CN101486202A - Cutting method for laminated body and cutting knife used therein - Google Patents

Cutting method for laminated body and cutting knife used therein Download PDF

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Publication number
CN101486202A
CN101486202A CNA2008101849157A CN200810184915A CN101486202A CN 101486202 A CN101486202 A CN 101486202A CN A2008101849157 A CNA2008101849157 A CN A2008101849157A CN 200810184915 A CN200810184915 A CN 200810184915A CN 101486202 A CN101486202 A CN 101486202A
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China
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cutting
cutting knife
brittle substrate
resin molding
crackle
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CNA2008101849157A
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CN101486202B (en
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中垣智贵
前川和哉
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority claimed from JP2008134887A external-priority patent/JP4918064B2/en
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Abstract

The invention provides a cutting off method of a laminated body and a cutting tool used therein. In the cutting process of the laminated body in which fragile material and resin films are laminated, no waste, such as stripped pieces or broken pieces, is generated, and the surface of the fragile material substrate will not be damaged. From the surface of the glass substrate (3), which is contrary to the resin film, cracks (31) with thickness of between 10% and 100% of the thickness of the glass substrate (3), which is substantial perpendicular to the glass substrate surface, are formed. Then, the cutting tool (2) is pressed at or near the position of the resin film (41) surface corresponding to the cracks (31), the cutting tool (2) moves corresponding to the laminated body (S1), thereby a cut (43) is formed on the resin film (41), the cut (43) has a thickness of more than 90% of the thickness of the resin film (41) and does not reach the range of the glass substrate (3).

Description

The cutting-off method of duplexer and the cutting knife that adopts in the method
Technical field
The cutting-off method of the duplexer that the present invention relates to brittle substrate and resin molding stacked and the cutting knife that adopts in the method.
Background technology
Because brittle substrates such as glass, pottery enbrittle on engineering properties, so the cut-out of brittle substrate is for example by making cutting wheel (cutter wheel) roll and form line of cut (Scribe Line) on substrate surface in crimping on the substrate, generate the crackle (cutting action) of vertical direction thus from substrate surface, then make this vertical crack grow into substrate back (breaking step of breaking), thereby cut off substrate the substrate stress application.
On the other hand, resin molding generally has flexibility or ductility, therefore the cut-out of resin molding is for example cut off effect by the phase mutual friction of 2 sharp hard metal blades of blade, perhaps by using the very sharp cutting off tool or the shear strength of cut off wheel to cut off.
As mentioned above, because brittle substrate and resin molding difference on physical property are very big, therefore as the method for cutting off the stacked duplexer of brittle substrate and resin molding, following method is arranged: for example, between brittle substrate and resin molding, insert scraper plate (Scraper), with cutting knife with predetermined compression power butt surface resin film, and scraper plate is moved relative to duplexer with cutting knife, thereby resin molding is peeled off from brittle substrate with band shape, form line of cut on the brittle substrate surface that cutting wheel is connected to expose, apply external stress then and cut off duplexer and (for example, refer to Patent Document 1,2).
Patent documentation 1:JP spy opens the 2003-335536 communique
Patent documentation 2:JP spy opens the 2007-45656 communique
But, in above-mentioned cutting-off method, unavoidably understand the stripping film of generation tree adipose membrane.In addition, when the insertion scraper plate relatively moves between brittle substrate and resin molding, might cause the surperficial impaired of brittle substrate because of scraper plate.
Summary of the invention
The present invention proposes in view of aforesaid problem in the past, its purpose is in the cut-out of the duplexer of stacked brittle substrate and resin molding is handled, can not generate stripping film or cut off machine the like waste, and can not cause the surperficial impaired of brittle substrate.
In addition, the present invention also aims to provide a kind of long service life and can prevent the cutting knife of the action such as rotation in the use really.
According to the present invention, provide a kind of one side side at brittle substrate stacked the cutting-off method of duplexer of the resin molding more than 1 or 2, it is characterized in that, from described brittle substrate with the opposite face side of described resin molding one side side, to the direction formation crackle of described brittle substrate face with approximate vertical, the scope of this crackle is more than 10% and less than 100% of described brittle substrate thickness, then, the position of corresponding with described crackle (extended position of crackle) of outermost surface resin film or near crimping cutting knife it in described resin molding, described cutting knife and described duplexer are relatively moved, cut the thick resin film that makes the otch of incision reach the most close brittle substrate side more than 90% and do not reach in the scope of described brittle substrate.
