TW201604156A - Laminate substrate dividing method and dividing device - Google Patents

Abstract

This invention provides a method of properly dividing a laminate substrate. This invention is a method for dividing a laminate substrate formed by laminating two brittle material substrates at a specifically predetermined dividing location, the method comprising: a scribed line formation step for scribing a line at the predetermined dividing location on a main surface of the laminate substrate; a holding tape adhering step for adhering a holding tape on the main surface of the laminate substrate provided with the scribed line; a carrying step for carrying the laminate substrate adhered with the holding tape, by contacting the entire surface of the main surface, onto a surface-smoothened elastomer; and a dividing step for, given that the laminate substrate is carried onto the elastomer, contacting the front tip of an upper blade to the predetermined dividing location and at the same time moving it downwardly, so as to extend the crack from the scribed line to divide the laminate substrate.

Description

Method for dividing substrate and dividing device

The present invention relates to a method of separating a bonded substrate obtained by bonding two brittle material substrates, for example, a bonded substrate obtained by bonding two brittle material substrates containing different materials, and a device for the same .

A bonded substrate in which two brittle material substrates are bonded together with an adhesive (resin), and a bonded substrate (a different material bonding substrate) obtained by bonding two brittle material substrates containing different materials by an adhesive is used. A substrate for various components. For example, there is a substrate or the like which is formed of a semiconductor substrate such as a single crystal germanium substrate in which a specific element (for example, a CMOS (Complementary Metal Oxide Semiconductor) sensor) is patterned on one main surface. One main surface is bonded to a glass substrate as a support substrate, and is formed by this. Such a device is formed by bonding an adhesive (resin) to a glass substrate on a single crystal germanium wafer as a mother substrate in which a circuit pattern is repeatedly formed two-dimensionally, and then breaking into short strips of a specific size. A single piece (wafer) in the form of a grid or a grid is produced (for example, refer to Patent Document 1).

In addition, a device (crusher) that breaks a crack from a scribe line by a three-point bending method in which a slab is formed by a three-point bending method is known (for example, see Patent Document 2). .

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-40621

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2014-83821

As a method of breaking (singulation) of a bonded substrate (a dissimilar material) formed by patterning a brittle material substrate (tantalum substrate), the inventors of the present invention have tried the following method: attaching to the surface on which the pattern is formed After the protective film, a scribe line is formed on the side of another brittle material substrate (glass substrate), and then fractured along the scribe line by a crusher as disclosed in Patent Document 2.

However, in the case of breaking by the method, there is a case where a crack is formed obliquely from the thickness direction of the substrate due to the layer of the adhesive agent interposed between the two brittle material substrates. Bad condition. Moreover, since the amount of press-fitting of the insert from the upper side of the crusher (the lowering distance of the upper blade from the upper blade abutting on the bonded substrate or the protective film to the completion of the break) is large, there is also a possibility that the bonded substrate is easily generated. The positional offset is a bad condition. The occurrence of such defects is a cause of a decrease in the yield of the wafer such as deterioration in quality of the wafer, which is not preferable.

The present invention has been made in view of the above problems, and it is an object of the invention to provide a method for preferably separating a bonded substrate, particularly a heterogeneous material bonded to a substrate.

In order to solve the above problems, the inventions of the first and third aspects are characterized in that the bonded substrate obtained by bonding two brittle material substrates is cut at a predetermined predetermined position, and is provided with a scribing line. a forming step of providing a scribe line at a predetermined predetermined position on a main surface side of the bonded substrate; and a substrate attaching step of attaching the one main surface of the bonded substrate provided with the scribe line a protective tape attaching step of attaching a protective film to the other main surface of the bonded substrate as needed; and a placing step of attaching the protective tape to the holding tape and attaching the protective layer as needed The above-mentioned bonded substrate is placed on the surface of the above-mentioned main surface side so as to be placed on the surface of the elastic body which is smoothed; and the breaking step is performed by placing the above-mentioned bonded substrate on the above elastic layer In the state of the body, by making The front end of the upper blade is lowered while abutting against the predetermined predetermined position (the crack is extended from the scribe line), and the bonded substrate is divided.

