TW201607904A - Method for manufacturing composite and method for manufacturing laminate - Google Patents

Method for manufacturing composite and method for manufacturing laminate Download PDF

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TW201607904A
TW201607904A TW104115297A TW104115297A TW201607904A TW 201607904 A TW201607904 A TW 201607904A TW 104115297 A TW104115297 A TW 104115297A TW 104115297 A TW104115297 A TW 104115297A TW 201607904 A TW201607904 A TW 201607904A
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resin layer
composite
glass
glass sheet
initial
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TW104115297A
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TWI648234B (en
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Junichi Kakuta
Kenichi Ebata
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Asahi Glass Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/003Cutting
    • B32B17/064
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/033 layers

Abstract

The invention provides a method for manufacturing composite and method for manufacturing laminate. The manufacturing method can prevent cracks of glass sheet cutting a composite binding the glass sheet and the resin layer and a laminate body laminated from the second glass sheet of the composite body; and the composite body and the laminate body preventing glass cracks and having desired shapes are manufactured.

Description

複合體之製造方法及積層體之製造方法 Manufacturing method of composite and manufacturing method of laminated body

本發明係關於在玻璃片之上具有樹脂層之複合體之製造方法、及於該複合體之樹脂層積層第2玻璃片而成之積層體之製造方法。 The present invention relates to a method for producing a composite having a resin layer on a glass sheet, and a method for producing a laminate in which a second glass sheet is laminated on a resin of the composite.

近年來,太陽電池(PV)、液晶面板(LCD)、有機EL(Electroluminescence,電致發光)面板(OLED)等電子裝置(電子機器)之薄型化、輕量化不斷推進。作為謀求該電子裝置之薄型化或輕量化之方法之一,推進用於電子裝置之基板之薄板化。 In recent years, thinner and lighter electronic devices (electronic devices) such as solar cells (PV), liquid crystal panels (LCDs), and organic EL (Electroluminescence) panels (OLEDs) have been increasingly promoted. As one of methods for reducing the thickness and weight of the electronic device, the thinning of the substrate for the electronic device is promoted.

又,藉由使用薄板之玻璃基板(玻璃片),亦期待具有可撓性之電子裝置之實用化。 Moreover, it is also expected to be practical to use a flexible electronic device by using a glass substrate (glass plate) of a thin plate.

然而,玻璃片強度不充分,於彎曲變形時,亦有產生破裂等破損之情形。 However, the strength of the glass piece is insufficient, and when it is bent and deformed, breakage such as cracking may occur.

相對於此,例如,專利文獻1中提出有於玻璃片貼附樹脂層而成之複合體。若為此種複合體,則即便複合體彎曲變形,而於與樹脂層貼附之玻璃片之表面產生拉伸應力,拉伸應力亦可藉由樹脂層而得以減輕,可抑制玻璃片之破損。 On the other hand, for example, Patent Document 1 proposes a composite in which a resin layer is attached to a glass sheet. In the case of such a composite, even if the composite is bent and deformed, tensile stress is generated on the surface of the glass sheet attached to the resin layer, and the tensile stress can be reduced by the resin layer, and the breakage of the glass sheet can be suppressed. .

於電子裝置之製造中,於使用此種複合體之情形時,必須將複合體視需要切割成所需尺寸或形狀。 In the manufacture of electronic devices, in the case of such composites, the composite must be cut to the desired size or shape as desired.

作為此種複合體之切割方法,專利文獻2中例示有如下方法:於玻璃片(脆性材料基板)之與樹脂層相反之面形成玻璃片厚度10%以上且未達100%之劃線,進而,於樹脂層之將劃線沿厚度方向延長之位置 劃出切口直至相對於厚度為90%以上且未達至玻璃片之位置,而切割複合體。 As a method of cutting such a composite, Patent Document 2 exemplifies a method of forming a scribe line having a thickness of 10% or more and less than 100% on a surface of a glass sheet (brittle material substrate) opposite to the resin layer. , the position of the scribe line extending in the thickness direction in the resin layer The slit was drawn until the composite was cut with respect to a thickness of 90% or more and not reaching the position of the glass piece.

又,與複合體稍有不同,專利文獻3中記載有如下方法:於玻璃片(脆性材料基板)之表面附膜防止玻璃屑附著之表面保護構件(樹脂膜等),使用於刀尖脊線形成有溝槽之刀輪,藉由該刀輪,一面自表面保護構件側切割表面保護構件一面對玻璃片切入劃線使其斷裂,藉此切割玻璃片。 In addition, in the case of the glass sheet (brittle material substrate), a surface protection member (resin film or the like) for preventing adhesion of glass swarf is attached to the ridge of the blade edge. A grooved cutter wheel is formed, by which the surface protection member is cut from the surface protection member side by cutting the scribe line to be broken, thereby cutting the glass piece.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]國際公開第2012/166343號 [Patent Document 1] International Publication No. 2012/166343

[專利文獻2]日本專利第4918064號公報 [Patent Document 2] Japanese Patent No. 4918064

[專利文獻3]日本專利第4198601號公報 [Patent Document 3] Japanese Patent No. 4198601

根據該等方法,可將於玻璃片形成樹脂層而成之複合體切割成所需之尺寸。 According to these methods, a composite in which a glass sheet is formed into a resin layer can be cut into a desired size.

然而,根據本發明者之研究,先前之複合體之切割方法中,於以劃線為起點對玻璃片進行切割(斷裂)時,經常產生如下情形:於玻璃片產生破裂(龜裂),該破裂於玻璃片之主面上擴大,作為製品變得不良。尤其是,於玻璃片較薄之情形時,容易產生玻璃片之破裂擴大之問題。 However, according to the study by the present inventors, in the cutting method of the prior composite, when the glass sheet is cut (broken) starting from the scribing, it is often the case that cracks (cracks) are generated in the glass sheet, which The rupture is enlarged on the main surface of the glass sheet, and the product becomes defective. In particular, when the glass piece is thin, the problem of cracking of the glass piece is likely to occur.

本發明之目的在於解決此種先前技術之問題,在於提供於玻璃片接著有樹脂層之複合體、及將該複合體接著於玻璃片之積層體之製造方法,該製造方法即便於使用較薄之玻璃片時,於對複合體進行切割(使玻璃片斷裂)時,亦可抑制於玻璃片產生之破裂擴大,可穩定地製造具有所需尺寸或形狀、且玻璃片之破裂經抑制之複合體或積層體。 SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art by providing a composite of a glass sheet followed by a resin layer and a method of manufacturing the laminate of the composite followed by a glass sheet, which is thinner if used. In the case of the glass sheet, when the composite is cut (breaking the glass sheet), cracking of the glass sheet can be suppressed from being expanded, and a composite having a desired size or shape and inhibiting cracking of the glass sheet can be stably produced. Body or laminate.

為了達成上述目的,本發明提供一種複合體之製造方法,其特徵在於:在具有玻璃片、及以180°剝離強度為1N/25mm以上之接著力接著於該玻璃片、距離與上述玻璃片之界面於法線方向為0~0.5μm之區域之楊氏模數為100MPa以上、且厚度為1~100μm的樹脂層之初始複合體中, 貫通上述樹脂層而於玻璃片形成劃線,以該劃線為起點對上述初始複合體進行切割,藉此製造複合體。 In order to achieve the above object, the present invention provides a method for producing a composite characterized by having a glass sheet and an adhesive force having a peel strength of 1 N/25 mm or more at 180°, followed by the glass sheet, the distance, and the glass sheet. In the initial composite of the resin layer having a Young's modulus of 100 MPa or more and a thickness of 1 to 100 μm in the region where the normal direction is 0 to 0.5 μm, The above-mentioned resin layer is passed through to form a scribe line, and the initial composite body is cut by using the scribe line as a starting point to produce a composite body.

關於此種本發明之複合體之製造方法,較佳為上述玻璃片之厚度為100μm以下。 In the method for producing a composite of the present invention, it is preferable that the thickness of the glass sheet is 100 μm or less.

又,本發明提供一種積層體之製造方法,其特徵在於:在具有第1玻璃片、及以180°剝離強度為1N/25mm以上之接著力接著於該第1玻璃片、距離與上述第1玻璃片之界面於法線方向為0~0.5μm之區域之楊氏模數為100MPa以上、且厚度為1~100μm的樹脂層之初始複合體中,使主面之面積小於上述樹脂層之主面之第2玻璃片以上述第2玻璃片之主面之外周內包於上述樹脂層之主面之外周之方式積層於上述樹脂層上並接著而形成初始積層體, 對上述初始積層體沿著上述第2玻璃片之主面之外周,貫通上述樹脂層而於第1玻璃片形成劃線,以該劃線為起點對上述初始複合體進行切割,藉此製造積層體。 Moreover, the present invention provides a method for producing a laminated body, comprising: forming a first glass sheet and an adhesive force having a 180° peel strength of 1 N/25 mm or more, followed by the first glass sheet, the distance, and the first In the initial composite of the resin layer having a Young's modulus of 100 MPa or more and a thickness of 1 to 100 μm in the region where the normal direction is 0 to 0.5 μm, the area of the main surface is smaller than that of the above resin layer. The second glass piece of the surface is laminated on the resin layer so as to surround the outer surface of the main surface of the resin layer in the outer periphery of the main surface of the second glass piece, and then the initial laminated body is formed. The initial laminate is formed by dicing the first glass sheet through the resin layer along the outer periphery of the main surface of the second glass sheet, and cutting the initial composite from the scribe line to form a laminate body.

關於此種積層體之製造方法,較佳為於進行上述初始複合體之切割後進而對上述積層體之端面進行倒角處理。 In the method for producing such a laminate, it is preferred that the end face of the laminate is chamfered after the initial composite is cut.