Here,, also may further include after forming above-mentioned crackle and otch for the reliable consideration of cutting off duplexer, from the outside to the operation of above-mentioned duplexer stress application.
In addition, carry out stacked occasion at above-mentioned brittle substrate and above-mentioned resin molding more than 1 or 2 via adhesive layer, preferably whole above-mentioned resin moldings are cut off fully, and otch reaches more than 10% and less than 100% of above-mentioned adhesive layer thickness by above-mentioned cutting knife.
In addition, the face side opposite of above-mentioned brittle substrate with above-mentioned resin molding one side side stacked the occasion of diaphragm, be preferably in diaphragm and above-mentioned brittle substrate forms above-mentioned crackle.
Moreover, in order on above-mentioned brittle substrate, to form crackle, preferably utilize cutting wheel to cut or irradiating laser.
The crimp force of above-mentioned cutting knife is 0.01~0.4MPa scope preferably.
In addition, form otch by the resin molding in the most close brittle substrate side, make described crackle expand to the described resin face side of described brittle substrate, described brittle substrate becomes the state that cuts off or almost cut off.
As above-mentioned cutting knife, also can on knife-edge is formed in the disk of neighboring, remove the part of the periphery that comprises blade and form a plurality of planes in periphery.
In addition, according to the present invention, a kind of cutting knife that adopts in above-mentioned cutting-off method is provided, this cutting knife can be supported on the bearing with freely loading and unloading, it is characterized in that, be formed in knife-edge and remove the part of the periphery that comprises blade on the disk of neighboring and form a plurality of planes in periphery, any 2 planes are by being maintained on the described bearing with 2 bearing surface butts that are formed on the described bearing in described a plurality of plane, by 2 planes of change, change the blade position of the cutting knife that is crimped on the resin molding with the cutting knife of described bearing surface butt.
Here, the consideration for effectively using the whole blade that is formed at the neighboring is preferably in a side semicircle and forms a plurality of planes, forms blade at the opposite side semicircle.
In addition, also can make one of bearing surface of being formed on the above-mentioned bearing form horizontal plane.
For reduce and resin molding between friction and cut off with less crimp force, knife edge angular is preferably 20 °~80 ° scope.
In order to make the life-span elongated, material preferably adopts superhard alloy or sintered diamond.
The invention effect
In cutting-off method of the present invention, after brittle substrate forms the crackle of desired depth, cutting knife is crimped near the correspondence position of above-mentioned crackle of resin molding or its, cut to desired depth, cut off duplexer thus, therefore in cutting off processing, can not produce discarded object.And, cut off the contact-making surface that contacts with resin molding that can not touch brittle substrate with parts, can not cause the substrate surface damage.
In cutting knife of the present invention, because the blade position that can change when loss with the resin molding crimping reuses, therefore, compare with conventional art, can increase the service life, and can effectively prevent problems such as rotation in the use.
Description of drawings
Fig. 1 is the process chart of one of expression cutting-off method of the present invention example.
Fig. 2 is the skeleton diagram of expression cut-out example of the duplexer of stacked diaphragm on the glass substrate.
Fig. 3 is the skeleton diagram of the cut-out example of the duplexer of stacked 2 resin moldings on the side of expression glass substrate.
Fig. 4 is the skeleton diagram of expression with the cut-out example of the duplexer of adhesive layer junction of glass substrate and resin molding.
Fig. 5 is the skeleton diagram of expression with the cut-out example of the duplexer of adhesive layer junction of glass substrate and resin molding peripheral part.
Fig. 6 is front view and the side view that expression is fit to an example of the cutting knife that cutting-off method of the present invention uses.
Fig. 7 is that the cutting knife of presentation graphs 6 is installed on the stereogram on the bearing.
Fig. 8 is the front view and the side view of base plate.
Fig. 9 is the front view and the side view of cover plate.
Figure 10 is the skeleton diagram of expression one routine cutter.
