JP6040705B2 - Method for dividing laminated ceramic substrate - Google Patents

Description

  The present invention relates to a method for dividing a laminated ceramic substrate in which ceramic substrates of different materials are laminated.

  Conventionally, when a laminated ceramic substrate in which a metal layer is laminated on a ceramic substrate is divided, the substrate is often divided using a dicing saw or the like. Patent Document 1 proposes a method of manufacturing a ceramic bonded substrate in which a metal layer is bonded after scribing the ceramic substrate, and then the metal layer on the scribe line is removed by etching and then a break is performed.

JP 2009-252971 A

  In the above-mentioned Patent Document 1, it is necessary to scribe before laminating a metal layer on a ceramic substrate, and there is a problem that the laminated ceramic substrate already laminated is not divided.

  Development of a laminated ceramic substrate in which different types of ceramic substrates are laminated has been progressing, but the method for dividing the substrate has not been established. As a method for dividing the multilayer ceramic substrate, it is conceivable to break the multilayer ceramic substrate by scribing the multilayer ceramic substrate using a scribing wheel, in addition to division by a dicing saw, which is a normal method for dividing a brittle material substrate. In order to divide the laminated ceramic substrates of different materials, a case will be described in which the laminated substrate 100 in which the ceramic substrates 101, 102, 103 of different materials are sequentially laminated as shown in FIG. First, as shown in FIG. 1B, the surface of the ceramic substrate 101 is scribed with a scribing wheel 104, and the laminated substrate 100 is held on the support members 106 and 107 as shown in FIG. Then, the break bar 105 is pressed to break. In this case, even if the laminated substrate 100 is divided, the ceramic substrate 102 and the ceramic substrate 103 have no vertical cracks. For this reason, it is difficult to break and cannot be separated, or as shown in FIG.

  As another method, as shown in FIGS. 2A and 2B, a scribing wheel 104 is used to scribe a ceramic substrate 103 on the other side of the laminated ceramic substrate 100. Next, as shown in FIG. 2C, the laminated substrate 100 is divided using a break bar 105. In this case, even if the laminated substrate 100 is divided, the ceramic substrate 101 and the ceramic substrate 102 have no vertical cracks. For this reason, it is difficult to break, and there is a problem that it cannot be separated or cannot be separated along the scribe line as shown in FIG.

  The present invention has been made in view of such problems, and an object of the present invention is to completely divide and individualize a laminated ceramic substrate in which ceramic substrates of three or more kinds of different materials are laminated.

In order to solve this problem, in the method for dividing a multilayer ceramic substrate of the present invention, at least first, second and third ceramic substrates are laminated, and at least the second ceramic substrate and the first and third ceramic substrates are laminated. A method for dividing a laminated ceramic substrate having different types of materials of the ceramic substrate, wherein a first scribe line with a vertical crack is formed along the planned dividing line on the first ceramic substrate, and the back surface of the laminated ceramic substrate Forming a second scribe line with a vertical crack along a line corresponding to the first scribe line, and breaking the at least one ceramic substrate along the first and second scribe lines. To cut the ceramic substrate along the scribe line. .

  Here, the laminated ceramic substrate is obtained by sequentially laminating the first to third ceramic substrates, and the intermediate second ceramic substrate is thinner than the first and third ceramic substrates. Also good.

  Here, the laminated ceramic substrate is obtained by sequentially laminating the first to third ceramic substrates, and the intermediate second ceramic substrate is lower in hardness than the first and third ceramic substrates. It may be a substrate.

  According to the present invention having such a feature, a laminated ceramic substrate on which ceramic substrates of different materials are laminated is scribed from both sides and broken from at least one surface. For this reason, it can divide | segment into a desired shape completely, can be individualized, and the effect that an end surface precision can be improved is acquired.

FIG. 1 is a diagram showing a dividing process when scribing and breaking from one ceramic substrate side of a laminated ceramic substrate. FIG. 2 is a diagram showing a state in which the laminated ceramic substrate is scribed and broken from the other ceramic substrate side. FIG. 3 is a diagram showing a dividing process of the multilayer ceramic substrate according to the embodiment of the present invention. FIG. 4 is a diagram showing a dividing process of the multilayer ceramic substrate according to the embodiment of the present invention.

