CN105082671B - The manufacturing method of complex and the manufacturing method of laminated body - Google Patents

The manufacturing method of complex and the manufacturing method of laminated body Download PDF

Info

Publication number
CN105082671B
CN105082671B CN201510243003.2A CN201510243003A CN105082671B CN 105082671 B CN105082671 B CN 105082671B CN 201510243003 A CN201510243003 A CN 201510243003A CN 105082671 B CN105082671 B CN 105082671B
Authority
CN
China
Prior art keywords
sheet glass
resin layer
complex
laminated body
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510243003.2A
Other languages
Chinese (zh)
Other versions
CN105082671A (en
Inventor
角田纯
角田纯一
江畑研
江畑研一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
AGC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AGC Inc filed Critical AGC Inc
Publication of CN105082671A publication Critical patent/CN105082671A/en
Application granted granted Critical
Publication of CN105082671B publication Critical patent/CN105082671B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/003Cutting
    • B32B17/064
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/033 layers

Landscapes

  • Laminated Bodies (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

The present invention provides the manufacturing method of complex and the manufacturing method of laminated body, its cut off with capable of inhibiting the crack propagation of sheet glass by sheet glass it is Nian Jie with resin layer made of complex, on the complex be laminated the 2nd sheet glass made of laminated body, manufacture inhibit sheet glass crackle the complex and laminated body with desirable shape.