Figure 11 is the front view that expression is fit to another routine cutting knife of using among the present invention.
Symbol description: 1-cutting wheel, 2-cutting knife, 3-glass substrate (brittle substrate), 11,12-adhesive layer, 13-diaphragm; 21-cutting knife, 21c, 21d-plane, 31-crackle, 41,42-resin molding; 43-otch, 75-the first bearing surface, 76-the second bearing surface, S 1, S 2, S 3, S 4, S 5-duplexer.
The specific embodiment
Below, be described in detail about cutting-off method of the present invention, but the present invention is not limited in these embodiments.
Fig. 1 is the process chart of one of expression cutting-off method of the present invention embodiment.That the figure shows is the stacked duplexer S of resin molding 41 on the side of glass substrate 3 that brittle substrate is constituted 1Situation about cutting off.In addition, the figure in left side is the profile on the vertical direction of relative crackle 31 in the (a) and (b) of Fig. 1, and the figure on right side is the profile along the crack surface on crackle 31 parallel directions.In (a) of Fig. 1, the cutting wheel 1 relative glass substrate 3 that at first will apply predetermined load relatively moves, and forms line of cut on glass substrate 3.At this moment, the surface of glass substrate 3 is formed the crackle 31 of vertical direction.It is important in this that the depth D scope of formed crackle 31 is at more than 10% and less than 100% of glass substrate 3 thickness.If the depth D of crackle 31 is shallower than above-mentioned scope, then can not cut off duplexer S 1On the other hand, if the depth D of crackle 31 is deeper than above-mentioned scope, then probably cause the surperficial impaired of resin face side.
For the depth D with crackle 31 is controlled at above-mentioned scope, can adjust cutting wheel 1 material or cutting edge shape, put on load on the cutting wheel 1 etc.For example, in order to add the depth D of deep torn grain 31, cutting wheel 1 can form the cutter that section slightly is in the shape of the letter V at the circumferential part of discoid wheel body, is to form a plurality of grooves with predetermined space on the blade at the crest line as this cutter.As the external diameter of above-mentioned cutting wheel, recommend to adopt 1mm~10mm scope; As the degree of depth of above-mentioned groove, recommend to adopt more than the 25 μ m; As the crest line length between above-mentioned groove, recommend to adopt more than the 25 μ m.
In addition, as the method that on glass substrate 3, forms the crackle 31 of desired depth,, also can adopt irradiating laser to form the method for crackle 31 except with the cutting method of cutting wheel 1.As laser, CO for example 2Gas laser, YAG laser instrument or titanium sapphire laser device etc.
Then, shown in Fig. 1 (b), the outer surface of resin molding 41 with the corresponding position of above-mentioned crackle or its near, make cutting knife 2 apply the predetermined load crimping, cutting knife 2 relative resin moldings 41 are relatively moved, form otch 43 at resin molding 41.Here one of material particular is to form otch 43 by cutting knife 2 being crimped on the resin molding 41 at resin molding 41.Thus, the crackle 31 that forms on glass substrate 3 in the operation extends to resin face one side (as illustrated D ' in Fig. 1 (b)) of glass substrate 3 in front, and glass substrate 3 becomes and cuts off or dissengaged positions almost.The load that puts on cutting knife 2 can wait suitably according to the shape of the material of resin molding 41 or glass substrate 3, cutting knife 2 and determine, but usually load preferably in 0.1~0.8MPa scope.
Another material particular is, the scope of the depth d of otch 43 be located at resin molding 41 thickness more than 90% and do not reach in the scope of glass substrate 3 (this moment is less than 100%).Thus, can realize reliably that the crackle 31 that is formed at glass substrate 3 extends to resin face one side, and not damage the cut-out of carrying out resin molding 41 under the situation of resin face one side of glass substrate 3.
Though in the embodiment of Fig. 1, used fixed cutter as cutting knife 2, be not limited to this, also can adopt rotary cutting knife.And according to the difference of the material of resin molding, load is disperseed and can not slick and slyly be formed otch 43 sometimes when blade rotates, and therefore recommends the cutting knife 2 that adopts blade fixing usually.For the cutting knife that is fit to use among the present invention further as described later.