Further, the invention according to the second and third aspects is characterized in that the bonded substrate obtained by bonding two brittle material substrates is sequentially cut at a plurality of predetermined predetermined positions, and is provided with a scribe line. a step of providing a scribe line at a plurality of predetermined predetermined positions on a main surface side of the bonded substrate; and a substrate attaching step of affixing the one main surface of the bonded substrate provided with the scribe line Attached to the holding tape; a protective film attaching step, wherein a protective film is attached to the other main surface of the bonded substrate as needed; and a placing step is attached to the holding tape and attached as needed The bonded substrate of the protective film is placed on the surface of the elastic surface of the smoothed surface so as to be in contact with the entire surface of the main surface; and the breaking step is performed by placing the bonded substrate on the surface In the state of the elastic body, the plurality of predetermined breaking positions are repeated at the predetermined position, that is, by lowering the front end of the upper blade against the predetermined breaking position (to cause the crack to extend from the scribe line), And the above-mentioned bonded substrate is cut off

Further, the invention of claim 4 is characterized in that the bonded substrate obtained by bonding two brittle material substrates is cut at a predetermined predetermined position, and the bonded substrate is on one main surface side. The predetermined predetermined position is formed with a scribe line and the one main surface faces downward. When the elastic body formed by smoothing the surface supports the bonded substrate from below, the front end of the upper blade is abutted. The bonded substrate is divided while being lowered at the predetermined predetermined position.

Further, the invention of claim 5 is characterized in that the bonded substrate obtained by bonding two brittle material substrates is cut at a predetermined predetermined position, and includes a scribing forming mechanism. a scribe line is provided at the predetermined predetermined position on the main surface side of the bonded substrate; and the substrate attaching mechanism attaches the one main surface of the bonded substrate on which the scribe line is provided to the holding tape; and the mounting mechanism And the laminated substrate to which the holding tape is attached is placed on the surface of the one main surface side so as to be placed on the surface to be smoothed And the breaking mechanism, wherein the bonding substrate is placed on the elastic body, and the bonding substrate is lowered by abutting the front end of the upper blade against the predetermined breaking position Break.

Further, the invention according to claim 6 is characterized in that the bonded substrate obtained by bonding two brittle material substrates is cut at a predetermined predetermined position, and the surface is smoothed. The elastic body supports the bonded substrate from below, the bonded substrate is formed with a scribe line at a predetermined predetermined position on one main surface side, and the one main surface faces downward; and a breaking mechanism is provided by The upper end of the upper surface of the upper surface of the upper surface of the elastic body is lowered while abutting against the predetermined predetermined position, and the bonded substrate is divided.

According to the present invention, the bonded substrate including the out-of-phase interface can be preferably separated by less pressing of the upper blade than the previous three-point bending method. Moreover, it is possible to achieve a good break without a positional shift in a single piece obtained by the division. Further, it is possible to preferably suppress the separation of the single-piece self-retaining tape obtained by the division. In particular, it is effective when the bonded substrate is sequentially cut at a plurality of predetermined predetermined positions.

1‧‧‧ glass substrate

2‧‧‧Semiconductor substrate

3‧‧‧Next layer

4‧‧‧Protective film

5‧‧‧Retaining belt

10‧‧‧Fixed substrate

10a‧‧‧ (a piece obtained by breaking the bonded substrate)

10b‧‧‧ (a piece obtained by breaking the bonded substrate)

10c‧‧‧ (a piece obtained by breaking the bonded substrate)