進而較佳為上述第1玻璃片之厚度為100μm以下。 Further preferably, the thickness of the first glass sheet is 100 μm or less.

根據本發明,於玻璃片接著樹脂層而成之複合體、及將該複合體積層於玻璃片而成之積層體,即便於玻璃片較薄之情形時,亦可抑制 於切割時玻璃片所產生之破裂擴大。 According to the present invention, the composite body in which the glass sheet is followed by the resin layer and the laminate in which the composite volume layer is formed on the glass sheet can be suppressed even when the glass sheet is thin. The crack generated by the glass sheet is enlarged at the time of cutting.

因此,根據本發明,可穩定地製造充分地抑制玻璃片之破裂的所需尺寸或形狀之複合體或積層體。 Therefore, according to the present invention, a composite or a laminate having a desired size or shape which sufficiently suppresses cracking of the glass sheet can be stably produced.

10‧‧‧複合體 10‧‧‧Compound

10a‧‧‧初始複合體 10a‧‧‧ initial complex

12‧‧‧玻璃片 12‧‧‧Stainless glass

14‧‧‧樹脂層 14‧‧‧ resin layer

18‧‧‧劃線 18‧‧‧dick

20‧‧‧切割器 20‧‧‧Cutter

30‧‧‧積層體 30‧‧‧Layered body

30a‧‧‧初始積層體 30a‧‧‧Integrated laminate

34‧‧‧第2玻璃片 34‧‧‧2nd glass piece

圖1(A)~1(D)係用以說明本發明之複合體之製造方法之一例之概念圖。 1(A) to 1(D) are conceptual views for explaining an example of a method of producing a composite of the present invention.

圖2(A)~2(E)係用以說明本發明之積層體之製造方法之一例之概念圖。 2(A) to 2(E) are conceptual views for explaining an example of a method of manufacturing a laminated body of the present invention.

以下,基於隨附圖式所示之較佳例對本發明之複合體之製造方法及積層體之製造方法進行詳細說明。 Hereinafter, a method for producing a composite of the present invention and a method for producing a laminate will be described in detail based on preferred examples shown in the accompanying drawings.

圖1概念性地表示本發明之複合體之製造方法之一例。 Fig. 1 conceptually shows an example of a method of producing a composite of the present invention.

本發明之複合體之製造方法係對於玻璃片12之一面形成樹脂層14而成之初始複合體10a進行切割(分割),而製造所需尺寸或形狀(主面之尺寸或形狀)之複合體10。 The method for producing a composite according to the present invention is to form a composite of a desired size or shape (size or shape of a main surface) by cutting (dividing) the initial composite 10a in which the resin layer 14 is formed on one surface of the glass sheet 12. 10.

於本發明之複合體之製造方法中,初始複合體10a(即,製造之複合體10)如圖1(A)概念性地所示般,係於玻璃片12之一面(一主面(表面))形成樹脂層14而成者。再者,於圖1所示之例中,初始複合體10a之主面之形狀作為一例為矩形。 In the manufacturing method of the composite of the present invention, the initial composite 10a (i.e., the manufactured composite 10) is one side of the glass sheet 12 (one main surface (surface) as conceptually shown in Fig. 1(A) )) The resin layer 14 is formed. Further, in the example shown in Fig. 1, the shape of the main surface of the initial composite 10a is rectangular as an example.

成為初始複合體10a之基板(基材)的玻璃片12之玻璃可利用公知之各種玻璃。具體而言,可例示鈉鈣玻璃或無鹼玻璃等。又,玻璃片12可使用利用浮式法、熔融法、再曳引法等公知之方法製造而成者。 As the glass of the glass piece 12 which becomes the board|substrate (substrate) of the initial composite 10a, the well-known various glass can be utilized. Specifically, soda lime glass, alkali-free glass, etc. are illustrated. Further, the glass sheet 12 can be produced by a known method such as a float method, a melting method, or a re-drawing method.

玻璃片12之厚度為對應於所製造之複合體10之用途之厚度即可。 The thickness of the glass sheet 12 may be a thickness corresponding to the use of the composite 10 to be manufactured.

此處,利用本發明之製造方法而製造之複合體10(積層體30)作為一例可用於太陽電池(PV)、液晶面板(LCD)、有機EL面板(OLED)等電子裝置之製造。對該等電子裝置要求謀求薄型化或輕量化,進而亦期 望向要求可撓性之用途發展。若考慮此方面,則玻璃片12於可製作電子裝置之範圍內愈薄愈佳。 Here, the composite 10 (layered body 30) manufactured by the manufacturing method of the present invention can be used as an example for the production of electronic devices such as a solar cell (PV), a liquid crystal panel (LCD), and an organic EL panel (OLED). The electronic devices are required to be thinner or lighter, and then Look for developments that require flexibility. If this aspect is considered, the thinner the glass sheet 12 is within the range in which the electronic device can be fabricated.

另一方面,如下所述,根據本發明之製造方法,可製造抑制切割初始複合體10a時所產生之玻璃片12之破裂擴大,而並無因玻璃片12之破裂導致之缺陷的複合體。玻璃片12越薄,切割該初始複合體10a時之破裂、及破裂之擴大越容易發生。 On the other hand, as described below, according to the manufacturing method of the present invention, it is possible to manufacture a composite in which the crack of the glass sheet 12 generated when the initial composite 10a is cut is suppressed from expanding, and there is no defect due to the crack of the glass sheet 12. The thinner the glass sheet 12, the more likely the cracking and the expansion of the crack when the initial composite 10a is cut.

即,若考慮電子裝置等利用複合體10之製品之可撓性而使玻璃片12較薄,則變得容易產生玻璃片12之破裂,但根據本發明,即便於使玻璃片12較薄時,亦可較佳地抑制破裂。若考慮此方面,則玻璃片12之厚度較佳為100μm以下,更佳為75μm以下,尤佳為50μm以下。 In other words, when the glass sheet 12 is made thinner in consideration of the flexibility of the product of the composite 10 such as an electronic device, the glass sheet 12 is easily broken. However, according to the present invention, even when the glass sheet 12 is made thinner. It is also preferable to suppress cracking. In consideration of this aspect, the thickness of the glass piece 12 is preferably 100 μm or less, more preferably 75 μm or less, and still more preferably 50 μm or less.

又,玻璃片12之厚度根據複合體10(積層體30)之用途,為可確保必需之強度之厚度以上即可。 Further, the thickness of the glass piece 12 may be equal to or greater than the thickness of the composite 10 (the laminated body 30) to ensure the necessary strength.

具體而言,玻璃片12之厚度較佳為1μm以上,更佳為10μm以上。 Specifically, the thickness of the glass piece 12 is preferably 1 μm or more, and more preferably 10 μm or more.

玻璃片12以提昇樹脂層14之接著力等為目的,亦可為於形成樹脂層14之前對樹脂層14之形成面實施表面處理者。 The glass sheet 12 may be used to lift the adhesion of the resin layer 14 or the like, or may be subjected to surface treatment on the surface on which the resin layer 14 is formed before the resin layer 14 is formed.

作為表面處理,可例示底塗處理、臭氧處理、電漿蝕刻處理等。作為底塗,可例示矽烷偶合劑。作為矽烷偶合劑,可例示胺基矽烷類、環氧矽烷類、烷氧基矽烷類、矽氮烷類等。 As the surface treatment, a primer treatment, an ozone treatment, a plasma etching treatment, or the like can be exemplified. As the primer, a decane coupling agent can be exemplified. Examples of the decane coupling agent include amino decanes, epoxy decanes, alkoxy decanes, and decazanes.

於初始複合體10a(即,製造之複合體10),於玻璃片12之表面形成樹脂層14。 The resin layer 14 is formed on the surface of the glass piece 12 in the initial composite 10a (i.e., the manufactured composite 10).

樹脂層14係含有各種樹脂材料之層(膜)。再者,圖1所示之初始複合體10a係樹脂層14由1層形成,但只要合計之厚度為1~100μm,則樹脂層14亦可由複數層形成。又,於由複數層形成樹脂層14時,全部層可由相同之材料形成,亦可混合存在含有不同材料之層。進而,於由複數層形成樹脂層14時,各層之厚度可相同亦可不同。 The resin layer 14 is a layer (film) containing various resin materials. Further, the initial composite body 10a-based resin layer 14 shown in Fig. 1 is formed of one layer, but the resin layer 14 may be formed of a plurality of layers as long as the total thickness is 1 to 100 μm. Further, when the resin layer 14 is formed of a plurality of layers, all of the layers may be formed of the same material, or a layer containing different materials may be mixed. Further, when the resin layer 14 is formed of a plurality of layers, the thickness of each layer may be the same or different.

再者,圖1所示之初始複合體10a係於玻璃片12之整個表面形成樹 脂層14,但只要為具有與製造之複合體10之尺寸或形狀相應之充分之面積者,則樹脂層14亦可不形成於玻璃片12之整個表面。 Furthermore, the initial composite 10a shown in FIG. 1 is formed on the entire surface of the glass sheet 12 to form a tree. The lipid layer 14 may not be formed on the entire surface of the glass sheet 12 as long as it has a sufficient area corresponding to the size or shape of the composite 10 to be manufactured.

此處,於本發明之製造方法中,樹脂層14之厚度為1~100μm,且距與玻璃片12之界面於法線方向之距離為0~0.5μm之區域之楊氏模數為100MPa以上。又,樹脂層14係以180°剝離強度為1N/25mm以上之接著力接著於玻璃片12。 Here, in the manufacturing method of the present invention, the resin layer 14 has a thickness of 1 to 100 μm, and a Young's modulus of a region of 0 to 0.5 μm from the interface with the glass sheet 12 in the normal direction is 100 MPa or more. . Further, the resin layer 14 is bonded to the glass piece 12 with an adhesive force of 180° peeling strength of 1 N/25 mm or more.