Then, shown in Fig. 1 (c), from glass substrate one side along line of cut to duplexer S 1Apply extruding force, glass substrate 3 and resin molding 41 are cut off (Fig. 1 (d)) in the part of crackle 31 and otch 43 thus.In above-mentioned operation (b), the crackle 31 of glass substrate 3 does not also reach under the situation of resin face side, and by applying above-mentioned extruding force, crackle 31 reaches resin face side.In addition, be formed with the otch more than 90% 43 of its thickness in the resin molding 41, therefore utilize above-mentioned extruding force to be easy to cut off.
As from the outside to duplexer S 1The method of stress application except the method that applies above-mentioned extruding force, for example can adopt along line of cut and give duplexer S 1Temperature difference produces the method for thermal stress.In addition, as duplexer S 1Thin thickness the time, sometimes naturally separately, therefore at this moment do not need to apply the operation of external stress along line of cut.
In the above-described embodiment, apply extruding force, but also can apply extruding force, perhaps apply extruding force from glass substrate side and these both sides of resin molding side from the resin molding side from the glass substrate side.In addition, according to the difference of resin molding 41 materials, when the resin molding side applies extruding force,, therefore recommend usually to apply extruding force from the glass substrate side sometimes at the section producd fibers shape thing of resin molding 41.
As the brittle substrate of cutting method object of the present invention, for example can list glass, pottery, silicon, sapphire brittle substrates such as (Sapphire).Thickness for brittle substrate is not particularly limited, and is generally 500~1000 mu m ranges.
In addition, as resin molding 41, can list and be processed to form membranaceous following ester moulding, described resin for example, PET (PET), triacetyl cellulose acetate fiber prime system resins such as (TAC), acrylic resin, fluorine resins such as hexafluoropropylene (HFP)/tetrafluoroethylene (TFE) based copolymer, polycarbonate resin, polyester based resins such as PET, polyimides is a resin, polysulfones is a resin, polyether sulfone is a resin, polystyrene resin, polyvinyl alcohol resin, the polyvinyl chloride resin, vistanex or polyamide-based resin etc.Thickness of resin film is not particularly limited, but is generally the following scope of 500 μ m.
Fig. 2 represents another embodiment of relevant cutting-off method of the present invention.Cut-out object among Fig. 2 is duplexer S 2Glass substrate 3 with resin face side opposing face side stacked diaphragm 13.At this moment, the cutting wheel 1 that applies predetermined load is crimped on diaphragm 13 surfaces relatively moves, cutting diaphragm 13, thus on diaphragm 13 and glass substrate 3, form crackle 31.Diaphragm 13 used herein for example is PET film or TAC film etc.
Fig. 3 represents an embodiment again of relevant cutting-off method of the present invention.Cut-out object duplexer S among Fig. 3 3Be stacked 2 resin moldings 41,42 in a side of glass substrate 3.At this moment, the degree of depth of the otch 43 that cutting knife 2 is produced is, the resin molding 42 in the outside is disconnected fully, and its degree of depth reaches resin molding 41 thickness more than 90% and do not reach glass substrate 3 in the resin molding 41 of glass substrate one side.Thus, as previously mentioned, when the crackle 31 that is formed at glass substrate 3 extends to the resin molding side, under the situation of not damaging resin face side, can cut off the resin molding 41,42 of glass substrate 3.The material of resin molding 41 and resin molding 42 can be identical, also can be inequality.In addition, the number of stacked resin molding without limits can certainly be for more than 3 on the side of glass substrate 3.
Fig. 4 represents the another embodiment of relevant cutting-off method of the present invention.Cut-out object duplexer S among Fig. 4 4Stacked adhesive layer 11 between glass substrate 3 and resin molding 41.At the duplexer S that cuts off this spline structure 4The time, the otch 43 that cutting knife 2 produces disconnects resin molding 41 fully, make adhesive layer 11 be disconnected to relative its thickness more than 90% and do not reach the scope of glass substrate 3.Thus, as previously mentioned, when the crackle 31 that is formed at glass substrate 3 extends to the resin molding side, under the situation of not damaging resin face side, can cut off the adhesive layer 11 of glass substrate 3.