101A, 101B‧‧‧ lower blade

101a, 101b‧‧‧ end

102‧‧‧Upper blade

201‧‧‧ Elastomers

201a, 201b‧‧‧ elastic concentration parts

201s‧‧‧Contact surface

202‧‧‧Support

A‧‧‧Dropped location

AR1, AR2‧‧‧ arrows

AR11~AR14‧‧‧ arrow

C‧‧‧dotted line

CR‧‧‧ crack

F1‧‧‧ force

F2‧‧‧ force

F2a, F2b‧‧‧ Elasticity

F3a, F3b‧‧‧ force

F11a, F11b‧‧‧ force

F12a, F12b‧‧‧ force

F13a, F13b‧‧‧ force

F14a, F14b‧‧‧ friction

G‧‧‧ gap

S‧‧‧

Α‧‧‧ clearance angle

Β‧‧‧ clearance angle

Fig. 1 is a schematic cross-sectional view showing a configuration of a bonded substrate 10 which is a target of the breaking method according to the embodiment of the present invention.

2 is a schematic cross-sectional view showing the bonded substrate 10 on which the scribe lines S are formed.

3(a) to 3(c) are schematic cross-sectional views showing a step of breaking by a three-point bending method of the bonded substrate 10 on which the scribe lines S are formed.

4(a) to 4(c) are views showing the breaking of the bonded substrate 10 in the present embodiment.

Fig. 5 (a) and (b) are views showing a state in which the single piece self-retaining tape 5 obtained by the breaking is detached.

Fig. 6 is a view exemplifying an elastic body 201 which is implemented to prevent a problem that a single piece of self-retaining tape is detached.

FIGS. 7(a) and 7(b) are diagrams showing the breaking state when the contact surface 201s of the elastic body 201 is subjected to the smoothing treatment.

1 is a schematic cross-sectional view showing a configuration of a bonded substrate (hereinafter simply referred to as a bonded substrate) 10 of a dissimilar material which is a target of the breaking method according to the embodiment of the present invention. 2 is a schematic cross-sectional view showing the bonded substrate 10 on which the scribe lines S are formed. In the present embodiment, the bonded substrate 10 obtained by using the glass substrate 1 including the adhesive layer 3 and the glass substrate 1 which is one of the brittle material substrates and the semiconductor substrate (for example, the germanium substrate) 2 is used as the breaking target.

The thickness of the glass substrate 1 and the semiconductor substrate 2 and the planar size of the bonded substrate 10 are not particularly limited, and an appropriate size can be selected in view of the ease of handling of the breaking and the preceding and succeeding steps, the processing efficiency, and the like.

In addition, the material of the adhesive agent is not particularly limited as long as the bonding strength between the glass substrate 1 and the semiconductor substrate 2 is ensured, and the ultraviolet (UV) curing resin or the like can be suitably used. . Further, from the viewpoint of preferably achieving the breaking method of the present embodiment, the thickness of the adhesive layer 3 is preferably about 5 μm to 200 μm, and usually about 5 μm to 50 μm.

A pattern for a specific element (for example, a CMOS sensor or the like) may be formed on the non-contiguous surface side of the semiconductor substrate 2.

When the bonded substrate 10 having the above configuration is divided, first, as shown in FIG. 2, a predetermined position A is divided in advance to form a scribe line S on the non-adjoining surface of the glass substrate 1. In Fig. 2, the case where the predetermined position A and the scribe line S extend in a direction perpendicular to the plane of the drawing are shown. The scribe line S is formed by continuously forming cracks (micro cracks) extending in the thickness direction of the glass substrate 1 on the non-adjoining surface of the glass substrate 1.

In addition, in FIG. 2, for the simple illustration, only the predetermined predetermined position A and the scribe line S are shown, and the bonded substrate 10 is divided into a short strip or a grid, for example, at a plurality of locations. When a plurality of single pieces are obtained by breaking, a predetermined position A is broken for all Draw a line S. Hereinafter, unless otherwise specified, in this case, the processing of the subsequent stage is also performed for all of the predetermined positions A.

