310381702.4A Pending CN103681295A (en) | 2012-09-26 | 2013-08-26 | Lamination ceramic substrate breaking method and groove processing tool |
| CN202010581467.5A Pending CN111916356A (en) | 2012-09-26 | 2013-08-26 | Breaking method of metal laminated ceramic substrate |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310381702.4A Pending CN103681295A (en) | 2012-09-26 | 2013-08-26 | Lamination ceramic substrate breaking method and groove processing tool |
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| Country | Link |
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| KR (2) | KR20140040613A (en) |
| CN (2) | CN103681295A (en) |
| TW (1) | TWI589420B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016113309A (en) * | 2014-12-11 | 2016-06-23 | 三星ダイヤモンド工業株式会社 | Scribe method and scribe device for composite substrate |
| JP6561565B2 (en) * | 2015-04-30 | 2019-08-21 | 三星ダイヤモンド工業株式会社 | Method and apparatus for dividing bonded substrate |
| JP6589358B2 (en) * | 2015-04-30 | 2019-10-16 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle material substrate |
| JP6561566B2 (en) * | 2015-04-30 | 2019-08-21 | 三星ダイヤモンド工業株式会社 | Method and apparatus for dividing bonded substrate |
| JP6589381B2 (en) * | 2015-05-29 | 2019-10-16 | 三星ダイヤモンド工業株式会社 | Method for forming vertical crack in brittle material substrate and method for dividing brittle material substrate |
| JP6589380B2 (en) * | 2015-05-29 | 2019-10-16 | 三星ダイヤモンド工業株式会社 | Method for forming vertical crack in brittle material substrate and method for dividing brittle material substrate |
| JP6648448B2 (en) * | 2015-08-17 | 2020-02-14 | 三星ダイヤモンド工業株式会社 | Method for forming vertical crack in brittle material substrate and method for cutting brittle material substrate |
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- 2013-08-26 CN CN201310381702.4A patent/CN103681295A/en active Pending
- 2013-08-26 CN CN202010581467.5A patent/CN111916356A/en active Pending
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Also Published As
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| TW201412483A (en) | 2014-04-01 |
| KR20180050626A (en) | 2018-05-15 |
| KR20140040613A (en) | 2014-04-03 |
| CN103681295A (en) | 2014-03-26 |
| KR101998653B1 (en) | 2019-07-10 |
| TWI589420B (en) | 2017-07-01 |
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