  FIG. 3A shows a laminated ceramic substrate (hereinafter simply referred to as a laminated substrate) 10 to be divided according to an embodiment of the present invention in which first to third ceramic substrates 11, 12, and 13 of different types are sequentially laminated. FIG. Here, the ceramic substrates 11, 12, and 13 may be LTCC substrates, ceramic substrates such as alumina (HTCC), aluminum nitride, barium titanate, ferrite, and silicon nitride, so-called fine ceramics substrates. The thickness of the ceramic substrates 11, 12, 13 is, for example, 0.2 to 0.4 mm. Moreover, the material of the 2nd ceramic substrate 12 should just differ from the 1st, 3rd ceramic substrates 11 and 13, and the material of the ceramic substrates 11 and 13 may be the same or different. The thickness of each ceramic substrate may be the same or different from each other. Here, the intermediate second ceramic substrate 12 is preferably a substrate relatively thinner than the ceramic substrates 11 and 13 on both sides, for example, a substrate having a thickness of 0.3 mm or less, so that the second ceramic substrate 12 can be divided by breaking. At the same time, or instead, the hardness of the second ceramic substrate is preferably relatively lower than the hardness of the first and third ceramic substrates. For example, even if the Pickers hardness HV is 800 or less Good. Here, the first ceramic substrate 11 is an LTCC substrate, the second ceramic substrate 12 is a ferrite, and the third ceramic substrate is an LTCC substrate.

  When the laminated substrate 10 is divided into a predetermined pattern, first, the scribing wheel 14 is pressed by a scribing device (not shown) along a line scheduled to be divided from the ceramic substrate 11 side as shown in FIG. 3B. Roll to form a scribe. The scribe line thus formed is defined as a first scribe line S1. The scribing wheel used for this scribing may be a scribing wheel capable of highly penetrating scribing, or may be a normal scribing wheel. Here, a highly penetrating scribing wheel with a blade angle of 110 ° is used. For example, Japanese Patent No. 3074143 proposes a scribing wheel in which a large number of grooves are formed at a predetermined interval on the circumferential surface, and a high penetration can be achieved by using protrusions therebetween.

  Further, the laminated substrate 10 is inverted, and a scribe is formed from the surface of the third ceramic substrate 13 directly above the scribe line S1 by a scribe device (not shown) as shown in FIG. The scribe line thus formed is referred to as a second scribe line S2. In this case, a material that can be scribed with high penetration may be used, or a normal scribing wheel may be used. Here, a scribing wheel 15 capable of highly scribe is used. The blade edge angle at this time is 110 °. The type of scribing wheel is appropriately selected according to the material, thickness, hardness, etc. of the ceramic substrates 11 and 13.

  Next, as shown in FIG. 3 (d), the tape 18 is arranged on the upper surfaces of the pair of support members 16 and 17 using a break device so that the scribe lines S1 and S2 are positioned between the support members 16 and 17. The laminated substrate 10 is disposed. Then, the break bar 19 is pushed down along the second scribe line S2 from above to perform the break. As a result, the ceramic substrate 11 can be broken. At this time, the ceramic substrate 12 may also be broken.

  Further, as shown in FIG. 4E, the laminated substrate 10 is inverted, the tape 20 is disposed on the upper surfaces of the support members 16 and 17, and the scribe lines S1 and S2 are positioned between the support members 16 and 17. The substrate 10 is disposed. Then, the break bar 19 is pushed down along the first scribe line S1 from above to break. In this way, as shown in FIG. 4 (f), the ceramic substrate 13 can be broken, and further penetrated through the intermediate ceramic substrate 12 and divided along the scribe lines S1 and S2 to be individualized. By dividing in this way, the end face accuracy can be improved. Individual laminated substrate chips can be formed by dividing the laminated ceramic substrate into a lattice shape.