As the material of adhesive layer 11, the resin of uv-hardening resin or thermmohardening type resin or sclerosis under both sides effect etc. for example.Concrete example as, hexenoic acid anhydride copolymer (epoxy resin binding agent), polyurethane resin are that binding agent, phenolic resin are UV cured cohesive agent such as thermosetting binding agent, silicone resin, cyanoacrylate, acrylic resin such as binding agent etc.In addition, the thickness of adhesive layer 11 is not particularly limited, but is generally 0.1 μ m~50 mu m ranges.
Fig. 5 represents an embodiment again of relevant cutting-off method of the present invention.Cut-out object duplexer S among Fig. 5 5Be that glass substrate 3 and resin molding 41 are laminated by the adhesive layer 12 in the peripheral part setting, both central portions are formed with the space.At the duplexer S that cuts off this structure 5The time, the otch 43 that cutting knife 2 produces also can disconnect resin molding 41 fully, but must make cutting knife 2 not reach glass substrate 3.On the other hand, when the otch 43 that produces when cutting knife 2 not exclusively disconnected resin molding 41, the degree of depth of otch 43 need be the thickness of resin molding 41 more than 90%.In addition, replace adhesive layer 12 and use isolated part such as particulate to make the duplexer that forms the space between glass substrate 3 and the resin molding 41, also can cut off by method shown in this Fig equally.
Cutting-off method of the present invention for example is applicable to the cut-out etc. of the glass substrate of liquid crystal panel.Specifically, applicable to the cut-out of the substrate of stacked polarizer on the glass substrate etc.Usually paste support membrane on the two sides of polariton (for example, polariscope) as polarizer.As polarizer, for example, the polarizer of directed absorption dichroic dye or iodine on polariton substrates such as polyvinyl alcohol resin, polyvinyl acetate resins, ethylene-vinyl acetate (EVA) resin, polyamide, mylar contains the dichroism dehydration product (polyvinylene: the poly-vinylene) polyvinyl alcohol of Ding Xiang strand-polyvinylene copolymer etc. of polyvinyl alcohol in the polyvinyl alcohol film of molecular orientation.Thickness for polariton is not particularly limited, but for the purposes such as slimming of polarizer, is generally the following scope of 50 μ m.On the other hand, as supporting and protection polariton support membrane, for example adopt TAC film or ENB (norbornene) mesentery etc.The thickness of support membrane is not particularly limited, but is generally the following scope of 300 μ m.
Figure 6 illustrates one of the cutting knife that is suitable for cutting-off method of the present invention example.(a) of this Fig. 6 is that the front view of cutting knife 21, (b) of Fig. 6 are right side view.Cutting knife 21 is formed by superhard alloy or sintered diamond, is formed with blade 21b in the neighboring.In addition, be formed with through hole 21a, at the pin 77 (Fig. 7 shown in) of this insertion as bolster at the center of cutting knife 21.In the neighboring of cutting knife 21, a part is removed blade and is formed with plane 21c and plane 21d.Plane 21c and plane 21d for example by discoid cutting knife is carried out line cutting or laser cutting, grinding forms.
Fig. 7 is the assembling stereogram of the bearing 22 of supporting cutting knife 21.Bearing 22 has base plate 71 and cover plate 72.The front view of base plate 71 shown in Figure 8 and right hand view, the front view of cover plate 72 shown in Figure 9 and right hand view.Below, according to Fig. 7~Fig. 9 the bearing 22 of supporting cutting knife 21 is described.
In Fig. 7 and Fig. 8, near the bottom of base plate 71, be formed with the notch part 73 that is used to install cutting knife 21.Notch part 73 is surrounded by side 74, first bearing surface 75, second bearing surface, 76 these 3 planes.Side 74 is formed with the hole 78 of the pin 77 of the bolster that is used to be mounted for cutting knife 21.In this hole 78, insert pin 77 and when cutting knife 21 was installed, the part of blade was outstanding laterally from the bottom of base plate 71.
In addition, when cutting knife 21 was installed on base plate 71, the plane 21c of cutting knife 21 and plane 21d were connected to first bearing surface 75 and second bearing surface 76 of base plate 71 respectively, and cutting knife 21 is not installed on base plate 71 revolvably.In addition, when cutting knife 21 counter-rotatings are installed, first bearing surface, 75 butts of the plane 21d of cutting knife 21 and base plate 71, plane 21c and second bearing surface, 76 butts are changed from the knife edge part that the bottom of base plate 71 is outstanding laterally.
