JPH0817766A - Braking device of semiconductor wafer - Google Patents

Abstract

PURPOSE:To prevent damage such as chipping and crack from occurring by placing a plurality of lines of edges on the outer-periphery surface of a braking roller by placing them in peripheral direction at an equal spacing so that they are extended in the direction of the axial line of the breaking roller and then allowing the spacing of each etch to correspond to the spacing of a breaking spare line. CONSTITUTION:A braking roller 14 is formed in a long and narrow hexagonal post shape. Therefore, six lines of edges 15 are placed at the outer periphery of the braking roller 14 according to six ridges of the hexagonal post at an equal spacing in peripheral direction so that they are extended in the direction of axial line of the braking roller 14. Then, a spacing L between the adjacent edges 15, 15 is set so that it is equal to a spacing P of braking spare lines. Also, a relief part 16 is provided in a sectional circular shape and in the groove shape with a constant width and a constant depth being extended in the direction of the axial line. Also, a position deviation compensation device 20 compensates the position deviation between the braking spare line of the semiconductor wafer and the edge.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer braking apparatus, and more particularly to a braking technology for rolling a braking roller to divide a semiconductor wafer into a plurality of pellets. , Which is effective for dividing a semiconductor wafer into a plurality of pellets.

[0002]

2. Description of the Related Art A semiconductor device manufacturing process includes a pre-process in which a semiconductor integrated circuit, an optical semiconductor circuit, or the like is formed for each pellet in a wafer state, and a step in which each pellet of a wafer is divided into one. It is roughly divided into a post process in which the substrate is assembled and a sealing process is performed.

Generally, in the subsequent step of the manufacturing process of the semiconductor device, the dividing step of dividing the semiconductor wafer into each pellet is carried out by the following work.

First, in order to prevent the divided pellets from being dispersed, a main surface (hereinafter referred to as a front surface) opposite to a main surface (hereinafter referred to as a front surface) on which an integrated circuit of a semiconductor wafer is formed is provided. That is) a synthetic resin adhesive sheet is attached. Next, a plurality of braking preliminary lines are formed on the front surface of this semiconductor wafer along a scribe line corresponding to the boundary line between the pellets with diamond needles, diamond blades, etc., like a grid pattern. .

After that, the semiconductor wafer is placed with the adhesive sheet on the upper side on an elastic base formed in a flat plate shape using an elastic material such as rubber or resin. Then, a round bar-shaped braking roller is pressed against the pressure-sensitive adhesive sheet of the semiconductor wafer and rolled, whereby the semiconductor wafer is divided into a plurality of pellets along the preliminary braking line. At this time, as the braking roller rolls, the semiconductor wafer is slightly bent and deformed following the elastic deformation of the elastic base, so that the semiconductor wafer is cleaved in the crystal axis direction along the breaking preliminary line. .

During the braking operation, the elasticity of the elastic base, the outer diameter of the braking roller, the pressing force of the braking roller, the moving speed of the braking roller, etc. affect the accuracy of dividing the semiconductor wafer.

Note that Japanese Patent Publication No. 2-59636 and Japanese Patent Publication No. 2-60076 are examples of a semiconductor wafer breaking device.

[0008]

However, in this semiconductor wafer braking operation, since the round bar-shaped braking roller is used, it is possible to brake against the braking reserve line to which a true force should be applied. Since the bending stress does not act efficiently, the semiconductor wafer is not satisfactorily braked, and problems such as two or three consecutive cracks remain. Then, the present inventor has clarified that this crack residue problem becomes more remarkable as the pellet size becomes smaller. When a breaking roller is applied again when cracks remain, breaking stress also acts on the already divided pellets, causing damage such as chipping and cracking.

An object of the present invention is to provide a braking device for a semiconductor wafer, which can satisfactorily and easily divide the semiconductor wafer into pellets.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, a semiconductor wafer in which a plurality of breaking preliminary lines are formed on one main surface and an adhesive sheet is adhered on the opposite main surface is provided on a base made of an elastic material and the breaking preliminary line side is provided. The main surface is brought into contact with and held, and the braking roller is pressed against the pressure-sensitive adhesive sheet of the semiconductor wafer and rolled, whereby the semiconductor wafer is divided into a plurality of pellets along the breaking preliminary line. In a semiconductor wafer braking device, a plurality of edges are provided on the outer peripheral surface of the braking roller, and the edges are laid so as to extend in the axial direction of the braking roller at equal intervals in the circumferential direction. It is characterized in that the interval of (1) corresponds to the interval of the braking preliminary line.