Description

The manufacturing method of complex and the manufacturing method of laminated body
Technical field
The present invention relates to the manufacturing method of the complex on the glass sheet with resin layer and in the resin layer of the complex The manufacturing method of laminated body made of the 2nd sheet glass of upper stacking.
Background technology
In recent years, the electronic equipments (electronic machine such as solar cell (PV), liquid crystal display panel (LCD), organic EL panel (OLED) Device) just gradually slimming, lightweight.As one of being thinned of electronic equipment as realization, light-weighted method, into It is about to the substrate thin plate used in electronic equipment.
In addition, by using the glass substrate (sheet glass) of thin plate, also it can be expected that the practicality of flexible electronic equipment Change.
However, sheet glass there is a situation where to crack when insufficient intensity, flexural deformation etc. it is damaged.
In this regard, for example, propose one kind in patent document 1 is bonded complex made of resin layer on the glass sheet.If For such complex, even if then generating flexural deformation and generating tensile stress on the surface for the sheet glass being bonded with resin layer, Tensile stress can also mitigate because of resin layer, can inhibit the breakage of sheet glass.
When using such complex in the manufacture of electronic equipment, as needed, complex is cut into desirable ruler Very little, shape is necessary.
As the cutting-off method of such complex, following method is illustrated in patent document 2:It is (crisp in sheet glass Property material substrate) the face opposite with resin layer formed sheet glass thickness 10% or more and the score line less than 100%, into And resin layer, through-thickness extend the position incision cut mark of score line until being 90% or more and not relative to thickness The position for reaching sheet glass, to cut off complex.
In addition, although complex has a little difference, following method has been recorded in patent document 3:In sheet glass (brittleness Material substrate) surface attach for prevent cullet adhere to surface protection component (resin film etc.), using in point of a knife crest line Slotted break bar is formed, using the break bar, is drawn from the disconnected surface protection component of surface protection component lateral incision and on the glass sheet incision Trace line, and be broken, to which sheet glass be cut off.
Existing technical literature
Patent document
Patent document 1:International Publication No. 2012/166343
Patent document 2:No. 4918064 bulletins of Japanese Patent Publication No.
Patent document 3:No. 4198601 bulletins of Japanese Patent Publication No.
Invention content
Problems to be solved by the invention
Using the above method, it will can on the glass sheet form complex obtained from resin layer and cut into desirable ruler It is very little.
It is being starting point by glass using score line in the cutting-off method of previous complex however, according to the research of the present inventor When glass piece cuts off (making its fracture), often there is sheet glass and crack (cracking), which propagates on the interarea of sheet glass, The case where making product be deteriorated.Especially sheet glass it is thin in the case of, the problem of being easy to happen the crack propagation of sheet glass.
It is an object of the invention to solve such problem of the prior art, offer is bonded with resin layer on the glass sheet Complex and the complex is adhered to the manufacturing method of laminated body obtained from sheet glass, wherein using thin glass In the case of piece, when cutting off and (sheet glass being made to be broken) complex, it can also inhibit the crack propagation generated in sheet glass, energy Complex, laminated body of enough steadily manufactures with desirable size, shape and the crackle that inhibits sheet glass.
The solution to the problem
In order to realize that such purpose, the manufacturing method of complex of the invention are characterized in that,
To the original complex with sheet glass and resin layer, cut is formed on the glass sheet through aforementioned resin layer Line, and thus complex is manufactured for starting point cut off aforementioned original complex with the score line,
Wherein, the resin layer is adhered to foregoing glass piece with the bonding force that 180 ° of peel strengths are 1N/25mm or more, and And the Young's modulus away from the region at a distance from the normal direction at the interface of foregoing glass piece being 0~0.5 μm is 100MPa or more, Resin layer thickness is 1~100 μm.
In the manufacturing method of the complex of such present invention, preferably the thickness of foregoing glass piece is 100 μm or less.
In addition, the manufacturing method of laminated body of the present invention is characterized in that, for the 1st sheet glass and resin layer By major-surface-area 2nd sheet glass smaller than the major-surface-area of aforementioned resin layer with the master of aforementioned 2nd sheet glass on original complex The periphery in face is laminated on aforementioned resin layer by the mode wrapped in the periphery of the interarea of aforementioned resin layer and original obtained from being bonded Laminated body forms score line through aforementioned resin layer along the periphery of the interarea of aforementioned 2nd sheet glass in the 1st sheet glass, with The score line is starting point cut off aforementioned original complex, thus manufactures laminated body,
Wherein, the resin layer is adhered to aforementioned 1st glass with the bonding force that 180 ° of peel strengths are 1N/25mm or more Piece, and the Young's modulus away from the region for being 0~0.5 μm at a distance from the normal direction at the interface of aforementioned 1st sheet glass is 100MPa or more, resin layer thickness are 1~100 μm.
In the manufacturing method of such laminated body, preferably after the cut-out for carrying out aforementioned original complex, further into The chamfering of the end face of the aforementioned laminated body of row.
In turn, the thickness of preferably aforementioned 1st sheet glass is 100 μm or less.
The effect of invention
According to the present invention, it is laminated on for complex obtained from adhering resin layer on the glass sheet and by the composite layer For laminated body obtained from sheet glass, even if can inhibit if in the case where sheet glass is thin in cut-out in sheet glass The crack propagation of generation.
According to the invention it is thus possible to steadily manufacture fully inhibit the crackle of sheet glass, with desirable ruler Very little, shape complex, laminated body.
Description of the drawings
Fig. 1:(A) of Fig. 1~(D) is the concept map of an example of the manufacturing method of the complex for illustrating the present invention.
Fig. 2:(A) of Fig. 2~(E) is the concept map of an example of the manufacturing method of the laminated body for illustrating the present invention.
Reference sign
10 complexs
The original complexs of 10a
12 sheet glass
14 resin layers
18 score lines
20 cutters
30 laminated bodies
The original laminated bodies of 30a
34 the 2nd sheet glass
Specific implementation mode
Hereinafter, preference based on ... shown in the drawings is to the manufacturing method of the complex of the present invention and the manufacturing method of laminated body It is described in detail.
Fig. 1 conceptually illustrates an example of the manufacturing method of the complex of the present invention.
It is original obtained from resin layer 14 by being formed in the one side of sheet glass 12 in the manufacturing method of the complex of the present invention Complex 10a cut-outs (segmentation) manufacture the complex 10 with desirable size, shape (size, the shape of interarea).
In the manufacturing method of the complex of the present invention, original complex 10a (complex 10 to be manufactured) is such as Fig. 1 (A) it is illustrated conceptually by, resin layer 14 is formed in the one side (interarea (surface)) of sheet glass 12.It should be noted that In example shown in FIG. 1, an example of the shape of the interarea of original complex 10a is rectangle.
The glass of the sheet glass 12 of substrate (base material) as original complex 10a can use well known various glass. Specifically, soda-lime glass, alkali-free glass etc. can be illustrated.In addition, sheet glass 12 can be used through float glass process, fusion method, horizontal drawing Sheet glass made from method well known to method etc..
The thickness of sheet glass 12 is the thickness corresponding to the purposes for the complex 10 to be manufactured.
Here, for the complex 10 (laminated body 30) obtained using the manufacturing method of the present invention, as an example, Ke Yiyong In the manufacture of the electronic equipments such as solar cell (PV), liquid crystal display panel (LCD), organic EL panel (OLED).These electronic equipments It is required that realizing slimming, lightweight, and it is desirable to requiring the expansion of flexible use on the way.In consideration of it, sheet glass 12 is preferably relatively thin in the range of can manufacture electronic equipment.
In addition, manufacturing method according to the invention, can inhibit to cut off the sheet glass 12 occurred when original complex 10a Crack propagation, can be made without the complex of defect caused by the crackle by sheet glass 12, this will be described later.For cutting The propagation of crackle and crackle when the disconnected original complex 10a, the sheet glass 12 the thin more is easy to happen.