As shown in Figure 8, the central authorities at base plate 71 are formed with the screw 80,81 that is used for fixing cover plate 72.Be formed with the hole 28 that is used for fixing on the elevating mechanism 23 near the top of base plate 71.The protuberance 83 that is formed with lid plate 72 butts on the left side of base plate 71 and positions.
As shown in Figure 9, be formed for installing and fixing the hole 85,86 of the screw on the base plate 71, be formed with the hole 87 that is used for fixing on the elevating mechanism 23 (shown in Fig. 7) near on top in the central authorities of cover plate 72.
As shown in figure 10, the bearing 22 of the installation cutting knife 21 that can not rotate is installed on the elevating mechanism 23 of cutter CM.The cutter of Figure 10 comprises: the sliding stand 52 that moves freely in pallet 51 upper edges relative paper vertical direction (Y direction); The pedestal 59 that moves freely at the left and right directions (directions X) of sliding stand upper edge figure; The rotating mechanism 65 that on pedestal 59, is provided with, carry and be fixed in the turntable 66 that is provided with on this rotating mechanism 65 and surface stacked the glass substrate of resin molding (brittle substrate) 3 move freely in horizontal plane by these mechanisms that move.
Sliding stand 52 is installed on the pair of guide rails 54,55 in the mode that moves freely, and this pair of guide rails 54,55 is in pallet 51 upper surfaces interval preset distance configured in parallel.And, between pair of guide rails 54,55, be provided with motor-driven by the not shown positive and negative ball-screw that rotate freely 53 parallel with guide rail 54,55.In addition, be provided with ball nut 56 in the bottom surface of sliding stand 52.This ball nut 56 screws togather with ball-screw 53.By the positive rotation and the despining of ball-screw 53, ball nut 56 moves on the Y direction, and the sliding stand 52 that ball nut 56 has been installed thus moves in guide rail 54,55 upper edge Y directions.
In addition, pedestal 59 is bearing on a pair of guiding part 61 movably, and this a pair of guiding part 61 is interval preset distance configured in parallel on sliding stand 52.And, be provided with between a pair of guiding part 61 and parallel with guiding part 61 driven the positive and negative ball-screw that rotates freely 62 by motor 63.In addition, be provided with ball nut 64, screw togather with ball-screw 62 in the bottom surface of pedestal 59.By the positive rotation or the despining of ball-screw 62, ball nut 64 moves on directions X, and pedestal 59 moves on directions X along a pair of guiding part 61 with ball nut 64 thus.
On pedestal 59, be provided with rotating mechanism 65.And on this rotating mechanism 65, be provided with turntable 66.The glass substrate 3 of the stacked resin molding in surface is fixed on the turntable 66 by vacuum suction.Rotating mechanism 65 makes the central shaft rotation of turntable 66 around vertical direction.
Be equipped with the cutting knife 21 that does not remain in revolvably on the bearing 22 above the turntable 66.On pallet 51, vertically be provided with framework 25, extend to horizontal direction from the upper end of this framework 25 arm 24 is installed.In the end of arm 24 elevating mechanism 23 is installed, on this elevating mechanism 23 bearing 22 is installed.Moved along the Z direction by elevating mechanism 23 by bearing 22, cutting knife 21 is moved to position and the non-contacting position with glass substrate 3 crimping.
Below, the action of cutter CM is described.Cutting knife 21 is installed on bearing 22, on turntable 65, carry glass substrate 3 and glass substrate 3 surfaces stacked resin molding (not shown).Since the plane 21c of cutting knife 21 and plane 21d respectively with first bearing surface 75 and second bearing surface, 76 butts of base plate, so cutting knife 21 is not installed on bearing 22 revolvably.And, by adjusting the position of sliding stand 52, determining the position of Y direction, the position of directions X is decided in the position of adjusting pedestal 59.Then, make cutting knife 21 be crimped on glass substrate 3 by operation elevating mechanism 23.By making pedestal 59 in the enterprising line scanning of directions X, the resin molding on glass substrate 3 surfaces forms otch.In the process of the action that repeats this formation otch,, then enter blade and change operation if when the blade loss of cutting knife 21, sharpness variation.