[0013]

According to the above-mentioned means, the edge of the braking roller hits directly above the preliminary braking line of the semiconductor wafer, so that the braking stress reliably acts on the preliminary braking line. As a result, the cleavage is formed along the breaking preliminary line in the crystal axis direction, so that the semiconductor wafer is reliably divided into the pellets without any cracking residue.

Further, by providing a current positional relationship between the edge and the braking preliminary line and providing a positional deviation correcting means for correcting the positional deviation between the edge and the braking preliminary line, the current braking preliminary line and Since the misalignment with the edge can be immediately corrected, the edge of the braking roller can be surely applied right above the preliminary braking line of the semiconductor wafer. As a result, it is possible to secure the above-mentioned effects.

[0015]

1 is an enlarged cross-sectional view showing an essential part of a semiconductor wafer breaking apparatus according to an embodiment of the present invention, and FIG. 2 is a partially omitted perspective view showing the whole thereof. FIG. 3 is a plan view showing a state where a breaking preliminary line is formed on the surface of a semiconductor wafer to which an adhesive sheet is attached.

In the present embodiment, the semiconductor wafer breaking apparatus 10 according to the present invention is configured to divide the semiconductor wafer into pellets each having a semiconductor integrated circuit formed therein. 11). The table 11 is supported so as to be linearly reciprocally movable in a horizontal plane, and is configured to be linearly and linearly driven by a linear and linear driving device (not shown) such as a linear motor. The table 11 is rotatably supported in a horizontal plane, and is configured to be rotationally driven by a rotational drive device (not shown). An elastic base 12 is provided on the upper surface of the table 11.
The elastic base 12 is made of rubber or resin having appropriate elasticity and is formed in a flat plate shape having a uniform thickness.

A pair of brackets 13 are installed above the table 11 so as to be parallel and horizontal to each other with a space equal to or larger than the outer diameter of the elastic base 12, and between the brackets 13 and 13. Is horizontally mounted and rotatably supported at both ends. In this embodiment, the braking roller 14 is formed in the shape of an elongated hexagonal prism. Therefore, by the six ridge lines of the hexagonal column, six edges 15 are arranged on the outer periphery of the braking roller 14 at equal intervals in the circumferential direction, and the braking roller 1 is provided.
4 is laid so as to extend in the axial direction. The distance L between the adjacent edges 15 is set to be equal to the distance P between the braking preliminary lines, which will be described later. In addition, a clearance portion 16 is formed between adjacent edges 15 and 15 in the shape of a groove having a constant width and a constant depth and extending in the axial direction with an arcuate cross section.

Servo motor 1 is attached to one bracket 13.
7, the servo motor 17 is configured to drive the braking roller 14 to rotate in cooperation with the feed motion of the table 11, and is also connected to a position deviation correction device described later to be feedback-controlled. Is configured to.

A pair of auxiliary rollers 18 are arranged above the braking roller 14 so as to be symmetrical with respect to each other with a vertical plane passing through the center line of the braking roller 14 in between and to be circumscribed to the braking roller 14. Both ends of each auxiliary roller 18 have a pair of brackets 1.
It is rotatably supported by 3 and 13, respectively.
Therefore, each auxiliary roller 18 is the braking roller 1
4 is configured to rotate following the rotation of No. 4, and the braking roller 14 is prevented from bending upward during this rotation.

The pair of brackets 13, 13 supporting the braking roller 14 and both auxiliary rollers 18 are configured to be movable in the vertical direction by a vertical drive device (not shown) such as a jack. By this vertical movement, the braking pressure, which will be described later, of the braking roller 14 is adjusted.

In this embodiment, the semiconductor wafer breaking device 10 has a positional deviation for correcting the positional deviation between the breaking preliminary line and the edge by obtaining the positional relationship between the breaking preliminary line and the edge of the semiconductor wafer. Correction device 2
0 is installed. The positional deviation correction device 20 includes a braking line detection device 21 that detects a braking line after the semiconductor wafer is braked. The braking line detection device 21 is close to one side of the braking roller 14. Are arranged. This braking line detection device 21 is a reflection type optical sensor (hereinafter referred to as a sensor).
A pair of sensors 22 are provided, and the sensors 22 and 22 are arranged at positions near both ends of the braking roller 14.
Both sensors 22 and 22 are electrically connected to the controller 23 of the braking line detection device 21, and the detection result is transmitted to the controller 23 as an electric signal. The controller 23 is constructed by using a computer, a signal processing device, etc.
The same braking line is determined from the detection results of 2 and 22, and the position of the determined braking line with respect to the reference position is obtained.