That is, when considering that electronic equipment etc. keeps sheet glass 12 relatively thin using the flexibility of the product of complex 10, sheet glass 12 Crackle is easy tod produce, but according to the present invention, even if sheet glass 12 can suitably inhibit crackle if relatively thin.In consideration of it, glass The thickness of glass piece 12 be preferably 100 μm hereinafter, more preferably 75 μm hereinafter, particularly preferably 50 μm or less.
In addition, the thickness of sheet glass 12 is to correspond to the purposes of complex 10 (laminated body 30) and can ensure necessary intensity Thickness more than.
Specifically, the thickness of sheet glass 12 is preferably 1 μm or more, more preferably 10 μm or more.
For the bonding force of resin layer 14 raising the purpose of, sheet glass 12 can before forming resin layer 14 to formed Implement surface treatment in the face of resin layer 14.
As surface treatment, can illustrate:Prime treatment, ozone treatment, plasma etch process etc..It, can as priming paint Illustrate silane coupling agent.As silane coupling agent, amino silicone alkanes, epoxy radicals silicone hydride class, alkoxysilanes, silazane can be illustrated Class etc..
In original complex 10a (complex 10 to be manufactured), resin layer 14 is formed on the surface of sheet glass 12.
Resin layer 14 is the layer (film) formed by various resin materials.It should be noted that original complex shown in FIG. 1 In 10a, resin layer 14 is formed by 1 layer, but if overall thickness is 1~100 μm, then resin layer 14 can also be formed by multilayer.This Outside, when forming resin layer 14 by multilayer, all layers can be formed with identical material, can also be mixed by different materials The layer of formation.In turn, when forming resin layer 14 by multilayer, the thickness of each layer can be the same or different.
It should be noted that original complex 10a shown in FIG. 1 is formed with resin layer in the whole surface of sheet glass 12 14, but as long as enough areas with size, shape corresponding to the complex 10 to be manufactured, resin layer 14 can not also shape At in the whole surface of sheet glass 12.
Here, in the manufacturing method of the present invention, the thickness of resin layer 14 is 1~100 μm, away from the interface with sheet glass 12 Normal direction distance be 0~0.5 μm the Young's modulus in region be 100MPa or more.In addition, resin layer 14 is shelled with 180 ° It is adhered to sheet glass 12 from the bonding force that intensity is 1N/25mm or more.
The present invention uses is formed with the original complex 10a of such resin layer 14 on the surface of sheet glass 12, from resin 14 side of layer form score line 18 on sheet glass 12, carry out the cut-out of original complex 10a, even if sheet glass 12 is relatively thin as a result, Also the crackle that sheet glass 12 generates when cut-out can be inhibited to be propagated on the interarea of sheet glass 12, can steadily be manufactured with institute The complex 10 of desired size, shape and the sheet glass 12 with the crackle for inhibiting sheet glass 12.This point will be rear Face describes in detail.
Resin layer 14 can be formed using well known various resin materials (high molecular material).For example, can be thermoplastic Property resin and thermosetting resin it is any number of.
As thermosetting resin, can illustrate:Polyimides (PI), epoxy (EP) resin etc..It, can example as thermoplastic resin Show:Polyamide (PA), polyamidoimide (PAI), polyether-ether-ketone (PEEK), polybenzimidazoles (PBI), poly terephthalic acid second Diol ester (PET), polyethylene naphthalate (PEN), polyether sulfone (PES), cyclic polyolefin (COP), makrolon (PC), Polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), polymethyl methacrylate (PMMA), polyurethane (PU) etc..
In addition, resin layer 14 can be formed by light-cured resin, or copolymer, mixture.
Manufacturing process using the electronic equipment of complex 10 (laminated body 30) includes the process of heat tracing processing sometimes. Therefore, the heat resisting temperature (temperature can be used continuously) for being used to form the resin material of resin layer 14 is preferably 100 DEG C or more.
The resin for being 100 DEG C or more as heat resisting temperature, can illustrate:Polyimides (PI), epoxy (EP) resin, polyamide (PA), polyamidoimide (PAI), polyether-ether-ketone (PEEK), polybenzimidazoles (PBI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether sulfone (PES), cyclic polyolefin (COP), makrolon (PC), polychlorostyrene second Alkene (PVC), polymethyl methacrylate (PMMA), polyurethane (PU) etc..
Resin layer 14 can be formed only by resin material, or can also contain filler etc..
As filler, the Non-fibrous such as threadiness or plate, flakey, granular, indefinite shape, pulverized product can be illustrated Filler.
Specifically, can illustrate:Glass fibre, the carbon fiber of PAN systems or asphalt series, stainless steel fibre, aluminum fiber or Huang The organic fibers such as the metallic fibers such as copper fiber, aromatic polyamide fibre, gypsum fiber, ceramic fibre, asbestos fibre, zirconium oxide Fiber, alumina fibre, silicon dioxide fibre, titanium dioxide fiber, silicon carbide fibre, rock wool (rock wool), calcium titanate are brilliant Palpus, barium titanate whisker, aluminium borate whisker, silicon nitride crystal whisker, mica, talcum, kaolin, silica, calcium carbonate, glass are micro- Pearl, sheet glass, glass microsphere, clay, molybdenum disulfide, wollastonite, titanium oxide, zinc oxide, calcium polyphosphate, graphite, metal powder, gold Belong to piece, metal tape, metal oxide, carbon dust, graphite, carbon plate (Carbon flake), flakey carbon, carbon nanotube etc..Make For the concrete example of the metal species of metal powder, sheet metal, metal tape and metal oxide, can illustrate:Silver, nickel, copper, zinc, aluminium, no Become rusty steel, iron, brass, chromium, tin etc..The type of glass fibre or carbon fiber does not have as long as the reinforcing for resin usually It is particularly limited to, such as can select to use from long fibre type, the chopped strand of staple fiber type, milled fibre etc..In addition, Resin layer 14 can also be made of woven fabric, the non-woven fabrics etc. for being impregnated with resin.
Resin layer 14 is formed using well known method corresponding with the forming material of resin layer 14.
For example, resin layer 14 can be formed:On the surface of sheet glass 12, coating includes the ingredient as resin layer 14 Liquid composition (coating), make its solidification, to be formed.
It is formed as the resin film of resin layer 14 alternatively, resin layer 14 can also attach on sheet glass 12.It needs Illustrate, when attaching resin film on sheet glass 12 forms resin layer 14, as needed, bonding agent can be used in glass Resin film is attached on glass piece 12.It should be noted that at this moment, adhesive layer is also considered as a part for resin layer 14, as by Also include the resin layer 14 that the multilayer of adhesive layer is formed, needs to meet the conditions such as Young's modulus.
In addition, resin layer 14 can also be by forming on the surface of sheet glass 12 by the resin material as resin layer 14 The layer (film) that precursor is formed, and heat treatment, electronbeam irradiation, ultraviolet light irradiation etc. are implemented by the layer that precursor is formed to this Reason, to obtain the resin layer 14 of target formed by resin material.It should be noted that the forming method of the resin layer 14 In, being coated and dried of composition that the layer that is formed by precursor can carry out liquid on the surface of sheet glass 12 is (or further solid Change) and formed, or can be formed in the surface adhered film shape object of sheet glass 12 and (bonding agent can be used as needed).
It should be noted that the manufacturing method of the complex (laminated body) of the present invention may be embodied on foregoing glass piece 12 Form the process (or the process for further carrying out aforementioned surfaces processing) of the resin layer 14.
In the manufacturing method of the complex of the present invention, if (B) of Fig. 1 is illustrated conceptually by, in such original complex 10a Sheet glass 12 on, according to the size for the complex 10 to be manufactured, shape, form the score line 18 for being cut off.As before It is described, since original complex 10a is rectangle, score line 18 is extended in the vertical direction in paper.
Here, the score line 18 formed on sheet glass 12 is formed from 14 side of resin layer.That is, making 20 contact pressure resin of cutter Layer 14 runs through (cut-out) resin layer 14, and score line 18 is formed on sheet glass 12.In other words, cut is formed on sheet glass 12 While line 18, the cut-out of resin layer 14 is carried out.
By being carried out at the same time the formation of the cut-out and score line 18 of resin layer 14, the side as shown in patent document 2 Cut-out and the formation of score line 18 the two processes for carrying out resin layer 14 shown in method like that, in addition, need not also carry out resin The position pairing of the off-position of layer 14 and the forming position of score line 18.
In turn, in complex 10 obtained, the section of the section and sheet glass 12 of resin layer 14 can be made well Unanimously (two sections can be made to be in same plane).
