JP6316395B2 - Multi-layer ceramic substrate scribing equipment - Google Patents

Description

The present invention relates to a scribing apparatus used for cutting how the laminated ceramic substrate formed by laminating a metal film to the ceramic substrate.

  Conventionally, when a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate is divided, it is often divided using a dicing saw or the like. Patent Document 1 proposes a method of manufacturing a ceramic bonded substrate in which a metal layer is bonded after scribing the ceramic substrate, and then the metal layer on the scribe line is removed by etching and then a break is performed.

JP 2009-252971 A

  In the above-mentioned Patent Document 1, it is necessary to scribe before laminating a metal thin film on a ceramic substrate, and there is a problem that the laminated ceramic substrate already laminated is not divided.

  A case will be described in which a laminated ceramic substrate 100 in which metal films 102 and 103 are laminated on both surfaces of a ceramic substrate 101 as shown in FIG. First, as shown in FIG. 1B, scribing is performed on the surface of the metal film 102 using a scribing wheel 104, and then, as shown in FIG. 1C, an attempt is made to divide the multilayer ceramic substrate 100 using a break bar 105. However, sufficient vertical cracks are not formed in the metal film 102, and no vertical cracks are generated in the ceramic substrate 101 and the metal film 103. For this reason, it is difficult to break and cannot be separated, or as shown in FIG.

  As another method, scribing is performed on the surface of the metal film 102 as shown in FIG. 2B and then on the surface of the metal film 103 as shown in FIG. As shown in FIG. 2, even if the laminated ceramic substrate 100 is divided using the break bar 105, sufficient vertical cracks are not formed in the metal films 102 and 103, and no vertical cracks are generated in the ceramic substrate 101. . For this reason, it is difficult to break, and there is a problem that it is not separated according to the scribe line as shown in FIG.

  The present invention has been made in view of such problems, and an object of the present invention is to completely divide and individualize a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate.

To solve this problem, the present onset Ming, a cutting method of a multilayer ceramic substrate on which the metal film is laminated on both sides of the ceramic substrate, on one of the metal film along the scribed lines of the multilayer ceramic substrate A groove is processed with a patterning tool, and a groove is processed with a patterning tool on the other metal film along the scribe line of the multilayer ceramic substrate, and the metal film is removed from one of the metal films. A scribing device that can be used for a scribing by rolling a scribing wheel on the ceramic substrate along the groove, and breaking along the scribe line of the multilayer ceramic substrate.

To solve this problem, the present onset Ming, a cutting method of a multilayer ceramic substrate on which the metal film is laminated on both sides of the ceramic substrate, on one of the metal film along the scribed lines of the multilayer ceramic substrate On the other hand, a grooving process is performed with a patterning tool, and a scribing wheel is rolled on the ceramic substrate along the groove from which the metal film has been removed from the surface of the metal film. This is a scribing device that can be used for performing a groove process on the other metal film along a planned line with a patterning tool and breaking in accordance with the scribe line of the multilayer ceramic substrate.

  Here, the scribing of the ceramic substrate may be a scribing using a scribing wheel.

  In order to solve this problem, the multilayer ceramic substrate scribing apparatus of the present invention is a scribing apparatus used for cutting a multilayer ceramic substrate in which a metal film is laminated on a ceramic substrate, and is a multilayer ceramic substrate to be scribed. , A bridge having a beam parallel to the surface of the laminated ceramic substrate placed on the table, and a scribe line for the laminated ceramic substrate held on the table, which is movably provided along the beam. A first scribe head that performs groove processing on the metal film on the surface along the surface by a patterning tool, and a scribing wheel that is provided so as to be movable along the beam and is grooved on the groove of the laminated ceramic substrate. 2nd scribe which performs scribing by rolling And the head, is intended to include a.

  According to the present invention having such a feature, the laminated ceramic substrate in which the metal films are laminated on both surfaces of the ceramic substrate is subjected to grooving along the scribe line, and the metal film is removed in the form of a band from the upper and lower identical portions. Then, the ceramic substrate is scribed from the groove of the removed metal film, and then the laminated ceramic substrate is inverted and broken. For this reason, the laminated ceramic substrate having the metal films on both sides can be completely divided into a desired shape and individualized, and the effect that the end face accuracy can be improved is obtained.