本發明係使用於玻璃片12之表面形成有此種樹脂層14之初始複合體10a,自樹脂層14側於玻璃片12形成劃線18,而進行初始複合體10a之切割,藉此,即便於玻璃片12較薄之情形時,亦可抑制於切割時玻璃片12所產生之破裂於玻璃片12之主面上擴大,可穩定地製造具有所需尺寸或形狀、且玻璃片12之破裂經抑制之具有玻璃片12之複合體10。關於此方面,於以下進行詳細敍述。 In the present invention, the initial composite 10a in which the resin layer 14 is formed on the surface of the glass sheet 12 is used, and the scribe line 18 is formed on the glass sheet 12 from the resin layer 14 side, and the initial composite 10a is cut, whereby even When the glass sheet 12 is thin, it is also possible to suppress the crack generated by the glass sheet 12 from being enlarged on the main surface of the glass sheet 12 during cutting, and to stably produce a desired size or shape and to rupture the glass sheet 12. The composite 10 having the glass flakes 12 is inhibited. This aspect will be described in detail below.

樹脂層14可由公知之各種樹脂材料(高分子材料)形成。例如,熱塑性樹脂及熱固性樹脂均可。 The resin layer 14 can be formed of various known resin materials (polymer materials). For example, both a thermoplastic resin and a thermosetting resin can be used.

作為熱固性樹脂,可例示:聚醯亞胺(PI)、環氧樹脂(EP)等。作為熱塑性樹脂,可例示:聚醯胺(PA)、聚醯胺醯亞胺(PAI)、聚醚醚酮(PEEK)、聚苯并咪唑(PBI)、聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚醚碸(PES)、環狀聚烯烴(COP)、聚碳酸酯(PC)、聚氯乙烯(PVC)、聚乙烯(PE)、聚丙烯(PP)、丙烯酸樹脂(PMMA)、胺基甲酸酯(PU)等。 Examples of the thermosetting resin include polyimine (PI), epoxy resin (EP), and the like. As the thermoplastic resin, polyamine (PA), polyamidoximine (PAI), polyetheretherketone (PEEK), polybenzimidazole (PBI), polyethylene terephthalate (PET) can be exemplified. ), polyethylene naphthalate (PEN), polyether oxime (PES), cyclic polyolefin (COP), polycarbonate (PC), polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), acrylic resin (PMMA), urethane (PU), and the like.

又,樹脂層14可由光硬化性樹脂形成,亦可為共聚物或混合物。 Further, the resin layer 14 may be formed of a photocurable resin, or may be a copolymer or a mixture.

利用複合體10(積層體30)之電子裝置之製造步驟有時包括伴有加熱處理之步驟。因此,形成樹脂層14之樹脂材料之耐熱溫度(可連續使用之溫度)較佳為100℃以上。 The manufacturing steps of the electronic device using the composite 10 (the laminated body 30) sometimes include the step accompanied by the heat treatment. Therefore, the heat resistant temperature (temperature at which continuous use) of the resin material forming the resin layer 14 is preferably 100 ° C or higher.

作為耐熱溫度為100℃以上之樹脂,可例示:聚醯亞胺(PI)、環氧樹脂(EP)、聚醯胺(PA)、聚醯胺醯亞胺(PAI)、聚醚醚酮(PEEK)、聚苯 并咪唑(PBI)、聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚醚碸(PES)、環狀聚烯烴(COP)、聚碳酸酯(PC)、聚氯乙烯(PVC)、丙烯酸樹脂(PMMA)、胺基甲酸酯(PU)等。 Examples of the resin having a heat resistance temperature of 100 ° C or higher include polyimine (PI), epoxy resin (EP), polyamine (PA), polyamidamine (PAI), and polyether ether ketone ( PEEK), polystyrene Imidazole (PBI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether oxime (PES), cyclic polyolefin (COP), polycarbonate (PC) , polyvinyl chloride (PVC), acrylic resin (PMMA), urethane (PU) and the like.

樹脂層14可僅由樹脂材料形成,或者亦可含有填料等。 The resin layer 14 may be formed only of a resin material, or may contain a filler or the like.

作為填料,可例示纖維狀、或者板狀、鱗片狀、粒狀、不規則形狀、破碎品等非纖維狀之填充劑。 As the filler, a non-fibrous filler such as a fiber or a plate, a scale, a pellet, an irregular shape, or a crushed product can be exemplified.

具體而言,可例示:玻璃纖維、PAN(Polyacrylonitrile,聚丙烯腈)系或瀝青系碳纖維、不鏽鋼纖維、鋁纖維或黃銅纖維等金屬纖維、芳香族聚醯胺纖維等有機纖維、石膏纖維、陶瓷纖維、石棉纖維、氧化鋯纖維、氧化鋁纖維、氧化矽纖維、氧化鈦纖維、碳化矽纖維、岩絨、鈦酸鉀晶鬚、鈦酸鋇晶鬚、硼酸鋁晶鬚、氮化矽晶鬚、雲母、滑石、高嶺土、氧化矽、碳酸鈣、玻璃珠、玻璃碎片、玻璃微球、黏土、二硫化鉬、矽灰石、氧化鈦、氧化鋅、聚磷酸鈣、石墨、金屬粉、金屬碎片、金屬帶、金屬氧化物、碳粉末、黑鉛、碳碎片、鱗片狀碳、奈米碳管等。作為金屬粉、金屬碎片、金屬帶及金屬氧化物之金屬種之具體例,可例示:銀、鎳、銅、鋅、鋁、不鏽鋼、鐵、黃銅、鉻、錫等。玻璃纖維或碳纖維之種類只要為通常樹脂之強化用所使用者則無特別限定,例如可使用選自長纖維型或短纖維型之切股、磨碎纖維等中者。又,樹脂層14亦可含有含浸有樹脂之織布、不織布等。 Specific examples thereof include glass fibers, PAN (Polyacrylonitrile) or pitch-based carbon fibers, stainless steel fibers, metal fibers such as aluminum fibers or brass fibers, organic fibers such as aromatic polyamide fibers, and gypsum fibers. Ceramic fiber, asbestos fiber, zirconia fiber, alumina fiber, yttria fiber, titanium oxide fiber, tantalum carbide fiber, rock wool, potassium titanate whisker, barium titanate whisker, aluminum borate whisker, tantalum nitride Whiskers, mica, talc, kaolin, strontium oxide, calcium carbonate, glass beads, glass shards, glass microspheres, clay, molybdenum disulfide, ash, titanium oxide, zinc oxide, calcium polyphosphate, graphite, metal powder, metal Debris, metal strips, metal oxides, carbon powder, black lead, carbon fragments, scaly carbon, carbon nanotubes, etc. Specific examples of the metal powder, metal fragments, metal strips, and metal oxides include silver, nickel, copper, zinc, aluminum, stainless steel, iron, brass, chromium, tin, and the like. The type of the glass fiber or the carbon fiber is not particularly limited as long as it is used for the reinforcement of a general resin. For example, a strand selected from a long fiber type or a short fiber type, a ground fiber, or the like can be used. Further, the resin layer 14 may contain a woven fabric impregnated with a resin, a non-woven fabric, or the like.

樹脂層14只要利用適合樹脂層14之形成材料的公知之方法形成即可。 The resin layer 14 may be formed by a known method suitable for forming a material of the resin layer 14.

例如,樹脂層14於玻璃片12之表面塗佈含有形成樹脂層14之成分之液狀組成物(塗料)並使其硬化而形成即可。 For example, the resin layer 14 may be formed by applying a liquid composition (coating material) containing a component forming the resin layer 14 to the surface of the glass sheet 12 and hardening it.

或者,樹脂層14亦可於玻璃片12貼附形成樹脂層14之樹脂膜而形成。再者,於在玻璃片12貼附樹脂膜而形成樹脂層14之情形時,視需要亦可使用接著劑於玻璃片12貼附樹脂膜。再者,於此情形時,將接 著劑層亦視為樹脂層14之一部分,作為亦包含接著劑層之含有複數層之樹脂層14,必須滿足楊氏模數等條件。 Alternatively, the resin layer 14 may be formed by attaching a resin film forming the resin layer 14 to the glass sheet 12. In the case where the resin film 14 is formed by attaching a resin film to the glass sheet 12, a resin film may be attached to the glass sheet 12 by using an adhesive as needed. Furthermore, in this case, it will be connected The primer layer is also regarded as a part of the resin layer 14, and as the resin layer 14 including the plurality of layers also including the adhesive layer, it is necessary to satisfy the Young's modulus and the like.

又,樹脂層14亦可為於玻璃片12之表面形成包含成為樹脂層14之樹脂材料之前軀物的層(膜),對該含有前軀物之層實施熱處理、電子束照射、紫外線照射等處理,藉此製成含有目標之樹脂材料之樹脂層14。再者,關於該樹脂層14之形成方法,含有前軀物之層可於玻璃片12之表面塗佈液狀組成物並乾燥(或者進而硬化)而形成,或者亦可於玻璃片12之表面貼附膜狀物而形成(視需要亦可使用接著劑)。 Further, the resin layer 14 may be formed by forming a layer (film) including a front material of the resin material of the resin layer 14 on the surface of the glass sheet 12, and performing heat treatment, electron beam irradiation, ultraviolet irradiation, or the like on the layer containing the precursor. The treatment is carried out to thereby form a resin layer 14 containing a target resin material. Further, in the method of forming the resin layer 14, the layer containing the precursor may be formed by applying a liquid composition on the surface of the glass sheet 12 and drying (or hardening), or may be on the surface of the glass sheet 12. It is formed by attaching a film (and an adhesive may be used as needed).