The formation of score line 18 can form score line according to sheet glass 12 and resin layer 14, utilization through resin layer 14 18 well known means carry out.As wherein an example, can illustrate the various cutters using resin, glass it is various The method of cutter.
It should be noted that in the manufacturing method of the complex (laminated body) of the present invention, have on the surface of sheet glass 12 Defined resin layer 14, this will be described later.Therefore, even if score line 18 (forming position of the score line 18 of sheet glass 12) There is the defects of more notch (chipping), can also inhibit the crackle that sheet glass 12 generates when cutting off in sheet glass 12 Interarea on propagate.Therefore, in the manufacturing method of the present invention, need not special consideration should be given to will produce notch etc. in score line 18, because This, the formation of score line 18 can also be carried out using cheap cutter 20 etc..
For the width (size in the direction vertical with extending direction of line) of score line 18, the depth of score line 18, with The cut-out of common sheet glass (glass plate) is same, can to suitably set according to the thickness of sheet glass 12, forming material etc. The width and depth for cutting off sheet glass 12 by ground.
As shown in (B) of Fig. 1, formed after score line 18 on the sheet glass 12 of original complex 10a, such as (C) of Fig. 1 It is illustrated conceptually by, bends original complex 10a in a manner of applying tensile stress to the face of 14 side of resin layer of sheet glass 12. Being as a result, starting point with score line 18 makes sheet glass 12 be broken, and cuts off original complex 10a, if (D) of Fig. 1 is illustrated conceptually by, shape At the complex 10 with target size, shape.That is, by bending original complex in a manner of so that 14 side of resin layer is become convex 10a makes sheet glass 12 be broken, cuts off sheet glass 12, formed and answered with target size, shape to be starting point with score line 18 Zoarium 10.
Here, the manufacturing method of complex (laminated body) according to the present invention, even if in the relatively thin situation of sheet glass 12, drawing In the case that trace line 18 is there are multiple notches, sheet glass 12 that when cut-out that can also prevent original complex 10a generates is split Line (cracking) propagates (diffusion/development) on the interarea of sheet glass 12.
As previously mentioned, by using the complex for being formed with resin layer on sheet glass 12, can manufacture may be implemented it is thin Membranization, lightweight, and set by the excellent electronics that can also prevent the crackle of sheet glass 12 when deformations, flexible such as be bent It is standby.
Here, complex be typically will be bigger than target complex the cut-out of original complex and be made desirable size, The complex of shape.As cutting-off method, there are as below methods:Resin layer is cut off, and then according to the cutting line and in sheet glass Score line is formed on 12, and sheet glass 12 is cut off.But this method needs cutoff process twice, and in the position of off-position It sets pairing etc. and expends energy.In addition, previous method usually also has following situations:When cutting off sheet glass 12, because drawing Notch of trace line etc. and the crackle of sheet glass 12 that generates is propagated on the interarea of sheet glass 12, complex has splitting for sheet glass 12 Defect as line.The crackle is particularly susceptible generation when sheet glass 12 is relatively thin.
In addition, the manufacturing method as the complex with desirable shape that need not expend the energy such as position pairing (cutting-off method) is carried out at the same time score line 18 just like shown in patent document 3, by forming score line 18 across resin layer Form the method with the cut-out of resin layer.
However, with the cut-out of resin layer and when forming score line 18 on sheet glass 12, the formation of score line 18 needs A degree of power, the power being applied on cutter 20 are also applied on sheet glass 12.Therefore, score line 18 will produce more lack The defects of mouth.In previous method, when the sheet glass 12 like this with multiple notches is cut off (making its fracture), it can be lacked because of this Mouthful the defects of and generated in sheet glass 12 compared with multiple cracks, moreover, the crackle can propagate on the inside of the interarea of sheet glass 12.It is tied Fruit, obtained complex become the complex of defect as the crackle with sheet glass 12.The generation of such crackle is in glass When glass piece 12 is relatively thin especially frequent occurrence.
In this regard, in the manufacturing method of the present invention, the thickness of the resin layer 14 of original complex 10a (i.e. complex 10) is 1 ~100 μm, the Young's modulus away from the region at a distance from the normal direction at the interface of sheet glass 12 being 0~0.5 μm is 100MPa More than.In turn, resin layer 14 is adhered to sheet glass 12 with the bonding force that 180 ° of peel strengths are 1N/25mm or more.
As a result, in the cut-out of original complex 10a (when with fracture of the score line 18 for the sheet glass 12 of starting point), even if Sheet glass 12 cracks and applies stress to sheet glass 12, and the elastomeric resin of sheet glass 12 is adhered to high bonding force Layer 14 can also prevent crack propagation caused by stress.Therefore, it is possible to inhibit the crackle that sheet glass 12 generates in sheet glass It is propagated on 12 interarea.
In addition, by having such resin layer 14, can prevent from not needing in the position application for not forming score line 18 Stress to sheet glass 12 rupture.Therefore, the manufacturing method of complex of the invention can also form answering for the abnormity such as circle It is fit.
Therefore, it using the manufacturing method of the complex of the present invention, can steadily manufacture with desirable size, shape And inhibit the complex 10 (not having the complex 10 of crackle in the effective coverage of sheet glass 12) of the crackle of sheet glass 12.
In the manufacturing method of the present invention, the thickness of resin layer 14 is 1~100 μm.
When the thickness of resin layer 14 is less than 1 μm, can not obtain has the effect of resin layer 14, will produce following bad feelings Condition etc.:On original complex 10a formed score line 18 when sheet glass 12 rupture and crack propagation, cut-out when (when fracture) Region other than score line 18 cracks.
In addition, when the thickness of resin layer 14 is more than 100 μm, following unfavorable condition etc. will produce:It can not obtain with good Good flexible complex 10 is unable to fully meet filming, light-weighted requirement, and the formation of score line 18 becomes difficult.
In addition, from can more appropriately inhibit the crackle of sheet glass 12, the complex with good flexibility can be obtained 10, it can suitably realize that lightweight, filming of complex etc. consider that the thickness of resin layer 14 is preferably 10~50 μ m。
Resin layer 14 away from a distance from the normal direction at the interface of sheet glass 12 (direction vertical with interface) be 0~ Young's modulus (hereinafter also referred to as " the resin layer in 0.5 μm of region (i.e. 0.5 μm of region below of the thickness of 12 side of sheet glass) 14 Young's modulus ") it is 100MPa or more.
When the Young's modulus of resin layer 14 is less than 100MPa, sheet glass 12 will produce in the cut-out of original complex 10a Crack propagation a problem that.
Consider from crackle that can more appropriately inhibit sheet glass 12 etc., the Young's modulus of resin layer 14 is preferably 1000MPa or more.
The upper limit of the Young's modulus of resin layer 14 is not limited.Here, if in view of not making flexible reduce (not make bending Rigidity improves) etc., the Young's modulus of resin layer 14 is preferably 50000MPa hereinafter, more preferably 10000MPa or less.
The Young's modulus of resin layer 14, which utilizes, is based on JIS K 7127:1999 method measures.
In addition, when resin layer 14 (0.5 μm of region below of thickness of its 12 side of sheet glass) is made of more (n) layers, tree The Young's modulus E (Young's modulus E) of lipid layer 14 is calculated with following formula (1).
E=Σ (Ek×Ik)/I···(1)
Ek;The Young's modulus of the material of kth layer
Ik;The cross sectional moment of inertia of kth layer
k;The integer of 1~n
I;The cross sectional moment of inertia in the region of 0~0.5 μm of the thickness of 12 side of sheet glass of resin layer 14
From formula (1) it is found that even if using bonding agent by resin layer 14 be bonded on sheet glass 12 and bonding agent than tree In the case that lipid layer 14 is also soft, as long as the thickness of adhesive layer is sufficiently thin (being, for example, 100nm or less), then the poplar of resin layer 14 Family name's modulus also can be 100MPa or more.
In the manufacturing method of the present invention, resin layer 14 with 180 ° of peel strengths be 1N/25mm or more bonding force (below Referred to as " bonding force of resin layer 14 ") it is adhered to sheet glass 12.
When the bonding force of resin layer 14 is less than 1N/25mm, a problem that following will produce:Original complex 10a's The crack propagation of sheet glass 12 when cut-out, in the cut-out of original complex 10a, sheet glass 12 cracks.