The replacing operation of the blade that is crimped on resin molding of cutting knife 21 is specific as follows: at first, unload the cover plate 72 of undersetting 22, take out the cutting knife 21 on the base plate 71.Then, make cutting knife 21 counter-rotatings, be installed on base plate 71 once more.Thus, the position of conversion blade, the outside, below of base plate 71 presents untapped knife edge part.With this state cover plate 72 is fixed in base plate 71.Be installed on the cutting knife 21 on the base plate 71, its plane 21c and plane 21d are respectively with second bearing surface 76 of base plate and first bearing surface, 75 butts and limit its rotation.Like this, the installation by changing cutting knife 21 towards, a cutting knife 21 can use 2 times, thereby increases the service life.
In the above-described embodiment, the cutting knife 21 and the bearing 22 that can use 2 times have been used, but by the angle of 2 bearing surfaces of formation on the base plate 71 that changes bearing 22, and the quantity and the angle on the plane that forms on the periphery of change cutting knife 21, access times can further be increased.
For example, Figure 11 is the front view of expression another embodiment of the present invention, is to be illustrated in the figure that the state of cutting knife 92 has been installed on the base plate 91 of bearing 22.Be formed with two bearing surfaces 93,94 that are in the hexagonal angle degree at base plate 91.On the other hand, cutting knife 92 is formed with 3 planes 95,96,97 that are in the hexagonal angle degree.
As the form that cutting knife 92 is installed on base plate 91, at first, following two kinds of forms are arranged: in bearing surface 93 and the plane 95 of bearing surface 94 difference butt cutting knifes 92 and the form on plane 96 of base plate 91; And the form of butt bearing surface 96 and bearing surface 97.Then, following two kinds of forms are arranged after making cutting knife 92 counter-rotatings: in bearing surface 93 and the plane 96 of bearing surface 94 difference butt cutting knifes 92 and the form on plane 95 of base plate 91; And the form of butt bearing surface 97 and bearing surface 96.Therefore, a cutting knife can use 4 times.
Equally, if further increase the quantity that is formed at the plane on the cutting knife, then a cutting knife can use more times.
Embodiment
Below, the present invention will be described in more detail by embodiment, but the present invention is not limited to these examples of implementation.
Embodiment 1
Be a side of the glass substrate of 1.1mm by receiving the thickness that lime glass (soda lime) forms, stack gradually a PET (polyethylene terephthalate) film that thickness is 0.3mm, the 2nd PET film that thickness is 0.2mm from glass substrate, constitute duplexer thus, for such duplexer, at first, cutting wheel is applied 0.14MPa load be crimped on the glass substrate, 300mm/sec moves relative to glass substrate with cutting speed, forms line of cut on glass substrate.This moment, the degree of depth of formed vertical crack was 50% of a thickness of glass substrate.In addition, the specification of employed cutting wheel is as follows.
The specification of cutting wheel:
External diameter: 2mm
Thickness: 0.65mm
Internal diameter: 0.8mm
Knife edge angular: 115 °
Groove depth: 25 μ m
Crest line length between the groove: 25 μ m
Then, the load that the cutting knife of 45 ° of knife edge angulars is applied 0.8MPa is crimped on the 2nd PET film, and cutting knife is moved relative to duplexer, cuts off the 2nd PET film fully, cuts a PET film.The degree of depth of otch is 90% of a PET film thickness.
Then, along line of cut duplexer is applied extruding force, duplexer is cut off at crackle and notch portion from the glass substrate side.
Embodiment 2
For the thickness except glass substrate is that the thickness of 0.55mm, a PET film is that the thickness of 0.2mm, the 2nd PET film is all identical with embodiment 1 duplexer of other structures the 0.05mm, the cutting wheel of specification as follows is applied 0.1MPa load to be crimped on the glass substrate, 300mm/sec moves relative to glass substrate with cutting speed, forms line of cut on glass substrate.This moment, the degree of depth of formed vertical crack was 10% of a thickness of glass substrate.