A well-known technique can be applied to form the scribe line S. For example, it is possible to form a scribe line S by causing a cutter wheel (scriber wheel) to be crimped and rotated along a predetermined breaking position A, the cutter wheel (scratch wheel) comprising superhard alloy, sintered diamond, The single crystal diamond or the like has a disk shape and has a ridge line functioning as a blade in the outer peripheral portion; it may be such that a scribe line S is formed by dividing the predetermined position A with a diamond edge to form a scribe line S; Aspect: The scribing S is formed by the formation of an ablation or metamorphic layer by laser (for example, ultraviolet (UV) laser irradiation); it may also be as follows: by laser (for example, infrared ( IR) laser causes thermal stress caused by heating and cooling to form a scribe line S.

In the present embodiment, the bonded substrate 10 in which the scribe line S is provided is set as the object, and the breaking at the predetermined position A is performed. Roughly, the bonded substrate 10 is stretched by stretching the crack CR (see FIG. 4) from the scribe line S in the thickness direction (more specifically, in the direction perpendicular to the main surface of the bonded substrate 10). Break.

Fig. 3 is a view showing a state of separation of the bonded substrate 10 using the previous three-point bending method exemplified for comparison. In the previous breaking method, first, as shown in FIG. 3(a), the adhesive tape 5 is attached to the glass substrate 1 side of the bonded substrate 10. Further, the holding tape 5 is used to hold the wafer in such a manner that the wafer (single piece) obtained by the breaking does not fly or the like. As the holding tape 5, for example, a so-called dicing tape which is used for the same purpose when cutting with a microtome can be preferably used. As shown in FIG. 3, the protective film 4 may be attached to the surface of the semiconductor substrate 2 as needed. By attaching the protective film 4 to the surface of the semiconductor substrate 4, it is possible to prevent damage of the substrate due to contact between the substrate and the blade for breaking.

Then, in a state in which the formation portion of the scribe line S is located between the two lower blades 101A and 101B which are spaced apart in the horizontal direction, in other words, between the two lower blades 101A and 101B which are arranged in parallel with each other, In the aspect in which the lines S are arranged in parallel, the two lower blades 101A and 101B support the bonded substrate 10 with the glass substrate 1 side facing downward from below. Of course Then, in the support state, the upper blade 102 is lowered from the position where the upper scribe line S is formed (that is, the predetermined breaking position A), and abuts against the bonded substrate 10 or abuts against the protective film 4, thereby making The upper blade 102 is lowered in a push-in manner. Further, the lower blades 101A and 101B are provided in a member having sufficient rigidity as compared with the bonded substrate 10.

In this aspect, when the upper blade 102 is press-fitted, as shown in FIG. 3(a), a downward force F1 is applied to a portion where the blade 102 abuts on the protective film 4, and as the force F1 is applied thereto. The reaction force (the force against the force F1 and the self-weight of the bonded substrate 10) generates upward forces F2a and F2b from the end portions 101a and 101b of the two lower blades 101A and 101B toward the bonded substrate 10. As the crack CR is stretched, as shown in FIG. 3(b), the left and right portions of the bonded substrate 10 are gradually divided by the end portions 101a and 101b as fulcrums. Along with this, the gap G having a wedge shape in cross section gradually spreads from the portion where the scribe line S was formed. The extension of the crack CR is maintained at the opposite phase interface (the interface between the glass substrate 1 and the bonding layer 3, and the interface between the bonding layer 3 and the semiconductor substrate 2) existing in the bonded substrate 10, and finally, as shown in FIG. 3(c). The bonded substrate 10 is divided perpendicular to the main surface. Furthermore, the angle (gap angle) formed by the two cross-sections generated by the breaking at the completion of the division is set to α.