A servo motor 17 and a controller (not shown) for the table 11 are electrically connected to the controller 23. The controller 23 compares the position signal from the encoder of the servo motor 17 with the position signal of the braking line obtained by the detection signal from the sensor 22 to detect the edge 15 of the braking roller 14 and the braking line. It is configured to obtain a positional relationship. Here, since the braking line is formed along the braking preliminary line, the position of the braking line always has a constant relationship with the braking preliminary line. Therefore, the positional relationship between the edge and the braking line indicates the positional relationship between the edge and the braking preliminary line. Then, the controller 23 obtains the positional deviation between the edge and the braking preliminary line based on the positional relationship between the edge and the braking preliminary line, calculates a correction value for correcting the positional deviation, and feeds back the calculated correction value. The control signal is transmitted to the servo motor 17 and the table 11.

On the other hand, the semiconductor wafer as the work of the semiconductor wafer breaking apparatus in this embodiment is manufactured in advance by the following work.

First, in a so-called pre-process in a manufacturing process of a semiconductor device, a semiconductor wafer 1 is formed into a substantially disc shape, and each pellet 2 has an electronic circuit such as a transistor, a diode, a semiconductor integrated circuit, and an optical semiconductor circuit. Built in.

Next, in the sheet attaching step, the adhesive sheet 3 is attached to the semiconductor wafer 1 on the back side opposite to the front side where the electronic circuit is formed. The adhesive sheet 3 is made of a material having elasticity such as synthetic resin,
A sheet base material 4 formed in a circular thin film shape having a diameter larger than that of the semiconductor wafer 1 is provided, and an appropriate pressure sensitive adhesive 5 is applied to one surface of the sheet base material 4. As the sheet base material 4, for example, a vinyl chloride sheet, a polyester sheet or the like is generally used, and in this embodiment, it is formed transparent.

Subsequently, in a scribing process or a dicing process, a plurality of braking preliminary lines 6 are provided on the front surface of the semiconductor wafer 1, and diamonds are respectively provided along scribe lines corresponding to boundaries between the pellets 2 and the pellets 2. It is formed like a grid with a needle or a diamond blade. The intervals (pitch) P of the braking preliminary lines 6 are set at equal intervals, and the braking rollers 14 are set at the pitch P of the braking preliminary lines 6.
The intervals L between the edges 15 of 15 are matched.

Next, the braking operation for dividing the semiconductor wafer 1 as the workpiece manufactured as described above into the pellets 2 by using the semiconductor wafer braking apparatus 10 having the above-described structure will be described.

First, the semiconductor wafer 1 as a workpiece manufactured as described above is placed on the elastic base 2 having elasticity with the adhesive sheet 3 on the upper side.

Subsequently, the pair of brackets 13 supporting the braking roller 14 and each auxiliary roller 18 are lowered with respect to the table 11, and an arbitrary edge 15 of the braking roller 14 is pushed onto the adhesive sheet 3. The braking pressure is determined by being touched.

Next, the table 11 is driven in one direction at a predetermined moving speed, and the braking roller 14 is moved relative to the table 11 by the servo motor 17 at the same peripheral speed as the moving speed of the table 11. It is rotated in the direction of rolling. As a result, the braking roller 14 is pressed against the semiconductor wafer 11 with a predetermined force and is relatively rolled at a predetermined moving speed. At this time, the distance L between the edges 15 of the braking roller 14 is set to the semiconductor wafer 1
Since it is set so as to match the spacing P of the braking preliminary line 6 in the above, the edge 15 formed on the outer periphery of the braking roller 14 is braked on the semiconductor wafer 1 in accordance with the rolling of the braking roller 14. Press directly on the ring spare line 6 in sequence.