再者,本發明之複合體(積層體)之製造方法亦可包括於上述玻璃片12形成該樹脂層14之步驟(或者進而進行上述表面處理之步驟)。 Furthermore, the method for producing the composite (layered body) of the present invention may also include the step of forming the resin layer 14 on the glass sheet 12 (or the step of performing the surface treatment described above).

本發明之複合體之製造方法如圖1(B)概念性地所示般,於此種初始複合體10a之玻璃片12對應於製造之複合體10之尺寸或形狀,形成用以進行切割之劃線18。如上所述,由於初始複合體10a為矩形,故而劃線18沿垂直於紙面之方向延伸。 The manufacturing method of the composite of the present invention is conceptually shown in Fig. 1(B), and the glass sheet 12 of the initial composite 10a is formed to be cut for the size or shape of the composite 10 to be manufactured. Line 18. As described above, since the initial composite body 10a is rectangular, the scribe line 18 extends in a direction perpendicular to the paper surface.

此處,於玻璃片12形成之劃線18係自樹脂層14側形成。即,將切割器20抵觸於樹脂層14,貫通(切割)樹脂層14,而於玻璃片12形成劃線18。換言之,於對玻璃片12形成劃線18之同時對樹脂層14進行切割。 Here, the scribe line 18 formed on the glass piece 12 is formed from the resin layer 14 side. That is, the cutter 20 is in contact with the resin layer 14, and the resin layer 14 is penetrated (cut), and the scribe line 18 is formed in the glass sheet 12. In other words, the resin layer 14 is cut while forming the scribe line 18 to the glass sheet 12.

藉由同時進行樹脂層14之切割與劃線18之形成,而如專利文獻2所示之方法般,無需進行樹脂層14之切割與劃線18之形成這兩個步驟,又,亦無需進行樹脂層14之切割位置與劃線18之形成位置之對位。 By performing the cutting of the resin layer 14 and the formation of the scribe lines 18 at the same time, as in the method of Patent Document 2, the two steps of cutting the resin layer 14 and forming the scribe line 18 are not required, and it is also unnecessary. The cutting position of the resin layer 14 is aligned with the formation position of the scribe line 18.

進而,於製造成之複合體10,可良好地使樹脂層14之切割面與玻璃片12之切割面一致(可使兩切割面為同一面)。 Further, in the composite 10 manufactured, the cut surface of the resin layer 14 can be satisfactorily matched with the cut surface of the glass sheet 12 (the both cut surfaces can be the same surface).

劃線18之形成係利用對玻璃片12及樹脂層14貫通樹脂層14而可形成劃線18之公知之方法即可。作為一例,可例示使用樹脂用之各種切割器或玻璃用之各種切割器之方法。 The formation of the scribe line 18 may be a known method in which the scribe line 18 is formed by penetrating the glass sheet 12 and the resin layer 14 through the resin layer 14. As an example, a method of using various cutters for resins or various cutters for glass can be exemplified.

再者,如下所述,本發明之複合體(積層體)之製造方法中,於玻 璃片12之表面具有特定之樹脂層14。因此,即便於劃線18(玻璃片12之劃線18之形成位置)存在較多之碎屑等缺陷,於進行切割時亦可抑制玻璃片12所產生之破裂於玻璃片12之主面上擴大。因此,本發明之製造方法中,並非必須考慮於劃線18產生碎屑等情況,因此,劃線18之形成亦可利用廉價之切割器20等進行。 Furthermore, as described below, in the method for producing the composite (layered body) of the present invention, The surface of the glass sheet 12 has a specific resin layer 14. Therefore, even if the scribe line 18 (the position where the scribe line 18 of the glass piece 12 is formed) has many defects such as chips, the rupture of the glass piece 12 can be suppressed from being broken on the main surface of the glass piece 12 at the time of cutting. expand. Therefore, in the manufacturing method of the present invention, it is not necessary to consider the occurrence of debris or the like in the scribe line 18, and therefore, the formation of the scribe line 18 can be performed by using the inexpensive cutter 20 or the like.

關於劃線18之寬度(與線之延伸方向正交之方向之尺寸)、或劃線18之深度,與通常之玻璃片(玻璃板)之切割同樣地根據玻璃片12之厚度、形成材料等而適當設定可確實地切割玻璃片12之寬度及深度即可。 The width of the scribe line 18 (the dimension in the direction orthogonal to the direction in which the line extends) or the depth of the scribe line 18 is the same as the thickness of the glass piece 12, the material to be formed, etc., similarly to the cutting of a normal glass piece (glass plate). The width and depth of the glass sheet 12 can be surely cut by an appropriate setting.

如圖1(B)所示,於初始複合體10a之玻璃片12形成劃線18後,如圖1(C)概念性地所示般,以對玻璃片12之樹脂層14側之面施加拉伸應力之方式使初始複合體10a彎折。藉此,以劃線18為起點使玻璃片12斷裂而切割初始複合體10a,如圖1(D)概念性地所示般,形成目標之尺寸或形狀之複合體10。即,藉由以樹脂層14側凸起之方式使初始複合體10a彎折,而以劃線18為起點使玻璃片12斷裂而切割玻璃片12,從而形成目標之尺寸或形狀之複合體10。 As shown in Fig. 1(B), after the scribe line 18 is formed on the glass piece 12 of the initial composite 10a, as shown conceptually in Fig. 1(C), the surface of the glass sheet 12 on the resin layer 14 side is applied. The manner in which the stress is stretched causes the initial composite 10a to be bent. Thereby, the glass piece 12 is broken by the scribe line 18 as a starting point, and the initial composite body 10a is cut, and the composite body 10 of the target size or shape is formed as conceptually shown in FIG. In other words, the initial composite body 10a is bent by the resin layer 14 side, and the glass sheet 12 is cut by the scribe line 18 as a starting point to cut the glass piece 12, thereby forming the target size or shape of the composite body 10. .

此處,根據本發明之複合體(積層體)之製造方法,即便於玻璃片12較薄之情形、或於劃線18存在大量碎屑之情形時,亦可防止初始複合體10a之切割時所產生之玻璃片12之破裂(龜裂)於玻璃片12之主面上擴大(擴散/擴展)。 Here, according to the method for producing a composite body (layered body) of the present invention, even when the glass piece 12 is thin, or when a large amount of debris is present in the scribe line 18, the cutting of the initial composite body 10a can be prevented. The crack (crack) of the produced glass piece 12 is enlarged (diffusion/expansion) on the main surface of the glass piece 12.

如上所述,藉由利用於玻璃片12形成樹脂層而成之複合體,而謀求薄膜化或輕量化,而且,即便於遭受彎曲等變形時亦可防止玻璃片12之破裂,可製造可撓性優異之電子裝置。 As described above, the composite formed by forming the resin layer on the glass sheet 12 is thinned or lightened, and the glass sheet 12 can be prevented from being broken even when subjected to deformation such as bending. Excellent electronic device.

此處,複合體通常係對較目標複合體更大之初始複合體進行切割而製成所需尺寸或形狀之複合體。作為切割方法,考慮如下方法:切割樹脂層,進而,與該切割線吻合而於玻璃片12形成劃線,從而切割玻璃片12。然而,該方法必須進行兩次切割處理,且切割位置之位置 對齊等耗費時間。又,先前之方法中,於切割玻璃片12時,因劃線之碎屑等而產生之玻璃片12之破裂於玻璃片12之主面上擴大,多數情形時,複合體會具有玻璃片12之破裂等缺陷。尤其是該破裂於玻璃片12較薄之情形時容易產生。 Here, the composite is typically formed by cutting a larger initial composite than the target composite to form a composite of the desired size or shape. As the cutting method, a method of cutting the resin layer and further forming a scribe line on the glass piece 12 in accordance with the dicing line is considered, thereby cutting the glass piece 12. However, the method must perform two cutting processes and the position of the cutting position It takes time to align. Further, in the prior method, when the glass piece 12 is cut, the rupture of the glass piece 12 due to the swarf debris or the like is enlarged on the main surface of the glass piece 12, and in many cases, the composite body has the glass piece 12 Defects such as rupture. In particular, the crack is likely to occur when the glass sheet 12 is thin.

另一方面,作為無需費事進行位置對齊等之所需形狀之複合體之製造方法(切割方法),考慮如專利文獻3所示之藉由穿過樹脂層形成劃線18而同時進行劃線18之形成與樹脂層之切割的方法。 On the other hand, as a manufacturing method (cutting method) of a composite body having a desired shape such as position alignment or the like, it is conceivable to simultaneously perform scribing by forming a scribe line 18 through a resin layer as shown in Patent Document 3. A method of forming 18 and cutting a resin layer.

然而,於伴隨著樹脂層之切割而於玻璃片12形成劃線18之情形時,劃線18之形成必需一定程度之力,施加於切割器20之力亦會施加至玻璃片12。因此,於劃線18產生大量碎屑等缺陷。先前之方法中,若如上述般對存在大量碎屑之玻璃片12進行切割(斷裂),則起因於該碎屑等缺陷而於玻璃片12產生大量破裂,且該破裂會擴大至玻璃片12之主面之內側。其結果,所獲得之複合體成為具有玻璃片12破裂之缺陷之複合體。此種破裂之產生尤其是於玻璃片12較薄之情形時會顯著發生。 However, in the case where the scribe line 18 is formed in the glass sheet 12 along with the cutting of the resin layer, the formation of the scribe line 18 requires a certain degree of force, and the force applied to the cutter 20 is also applied to the glass sheet 12. Therefore, a large amount of defects such as debris are generated in the scribe line 18. In the prior method, if the glass sheet 12 having a large amount of chips is cut (broken) as described above, a large amount of cracks are generated in the glass sheet 12 due to defects such as the chips, and the crack is expanded to the glass sheet 12. The inner side of the main face. As a result, the obtained composite becomes a composite having defects in which the glass piece 12 is broken. Such cracking occurs particularly when the glass sheet 12 is thin.