Consider that the bonding force of resin layer 14 is preferably 3N/ from crackle that can more appropriately inhibit sheet glass 12 etc. 25mm or more, more preferably 5N/25mm or more.
In addition, not limiting the upper limit of the bonding force of resin layer 14.
It should be noted that the bonding force (180 ° of peel strengths) of resin layer 14 is based on JIS K 6854:1999 are surveyed It is fixed.
As above desirable size and shape, of the invention complex 10 has been made as previously mentioned, may be used as in operation Such as the substrate of the electronic equipments such as PV, LCD, OLED.
Fig. 2 conceptually illustrates an example of the manufacturing method of the laminated body of the present invention.
In the manufacturing method of the laminated body of the present invention, by it is aforementioned formed by sheet glass 12 and resin layer 14 it is original compound Original laminated body 30a (laminated body of complex) made of the 2nd sheet glass 34 is laminated on body 10a to cut off, manufacture has desirable The laminated body 30 of size, shape.It should be noted that in the example shown in Fig. 2, original complex 10a and the 2nd sheet glass 34 Interarea shape an example be rectangle.
Here, it is illustrated conceptually by such as (A) of Fig. 2, in the manufacturing method of laminated body of the invention, the stacking of the 2nd sheet glass 34 (resin layer 14 is clamped with sheet glass 12 and the 2nd sheet glass 34) in resin layer 14.In turn, the 2nd sheet glass 34 is with size ratio tree The interarea of lipid layer 14 small (area of the interarea of the 2nd sheet glass 34 is smaller than the area of the interarea of resin layer 14), the 2nd sheet glass 34 Periphery is laminated by the mode wrapped in the periphery of the interarea of resin layer 14.
It should be noted that in the manufacturing method of laminated body below, using identical as the manufacturing method of aforementioned complex Component therefore assign identical symbol to identical components, mainly illustrate difference.
In the manufacturing method of the laminated body of the present invention, original complex 10a and aforementioned original complex 10a shown in FIG. 1 It is identical.Former laminated body 30a is to be laminated, be bonded made of (bonding) the 2nd sheet glass 34 on such original complex 10a.Cause This, the sheet glass 12 of original complex 10a is the 1st sheet glass in the manufacturing method of the laminated body of the present invention.
In the manufacturing method of the laminated body of the present invention, original complex 10a is cut along the periphery of the interarea of the 2nd sheet glass 34 It is disconnected, manufacture the laminated body 30 with desirable size and shape.Therefore, the size and shape of the 2nd sheet glass 34 with to manufacture Laminated body 30 size and shape it is identical.
The glass of 2nd sheet glass 34, in turn, can also with foregoing glass piece 12 it is also possible to using well known various glass To utilize the glass manufactured by well known method.
It should be noted that laminated body 30 obtained implement with the heating such as heat treatment process with using on the way When, the 2nd sheet glass 34 preferably by and the small material of difference of linear expansion coefficient of sheet glass 12 formed, more preferably by with sheet glass 12 Identical material is formed.
The thickness of 2nd sheet glass 34 is the thickness of the purposes of the correspondence laminated body 30 to be manufactured.Therefore, the 2nd glass The thickness of piece 34 can be identical as sheet glass 12, can also be thicker than sheet glass 12 or thinner than sheet glass 12.
As wherein an example, the laminated body 30 obtained by the manufacturing method of the present invention be used to regard sheet glass 12 as substrate In the manufactures of electronic equipments such as PV, LCD, the OLED of (substrate (device substrate) for being formed with element).At this point, the 2nd sheet glass 34 It is formed with the thin glass sheet 12 of element preferably as support, the supporting base material (carrier substrate) that can carry out appropriate processing acts as With.Therefore, at this point, the thickness of the 2nd sheet glass 34 is preferably 0.2~1mm, more preferably 0.4~0.7mm.
The method that the 2nd sheet glass 34 is bonded on the resin layer 14 of former laminated body 30a can be according to the formation of resin layer 14 Various methods well known to material use.
As wherein an example, the method using bonding agent, the method etc. being laminated using heating in vacuum may be exemplified.
It should be noted that for bonding force raising the purpose of, the 2nd sheet glass 34 can also be laminated in resin layer 14 Before surface is implemented to be surface-treated.As the surface treatment of the 2nd sheet glass 34, before can illustrating in the explanation of sheet glass 12 The various surface treatments illustrated.
It should be noted that resin layer 14 and the 2nd sheet glass 34 are can ensure that enough bonding forces and 14 and of resin layer The mode that 2nd sheet glass 34 can be removed as needed is bonded.
It is laminated it should be noted that the manufacturing method of the laminated body of the present invention can also be included on original complex 10a The process (or the process for further carrying out aforementioned surfaces processing) of 2nd sheet glass 34.
If (B) of Fig. 2 is illustrated conceptually by, in the manufacturing method of laminated body of the invention, to such former laminated body 30a, Along the periphery (outer rim) (periphery for following the interarea of the 2nd sheet glass 34) of the interarea of the 2nd sheet glass 34,20 shape of cutter is utilized At the score line 18 for being cut off.As previously described, because original complex 10a be rectangle, therefore, score line 18 along with paper The vertical direction in face extends.
Here, same as the manufacturing method of complex shown in FIG. 1, the manufacturing method of laminated body of the invention also makes cutting 20 contact pressure resin layer 14 of device runs through (cut-out) resin layer 14, and score line 18 is formed on sheet glass 12.That is, on sheet glass 12 The cut-out of resin layer 14 is carried out while forming score line 18.The manufacture of the formation and complex shown in FIG. 1 of the score line 18 Method equally carries out.
It should be noted that being illustrated only in Fig. 2 along vertical with the paper of both sides lateral in the figure of the 2nd sheet glass 34 The extended score line 18 in direction, but as previously mentioned, the periphery of the interarea of the 2nd sheet glass 34 by the periphery of the interarea of resin layer 14 Packet, therefore, the score line of the extending transversely along figure is also formed in the both sides of the 2nd sheet glass 34 in the direction vertical with paper 18。
It is formed after score line 18 on the sheet glass 12 of former laminated body 30a (original complex 10a), the system with complex Same operation is made, if (C) of Fig. 2 is illustrated conceptually by, to apply the side of tensile stress in the face of 14 side of resin layer of sheet glass 12 Formula bends original complex 10a.
Being as a result, starting point with score line 18 makes sheet glass 12 be broken, to cut off original complex 10a, such as Fig. 2 (D) it is illustrated conceptually by, forms the laminated body 30 of target size, shape.
Here, as previously mentioned, original complex 10a with defined bonding force bonding with specific thickness and Young's modulus Resin layer 14.Therefore, same as the manufacturing method of complex of the present invention, even if sheet glass 12 is relatively thin, laminated body of the invention Manufacturing method can also prevent the crack propagation of the sheet glass 12 generated when cutting off the original complex 10a, and can also Carry out the cut-out of the abnormity such as circle.Therefore, the manufacturing method of laminated body according to the present invention can be manufactured with desirable ruler Very little and shape inhibits the laminated body 30 of the crackle of sheet glass 12 (not have the laminated body of crackle in the effective coverage of sheet glass 12 30)。
The manufacturing method of the present invention is preferably, after original complex 10a cut-outs are formed laminated body 30, such as Fig. 2 (E) be illustrated conceptually by, carry out laminated body 30 end face (side portion) chamfering.
The chamfering of laminated body 30 carries out falling for the laminated body of glass plate and resin using the method for grinding stone etc. using rotation Angle etc, well known various methods carry out.
As wherein an example, the method that No. 2012/176608 record of International Publication No. can be illustrated.The chamfering method utilizes circle The grinding stone of the rotation of plate-like or cylindrical shape carries out grinding to chamfering, wherein make 14 He of resin layer to the end face of laminated body 30 The interface and the interface of resin layer 14 and the 2nd sheet glass 34 of sheet glass 12 are obliquely abutted with grinding stone, are ground, thus into The chamfering of row laminated body 30.Preferably, to peripheral surface, using with the mill for abutting and being ground with the end face of laminated body 30 The grinding stone of slot is cut, also, opposite with the interface of sheet glass 12 and the interface of resin layer 14 and the 2nd sheet glass 34 with resin layer 14 In the most deep of grind reliefs, the mode deviated to the width direction (extending direction of rotary shaft) of grind reliefs configures the grinding of grinding stone Slot makes grind reliefs obliquely be abutted relative to two interfaces and is ground.It is further preferred that making the end of grind reliefs and laminated body 30 Face abuts, it is further preferred that, it is section arc-shaped to make grind reliefs, makes part and resin layer 14 and the glass of section arc-shaped The interface of piece 12 and the interface of resin layer 14 and the 2nd sheet glass 34 abut, and are ground.