Then, the semiconductor wafer 1 of this edge 15
Since the elastic base 2 is pressed and elastically deformed by pressing against the semiconductor wafer 1, the semiconductor wafer 1 is in a depressed state. At this time, since the edge 15 of the braking roller 14 is pressed against the breaking preliminary line 6 of the semiconductor wafer 1, the load is concentrated on the breaking preliminary line 6 and thus the semiconductor is concentrated. The wafer 1 tries to bend from the edge 15 as a starting point. As a result, a force is applied to the semiconductor wafer 1 such that the breaking preliminary line 6 is opened to the end with the edge 15 as a starting point, so that the semiconductor wafer 1 is accurately cleaved along the breaking preliminary line 6 in the crystal axis direction. It will be in the state to be.

When the semiconductor wafer 1 is cleaved along the breaking preliminary line 6 in the crystal axis direction, the breaking line 7 appears on the front surface of the semiconductor wafer 1. The braking line 7 is detected by the braking line detection device 21.
That is, since the adhesive sheet 3 is composed of the transparent sheet base material 4, the braking line 7 appearing on the front surface of the semiconductor wafer 1 can be detected by the sensor 22 of the braking line detection device 21. By the way, since the sheet base material 4 and the adhesive 5 are formed into an extremely thin film, the detection light of the sensor 22 can be sufficiently transmitted,
Even if the sheet base material 4 is not transparent, the breaking line 7 appearing on the front surface of the semiconductor wafer 1 can be detected by the sensor 22 of the breaking line detecting device 21.

The detection result of the sensor 22 is transmitted to the controller 23 of the braking line detecting device 21. The controller 23 obtains the position of the braking line 7 with respect to the reference position based on the detection result of the sensor 22. Then, the controller 23 compares the position signal from the encoder of the servo motor 17 with the obtained position signal of the braking line 7 to determine the positional relationship between the edge 15 of the braking roller 14 and the braking line 7. Ask.
Here, as described above, since the braking line 7 is formed along the braking line 6, the detected position of the braking line 7 is always in a fixed relationship with the braking line 6. Therefore, the positional relationship between the edge 15 and the detected braking line 7 indicates the positional relationship between the edge 15 and the braking preliminary line 6. Therefore, the controller 23 obtains the positional deviation between the edge 15 and the braking preliminary line 6 based on the positional relationship between the edge 15 and the braking preliminary line 6, and calculates and calculates a correction value for correcting the positional deviation. The correction value is transmitted to the servo motor 17 and the table 11 as a feedback control signal.

When a feedback control signal is sent from the controller 23, the servo motor 17 controls the rotation angle of the braking roller 14, and the table 11 controls the feed amount of the semiconductor wafer 1. If the controller 23 determines that the detected braking line 7 is inclined with respect to the reference line, the table 1
1 is rotated in a direction to eliminate the inclination.
By these controls, the edge 15 of the braking roller 14 is automatically aligned right above the braking preliminary line 6 of the semiconductor wafer 1. And edge 15
Is aligned right above the braking reserve line 6 so that the braking line 7 is accurately formed along the braking reserve line 6. For this reason, the semiconductor wafer 1 is satisfactorily divided along the breaking preliminary line 6, and the occurrence of cracks at the divided portions, cracks, cracks, two cracks, and the like are prevented.

Of the braking preliminary lines 6 formed in the vertical and horizontal directions, for example, the vertical braking preliminary lines 6 are provided.
When the braking operation of the semiconductor wafer 1 along the line is completed, the table 11 is rotated by 90 degrees, and subsequently, the braking roller 1 is moved along the lateral breaking preliminary line 6.
By relatively rolling 4 on the semiconductor wafer 1, the braking operation is performed in the same manner as described above. When each braking operation is completed on the braking preliminary line 6 formed in the vertical and horizontal directions in this manner, the semiconductor wafer 1 is divided into the pellets 2 along the braking preliminary line 6. Then, the edge 15 is aligned right above the braking preliminary line 6 so that the braking line 7 is accurately formed along the braking preliminary line 6. Therefore, the semiconductor wafer 1
Is satisfactorily divided for each pellet 2 along the preliminary braking line 6, and cracking of the pellet 2 and chipping, cracks, and two cracks remaining such as continuous cracks are prevented from occurring.