The previous breaking method of the above-described aspect can be said to be roughly a method in which the end portions 101a and 101b of the two lower blades 101A and 101B are fulcrum by the action of the force F1 and the forces F2a and F2b. The moment in the opposite direction causes the two portions, which are gradually separated by the gradual division, to generate the rotation in the opposite direction, thereby performing the division. In this method, a portion corresponding to the energy applied to the bonded substrate 10 by press-fitting the upper blade 102 is consumed in the rotation.

Fig. 4 is a view showing the breaking of the bonded substrate 10 in the present embodiment. In the present embodiment, the bonding substrate 10 is also cut in the same manner as in the prior art. First, the adhesive tape 5 is attached to the glass substrate 1 side of the bonded substrate 10.

Next, as shown in FIG. 4(a), the bonded substrate 10 is placed on the elastic body 201 so that the main surface is in contact with the entire surface with the main surface side on the side where the holding tape 5 is attached facing downward. on. In the present embodiment, the elastic body 201 refers to a material having a hardness of 65 to 95, preferably 70 to 90, and for example 80. As the elastic body 201, for example, polyoxyethylene rubber or the like can be preferably used. Further, as shown in FIG. 4(a), the elastic body 201 may be supported by a support 202 such as a platform. When the scribing is observed (identified) from the side of the elastic body 201 and the support 202, the elastic body 201 and the support body 202 are preferably transparent.

In the present embodiment, the cutting is performed in the placed state. Specifically, in order to extend the crack CR from the scribe line S in the thickness direction, the upper blade 102 is lowered from the upper side toward the formation position of the scribe line S (that is, the predetermined breaking position A), thereby abutting on the affixing. The substrate 10, in turn, lowers the upper blade 102 by press-fitting.

In this aspect, when the upper blade 102 is press-fitted, as shown in FIG. 4(a), a downward force F1 is applied to a portion where the blade 102 on the protective film 4 abuts. Then, as a reaction force against the force F1 (the force against the force F1 and the self-weight of the bonded substrate 10), the self-elastic body 201 faces the bonded substrate 10, and the abutting position of the upper blade 102 is directly below. The position is centered to generate an upward elastic force F2. Thereafter, the left and right portions of the bonded substrate 10 are gradually divided, and the slit CR is immediately extended from the scribe line S as shown in FIG. 4(b). The gap G in the shape of a wedge gradually expands. Also in the case of the breaking method of the present embodiment, the stretching of the crack CR is also present at the heterophase interface (the interface between the glass substrate 1 and the bonding layer 3, the interface between the bonding layer 3 and the semiconductor substrate 2) existing inside the bonded substrate 10. It is maintained. Therefore, finally, as shown in FIG. 4(c), the bonded substrate 10 is divided perpendicularly to the main surface.

More specifically, when the crack CR starts to expand and the gap G is formed, the elastic forces F2a and F2b act on the abutting surfaces of the two portions of the left and right portions of the bonded substrate 10 to be separated from the elastic body 201. Further, as in the previous method, as the crack CR is stretched, as shown in Fig. 4(b), the gap G which is wedge-shaped in cross section gradually spreads from the portion where the scribe line S was formed.

In this case, as shown in FIG. 4(b), the vicinity of the two cross-sections forming the gap G is an elastic force-concentrating portion in which the elastic forces F2a and F2b collectively act. 201a and 201b, it can be said that the breaking method of the present embodiment is also based on the three-point bending method.

However, in the case of the breaking method of the present embodiment, unlike the above-described previous breaking method, as the gap G gradually expands, the elastic force concentrated portions 201a, 201b are displaced as indicated by the arrows AR1, AR2, but Since the bonded substrate 10 is entirely supported by the elastic body 201, the bonding substrate 10 is less likely to generate a moment with the elastic force concentrated portions 201a and 201b as fulcrums. This means that in the breaking method of the present embodiment, the energy applied to the bonded substrate 10 by press-fitting the upper blade 102 contributes more effectively to the breaking. Specifically, the forces F3a and F3b which are opposite to each other at the predetermined breaking position of the bonded substrate 10 (the extended target position of the crack CR) are larger than those of the prior art. The forces F3a, F3b effectively contribute to the stretching of the crack CR, in particular to the breaking (tearing) of the adhesive layer 3.

