JP2016112714A - Dividing method and dividing device of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a push-in quantity of a break blade when dividing a substrate.SOLUTION: A scribe line S is formed in advance on one glass substrate 11 among two brittle material substrates stuck together by an adhesive layer 12, and a constant width groove 14 is formed on the other silicon substrate 13 along its scribe line S. A break blade 23 is pushed down from the groove 14 side, so that the break blade 23 contacts with a corner part of the groove 14, and the contact area of the break blade is reduced, and a push-in quantity is reduced, and a break can be executed.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a cutting method for breaking a brittle material substrate, and more particularly to a cutting method and a cutting device for a composite substrate in which two brittle material substrates are laminated with an adhesive.

  Conventionally, when a silicon substrate is divided, it is often divided using a dicing saw or the like. Patent Document 1 proposes a method for dividing a glass ceramic substrate that breaks after scribing the glass ceramic substrate a plurality of times with a light load.

Japanese Patent Laid-Open No. 2001-113521

  In Patent Document 1, the glass ceramic substrate is scribed a plurality of times, but the silicon substrate is not divided. In dividing a glass plate, a method is widely used in which a scribe line is formed on a glass plate by a scribing device, and the glass plate is broken by breaking along the scribe line.

  FIG. 1A shows a substrate 100 to be divided, and shows a composite substrate 100 in which a silicon substrate 103 is laminated on a glass substrate 101 with an adhesive layer 102 interposed therebetween. In this composite substrate, a scribe line S is formed in advance along the line to be divided on the lower surface of the glass substrate 101. FIG. 1B is a cross-sectional view showing a state in which the composite substrate 100 is disposed on the table 104 via the elastic body 105 and the dicing tape 106 and is broken from above using the break blade 108 via the protective film 107. is there. Then, when the break blade 108 is vertically lowered along the scribe line from the top, the crack along the lower scribe line S progresses upward and is divided as shown in FIGS. 2 (a) to 2 (c). it can.

  However, with such a dividing method, the amount of pushing required for breaking at the time of dividing becomes as large as 0.35 mm, for example. When the push-in amount is large, the contact area of the break blade is large, so that the contact surface is liable to deteriorate. Further, when the pushing amount increases, the dicing tape 106 may be pulled left and right, and the substrate may be peeled off. When peeling occurs, it causes a positional shift of the substrate and a contact with the substrate, and there is a problem that the processing quality is deteriorated.

  The present invention has been made paying attention to such problems. When the substrate is scribed and the break blade is pushed down from the opposite surface and divided, the break blade is pushed in to reduce the amount to be divided. For the purpose.

  In order to solve this problem, the substrate cutting method according to the present invention is formed by forming a scribe line on one surface of the substrate along a planned cutting line and a groove on the other surface of the substrate, and forming the groove on the elastic body. Place the substrate so that the surface on which the scribe line is formed is aligned, and press the break blade along the scribe line against the surface on which the groove is formed on the substrate, and break along the scribe line. To do.

  Further, the substrate cutting apparatus of the present invention includes a scribe line forming means for forming a scribe line on one surface of the substrate along the planned cutting line, and a groove on the other surface of the substrate along the planned cutting line. Groove forming means to be formed; and break means for breaking by pressing a break blade along the scribe line against the surface of the substrate on which the groove is formed.

  Here, the substrate may be a composite substrate in which the first and second brittle material substrates are laminated via an adhesive layer.

  Here, the first brittle material substrate may be a glass substrate, and the second brittle material substrate may be a silicon substrate.

  According to the present invention having such a feature, a scribe line is formed in advance on one surface along the planned dividing line of the substrate, a groove is formed on the opposite surface, and the groove portion is extended along the scribe line. Press the break blade to break. In this way, the break blade comes into contact with the corners of the grooves, and the cracks along the scribe line penetrate by spreading the substrate. For this reason, the pushing amount of the break blade can be reduced, and the effect that the accuracy of the end face can be improved is obtained.

FIG. 1 is a cross-sectional view showing an example of a conventional composite substrate to be divided. FIG. 2 is a cross-sectional view showing a process of dividing a conventional composite substrate. FIG. 3 is a cross-sectional view of a composite substrate to be divided according to the embodiment of the present invention. FIG. 4 is a cross-sectional view showing a dividing process of the composite substrate according to the embodiment of the present invention.

  Next, an embodiment of the present invention will be described. FIG. 3A is a diagram showing the composite substrate 10 to be divided according to the embodiment of the present invention. The composite substrate 10 is, for example, a composite substrate in which a silicon substrate 13 is laminated on a glass substrate 11 with an adhesive layer 12 interposed therebetween. For example, the glass substrate 11 has a thickness of 0.4 mm, the adhesive layer 12 has a thickness of 50 μm, and the silicon substrate 13 has a thickness of 70 μm. When dividing such a composite substrate 10 in a predetermined pattern, the scribing wheel is pressed and rolled by a scribing device (not shown) along the planned dividing line from the surface of the glass substrate 11 for scribing. The scribe line thus formed is referred to as a scribe line S. The scribing wheel used at this time may be a normal scribing wheel (normal scribing wheel) in which notches and grooves are not formed on the ridgeline in the outermost peripheral portion, and the cutting edge is formed with a notch and grooves. It may be a penetrating or non-high penetrating scribing wheel (Japanese Patent No. 3074143, Japanese Patent No. 5022602, Japanese Patent No. 5078354, Japanese Patent No. 5055119, etc.).