According to the above embodiment, the following effects can be obtained. (1) Edge 15 is formed on the outer peripheral surface of the braking roller 14.
By arranging a plurality of lines at equal intervals in the circumferential direction so as to extend in the axial direction of the braking roller 14, and by making the interval L of each edge 15 correspond to the interval P of the braking preliminary line 6, Since the edge 15 of the braking roller 14 can be applied right above the braking preliminary line 6 of the semiconductor wafer 1, the braking stress can be reliably applied to the braking preliminary line 6 and, as a result, the braking Since the cleavage is formed in the crystal axis direction along the ring preliminary line 6, it is possible to surely divide the semiconductor wafer 1 into the pellets 2 in a state where no cracking residue is generated.

(2) According to the above (1), since it is not necessary to re-roll the semiconductor wafer on which the braking operation has been performed, defects such as chipping and cracks caused by re-rolling occur. Can be avoided in advance.

(3) By providing the positional deviation correcting device 20 for finding the current positional relationship between the edge 15 and the braking preliminary line 6 and correcting the positional deviation between the edge 15 and the braking preliminary line 6, Breaking spare line 6
Since the misalignment between the edge 15 and the edge 15 can be immediately corrected, the edge 15 of the braking roller 14 can be surely applied right above the braking preliminary line 6 of the semiconductor wafer 1. As a result, the function and effect of the above (1) can always be reliably maintained.

FIG. 4 is a perspective view showing a semiconductor wafer breaking device according to another embodiment of the present invention.

In the second embodiment, the semiconductor wafer breaking device 30 according to the present invention is configured to manually divide the semiconductor wafer into pellets each having a semiconductor integrated circuit, and the semiconductor wafer is fixed. A braking table (hereinafter, referred to as a table) 31 having a shape, a weight 33, and a braking roller 34 are provided. An elastic base 32 is laid on the upper surface of the table 31,
The elastic base 32 is made of rubber or resin having an appropriate elasticity and is formed in a flat plate shape having a uniform thickness.

Similar to the first embodiment, the braking roller 34 is formed in an elongated hexagonal prism shape. Therefore, by the six ridge lines of the hexagonal prism, six edges 35 are laid on the outer circumference of the braking roller 34 so as to extend in the axial direction at equal intervals in the circumferential direction. The interval L between the adjacent edges 35 and 35 is set to be equal to the interval P between the braking preliminary lines. In addition, a clearance portion 36 is formed between each adjacent edge 35 and 35 so as to be recessed in a groove shape having an arc-shaped cross section and extending in the axial direction and having a constant width and a constant depth.

The weight 33 has a length corresponding to the braking roller 14 and is formed in an I-shaped steel shape having a weight that exerts an appropriate braking pushing force, and is placed so as to be orthogonal to the upper surface of the braking roller 34. With the peeled off,
The braking roller 34 can be rolled with respect to the semiconductor wafer 1 by being linearly moved with respect to the table 31 by a manual operation.

Next, the braking work by the braking device 30 for the semiconductor wafer having the above structure will be described. Here, the work is manufactured and configured in the same manner as in the first embodiment.

First, the semiconductor wafer 1 as a work is placed on the elastic base 32 with the adhesive sheet 3 on the upper side.

Subsequently, the braking roller 34 is placed on the upper surface of the adhesive sheet 3 of the semiconductor wafer 1. At this time, the edge 35 of the braking roller 34 is aligned with the preliminary braking line 6 of the semiconductor wafer 1.

Next, the weight 34 is manually applied by the operator.
Is applied to the upper surface of the braking roller 34 so as to be orthogonal to each other in the central portion, and the weight 34 is horizontally translated in the longitudinal direction while applying an appropriate load. By operating the weight 33, the braking roller 34 rolls while being pressed against the semiconductor wafer 1 with a predetermined force. At this time, the interval L between the respective edges 35 of the braking roller 34 is set to match the interval P of the preliminary braking line 6 on the semiconductor wafer 1, so that the braking roller 34 rolls along with it. The edge 35 formed on the outer circumference of the braking roller 34 is pressed onto the semiconductor wafer 1 directly above the preliminary braking line 6.

Then, the semiconductor wafer 1 of this edge 35
Since the elastic base 2 is pressed and elastically deformed by pressing against the semiconductor wafer 1, the semiconductor wafer 1 is in a depressed state. At this time, the edge 35 of the braking roller 34 presses directly above the braking preliminary line 6 of the semiconductor wafer 1, so that the load concentrates directly above the braking preliminary line 6 and therefore the semiconductor The wafer 1 tries to bend with the edge 35 as a starting point. As a result, a force is applied to the semiconductor wafer 1 so that the breaking preliminary line 6 is opened to the end with the edge 35 as a starting point, so that the semiconductor wafer 1 is accurately cleaved along the breaking preliminary line 6 in the crystal axis direction. It will be in the state to be.