As a result, in the case of the breaking method of the present embodiment, even if the amount of pressing of the upper blade 102 is not as large as before, the bonded substrate 10 can be preferably separated. Further, when the magnitude of the gap angle in the breaking method of the present embodiment is β, β < α is established. Therefore, the problem that the gap angle α generated in the case of the previous breaking method is increased and the positional displacement occurs in the bonded substrate 10 is preferably suppressed in the breaking method of the present embodiment.

<Prevent breakaway after breaking>

As described above, the bonded substrate 10 can be divided by the three-point bending method by being supported by the elastic body 201. However, when a bonded substrate 10 is divided into a plurality of portions to obtain a plurality of individual sheets, the combination of the elastic body 201 and the holding tape 5 to which the bonded substrate 10 is attached may be obtained by breaking. The single piece will be detached from the retaining band 5. Fig. 5 is a view showing a state in which the detachment occurs. Furthermore, the illustration of the bonded substrate 10 is simplified in FIG. 5, and the illustration of the upper blade 102 and the support 202 is omitted.

Fig. 5(a) shows the force acting on the holding tape 5 when the single piece 10a is obtained by the previous division, and then the single piece 10b is obtained.

First, as described above, when the force F1 is applied from the upper blade 102 to the bonded substrate 10 in order to obtain the single piece 10b, the formation of the gap G progresses, and at this time, the single piece 10b and the bonded substrate which are gradually peeled off from each other are formed. The remaining portion (hereinafter, referred to as a single piece for convenience) 10c is attached to the single piece of the holding tape 5, and the holding tape 5 is intended to be stretched outward along the surface of the elastic body 201. Forces F11a, F11b. Further, the forces F11a, F11b also include components acting in the direction of the bonding force between the single piece 10b and the portion 10c and the holding tape 5. These forces F11a and F11b correspond to the force which causes the holding belt 5 to follow the movement of the single piece generated when the cutting is performed.

However, for the retaining belt 5 to which the forces F11a, F11b act, between the elastic body 201 and the elastic body 201, the frictional forces F12a, F12b act along the surface of the elastic body 201 in the opposite direction to the forces F11a, F11b. . Here, the frictional forces F12a and F12b are the forces that maximize the maximum static frictional force, and the larger the static frictional coefficient, the larger the frictional forces F12a and F12b are. The larger the static friction coefficient is, the more the retaining tape 5 is formed of a material that is less likely to slide relative to the elastic body 201.

Further, in the holding belt 5, the elastic body 201 is compressed as the upper blade 102 is pressed, and F13a and F13b which are to be stretched in the direction around the holding belt also function. Further, when the upper blade 102 is compressed, the elastic body 201 is also displaced by the force in the same direction as the holding tape 5, so that the force F13a, 13b acts, and no frictional force is generated between the two.

As a result, during the break, the forces F11a and F11b act on the outer side of the holding belt 5, and the forces F12a and F12b and the forces F13a and 13b act toward the center.

Therefore, in order to perform the breaking well, the required forces F11a and F11b exceed the resultant force F12a+F13a and the resultant force F12b+F13b when F12a and F13a are maximum values, respectively. It is assumed that the holding belt 5 is formed of a material that is not easily slidable with respect to the elastic body 201. Therefore, when the forces F11a and F11b do not exceed the combined force F12a+F13a and the resultant force F12b+F13b, respectively, the holding belt is stretched compared to the single piece 10b. The force toward the outside of 5, the force toward the inside is greater, so as shown in the figure In the case of the dotted line C in 5(b), the single piece 10b and the holding tape 5 are no longer maintained in the continuation state, and the single piece 10b which may cause the middle of the breaking is detached from the holding tape 5. That is, the single piece 10b obtained by breaking the bonded substrate 10 may be detached from the holding tape 5. Further, although the single piece 10c which is larger than the single piece 10b is less likely to cause such detachment, the same situation may be caused in principle.