Moreover, the scribing apparatus of the present invention has an effect that it is possible to simultaneously remove the metal film in a strip shape and scribing with a single scribing apparatus.

FIG. 1 is a diagram showing a dividing process when scribing and breaking from the metal film side on one side of the multilayer ceramic substrate. FIG. 2 is a diagram showing a state in which the metal film side on the opposite side of the multilayer ceramic substrate is scribed and broken. FIG. 3 is a perspective view showing a scribing device used for dividing the multilayer ceramic substrate according to the embodiment of the present invention. FIG. 4 is a diagram showing a patterning tool using groove processing of a metal film used in the present embodiment. FIG. 5 is a diagram showing a dividing process (groove processing by a patterning tool) of the multilayer ceramic substrate according to the embodiment of the present invention. FIG. 6 is a diagram showing a dividing process (scribe and break) of the multilayer ceramic substrate according to the embodiment of the present invention.

  FIG. 3 is a schematic perspective view showing an example of a scribing device used for cutting the multilayer ceramic substrate according to the embodiment of the present invention. In the scribing device 10, a movable table 11 is held so as to be movable in the y-axis direction along a pair of guide rails 12 a and 12 b. The ball screw 13 is screwed with the movable table 11. The ball screw 13 is rotated by the drive of the motor 14 and moves the moving base 11 in the y-axis direction along the guide rails 12a and 12b. A motor 15 is provided on the upper surface of the movable table 11. The motor 15 rotates the table 16 on the xy plane and positions it at a predetermined angle.

  In the scribe device 10, a bridge 20 is installed by struts 21a and 21b along the x-axis direction so as to straddle the movable table 11 and the table 16 on the upper side thereof. The bridge 20 is provided with a beam 22 in the lateral direction parallel to the surface of the table 16, and a linear motor 23 is provided in the longitudinal direction of the beam 22. The linear motor 23 is provided with a first scribe head 24 for patterning. A patterning tool 25 is attached to the lower end of the scribe head 24. The patterning tool 25 is a tool for peeling a metal film with a constant width. For example, a patterning tool used as a groove processing tool for a solar cell disclosed in Japanese Patent Application Laid-Open No. 2011-216646 is used. The patterning tool 25 may be a frustoconical tool, for example, as shown in a perspective view in FIG. Further, the tool may have a prism shape with a cutting edge as shown in FIG. 4 (b), and may further have a prism shape with left and right notches as shown in FIG. 4 (c). Further, not only the tip of the tool but also the whole may be a prismatic shape. The scribe head 24 is provided with an elevating part that enables such an elevating operation, for example, an air cylinder using air pressure control or an electric elevating part using a linear motor.

  The linear motor 23 is provided with a second scribing head 26 for scribing. The scribe head 26 holds the scribing wheel 27 so as to be movable up and down. The linear motor 23 is a drive source that moves the scribe heads 24 and 26 along the x-axis direction.

  FIG. 5A is a view showing a laminated ceramic substrate (hereinafter simply referred to as a laminated substrate) 30 to be divided. The laminated substrate 30 is a substrate in which metal films 32 and 33 are laminated on both surfaces of a ceramic substrate 31. Here, the ceramic substrate 31 may be an LTCC substrate or a ceramic substrate such as alumina, aluminum nitride, barium titanate, ferrite, or silicon nitride. The metal films 32 and 33 are thin films such as nickel, silver, gold, copper and platinum, and have a film thickness of 10 to 20 μm, for example. At this time, the metal films 32 and 33 may be formed with some pattern.

  When such a laminated substrate 30 is divided into a predetermined pattern, the laminated substrate 30 is first placed on the table 16 of the scribing apparatus 10 of FIG. Then, as shown in FIG. 5B, the metal film 32 is linearly removed by the patterning tool 25 with a certain width along a line scheduled to be scribed. The removal of the metal film is performed by moving the scribe head 24 of the scribe device 10 by the linear motor 23. A cross-sectional view of the multilayer ceramic substrate 30 from which the metal film 32 has been removed is shown in FIG. The width of the groove 32a is, for example, 25 to 200 μm.