When the semiconductor wafer 1 is cleaved along the breaking preliminary line 6 in the crystal axis direction, the breaking line 7 appears on the front surface of the semiconductor wafer 1. This braking line 7 is visually observed by the operator. That is, since the adhesive sheet 3 is composed of the transparent sheet base material 4,
The breaking line 7 appearing on the front surface of the semiconductor wafer 1 can be visually detected by an operator.

Then, the operator obtains the positional relationship between the visually observed braking line 7 and the edge 35 of the braking roller 34. Here, as described above, since the braking line 7 is formed along the braking preliminary line 6, the visually recognized position of the braking line 7 is always in a constant relationship with the braking preliminary line 6. Therefore, the positional relationship between the edge 35 and the detected braking line 7 is the edge 3
5 shows the positional relationship between the braking line 5 and the backup line 6.

Therefore, when the operator sees the braking line 7 and the edge 35 of the braking roller 34 deviate from each other, the operator aligns the edge 35 of the braking roller 34 with the observed braking line 7. Perform correction work. Since the edge 35 is aligned with the braking line 7 by aligning the edge 35 with the braking line 7, the braking line 7 will be accurately aligned with the braking line 6 thereafter. Will be formed in. For this reason, the semiconductor wafer 1 is satisfactorily divided along the breaking preliminary line 6, and the occurrence of cracks at the divided portions, cracks, cracks, two cracks, and the like are prevented.

Then, when the braking operation of the semiconductor wafer 1 along, for example, the vertical breaking preliminary line 6 of the vertical and horizontal braking preliminary lines 6 is completed, the worker sets the braking roller 34 and Weight 3
3 is rotated 90 degrees to perform the rearrangement. Subsequently, the braking roller 34 is relatively rolled on the semiconductor wafer 1 along the lateral braking preliminary line 6 to perform the braking operation in the same manner as described above. When each braking operation is completed on the braking preliminary line 6 formed in the vertical and horizontal directions in this manner, the semiconductor wafer 1 is divided into the pellets 2 along the braking preliminary line 6. Then, the edge 35 is aligned right above the braking preliminary line 6, so that the braking line 7 is accurately formed along the braking preliminary line 6. Therefore, the semiconductor wafer 1
Is satisfactorily divided for each pellet 2 along the preliminary braking line 6, and cracking of the pellet 2 and chipping, cracks, and two cracks remaining such as continuous cracks are prevented from occurring.

According to the second embodiment, the following effects can be obtained. (1) Edge 35 is formed on the outer peripheral surface of the braking roller 34.
By arranging a plurality of lines at equal intervals in the circumferential direction so as to extend in the axial direction of the braking roller 34, the interval L of each edge 35 corresponds to the interval P of the braking preliminary line 6. Since the edge 35 of the braking roller 34 can be applied directly above the braking preliminary line 6 of the semiconductor wafer 1, the braking force can be reliably applied to the braking preliminary line 6, and as a result,
Since the cleavage is formed along the breaking preliminary line 6 in the crystal axis direction, it is possible to surely divide the semiconductor wafer 1 into the pellets 2 in a state where no cracking residue is generated.

(2) According to the above (1), since it is not necessary to re-roll the semiconductor wafer on which the braking operation has been performed, defects such as chipping and cracks caused by re-rolling occur. Can be avoided in advance.

(3) Since the braking roller 34 is rolled by the weight 33 operated by the operator with respect to the semiconductor wafer 1, the braking device 3 for the semiconductor wafer is used.
The configuration of 0 is extremely simple.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the edge of the braking roller is not limited to the hexagonal prism shape, and the braking roller is formed into a polygonal prism shape such as a triangular prism shape or a quadrangular prism shape. Good. Furthermore, the edge of the braking roller may be formed by arranging projections on the outer circumference of the cylinder at equal intervals in the circumferential direction so as to extend in the axial direction, or by forming grooves on the outer circumference of the cylinder. The edges may be relatively arranged by arranging them at equal intervals in the direction so as to extend in the axial direction.

Further, depending on the shape of the braking roller, the relief portion between the edges can be omitted.