Figure 6 is a diagram illustrating an elastomer 201 that is implemented to prevent such undesirable conditions.

Specifically, in order to reduce the static friction coefficient between the holding belt 5 and the elastic body 201, that is, to smooth the holding belt 5 with respect to the elastic body 201, the contact surface 201s of the elastic body 201 and the holding belt 5 is smoothed. deal with. Here, the smoothing treatment is, for example, a film attachment or coating.

Fig. 7 is a view showing a state of separation when the contact surface 201s of the elastic body 201 is subjected to a smoothing treatment. In addition, in FIG. 7, as in FIG. 5, the illustration of the bonding substrate 10 is simplified, and illustration of the upper blade 102 and the support body 202 is abbreviate|omitted.

First, in Fig. 7(a), similarly to Fig. 5(a), the force acting on the holding belt 5 when the single piece 10a is obtained by the previous division is obtained, and then the single piece 10b is obtained. In this case, the type of force acting on the holding belt 5 is the same as that shown in Fig. 5(a), but at this time, since the contact surface 201s is smoothed to lower the static friction coefficient, the holding belt 5 is self-elastic. The maximum value of the frictional forces F14a and F14b received by 201 is smaller than the maximum value of the frictional forces F12a and F12b shown in Fig. 5(a). As a result, when the forces F11a and F11b are respectively greater than the combined forces F14a+F13a and the combined forces F14b+F13b when the frictional forces F14a and F14b are the maximum static frictional force, as shown in FIG. 7(b), the upper blade 102 is pressed. The holding belt 5 of the center portion follows the movement when the single sheets 10b and 10c are to be moved outward. At this time, the holding belt 5 is stretched as indicated by the arrows AR11 to AR14, and the single piece 10b is broken without being separated.

Further, in more detail, the frictional forces F14a and F14b acting between the holding belt 5 and the elastic body 201 when the holding belt 5 follows the movement of the single sheets 10b and 10c are dynamic frictional forces which depend on the dynamic friction coefficient. Value, but implemented on the contact surface 201s of the elastomer 201 In the case of the smoothing treatment, not only the static friction coefficient is lowered but also the dynamic friction coefficient is lowered. Therefore, when the smoothing treatment is performed, the separation of the single piece 10b can be preferably suppressed.

As described above, according to the present embodiment, the bonded substrate obtained by bonding two brittle material substrates, in particular, two brittle material substrates containing different materials, by means of an adhesive is cut at a predetermined predetermined position. In the first place, a scribe line is provided at a predetermined predetermined position on the main surface side of one of the bonded substrates. Then, the main surface on the side where the scribe line is formed is attached to the holding tape, and if a protective film is attached to the other main surface as needed, the bonded substrate is placed on the elastic body with the side of the holding tape as the lower side. . In the placed state, the upper blade is lowered from the upper predetermined position with respect to the bonded substrate. Thereby, the bonded substrate including the out-of-phase interface can be preferably separated by less than the previous three-point bending method. Moreover, it is possible to achieve a good break without a positional shift in a single piece obtained by the division.

Further, by performing the smoothing treatment on the surface of the elastic body in advance, it is possible to preferably suppress the separation of the single-piece self-retaining tape obtained by the breaking.

<variation>

In addition to the glass substrate and the tantalum substrate, ceramic substrates such as various semiconductor substrates, sapphire substrates, and alumina substrates, and glass ceramic substrates (so-called LTCC (Low Temperature Co-fired Ceramic) can be exemplified as the brittle material substrate of the above-described embodiment. Burn ceramics) substrates, etc.