  Next, as shown in FIG. 3B, a groove 14 having a constant width is formed in the composite substrate 10 with respect to the silicon substrate 13 so that the scribe line S is located in the center along the planned dividing line. In the present embodiment, the groove 14 is formed along the planned dividing line using a dicer. The width w of the groove 14 is about 100 μm, for example.

  The groove 14 may cut the silicon substrate 13 completely with a constant width, or the layer of the silicon substrate 13 may remain or the groove may reach the adhesive layer 12. Moreover, although the cross-sectional shape of the groove | channel 14 is formed so that it may become a substantially rectangular shape, it may be a groove | channel with the shape where the bottom face curved, and you may make it a cross section become a V-shaped groove | channel.

  Next, the dicing tape 15 is bonded in advance to the lower surface of the glass substrate 11 of the composite substrate 10, and the composite substrate 10 is disposed on the elastic body 21 on the table 20 of the breaking device as shown in FIG. . Then, the protective film 22 is placed on the composite substrate 10 and the break blade 23 is pushed down from directly above the scribe line S to perform the break. When the break blade 23 is gradually pushed down, the side wall of the break blade 23 first comes into contact with the corner of the groove of the silicon substrate 13 via the protective film 22 as shown in FIG. 4B, and the break blade 23 is pushed down. As a result, cracks in the scribe line penetrate upward in the glass substrate 11. When the break blade 23 is further pushed down, as shown in FIG. 4C, a force to tear the adhesive layer 12 in the lateral direction works, and a push-down amount smaller than that without the groove 14, for example, 0.2 mm. The composite substrate 10 can be divided by the amount of depression. Therefore, the positional deviation of the substrate at the time of break is reduced. Further, since the contact area of the break blade 23 is reduced, it is possible to minimize the deterioration of the quality of the contacting surface and improve the processing quality.

  In the embodiment described above, the grooves are formed in the silicon substrate 12 using a dicer, but the present invention is not limited to this, and the grooves may be formed by a laser such as a YAG laser. It is also possible to form the grooves using dry etching such as plasma etching or wet etching.

  Although the width w of the groove 14 formed in the silicon substrate 13 is 100 μm, the width w and the apex angle of the break blade are determined so that the side surface of the break blade 23 contacts the corner of the groove 14. The portion that contacts the groove of the break blade is preferably close to perpendicular to the surface of the composite substrate 10.

  In this embodiment, a composite substrate in which a silicon substrate is laminated on an upper surface of a glass substrate through an adhesive layer is described. However, the present invention is a composite substrate in which two brittle material substrates are laminated through an adhesive layer. Can be applied to breaks. Further, in this embodiment, after the scribe is formed, a groove is formed and breaks. However, the groove is formed first, and the position corresponding to the center of the groove of the other brittle material substrate where the groove is not formed. Alternatively, a scribe may be formed, and a break blade may be pushed down along the groove to break.

  In this embodiment, a break of a composite substrate in which two layers of a brittle material substrate are laminated via an adhesive layer is described. However, the present invention forms a scribe line on one surface of a single layer of a brittle material substrate. It can also be applied to the case where a groove including a scribe line at the center is formed on the other surface and the break blade is pushed down from the groove side to break.

  INDUSTRIAL APPLICABILITY The present invention can be easily divided using a scribing device and a break device, and is effective in manufacturing a minute composite substrate.

DESCRIPTION OF SYMBOLS 10 Composite substrate 11 Glass substrate 12 Adhesion layer 13 Silicon substrate 14 Groove 20 Table 21 Elastic body 22 Protective film 23 Break blade

Claims (4)

A method for dividing a substrate,
A scribe line is formed on one surface of the substrate along the planned dividing line, and a groove is formed on the other surface of the substrate,
The substrate is placed on an elastic plate so that the surface on which the scribe line of the substrate is formed is aligned, and a break blade is pressed against the surface of the substrate on which the groove is formed along the scribe line to break. A method of dividing a substrate that is divided along a line.   2. The method for dividing a substrate according to claim 1, wherein the substrate is a composite substrate in which first and second brittle material substrates are laminated via an adhesive layer.   3. The method for dividing a substrate according to claim 2, wherein the first brittle material substrate is a glass substrate, and the second brittle material substrate is a silicon substrate. A substrate cutting device,
A scribe line forming means for forming a scribe line on one surface of the substrate along a line to be cut;
A groove forming means for forming a groove on the other surface of the substrate along the planned cutting line;
Breaking means for breaking by pressing a break blade along the scribe line on the surface of the substrate where the groove is formed;
Cutting device having.

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