The specification of cutting wheel:
External diameter: 3mm
Thickness: 0.65mm
Internal diameter: 0.8mm
Knife edge angular: 130 °
Groove depth: 3 μ m
Crest line length between the groove: 15 μ m
Then, the load that the cutting knife of 30 ° of knife edge angulars is applied 0.4MPa is crimped on the 2nd PET film, and cutting knife is moved relative to duplexer, cuts off the 2nd PET film fully, cuts a PET film.The degree of depth of otch is 90% of a PET film thickness.
Then, along line of cut duplexer is applied extruding force, duplexer is cut off at crackle and notch portion from the glass substrate side.

Claims (14)

1. the cutting-off method of a duplexer, this duplexer the one side side of brittle substrate stacked resin molding more than 1 or 2, it is characterized in that:
With the opposite face side of described resin molding one side side, to the direction formation crackle of described brittle substrate face with approximate vertical, the scope of this crackle is more than 10% and less than 100% of described brittle substrate thickness from described brittle substrate,
Then, cutting knife is crimped on outermost surface resin film in the described resin molding with the corresponding position of described crackle or its near, described cutting knife and described duplexer are relatively moved, cut the thick resin film that makes the scope of otch of incision reach the most close brittle substrate side more than 90% and do not reach described brittle substrate.
2. cutting-off method as claimed in claim 1 is characterized in that:
After forming described crackle and otch, also comprise from the outside the operation of described duplexer stress application.
3. cutting-off method as claimed in claim 1 or 2 is characterized in that:
Via adhesive layer described brittle substrate and described resin molding more than 1 or 2 are carried out stacked,
By described cutting knife all described resin moldings are cut off fully, and otch reaches more than 10% and less than 100% of described adhesive layer thickness.
4. as each described cutting-off method in the claim 1~3, it is characterized in that:
Described brittle substrate with the opposite face side stacked guard film of described resin molding one side side, form described crackle at described diaphragm and described brittle substrate.
5. as each described cutting-off method in the claim 1~4, it is characterized in that:
Utilize cutting wheel cutting, on described brittle substrate, form crackle.
6. as each described cutting-off method in the claim 1~4, it is characterized in that:
Irradiating laser forms crackle on described brittle substrate.
7. as each described cutting-off method in the claim 1~6, it is characterized in that:
The crimp force of described cutting knife is 0.01~0.4MPa scope.
8. as each described cutting-off method in the claim 1~7, it is characterized in that:
Form otch by the resin molding in the most close brittle substrate side, make described crackle expand to the described resin face side of described brittle substrate, described brittle substrate becomes the state that cuts off or almost cut off.
9. as each described cutting-off method in the claim 1~8, it is characterized in that:
Described cutting knife adopts the cutting knife of removing the part of the periphery that comprises blade and form a plurality of planes in periphery on the disk of neighboring formation blade.
10. cutting knife that adopts in each described cutting-off method in claim 1~9, this cutting knife are supported on the bearing and can freely load and unload, and it is characterized in that:
On the disk of neighboring formation blade, remove the part of the periphery that comprises blade and form a plurality of planes in periphery,
Any 2 planes are by being maintained on the described bearing with 2 bearing surface butts that are formed on the described bearing in described a plurality of plane, by 2 planes of change, change the blade position of the cutting knife that is crimped on the resin molding with the cutting knife of described bearing surface butt.
11. cutting knife as claimed in claim 10 is characterized in that:
Be formed with a plurality of planes at a side semicircle, be formed with blade at the opposite side semicircle.
12., it is characterized in that as claim 10 or 11 described cutting knifes:
Be formed at one of bearing surface on the described bearing and form horizontal plane.
13., it is characterized in that as each described cutting knife in the claim 10~12:
Knife edge angular is 20 °~80 ° a scope.
14., it is characterized in that as each described cutting knife in the claim 10~13:
Material adopts superhard alloy or sintered diamond.
CN2008101849157A 2008-01-15 2008-12-23 Cutting method for laminated body and cutting knife used therein Expired - Fee Related CN101486202B (en)

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JP2008134887A JP4918064B2 (en) 2008-05-23 2008-05-23 Laminate cutting method
JP2008134887 2008-05-23

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