  Further, as shown in FIG. 5D, the laminated substrate 30 is reversed and the metal film 33 is removed by the patterning tool 25 in the same portion as the groove 32a described above, and a groove 33a having the same width is formed at a position symmetrical to the groove 32a. Form. In this way, as shown in FIG. 6E, the metal films on both sides are removed along the scribe line.

  Then, scribing is performed on the ceramic substrate 31 inside the band-shaped groove 33a from the surface of one of the metal films, here the metal film 33. Also for this scribing, the scribing device 10 shown in FIG. 3 is used so that the scribing wheel 27 is pressed against the laminated substrate 30 with a constant load and rolled as shown in FIG. A scribe line S1 is formed. As the scribing wheel used for this scribing, a scribing wheel capable of highly penetrating may be used, or a normal scribing wheel may be used. For example, as disclosed in Japanese Patent No. 3074143, a scribing wheel is proposed in which a large number of grooves are formed on a circumferential surface at predetermined intervals, and a high penetration type is formed with protrusions therebetween.

  Next, as shown in FIG. 6G, the laminated substrate 30 is inverted, the tape 36 is disposed on the upper surface of the pair of support members 34 and 35 of the break device, and the scribe line is located between the support members 34 and 35. Thus, the laminated substrate 30 is arranged. Then, the break bar 37 is pushed down along the scribe line S1 from above to break. In this way, as shown in FIG. 6H, the laminated substrate can be completely divided along the scribe line, and the end face accuracy can be improved. By dividing the laminated substrate into a lattice shape, individual laminated substrate chips can be formed. The scribing shown in FIG. 6 (f) may be performed on the groove 32a. In this case as well, the breaking is performed by inverting the laminated ceramic substrate before breaking.

  In this embodiment, as shown in FIGS. 5B to 6F, grooves are formed on both surfaces of the metal film, and then the metal grooves are scribed on the ceramic substrate. Alternatively, groove processing may be performed on the metal film on one surface, and after scribing the ceramic substrate from the groove, the groove may be processed on the other metal film by reversing. The subsequent break process is the same.

  In this embodiment, scribing is performed by rolling the scribing wheel using a scribing device in the step of FIG. 6 (f), but scribing may be performed by a laser scribing device. Moreover, although it has broken using the break device in the process of FIG. 6 (g), if the shape of a small piece to be cut instead is relatively large, the operator may cut it directly by hand. . In this case, the tape 36 is unnecessary.

  The scribe device according to this embodiment can be applied not only to a cutting method in which a metal substrate on both sides is peeled off and a ceramic substrate is scribed on a laminated ceramic substrate having metal films on both sides, but the metal film is laminated only on one side. The laminated ceramic substrate thus obtained can also be used for a cutting method in which one metal film is peeled off and the ceramic substrate is scribed.

  INDUSTRIAL APPLICABILITY According to the present invention, a laminated substrate in which a metal film is laminated on a ceramic substrate can be easily divided using a patterning tool and a scribe device, which is effective for manufacturing a minute laminated substrate.

DESCRIPTION OF SYMBOLS 10 Scribing device 11 Moving table 16 Table 20 Bridge 22 Beam 23 Linear motor 24, 26 Scribe head 25 Scribing wheel 27 Patterning tool 30 Multilayer ceramic substrate 31 Ceramic substrate 32, 33 Metal film 32a, 33a Groove 34, 35 Support member 36 Tape 37 Break bar

Claims (1)

A scribing device used for dividing a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate,
A table for holding a multilayer ceramic substrate to be scribed;
A bridge having a beam parallel to the surface of the laminated ceramic substrate placed on the table;
A first scribe head that is movably provided along the beam and performs a groove processing with a patterning tool on a metal film on a surface along a scribe line of the multilayer ceramic substrate held by the table;
A scribing apparatus for a multilayer ceramic substrate, comprising: a second scribing head that is slidable by rolling a scribing wheel with respect to the groove of the multilayer ceramic substrate that has been grooved, and is movably provided along the beam. .