相對於此,本發明之製造方法中,初始複合體10a(即複合體10)之樹脂層14係厚度為1~100μm,且距與玻璃片12之界面於法線方向之距離為0~0.5μm之區域之楊氏模數為100MPa以上。進而,又,樹脂層14係以180°剝離強度為1N/25mm以上之接著力接著於玻璃片12。 On the other hand, in the manufacturing method of the present invention, the resin layer 14 of the initial composite 10a (that is, the composite 10) has a thickness of 1 to 100 μm, and the distance from the interface with the glass sheet 12 in the normal direction is 0 to 0.5. The Young's modulus of the region of μm is 100 MPa or more. Further, the resin layer 14 is bonded to the glass piece 12 with an adhesive force of 180° peeling strength of 1 N/25 mm or more.

藉此,於切割初始複合體10a時(以劃線18為起點之玻璃片12之斷裂時),即便於玻璃片12產生破裂,且對玻璃片12施加應力,於玻璃片12以較高之接著力接著之高彈性樹脂層14亦可防止因應力而破裂擴大之情況。因此,可抑制玻璃片12所產生之破裂於玻璃片12之主面上擴大。 Thereby, when the initial composite 10a is cut (when the glass piece 12 starting from the scribe line 18 is broken), even if the glass piece 12 is broken and stress is applied to the glass piece 12, the glass piece 12 is higher. Then, the high elastic resin layer 14 is further prevented from being broken and expanded due to stress. Therefore, it is possible to suppress the crack generated by the glass sheet 12 from being enlarged on the main surface of the glass sheet 12.

又,藉由具有此種樹脂層14,而可防止於未形成劃線18之位置施加不必需之應力而使玻璃片12破裂。因此,本發明之複合體之製造方 法中,亦可形成圓形等不規則形之複合體。 Further, by having such a resin layer 14, it is possible to prevent the glass sheet 12 from being broken by applying unnecessary stress to a position where the scribe line 18 is not formed. Therefore, the manufacturer of the composite of the present invention In the method, a complex such as a circular shape or the like can also be formed.

因此,根據本發明之複合體之製造方法,可穩定地製造具有所需尺寸或形狀、且玻璃片12之破裂經抑制之複合體10(即,於玻璃片12之有效區域無破裂之複合體10)。 Therefore, according to the method for producing a composite of the present invention, the composite 10 having the desired size or shape and the crack of the glass sheet 12 can be stably produced (i.e., the composite having no crack in the effective region of the glass sheet 12) can be stably produced. 10).

於本發明之製造方法中,樹脂層14之厚度為1~100μm。 In the manufacturing method of the present invention, the resin layer 14 has a thickness of 1 to 100 μm.

若樹脂層14之厚度未達1μm,則無法獲得具有樹脂層14之效果,會產生如下不良情況:於初始複合體10a形成劃線18時玻璃片12破裂,且破裂擴大,於切割時(斷裂時)亦於劃線18以外之區域產生破裂等。 If the thickness of the resin layer 14 is less than 1 μm, the effect of having the resin layer 14 cannot be obtained, and there is a problem that the glass sheet 12 is broken when the scribe line 18 is formed in the initial composite body 10a, and the crack is enlarged, and at the time of cutting (breaking) At the time), cracks and the like are also generated in areas other than the scribe line 18.

又,若樹脂層14之厚度超過100μm,則無法獲得具有良好可撓性之複合體10,無法充分地響應薄膜化或輕量化之要求,產生難以形成劃線18等不良情況。 In addition, when the thickness of the resin layer 14 exceeds 100 μm, the composite 10 having good flexibility cannot be obtained, and it is not possible to sufficiently respond to the request for thinning or weight reduction, and it is difficult to form the scribe line 18 or the like.

又,就可更佳地抑制玻璃片12之破裂、可獲得具有良好可撓性之複合體10、可較佳地謀求複合體之輕量化或薄膜化等方面而言,樹脂層14之厚度較佳為10~50μm。 Further, the thickness of the resin layer 14 can be more preferably suppressed by suppressing cracking of the glass sheet 12, obtaining the composite 10 having good flexibility, and preferably reducing the weight or film formation of the composite. Good for 10~50μm.

樹脂層14之距與玻璃片12之界面於法線方向(與界面正交之方向)之距離為0~0.5μm之區域(即,玻璃片12側之厚度為0.5μm以下之區域)之楊氏模數(以下,亦簡稱為『樹脂層14之楊氏模數』)為100MPa以上。 The distance between the distance between the resin layer 14 and the interface of the glass sheet 12 in the normal direction (the direction orthogonal to the interface) is 0 to 0.5 μm (that is, the region on the side of the glass sheet 12 having a thickness of 0.5 μm or less). The modulus (hereinafter also referred to as "the Young's modulus of the resin layer 14") is 100 MPa or more.

若樹脂層14之楊氏模數未達100MPa,則於初始複合體10a之切割時會產生玻璃片12之破裂擴大等不良情況。 When the Young's modulus of the resin layer 14 is less than 100 MPa, problems such as cracking of the glass piece 12 may occur during the dicing of the initial composite 10a.

就可更佳地抑制玻璃片12之破裂等方面而言,樹脂層14之楊氏模數較佳為1000MPa以上。 The Young's modulus of the resin layer 14 is preferably 1000 MPa or more in terms of suppressing the breakage of the glass piece 12 and the like.

樹脂層14之楊氏模數之上限並無限定。此處,若考慮不降低可撓性(不提昇彎曲剛性)等,則樹脂層14之楊氏模數較佳為50000MPa以下,更佳為10000MPa以下。 The upper limit of the Young's modulus of the resin layer 14 is not limited. Here, the Young's modulus of the resin layer 14 is preferably 50,000 MPa or less, and more preferably 10,000 MPa or less, in consideration of not reducing flexibility (not increasing bending rigidity).

樹脂層14之楊氏模數利用依據JIS K 7127:1999之方法測定即可。 The Young's modulus of the resin layer 14 may be measured by a method in accordance with JIS K 7127:1999.

又,於樹脂層14(該玻璃片12側之厚度0.5μm以下之區域)包含複數(n個)層之情形時,樹脂層14之楊氏模數E(楊氏模數E)利用下述式(1)計算即可。 In the case where the resin layer 14 (the region having a thickness of 0.5 μm or less on the side of the glass piece 12) contains a plurality of (n) layers, the Young's modulus E (Young's modulus E) of the resin layer 14 is as follows. Equation (1) can be calculated.

E=Σ(Ek×Ik)/I...(1) E=Σ(E k ×I k )/I. . . (1)

Ek:第k層之材料之楊氏模數 E k : Young's modulus of the material of the kth layer

Ik:第k層之斷面二次矩 I k : the second moment of the section of the kth layer

k:1~n之整數 k: an integer from 1 to n

I:樹脂層14之玻璃片12側之厚度0~0.5μm之區域之斷面二次矩 I: the second moment of the section of the glass sheet 12 side of the resin layer 14 having a thickness of 0 to 0.5 μm

如式(1)所明示般,即便於將樹脂層14藉由接著劑而接著於玻璃片12之情形時,且於接著劑較樹脂層14柔軟之情形時,接著劑層之厚度只要足夠薄(例如只要為100nm以下),則樹脂層14之楊氏模數成為100MPa以上。 As is apparent from the formula (1), even when the resin layer 14 is followed by the glass sheet 12 by the adhesive, and the adhesive is softer than the resin layer 14, the thickness of the adhesive layer is sufficiently thin. (For example, if it is 100 nm or less), the Young's modulus of the resin layer 14 becomes 100 MPa or more.

於本發明之製造方法中,樹脂層14係以180°剝離強度為1N/25mm以上之接著力(以下,亦簡稱為『樹脂層14之接著力』)接著於玻璃片12。 In the manufacturing method of the present invention, the resin layer 14 is bonded to the glass sheet 12 with an adhesive force of 180° peeling strength of 1 N/25 mm or more (hereinafter, simply referred to as “adhesion force of the resin layer 14”).

若樹脂層14之接著力未達1N/25mm,則會產生如下不良情況:於切割初始複合體10a時玻璃片12之破裂擴大,或於切割初始複合體10a時於玻璃片12產生破裂等。 If the adhesive force of the resin layer 14 is less than 1 N/25 mm, there is a problem that the crack of the glass sheet 12 is enlarged when the initial composite 10a is cut, or cracking occurs in the glass sheet 12 when the initial composite 10a is cut.

就可更佳地抑制玻璃片12之破裂等方面而言,樹脂層14之接著力較佳為3N/25mm以上,更佳為5N/25mm以上。 The adhesive force of the resin layer 14 is preferably 3 N/25 mm or more, and more preferably 5 N/25 mm or more, in terms of suppressing the rupture of the glass piece 12 and the like.

又,樹脂層14之接著力之上限並無限定。 Further, the upper limit of the adhesion of the resin layer 14 is not limited.

再者,樹脂層14之接著力(180°剝離強度)依據JIS K 6854:1999測定即可。 Further, the adhesion force (180° peel strength) of the resin layer 14 may be measured in accordance with JIS K 6854:1999.

如此被製造成所需尺寸及形狀的本發明之複合體10如上述般,可用作例如PV、LCD、OLED等電子裝置之基板。 The composite 10 of the present invention thus manufactured to a desired size and shape can be used as a substrate of an electronic device such as PV, LCD, or OLED, as described above.

