JPS6418605A - Dividing method for ceramic wiring base - Google Patents

Dividing method for ceramic wiring base

Info

Publication number
JPS6418605A
JPS6418605A JP17631687A JP17631687A JPS6418605A JP S6418605 A JPS6418605 A JP S6418605A JP 17631687 A JP17631687 A JP 17631687A JP 17631687 A JP17631687 A JP 17631687A JP S6418605 A JPS6418605 A JP S6418605A
Authority
JP
Japan
Prior art keywords
wirings
notches
ceramic base
base
dividing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17631687A
Other languages
Japanese (ja)
Inventor
Mitsuhiro Kani
Tatsuhiko Irie
Yoshimasa Himura
Shuichiro Yamaguchi
Jiro Hashizume
Shigenari Takami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP17631687A priority Critical patent/JPS6418605A/en
Publication of JPS6418605A publication Critical patent/JPS6418605A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Abstract

PURPOSE:To prevent wiring from peeling off or deviating from pattern positions during the manufacturing process by cutting notches in the thickness direction of a ceramic base provided with wirings constituted of metallic laminates from the metallic laminates side. CONSTITUTION:A plurality of wirings 2 constituted of metallic laminates are formed for a plurality of chips on a ceramic base 1. Forming of wirings 2 is carried out by etching and removing unnecessary sections of metallic foils bonded or deposited on the surface of the ceramic base. Dividing of the ceramic base 1 into respective chips is carried out by cutting notches 3...3 in the thickness direction from the upper side of the wirings 2, for instance, by means of a dicing saw. The base is divided along the notches 3 after cutting the notches 3 to manufacture respective chips 5. As the wirings 2 are already cut before dividing by the dicing saw, wirings 2 are not torn off in dividing the base. Abnormal force is not added to the wirings 2 remaining on respective chips 5, and said wirings 2 are highly reliable without peeling off or deviating from pattern positions.
JP17631687A 1987-07-15 1987-07-15 Dividing method for ceramic wiring base Pending JPS6418605A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17631687A JPS6418605A (en) 1987-07-15 1987-07-15 Dividing method for ceramic wiring base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17631687A JPS6418605A (en) 1987-07-15 1987-07-15 Dividing method for ceramic wiring base

Publications (1)

Publication Number Publication Date
JPS6418605A true JPS6418605A (en) 1989-01-23

Family

ID=16011453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17631687A Pending JPS6418605A (en) 1987-07-15 1987-07-15 Dividing method for ceramic wiring base

Country Status (1)

Country Link
JP (1) JPS6418605A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116890A (en) * 1989-09-29 1991-05-17 Nippon Dempa Kogyo Co Ltd Printed wiring board
JPH0737073A (en) * 1993-07-20 1995-02-07 Clarion Co Ltd Map data base for navigation system and map retrieval and display system for map data base
EP1288021A2 (en) 2001-09-04 2003-03-05 Ntn Corporation A bearing apparatus for wheel
JP2014065633A (en) * 2012-09-26 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd Method for dividing laminated ceramic substrate
JP2014067859A (en) * 2012-09-26 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd Method for parting laminated ceramic substrate
JP2014067858A (en) * 2012-09-26 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd Method for parting laminated ceramic substrate
JP2014090053A (en) * 2012-10-30 2014-05-15 Mitsuboshi Diamond Industrial Co Ltd Parting method and scribe device of multilayer ceramic substrate
JP2017056740A (en) * 2016-12-16 2017-03-23 三星ダイヤモンド工業株式会社 Laminate ceramic substrate scribe device
CN111916356A (en) * 2012-09-26 2020-11-10 三星钻石工业股份有限公司 Breaking method of metal laminated ceramic substrate

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116890A (en) * 1989-09-29 1991-05-17 Nippon Dempa Kogyo Co Ltd Printed wiring board
JPH0737073A (en) * 1993-07-20 1995-02-07 Clarion Co Ltd Map data base for navigation system and map retrieval and display system for map data base
EP1288021A2 (en) 2001-09-04 2003-03-05 Ntn Corporation A bearing apparatus for wheel
JP2014065633A (en) * 2012-09-26 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd Method for dividing laminated ceramic substrate
JP2014067859A (en) * 2012-09-26 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd Method for parting laminated ceramic substrate
JP2014067858A (en) * 2012-09-26 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd Method for parting laminated ceramic substrate
CN111916356A (en) * 2012-09-26 2020-11-10 三星钻石工业股份有限公司 Breaking method of metal laminated ceramic substrate
JP2014090053A (en) * 2012-10-30 2014-05-15 Mitsuboshi Diamond Industrial Co Ltd Parting method and scribe device of multilayer ceramic substrate
JP2017056740A (en) * 2016-12-16 2017-03-23 三星ダイヤモンド工業株式会社 Laminate ceramic substrate scribe device

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