Using the chamfering method, the chamfering of the end face of laminated body 30 can be carried out and reduce the production of defect caused by grinding It is raw.
Thus the laminated body 30 of the present invention of desirable size and shape has been made as previously mentioned, may be used as example The substrate of the electronic equipments such as PV, LCD, OLED.
The manufacturing method of complex and the manufacturing method of laminated body of the present invention are described in detail above, but this hair It is bright to be not limited to above-mentioned example, various improvement, change can be carried out without departing from the spirit and scope of the invention, this is not say And explain.
Embodiment
Hereinafter, illustrating specific embodiment of the invention, the present invention will be described in more detail.
[embodiment 1]
As sheet glass 12, prepare 100 μm of thickness, 150 × 100mm alkali-free glass plate (Asahi Glass Co., Ltd's manufacture, AN100)。
First, as pretreatment, after keeping sheet glass 12 purifying by pure water cleaning and UV cleanings, in order to improve bonding Power, by the spin coating rotating speed of 2000rpm (, 10 seconds) coating using isopropanol as the TSL 8330 of solvent (KBM903) 0.1wt% solution, it is 10 minutes dry at 80 DEG C, carry out the silane coupled processing of sheet glass 12.
Then, the polyamic acid solution of coating is prepared using following methods.
So that p-phenylenediamine (10.8g, 0.1mol) is dissolved in n,N-dimethylacetamide (198.6g), is stirred at room temperature It mixes.3,3 ', 4,4 '-biphenyltetracarboxylic dianhydrides (BPDA) (29.4g, 0.1mol) were added thereto with 1 minute, are stirred at room temperature 2 hours, obtain the polyamic acid comprising the repetitive unit indicated with following formula (2-1) and/or formula (2-2), solid constituent The polyamic acid solution of 20 mass % of concentration.
The polyamic acid solution is utilized into spin-coating method (2000rpm, coated weight 10g/m2) be coated on sheet glass 12, it is formed Film.Later, it heats 10 minutes, and then is heated in an atmosphere at 120 DEG C again 10 minutes in an atmosphere at 60 DEG C, thus will Dried coating film forms the film of polyamic acid on the surface of sheet glass 12.
In turn, by being heated 1 hour at 350 DEG C in an atmosphere, make polyamic acid imidizate, be produced on sheet glass 12 Surface have 25 μm of the thickness formed by polyimides resin layer 14 original complex 10a.
The viscous of resin layer 14 is measured using universal testing machine (Shimadzu Seisakusho Ltd.'s manufacture) to original complex 10a obtained Relay (180 ° of peel strengths).As a result, the bonding force of resin layer 14 is 12N/25mm.
In addition, being based on JIS K 7127:1999, the Young's modulus of resin layer 14 is measured (away from the interface with sheet glass 12 The Young's modulus in the region that the distance of normal direction is 0~0.5 μm).As a result, the Young's modulus of resin layer 14 is 5GPa.It needs It is noted that Young's modulus is measured from after original complex 10a strippings resin layer 14 obtained.It can not be by resin layer 14 In the case that original complex 10a is removed, so that sheet glass 12 is dissolved using hydrofluoric acid, obtain the resin layer 14 of measurement.
To thus obtained original complex 10a, flywheel type cutter (wheel cutter, Mitsuboshi are utilized Diamond Industrial Co., Ltd.s manufacture Penett), run through resin layer 14 from 14 side of resin layer, on sheet glass 12 Form linear score line 18.
Then, by make resin side be it is convex in a manner of by original complex 10a bend, with score line 18 be starting point make sheet glass 12 fractures, cut off original complex 10a, manufacture complex 10.
To the sheet glass 12 of complex 10 obtained, by visual observation and light microscope, confirmation is used to exist away from score line 18 Normal direction (direction vertical with score line) has propagated the crackle of 5mm or more.It is propagated away from score line 18 as a result, not observing The crackle of 5mm or more (no breakage).
[embodiment 2]
Other than resin layer 14 to be changed to the resin layer by PES (polyethers sulfonic acid) 20 μm of the thickness formed, with implementation Example 1 equally operates, and manufactures complex 10.
The formation of the resin layer 14 formed by PES carries out as follows.First, make PES (Sumitomo Chemical manufacture, 5003P) with 20 Quality % is dissolved in N-Methyl pyrrolidone, makes PES solution.The PES solution is passed through into spin-coating method (2000rpm, coated weight 10g/m2) it is coated on sheet glass 12, form film.Thereafter, it heats at 130 DEG C 1 hour, thus does film in an atmosphere It is dry, form the film of PES.It should be noted that in this example, the silane coupled processing without sheet glass 12.
In addition, when making original complex 10a, the bonding force and Young of resin layer 14 are measured similarly to Example 1 Modulus.As a result, bonding force is 5.4N/25mm, Young's modulus 2.4GPa.
In addition, confirming the sheet glass 12 of complex 10 similarly to Example 1, as a result, do not observe and passed away from score line 18 The crackle (no breakage) of 5mm or more is broadcast.
[comparative example 1]
Make polyamic acid solution solid component concentration be 10 mass %, make resin layer thickness be 0.5 μm, except this with Outside, it operates similarly to Example 1, manufactures complex.
In addition, when making original complex, the bonding force and Young's modulus of resin layer are measured similarly to Example 1. As a result, bonding force is shown as 10N/25mm or more, but resin layer ruptures, therefore can not measure correct value.In addition, poplar Family name's modulus is 5GPa.
In addition, confirming the sheet glass 12 of complex similarly to Example 1, propagated away from score line 18 as a result, observing The crackle of 5mm or more (having breakage).
[comparative example 2]
It is same with embodiment 1 other than the resin layer for 16 μm of thickness for being changed to resin layer to be formed by organic siliconresin Sample operates, and manufactures complex.
The formation of the resin layer formed by organic siliconresin carries out as follows.By the solvent-free addition reaction-type stripping of 100 mass parts From paper organosilicon (Shin-Etsu Silicones CO., LTD. manufacture, KNS-320A.Olefinic organic based polysiloxane with it is organic The mixture of hydrogen polysiloxanes) (Shin-Etsu Silicones CO., LTD. manufacture CAT- with 2 mass parts platinum group catalysts PL-56 mixture) passes through spin-coating method (2000rpm, coated weight 10g/m2) it is coated on sheet glass 12, form film.Thereafter, lead to It crosses and is heated in an atmosphere at 180 DEG C 30 minutes, by dried coating film, to form the film of organic siliconresin.It should be noted that In this example, the silane coupled processing without sheet glass 12.
In addition, when making original complex, the bonding force and Young's modulus of resin layer are measured similarly to Example 1. As a result, bonding force is 2.7N/25mm or more, Young's modulus 0.003GPa.
In addition, confirming the sheet glass 12 of complex similarly to Example 1, propagated away from score line 18 as a result, observing The crackle of 5mm or more (having breakage).
[comparative example 3]
It other than the silane coupled processing without sheet glass 12, operates similarly to Example 1, manufactures complex.
In addition, when making original complex, the bonding force and Young's modulus of resin layer are measured similarly to Example 1. As a result, bonding force is 0.1N/25mm, Young's modulus 5GPa.
In addition, confirming the sheet glass 12 of complex similarly to Example 1, propagated away from score line 18 as a result, observing The crackle of 5mm or more (having breakage).
Result above is summarized and is shown in following table 1.
Table 1
As shown in above-described embodiment, according to the thickness of resin layer 14 be 1~100 μm, bonding force (180 ° of peel strengths) is 1N/25mm or more, the manufacturing method of the present invention that Young's modulus is 100MPa or more, can inhibit will be original by score line 18 The propagation of crackle when complex 10a cut-outs (sheet glass 12 is made to be broken), can manufacture does not have 5mm's or more in sheet glass 12 The complex of the high-quality of crackle.
In contrast, the thin comparative example 1 of resin layer, resin layer the low comparative example 2 and resin layer of Young's modulus bonding In the low comparative example 3 of power, when being cut off original complex 10a by score line 18, crackle is propagated, and is produced in sheet glass 12 The crackle of raw 5mm or more.
The effect of the present invention can be defined by result above.
The application goes out to be willing to 2014-099381 based on Japanese Patent filed in 13 days Mays in 2014, and content is as reference simultaneously Enter in the application.
Industrial availability
The manufacturing method of the present invention can be suitably used for the manufacture etc. of various electronic equipments.