When the substrate is bonded to a different material, it is preferable to form a protective film on the side of the brittle material having a property of being easily broken (high brittleness, small thickness), and having a property of being difficult to break (low brittleness, A large thickness) of the brittle material substrate side is formed with a scribe line.

1‧‧‧ glass substrate

2‧‧‧Semiconductor substrate

3‧‧‧Next layer

4‧‧‧Protective film

5‧‧‧Retaining belt

10‧‧‧Fixed substrate

102‧‧‧Upper blade

201‧‧‧ Elastomers

201s‧‧‧Contact surface

202‧‧‧Support

S‧‧‧

Claims (7)

A method for separating a bonded substrate, which is characterized in that a bonded substrate obtained by bonding two brittle material substrates is cut at a predetermined predetermined position, and a scribing forming step is provided. Providing a scribe line at a predetermined predetermined position on a main surface side of the bonded substrate; and a substrate attaching step of attaching the one main surface of the bonded substrate provided with the scribe line to the holding tape a mounting step of placing the bonded substrate to which the holding tape is attached on the surface of the surface of the main surface to be smoothed, and the step of breaking, In the state where the bonded substrate is placed on the elastic body, the bonded substrate is cut by lowering the front end of the upper blade while abutting against the predetermined predetermined position. The method for separating a bonded substrate according to claim 1, wherein at least after the scribe forming step and before the dividing step, a protective film attaching step is provided, the protective film attaching step being attached to the bonded substrate A protective film is attached to the main surface. A method for separating a bonded substrate, characterized in that the bonded substrate obtained by bonding two brittle material substrates is sequentially divided at a plurality of predetermined predetermined positions, and is provided with a scribe line. a step of providing a scribe line at a plurality of predetermined predetermined positions on one of the main surface sides of the bonded substrate; and a holding tape attaching step of the above-mentioned affixed substrate The main surface is attached to the holding tape, and the mounting step is performed by smoothing the surface of the bonding substrate to which the holding tape is attached so as to be in contact with the entire surface of the main surface. And the breaking step of repeating the operation of placing the bonded substrate on the elastic body at the plurality of predetermined predetermined positions, that is, by making the front end of the upper blade The bonded substrate is cut while being lowered while abutting against the predetermined predetermined position. The method for separating a bonded substrate according to claim 3, wherein at least after the scribe forming step and before the dividing step, a protective film attaching step is provided, the protective film attaching step being attached to the bonded substrate A protective film is attached to the main surface. A method for separating a bonded substrate, characterized in that the bonded substrate obtained by bonding two brittle material substrates is cut at a predetermined predetermined position, and the bonded substrate is in a main The surface of the upper blade is formed with a scribe line and the one main surface faces downward, and the elastic body formed by smoothing the surface supports the bonded substrate from below. The bonded substrate is divided while being lowered against the predetermined predetermined position. A breaking device for bonding a substrate, which is characterized in that a bonding substrate obtained by bonding two brittle material substrates is cut at a predetermined predetermined position, and a scribing forming mechanism is provided. The above-mentioned breaking pre-preparation on one main surface side of the above-mentioned bonding substrate a substrate affixing mechanism for attaching the one main surface of the bonded substrate provided with the scribe line to the holding tape, and a mounting mechanism for attaching the bonding tape to the holding tape The substrate is placed on the surface of the above-mentioned main surface side so as to be placed on the surface of the surface of the elastic body; and the breaking mechanism is used to mount the bonding substrate on the elastic body. The bonded substrate is divided by lowering the front end of the upper blade while abutting against the predetermined predetermined position. A breaking device for bonding a substrate, characterized in that the bonding substrate obtained by bonding two brittle material substrates is cut at a predetermined predetermined position, and the surface is smoothed An elastic body that supports the bonded substrate from below, wherein the bonded substrate is formed with a scribe line at a predetermined predetermined position on one main surface side, and the one main surface faces downward; and a breaking mechanism is provided The front surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of the upper surface of