A positional deviation correcting device for determining the positional relationship between the braking preliminary line and the edge of the semiconductor wafer to correct the positional deviation between the braking preliminary line and the edge is a braking device after the semiconductor wafer is braked. It is not limited to the configuration in which the positional relationship between the braking preliminary line and the edge is obtained based on the comparison between the line and the edge position of the braking roller. It can be configured to ask for a relationship,
Further, the rolling amount of the braking roller and the moving amount of the table may be compared to obtain the positional relationship between the edge and the braking preliminary line.

Further, the braking line detecting device 20 for detecting the braking line is not limited to the use of the reflection type optical sensor 21, but an image recognition device constructed from a television camera, a signal processing device and the like is used. Good.

The auxiliary rollers are not limited to one pair, but one or three or more auxiliary rollers may be provided, or may be omitted if the braking roller has sufficient rigidity.

In the above-mentioned embodiment, the case where a circular semiconductor wafer is divided vertically and horizontally has been described, but it is also possible to divide a quadrilateral semiconductor wafer or a semiconductor wafer previously divided into an elongated plate shape into a plurality of pellets. The present invention can be applied.

[0062]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

A plurality of edges are arranged on the outer peripheral surface of the braking roller at equal intervals in the circumferential direction so as to extend in the axial direction of the braking roller, and the interval between the edges is defined as the braking preliminary line. Corresponding to the spacing, the edge of the braking roller can be applied directly above the braking preliminary line of the semiconductor wafer, so that the braking force can be reliably applied to the braking preliminary line, and as a result, Since the cleavage is formed in the crystal axis direction along the breaking preliminary line, it is possible to always surely divide the semiconductor wafer into the pellets in a state where no cracking residue is generated.

[Brief description of drawings]

FIG. 1 is an enlarged cross-sectional view showing a main part of a semiconductor wafer braking apparatus that is an embodiment of the present invention.

FIG. 2 is a partially omitted perspective view showing the entire structure.

FIG. 3 is a plan view showing a state where a preliminary braking line is formed on the surface of a semiconductor wafer to which an adhesive sheet is attached.

FIG. 4 is a perspective view showing a braking device for a semiconductor wafer according to another embodiment of the present invention.

[Explanation of symbols]

1 ... Semiconductor wafer, 2 ... Pellet, 3 ... Adhesive sheet, 4
... sheet base material, 5 ... adhesive, 6 ... breaking preliminary line,
7 ... Braking line, 10 ... Semiconductor wafer breaking device, 11 ... Braking table, 12 ... Elastic base, 13 ... Bracket, 14 ... Braking roller, 1
5 ... Edge, 16 ... Relief, 17 ... Servo motor, 18
... Auxiliary roller, 20 ... Positional deviation correcting device, 21 ... Braking line detecting device, 22 ... Reflective optical sensor, 23 ... Controller, 30 ... Semiconductor wafer breaking device, 3
1 ... Braking table, 32 ... Elastic base, 33 ...
Weight, 34 ... Braking roller, 35 ... Edge,
36 ... escape section.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroshi Moriguchi 3-3 Fujibashi, Ome City, Tokyo 2 Inside Hitachi Tokyo Electronics Co., Ltd.

Claims (4)

[Claims] 1. A semiconductor wafer having a plurality of braking preliminary lines formed on one main surface and an adhesive sheet adhered to the opposite main surface is a base made of an elastic material, and The main surface is brought into contact with and held, and the braking roller is pressed against the pressure-sensitive adhesive sheet of the semiconductor wafer and rolled, whereby the semiconductor wafer is divided into a plurality of pellets along the breaking preliminary line. In a semiconductor wafer braking device, a plurality of edges are provided on the outer peripheral surface of the braking roller,
The semiconductor wafer is arranged at equal intervals in the circumferential direction and is laid so as to extend in the axial direction of the braking roller, and the interval between the edges corresponds to the interval between the preliminary braking lines. Braking device. 2. A position deviation correction means for determining the positional relationship between the breaking preliminary line and the edge of the semiconductor wafer and correcting the positional deviation between the breaking preliminary line and the edge. 1. A semiconductor wafer breaking device according to 1. 3. The braking apparatus for a semiconductor wafer according to claim 2, wherein the positional deviation correcting means includes a detecting means for detecting a braking line after the semiconductor wafer is braked. 4. The braking device for a semiconductor wafer according to claim 1, wherein escape portions are respectively provided between adjacent edges of the braking roller.