Claims (5)

1. the manufacturing method of a species complex, which is characterized in that
To the original complex with sheet glass and resin layer, score line is formed on the glass sheet through the resin layer, and With the score line for starting point cut off the original complex, complex is thus manufactured,
Wherein, the resin layer is adhered to the sheet glass with the bonding force that 180 ° of peel strengths are 1N/25mm or more, and away from The Young's modulus in the region for being 0~0.5 μm at a distance from the normal direction at the interface of the sheet glass is 100MPa or more, resin Layer thickness is 1~100 μm.
2. the manufacturing method of complex according to claim 1, wherein the thickness of the sheet glass is 100 μm or less.
3. a kind of manufacturing method of laminated body, which is characterized in that in the original complex with the 1st sheet glass and resin layer On by major-surface-area 2nd sheet glass smaller than the major-surface-area of the resin layer with the periphery quilt of the interarea of the 2nd sheet glass Original laminated body obtained from the mode wrapped in the periphery of the interarea of the resin layer is laminated on the resin layer and is bonded, edge The periphery for the interarea of the 2nd sheet glass forms score line, with the cut through the resin layer on the 1st sheet glass Line is starting point cut off the original complex, thus manufactures laminated body,
Wherein, the resin layer is adhered to the 1st sheet glass with the bonding force that 180 ° of peel strengths are 1N/25mm or more, and And the Young's modulus away from the region for being 0~0.5 μm at a distance from the normal direction at the interface of the 1st sheet glass be 100MPa with On, resin layer thickness is 1~100 μm.
4. the manufacturing method of laminated body according to claim 3, wherein after the cut-out for carrying out the original complex, Further carry out the chamfering of the end face of the laminated body.
5. the manufacturing method of laminated body according to claim 3 or 4, wherein the thickness of the 1st sheet glass is 100 μm Below.
CN201510243003.2A 2014-05-13 2015-05-13 The manufacturing method of complex and the manufacturing method of laminated body Active CN105082671B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-099381 2014-05-13
JP2014099381A JP6299405B2 (en) 2014-05-13 2014-05-13 Method for producing composite and method for producing laminate