圖2概念性地表示本發明之積層體之製造方法之一例。 Fig. 2 conceptually shows an example of a method of producing a laminated body of the present invention.

本發明之積層體之製造方法係對在上述包含玻璃片12與樹脂層14之初始複合體10a積層第2玻璃片34而成之初始積層體30a(複合體之積層體)進行切割,而製造所需尺寸或形狀之積層體30。再者,於圖2所示之例中,初始複合體10a及第2玻璃片34之主面之形狀作為一例為矩形。 In the method for producing a laminate according to the present invention, the initial laminate 30a (the laminate of the composite) obtained by laminating the second glass sheet 34 including the initial composite 10a of the glass sheet 12 and the resin layer 14 is cut and manufactured. A laminate 30 of the desired size or shape. In the example shown in FIG. 2, the shape of the main surface of the initial composite 10a and the second glass piece 34 is rectangular as an example.

此處,如圖2(A)概念性地所示般,於本發明之積層體之製造方法中,第2玻璃片34係積層於樹脂層14(以玻璃片12與第2玻璃片34夾著樹脂層14)。進而,第2玻璃片34之尺寸小於樹脂層14(第2玻璃片34之主面之面積小於樹脂層14之主面之面積),且以第2玻璃片34之主面之外周內包於樹脂層14之主面之外周之方式積層。 Here, as shown conceptually in FIG. 2(A), in the method of manufacturing a laminated body of the present invention, the second glass piece 34 is laminated on the resin layer 14 (the glass piece 12 and the second glass piece 34 are sandwiched). The resin layer 14). Further, the size of the second glass piece 34 is smaller than that of the resin layer 14 (the area of the main surface of the second glass piece 34 is smaller than the area of the main surface of the resin layer 14), and is wrapped in the outer periphery of the main surface of the second glass piece 34. The outer surface of the main surface of the resin layer 14 is laminated.

再者,以下之積層體之製造方法中,使用與上述複合體之製造方法相同之構件,故而對相同構件標註相同符號,主要對不同方面進行說明。 In the following methods for manufacturing a laminate, the same members as those of the above-described composite are used. Therefore, the same members are denoted by the same reference numerals, and the different aspects will be mainly described.

於本發明之積層體之製造方法中,初始複合體10a係與上述圖1所示之初始複合體10a相同者。初始積層體30a係於此種初始複合體10a積層第2玻璃片34並貼附(接著)而成者。因此,初始複合體10a之玻璃片12成為本發明之積層體之製造方法中之第1玻璃片。 In the method for producing a laminate according to the present invention, the initial composite 10a is the same as the initial composite 10a shown in Fig. 1 described above. The initial laminated body 30a is formed by laminating the second glass piece 34 in the initial composite body 10a and attaching it (subsequently). Therefore, the glass piece 12 of the initial composite 10a becomes the first glass piece in the manufacturing method of the laminated body of this invention.

本發明之積層體之製造方法中,沿著第2玻璃片34之主面之外周切割初始複合體10a,而製造所需尺寸及形狀之積層體30。因此,第2玻璃片34之尺寸及形狀與製造之積層體30之尺寸及形狀相同。 In the method for producing a laminated body according to the present invention, the initial composite 10a is cut along the outer periphery of the main surface of the second glass piece 34 to produce a laminated body 30 having a desired size and shape. Therefore, the size and shape of the second glass piece 34 are the same as those of the laminated body 30 to be manufactured.

第2玻璃片34之玻璃亦與上述玻璃片12同樣地可利用公知之各種玻璃,進而,可利用由公知之方法製造而成者。 Similarly to the above-described glass sheet 12, the glass of the second glass sheet 34 can be made of various known glass, and can be produced by a known method.

再者,製造成之積層體30於利用於進行熱處理等伴有加熱之步驟之用途之情形時,第2玻璃片34較佳為由與玻璃片12線膨脹係數之差較小之材料形成,更佳為由與玻璃片12相同之材料形成。 Further, in the case where the laminated body 30 to be produced is used for the purpose of performing a heating step such as heat treatment, the second glass sheet 34 is preferably formed of a material having a small difference from the linear expansion coefficient of the glass sheet 12. More preferably, it is formed of the same material as the glass piece 12.

第2玻璃片34之厚度為適合製造之積層體30之用途之厚度即可。 因此,第2玻璃片34之厚度可與玻璃片12相同,亦可較玻璃片12厚或薄。 The thickness of the second glass piece 34 may be a thickness suitable for the use of the laminated body 30 to be manufactured. Therefore, the thickness of the second glass piece 34 can be the same as that of the glass piece 12, or can be thicker or thinner than the glass piece 12.

作為一例,由本發明之製造方法獲得之積層體30可利用於製造以玻璃片12作為基板(形成有元件之基板(元件基板))之PV、LCD、OLED等電子裝置。此時,第2玻璃片34較佳為作為支持形成有元件之較薄之玻璃片12、並可進行適當處理之支持基材(載體基板)而發揮作用。因此,此時,第2玻璃片34之厚度較佳為0.2~1mm,更佳為0.4~0.7mm。 As an example, the laminated body 30 obtained by the manufacturing method of the present invention can be used for manufacturing an electronic device such as PV, LCD, or OLED using the glass piece 12 as a substrate (a substrate (element substrate) on which an element is formed). At this time, the second glass piece 34 preferably functions as a supporting substrate (carrier substrate) which can support the thin glass piece 12 in which the element is formed and can be appropriately processed. Therefore, at this time, the thickness of the second glass piece 34 is preferably 0.2 to 1 mm, more preferably 0.4 to 0.7 mm.

於初始積層體30a之樹脂層14接著第2玻璃片34之方法可利用適合樹脂層14之形成材料的公知之各種方法。 The method of adhering the resin layer 14 of the initial laminated body 30a to the second glass sheet 34 can be carried out by various known methods suitable for forming the material of the resin layer 14.

作為一例,可例示使用接著劑之方法、利用真空加熱積層之方法等。 As an example, a method of using an adhesive, a method of laminating by vacuum heating, or the like can be exemplified.

再者,第2玻璃片34以提昇接著力等為目的,亦可於積層於樹脂層14之前於表面施加表面處理。作為第2玻璃片34之表面處理,可例示先前玻璃片12之說明中所例示之各種表面處理。 Further, the second glass piece 34 may be subjected to a surface treatment on the surface before the resin layer 14 is laminated for the purpose of improving the adhesion. As the surface treatment of the second glass piece 34, various surface treatments exemplified in the description of the previous glass piece 12 can be exemplified.

再者,樹脂層14與第2玻璃片34可確保充分之接著力、並且視需要以樹脂層14與第2玻璃片34可剝離之方式接著。 Further, the resin layer 14 and the second glass sheet 34 can ensure sufficient adhesion and, if necessary, the resin layer 14 and the second glass sheet 34 can be peeled off.

再者,本發明之積層體之製造方法亦可包括於初始複合體10a積層第2玻璃片34之步驟(或者,進而進行上述表面處理之步驟)。 Furthermore, the method for producing a laminate according to the present invention may include the step of laminating the second glass sheet 34 in the initial composite 10a (or the step of performing the surface treatment described above).

如圖2(B)概念性地所示般,本發明之積層體之製造方法係於此種初始積層體30a沿著第2玻璃片34之主面之外周(外邊)(模仿第2玻璃片34之主面之外周)藉由切割器20形成用於進行切割之劃線18。如上述般,由於初始複合體10a為矩形,故而劃線18沿與紙面垂直之方向延伸。 As shown conceptually in FIG. 2(B), the method for producing a laminated body according to the present invention is such that the initial laminated body 30a is along the outer periphery (outer side) of the main surface of the second glass piece 34 (imitation of the second glass piece) The outer circumference of the main surface of 34 is formed by the cutter 20 to form a scribe line 18 for cutting. As described above, since the initial composite body 10a has a rectangular shape, the scribe line 18 extends in a direction perpendicular to the paper surface.

此處,與圖1所示之複合體之製造方法同樣地,即便為本發明之積層體之製造方法,亦將切割器20抵觸於樹脂層14,貫通(切割)樹脂層14而於玻璃片12形成劃線18。即,於對玻璃片12形成劃線18之同時進行樹脂層14之切割。該劃線18之形成與圖1所示之複合體之製造方法相同地進行即可。 Here, similarly to the manufacturing method of the composite body shown in FIG. 1, even in the manufacturing method of the laminated body of this invention, the cutter 20 penetrates the resin layer 14, and penetrates (cuts) the resin layer 14 in the glass piece. 12 forms a scribe line 18. That is, the dicing of the resin layer 14 is performed while forming the scribe line 18 on the glass piece 12. The formation of the scribe line 18 may be performed in the same manner as the method of manufacturing the composite shown in Fig. 1 .

再者,於圖2中,雖僅例示沿與第2玻璃片34之圖中水平方向之兩側紙面垂直之方向延伸之劃線18,但如上述般,由於第2玻璃片34之主面之外周內包於樹脂層14之主面之外周,故而於與紙面垂直之方向之第2玻璃片34之兩側亦形成沿圖中水平方向延伸之劃線18。 In addition, in FIG. 2, although the scribe line 18 extended in the perpendicular direction of the paper surface of the both sides of the horizontal direction of the 2nd glass piece 34 is illustrated, the main surface of the 2nd glass piece 34 as above. The outer circumference is wrapped around the outer surface of the main surface of the resin layer 14, so that the scribe lines 18 extending in the horizontal direction in the drawing are formed on both sides of the second glass sheet 34 in the direction perpendicular to the plane of the paper.