  In the above-described embodiment, as shown in FIGS. 3B and 3C, the ceramic substrate 11 is scribed and then the ceramic substrate 13 is scribed. Also good.

  In the above example, as shown in FIGS. 3 (d) and 4 (e), the break is made from the ceramic substrates on both sides by the break device, but depending on the type and thickness of the ceramic substrate or the penetration of the scribe line. Can be divided by performing one of the breaks. For example, when the scribe penetrates deep enough along the scribe line S2 into the ceramic substrate 13 or when the ceramic substrates 11 to 13 are sufficiently thin, the ceramic substrate 13 can be divided and individualized by breaking from one of the surfaces. it can.

  Here, the same scribing wheel is used when scribing the first and third ceramic substrates, but they may be different. The type of scribing wheel is appropriately selected according to the material, thickness, hardness, etc. of the ceramic substrates 11-13. The angle of the cutting edge of the scribing wheel, the cribing load, and the like are also appropriately selected according to the ceramic substrate. In general, a shallow scribe may be used for ferrite, and the properties of LTCC vary greatly depending on the sintering temperature, additives, and the like. Therefore, the blade angle and the type of scribing wheel and scribe load suitable for the substrate are used.

  In this embodiment, scribing is performed by rolling the scribing wheel using the scribing device in the steps of FIGS. 3B and 3C, but the scribing may be performed by the laser scribing device. Good. This laser scriber may be a laser scriber that is heated by a laser and then cooled immediately after that to infiltrate the scriber, or may be one that melts and scribes the substrate by increasing the output of the laser itself. Good. Further, a laser scribing apparatus that performs scribing by intermittently irradiating a laser and changing the irradiation position may be used. Moreover, although it has broken using the break device in the step of FIG. 4 (e), if the shape of the small piece to be cut instead is relatively large, the operator may cut it directly by hand. . In this case, the tape 20 is unnecessary.

  In this embodiment, the first and third ceramic substrates are made of the same material, and the material of the intermediate second ceramic substrate is different. However, any of the materials of the first to third ceramic substrates is also used. They may be different from each other.

  In this embodiment, the laminated ceramic substrate in which the first to third ceramic substrates are laminated is described. However, the present invention can also be applied to a laminated ceramic substrate in which many different kinds of ceramic substrates are laminated. . In this case, the second scribe line S2 is formed at the same position as the scribe line S1 with respect to the ceramic substrate on the surface opposite to the first ceramic substrate of the multilayer ceramic substrate.

  INDUSTRIAL APPLICABILITY The present invention can be easily divided into a multilayer ceramic substrate made of different materials by using a scribe device and a break device, and is effective in manufacturing a micro multilayer substrate.

10 Laminated Ceramic Substrate 11, 12, 13 Ceramic Substrate 14, 15 Scribing Wheel 16, 17 Support Member 18, 20 Tape 19 Break Bar

Claims (3)

A method of dividing a laminated ceramic substrate in which at least first, second, and third ceramic substrates are laminated, and at least different types of materials of the second ceramic substrate and the first and third ceramic substrates are provided,
Forming a first scribe line with a vertical crack along the line to be cut in the first ceramic substrate;
Forming a second scribe line with a vertical crack along a line corresponding to the first scribe line on the ceramic substrate on the back surface of the multilayer ceramic substrate;
A method for dividing a multilayer ceramic substrate, wherein the ceramic substrate is divided along the scribe line by breaking the at least one ceramic substrate along the first and second scribe lines.   The laminated ceramic substrate is obtained by sequentially laminating the first to third ceramic substrates, and the intermediate second ceramic substrate is a substrate thinner than the first and third ceramic substrates. Item 2. A method for dividing a laminated ceramic substrate according to Item 1.   The laminated ceramic substrate is obtained by sequentially laminating the first to third ceramic substrates, and the intermediate second ceramic substrate is a substrate having a lower hardness than the first and third ceramic substrates. The method for dividing a laminated ceramic substrate according to claim 1.

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