Publications (2)

Publication Number Publication Date
CN105082671A CN105082671A (en) 2015-11-25
CN105082671B true CN105082671B (en) 2018-09-28

Family

ID=54564405

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510243003.2A Active CN105082671B (en) 2014-05-13 2015-05-13 The manufacturing method of complex and the manufacturing method of laminated body

Country Status (4)

Country Link
JP (1) JP6299405B2 (en)
KR (1) KR20150130248A (en)
CN (1) CN105082671B (en)
TW (1) TWI648234B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6597361B2 (en) * 2016-02-12 2019-10-30 三菱ケミカル株式会社 Manufacturing method of substrate for electronic device
CN106442107B (en) * 2016-09-28 2019-08-02 同济大学 Rock-like materials and its preparation method and application for stress test
WO2018079545A1 (en) 2016-10-26 2018-05-03 日東電工株式会社 Glass film-resin composite
CN109890773B (en) 2016-10-26 2022-04-26 日东电工株式会社 Glass roll with resin film
KR20180051695A (en) 2016-11-07 2018-05-17 삼성디스플레이 주식회사 Glass substrate, manufacturing method of the same, and display device having the same
US20200247092A1 (en) * 2017-09-29 2020-08-06 Dai Nippon Printing Co., Ltd. Optical film and image display device
CN109410768A (en) * 2018-12-24 2019-03-01 武汉华星光电半导体显示技术有限公司 Display coversheet and its manufacturing method
FR3099152B1 (en) 2019-07-26 2021-07-23 Saint Gobain Method and system for generating a cutting plan for a complex glass product

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101486202A (en) * 2008-01-15 2009-07-22 三星钻石工业股份有限公司 Cutting method for laminated body and cutting knife used therein
CN103347829A (en) * 2010-11-30 2013-10-09 康宁股份有限公司 Structures and methods for splicing glass ribbon
CN103509479A (en) * 2012-06-28 2014-01-15 古河电气工业株式会社 Adhesive tape for wafer processing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69831325T2 (en) * 1998-07-15 2006-06-14 Agfa Gevaert Nv Composite pane with a glass pane containing cracks
JP5438422B2 (en) * 2009-07-31 2014-03-12 三星ダイヤモンド工業株式会社 Method and apparatus for processing brittle material substrate
JP2012083659A (en) * 2010-10-14 2012-04-26 Nsc:Kk Method for manufacturing glass substrate for electronic device
CN103298615B (en) * 2010-12-28 2015-06-10 旭硝子株式会社 Process for production of laminate
JP5244202B2 (en) * 2011-01-27 2013-07-24 三星ダイヤモンド工業株式会社 Method for scribing a brittle material substrate
CN104647840B (en) * 2011-05-13 2017-06-06 日本电气硝子株式会社 The shearing device and cutting-off method of layered product, the processing method of the cutting-off method of layered product and layered product and fragility plate object
TWI547369B (en) * 2011-05-27 2016-09-01 康寧公司 Glass-plastic laminate device, processing line and methods therefor
JP5944155B2 (en) * 2011-12-12 2016-07-05 日東電工株式会社 LAMINATED SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING LAMINATED SHEET
WO2013172353A1 (en) * 2012-05-15 2013-11-21 電気化学工業株式会社 Processing apparatus and method for processing laminated article
JP6186675B2 (en) * 2012-07-05 2017-08-30 日本電気硝子株式会社 Glass resin laminate
JP6090325B2 (en) * 2012-08-21 2017-03-08 旭硝子株式会社 Composite sheet cutting method, glass sheet cutting method, composite sheet cutting piece
KR20150095670A (en) * 2012-12-13 2015-08-21 아사히 가라스 가부시키가이샤 Electronic device manufacturing method, and glass laminate manufacturing method
JP2014159352A (en) * 2013-02-20 2014-09-04 Nitto Denko Corp Production method of flexible film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101486202A (en) * 2008-01-15 2009-07-22 三星钻石工业股份有限公司 Cutting method for laminated body and cutting knife used therein
CN103347829A (en) * 2010-11-30 2013-10-09 康宁股份有限公司 Structures and methods for splicing glass ribbon
CN103509479A (en) * 2012-06-28 2014-01-15 古河电气工业株式会社 Adhesive tape for wafer processing

Also Published As

Publication number Publication date
KR20150130248A (en) 2015-11-23
CN105082671A (en) 2015-11-25
JP6299405B2 (en) 2018-03-28
TWI648234B (en) 2019-01-21
TW201607904A (en) 2016-03-01
JP2015214468A (en) 2015-12-03

Similar Documents

Publication Publication Date Title
CN105082671B (en) The manufacturing method of complex and the manufacturing method of laminated body
CN106457776B (en) Complex, laminated body and electronic device and their manufacturing method
CN101437772B (en) Thin plate glass laminate, process for producing display device using thin plate glass laminate, and support glass substrate
JP4834758B2 (en) Substrate structure applied to flexible electronic device and manufacturing method thereof
EP3450164B1 (en) Polyimide film layered body
JP7070425B2 (en) Manufacturing method for laminated boards and electronic devices
WO2014192560A1 (en) Resin-layer-equipped support substrate and method for producing same, glass laminate and method for producing same, and method for producing electronic device
JP6943249B2 (en) Laminated body, manufacturing method of electronic device, manufacturing method of laminated body
JP2016035832A (en) Method of manufacturing electronic device, method of manufacturing glass laminate
WO2015098888A1 (en) Glass laminate body, and method for manufacturing electronic device
JPWO2016043180A1 (en) Laminate and flexible device manufacturing method
KR20230044023A (en) Glass laminate, method for producing electronic device, method for producing glass laminate, and glass plate package
JP2017087417A (en) Glass laminate
TW201604005A (en) Composite
JP7103163B2 (en) Laminates, continuity check methods, and electronic device manufacturing methods
WO2015166880A1 (en) Glass laminate, glass substrate with resin layer, support base material with resin layer
CN113276504A (en) Laminated substrate, method for producing laminated body, laminated body with member for electronic device, and method for producing electronic device
JP2014205327A (en) Composite sheet and electronic device
TWI841614B (en) Multilayer body, conduction inspection method, and method for manufacturing electronic device
KR20240027550A (en) Film laminated substrate
JP2016034884A (en) Production method of glass film laminate, and manufacturing method of electronic device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Tokyo, Japan, Japan

Applicant after: AGC Corporation

Address before: Tokyo, Japan, Japan

Applicant before: Asahi Glass Co., Ltd.

CB02 Change of applicant information
GR01 Patent grant
GR01 Patent grant