於在初始積層體30a(初始複合體10a)之玻璃片12形成劃線18後,與複合體之製造同樣地,如圖2(C)概念性地所示般,以對玻璃片12之樹脂層14側之面施加拉伸應力之方式使初始複合體10a彎折。 After the scribe line 18 is formed on the glass piece 12 of the initial laminated body 30a (initial composite 10a), the resin of the glass piece 12 is conceptually shown as shown in FIG. 2(C), similarly to the manufacture of the composite. The initial composite 10a is bent by applying a tensile stress to the surface of the layer 14 side.

藉此,以劃線18為起點使玻璃片12斷裂而切割初始複合體10a,如圖2(D)概念性地所示般,形成目標之尺寸或形狀之積層體30。 Thereby, the glass piece 12 is broken by the scribe line 18 as a starting point, and the initial composite body 10a is cut, and as shown in FIG. 2(D), the layered body 30 of the target size or shape is formed.

此處,如上述般,初始複合體10a係以特定之接著力接著具有特定之厚度及楊氏模數之樹脂層14。因此,與本發明之複合體之製造方法同樣地,於本發明之積層體之製造方法中,即便玻璃片12較薄,亦可防止切割該初始複合體10a時所產生之破裂於玻璃片12擴大,進而,亦可切割為圓形等不規則形。因此,根據本發明之積層體之製造方法,可製造具有所需之尺寸及形狀、且玻璃片12之破裂經抑制之積層體30(於玻璃片12之有效區域無破裂之積層體30)。 Here, as described above, the initial composite 10a is a resin layer 14 having a specific thickness and a Young's modulus with a specific adhesion. Therefore, similarly to the method for producing a composite of the present invention, in the method for producing a laminate according to the present invention, even if the glass sheet 12 is thin, it is possible to prevent cracking of the glass sheet 12 when the initial composite 10a is cut. Expanded, and further, it can be cut into irregular shapes such as a circle. Therefore, according to the method for producing a laminate of the present invention, the laminate 30 having the desired size and shape and in which the crack of the glass sheet 12 is suppressed (the laminate 30 having no crack in the effective region of the glass sheet 12) can be produced.

於本發明之製造方法中,較佳為於切割初始複合體10a而形成積層體30後,如圖2(E)概念性地所示般,將積層體30之端面(側緣部)進行倒角處理。 In the manufacturing method of the present invention, after the initial composite 10a is cut to form the laminated body 30, the end surface (side edge portion) of the laminated body 30 is preferably poured as shown conceptually in FIG. 2(E). Angle processing.

積層體30之倒角處理係利用使用旋轉之磨石之方法等進行玻璃板與樹脂之積層體之倒角處理的公知之各種方法進行即可。 The chamfering treatment of the laminated body 30 may be carried out by various known methods of chamfering the laminated body of the glass plate and the resin by a method using a rotating grindstone.

作為一例,可例示國際公開第2012/176608號所記載之方法。該倒角處理方法係藉由圓盤狀或圓筒狀之旋轉之磨石對積層體30之端面進行研磨而製成倒角之方法,使磨石傾斜地抵接於樹脂層14與玻璃片12之界面、及樹脂層14與第2玻璃片34之界面而進行研磨,從而進行積層體30之倒角處理。較佳為,於外周面,使用抵接於積層體30之端面進 行研磨之具有研磨溝槽之磨石,且以使樹脂層14與玻璃片12之界面、及樹脂層14與第2玻璃片34之界面對應於研磨溝槽之最深部沿研磨溝槽之寬度方向(旋轉軸之延伸方向)偏移之方式配置磨石之研磨溝槽,而使研磨溝槽傾斜地抵接於兩界面而進行研磨。更佳為,使研磨溝槽抵接於積層體30之端面,進而較佳為將研磨溝槽設為剖面圓弧狀,於樹脂層14與玻璃片12之界面、及樹脂層14與第2玻璃片34之界面抵接剖面圓弧狀之部分而進行研磨。 As an example, the method described in International Publication No. 2012/176608 can be exemplified. The chamfering method is a method of chamfering the end surface of the laminated body 30 by a disc-shaped or cylindrical rotating grindstone, and the grinding stone is obliquely abutted against the resin layer 14 and the glass sheet 12. The interface and the interface between the resin layer 14 and the second glass piece 34 are polished to perform chamfering treatment of the laminated body 30. Preferably, on the outer peripheral surface, the end surface abutting on the laminated body 30 is used. Grinding the grindstone having the grinding groove so that the interface between the resin layer 14 and the glass sheet 12 and the interface between the resin layer 14 and the second glass sheet 34 correspond to the width of the grinding groove along the deepest portion of the grinding groove The grinding groove of the grindstone is disposed in such a manner that the direction (the direction in which the rotating shaft extends) is offset, and the grinding groove is obliquely abutted at both interfaces to be polished. More preferably, the polishing groove is brought into contact with the end surface of the laminated body 30, and it is preferable that the polishing groove has a circular arc shape, the interface between the resin layer 14 and the glass piece 12, and the resin layer 14 and the second layer. The interface of the glass piece 34 is abraded by abutting the arcuate portion of the cross section.

根據該倒角處理方法,可減少因研磨而導致之缺陷之產生,可進行積層體30之端面之倒角處理。 According to this chamfering treatment method, the occurrence of defects due to polishing can be reduced, and the chamfering treatment of the end faces of the laminated body 30 can be performed.

如此按所需尺寸及形狀製造成之由本發明獲得之積層體30係如上述般可利用作例如PV、LCD、OLED等電子裝置之基板。 The laminate 30 obtained by the present invention, which is manufactured in the desired size and shape, can be used as a substrate for an electronic device such as PV, LCD, or OLED as described above.

以上,雖已對本發明之複合體之製造方法及積層體之製造方法進行詳細說明,但本發明並不限定於上述例,當然可於不脫離本發明之主旨之範圍內,進行各種改良或變更。 In the above, the method for producing the composite of the present invention and the method for producing the laminate are described in detail. However, the present invention is not limited to the above examples, and various modifications and changes can be made without departing from the spirit and scope of the invention. .

[實施例] [Examples]

以下,表示本發明之具體實施例,而對本發明進行更詳細之說明。 Hereinafter, the present invention will be described in more detail with reference to specific embodiments of the invention.

[實施例1] [Example 1]

準備厚度100μm、150×100mm之無鹼玻璃板(旭硝子公司製造,AN100)作為玻璃片12。 An alkali-free glass plate (manufactured by Asahi Glass Co., Ltd., AN100) having a thickness of 100 μm and 150 × 100 mm was prepared as the glass piece 12.

首先,作為預處理,將玻璃片12以純水洗淨及UV洗淨進行潔淨化後,為了提昇接著力,藉由旋轉塗佈(2000rpm、10秒)塗佈以異丙醇為溶劑之胺基丙基三甲氧基矽烷(KBM903)0.1wt%溶液,於80℃下乾燥10分鐘,而進行玻璃片12之矽烷偶合處理。 First, as a pretreatment, the glass piece 12 was cleaned by washing with pure water and UV cleaning, and then, in order to improve the adhesion, an amine coated with isopropanol as a solvent was applied by spin coating (2000 rpm, 10 seconds). A 0.1 wt% solution of propyltrimethoxydecane (KBM903) was dried at 80 ° C for 10 minutes to carry out a decane coupling treatment of glass flakes 12.

繼而,利用以下之方法製備塗佈用之聚醯胺酸溶液。 Then, a polyacrylic acid solution for coating was prepared by the following method.

使對苯二胺(10.8g、0.1mol)溶解於N,N-二甲基乙醯胺(198.6g),於室溫下攪拌。於其中以1分鐘添加3,3',4,4'-聯苯四羧酸二酐 (BPDA)(29.4g、0.1mol),於室溫下攪拌2小時,而獲得含有具有下述式(2-1)及/或式(2-2)所表示之重複單元之聚醯胺酸的固形物成分濃度20質量%之聚醯胺酸溶液。 P-phenylenediamine (10.8 g, 0.1 mol) was dissolved in N,N-dimethylacetamide (198.6 g), and stirred at room temperature. Add 3,3',4,4'-biphenyltetracarboxylic dianhydride to 1 minute (BPDA) (29.4 g, 0.1 mol) was stirred at room temperature for 2 hours to obtain a polylysine containing a repeating unit represented by the following formula (2-1) and/or formula (2-2) A polyamic acid solution having a solid content of 20% by mass.

將該聚醯胺酸溶液藉由旋轉塗佈法(2000rpm、塗佈量10g/m2)塗佈於玻璃片12,形成塗膜。其後,以60℃於大氣中加熱10分鐘,進而,以120℃於大氣中加熱10分鐘,藉此使塗膜乾燥,而於玻璃片12之表面形成聚醯胺酸之膜。 This polyamine acid solution was applied to the glass piece 12 by a spin coating method (2000 rpm, coating amount: 10 g/m 2 ) to form a coating film. Thereafter, the film was heated in the air at 60 ° C for 10 minutes, and further heated at 120 ° C for 10 minutes in the air to dry the coating film to form a film of polylysine on the surface of the glass piece 12.

進而,藉由於大氣中以350℃加熱1小時,而使聚醯胺酸醯亞胺化,製造於玻璃片12之表面具有含有聚醯亞胺之厚度25μm之樹脂層14的初始複合體10a。 Further, by heating at 350 ° C for 1 hour in the atmosphere, the polyphosphonium amide was imidized, and the initial composite 10a having the resin layer 14 having a thickness of 25 μm of polyimine was produced on the surface of the glass piece 12.

對製造成之初始複合體10a藉由萬能試驗機(島津製作所製造)測定樹脂層14之接著力(180°剝離強度)。結果為,樹脂層14之接著力為12N/25mm。 The adhesive force (180 peeling strength) of the resin layer 14 was measured by the universal testing machine (manufactured by Shimadzu Corporation) for the initial composite 10a. As a result, the adhesive force of the resin layer 14 was 12 N/25 mm.

又,依據JIS K 7127:1999測定樹脂層14之楊氏模數(距與玻璃片 12之界面於法線方向之距離為0~0.5μm之區域之楊氏模數)。結果為,樹脂層14之楊氏模數為5GPa。再者,楊氏模數係自製造成之初始複合體10a將樹脂層14剝離而測定。於不自初始複合體10a剝離樹脂層14之情形時,藉由氫氟酸使玻璃片12溶解而獲得測定用之樹脂層14。 Further, the Young's modulus of the resin layer 14 was measured in accordance with JIS K 7127:1999 (distance from the glass piece) The interface of 12 is in the direction of the normal direction, and the Young's modulus in the region of 0 to 0.5 μm). As a result, the Young's modulus of the resin layer 14 was 5 GPa. Further, the initial composite 10a which was self-made by the Young's modulus was measured by peeling off the resin layer 14. When the resin layer 14 is not peeled off from the initial composite 10a, the glass sheet 12 is dissolved by hydrofluoric acid to obtain a resin layer 14 for measurement.

於如上述般製造成之初始複合體10a,藉由滾輪切割器(Mitsuboshi Diamond工業公司製造,Penett)自樹脂層14側貫通樹脂層14而於玻璃片12形成直線狀之劃線18。 In the initial composite 10a manufactured as described above, the resin layer 14 is penetrated from the resin layer 14 side by a roller cutter (Pentett, manufactured by Mitsuboshi Diamond Co., Ltd.) to form a linear line 18 on the glass sheet 12.

繼而,使樹脂側凸起而使初始複合體10a彎折,以劃線18為起點使玻璃片12斷裂而切割初始複合體10a,從而製造複合體10。 Then, the initial side body 10a is bent by the resin side, and the glass piece 12 is broken by the scribe line 18 to cut the initial composite body 10a, thereby manufacturing the composite body 10.

對製造成之複合體10之玻璃片12使用目視及光學顯微鏡確認沿劃線18於法線方向(與劃線正交之方向)擴大5mm以上之破裂。結果為,未觀察到自劃線18擴大5mm以上之破裂(無破損)。 The glass piece 12 of the composite 10 thus produced was visually and optically confirmed to have a crack of 5 mm or more in the normal direction (the direction orthogonal to the scribe line) along the scribe line 18. As a result, it was not observed that the rupture (no damage) of 5 mm or more was enlarged from the scribe line 18.

[實施例2] [Embodiment 2]

將樹脂層14變更為含有PES(聚醚碸酸)之厚度20μm者,除此以外,與實施例1同樣地製造複合體10。 The composite 10 was produced in the same manner as in Example 1 except that the resin layer 14 was changed to a thickness of 20 μm including PES (polyether tannic acid).

含有PES之樹脂層14之形成係以如下方式進行。首先,使PES(住友化學製造,5003P)以20質量%溶解於N-甲基吡咯啶酮中而製造PES溶液。將該PES溶液藉由旋轉塗佈法(2000rpm、塗佈量10g/m2)塗佈於玻璃片12而形成塗膜。其後,藉由於130℃下於大氣中加熱1小時,使塗膜乾燥而形成PES之膜。再者,本例中未進行玻璃片12之矽烷偶合處理。 The formation of the PES-containing resin layer 14 is carried out in the following manner. First, PES (manufactured by Sumitomo Chemical Co., Ltd., 5003P) was dissolved in N-methylpyrrolidone at 20% by mass to produce a PES solution. This PES solution was applied to the glass piece 12 by a spin coating method (2000 rpm, coating amount: 10 g/m 2 ) to form a coating film. Thereafter, the film was dried by heating in the air at 130 ° C for 1 hour to form a film of PES. Further, in this example, the decane coupling treatment of the glass piece 12 was not performed.

又,於製造初始複合體10a之時,與實施例1同樣地測定樹脂層14之接著力及楊氏模數。結果為,接著力為5.4N/25mm,楊氏模數為2.4GPa。 Moreover, when the initial composite 10a was produced, the adhesion force and the Young's modulus of the resin layer 14 were measured in the same manner as in the first embodiment. As a result, the subsequent force was 5.4 N/25 mm, and the Young's modulus was 2.4 GPa.

又,與實施例1同樣地對複合體10之玻璃片12進行確認,結果,未觀察到自劃線18擴大5mm以上之破裂(無破損)。 Further, in the same manner as in the first embodiment, the glass piece 12 of the composite 10 was examined. As a result, no crack (no damage) of 5 mm or more from the scribe line 18 was observed.

[比較例1] [Comparative Example 1]

將聚醯胺酸溶液之固形物成分濃度設為10質量%,將樹脂層之厚度設為0.5μm,除此以外,與實施例1同樣地製造複合體。 A composite was produced in the same manner as in Example 1 except that the concentration of the solid content of the polyaminic acid solution was changed to 10% by mass, and the thickness of the resin layer was changed to 0.5 μm.

又,於製造初始複合體之時,與實施例1同樣地測定樹脂層之接著力及楊氏模數。結果為,接著力雖顯示為10N/25mm以上,但樹脂層破裂,故而無法測定正確之值。又,楊氏模數為5GPa。 Further, at the time of producing the initial composite, the adhesion force and the Young's modulus of the resin layer were measured in the same manner as in Example 1. As a result, although the adhesive force was 10 N/25 mm or more, the resin layer was broken, so that the correct value could not be measured. Also, the Young's modulus is 5 GPa.

又,與實施例1同樣地對複合體之玻璃片12進行確認,結果,觀察到自劃線18擴大5mm以上之破裂(有破損)。 Moreover, the glass piece 12 of the composite was confirmed in the same manner as in the example 1, and as a result, it was observed that the rug 18 was expanded by 5 mm or more (broken).

[比較例2] [Comparative Example 2]

將樹脂層變更為含有聚矽氧樹脂之厚度16μm者,除此以外,與實施例1同樣地製造複合體。 A composite was produced in the same manner as in Example 1 except that the resin layer was changed to have a thickness of 16 μm.

含有聚矽氧樹脂之樹脂層之形成係以如下方式進行。將無溶劑加成反應型剝離紙用聚矽氧(Shin-Etsu Silicones股份有限公司製造,KNS-320A。有機烯基聚矽氧烷與有機氫聚矽氧烷之混合物)100質量份與鉑系觸媒(Shin-Etsu Silicones股份有限公司製造CAT-PL-56)2質量份之混合物藉由旋轉塗佈法(2000rpm、塗佈量10g/m2)塗佈於玻璃片12而形成塗膜。其後,以180℃於大氣中加熱30分鐘,藉此使塗膜乾燥而形成聚矽氧樹脂之膜。再者,於本例中,未進行玻璃片12之矽烷偶合處理。 The formation of the resin layer containing the polyoxyxylene resin is carried out in the following manner. 100 parts by mass of a platinum-based polymerized polyether (for a solvent-free addition type release paper, manufactured by Shin-Etsu Silicones Co., Ltd., KNS-320A, a mixture of an organic alkenyl polysiloxane and an organic hydrogen polyoxyalkylene) A mixture of 2 parts by mass of a catalyst (CAT-PL-56 manufactured by Shin-Etsu Silicones Co., Ltd.) was applied to the glass piece 12 by a spin coating method (2000 rpm, coating amount: 10 g/m 2 ) to form a coating film. Thereafter, the film was dried in the air at 180 ° C for 30 minutes to dry the coating film to form a film of a polyoxynoxy resin. Further, in this example, the decane coupling treatment of the glass piece 12 was not performed.

又,於製造初始複合體之時,與實施例1同樣地測定樹脂層之接著力及楊氏模數。結果為,接著力為2.7N/25mm以上,楊氏模數為0.003GPa。 Further, at the time of producing the initial composite, the adhesion force and the Young's modulus of the resin layer were measured in the same manner as in Example 1. As a result, the subsequent force was 2.7 N/25 mm or more, and the Young's modulus was 0.003 GPa.

又,與實施例1同樣地對複合體之玻璃片12進行確認,結果,觀察到自劃線18擴大5mm以上之破裂(有破損)。 Moreover, the glass piece 12 of the composite was confirmed in the same manner as in the example 1, and as a result, it was observed that the rug 18 was expanded by 5 mm or more (broken).

[比較例3] [Comparative Example 3]

不進行玻璃片12之矽烷偶合處理,除此以外,與實施例1同樣地 製造複合體。 The same procedure as in Example 1 was carried out except that the decane coupling treatment of the glass piece 12 was not performed. Manufacturing a composite.

又,於製造初始複合體之時,與實施例1同樣地測定樹脂層之接著力及楊氏模數。結果為,接著力為0.1N/25mm,楊氏模數為5GPa。 Further, at the time of producing the initial composite, the adhesion force and the Young's modulus of the resin layer were measured in the same manner as in Example 1. As a result, the subsequent force was 0.1 N/25 mm, and the Young's modulus was 5 GPa.

又,與實施例1同樣地對複合體之玻璃片12進行確認,結果,觀察到自劃線18擴大5mm以上之破裂(有破損)。 Moreover, the glass piece 12 of the composite was confirmed in the same manner as in the example 1, and as a result, it was observed that the rug 18 was expanded by 5 mm or more (broken).

將以上之結果彙總示於下述表中。 The above results are summarized in the following table.

如上述實施例所示般,根據樹脂層14之厚度為1~100μm、且接著力(180°剝離強度)為1N/25mm以上、楊氏模數為100MPa以上之本發明之製造方法,可抑制沿著劃線18對初始複合體10a進行切割(使玻璃片12斷裂)時之破裂之擴大,可製造於玻璃片12不存在5mm以上之破裂之高品質複合體。 As shown in the above embodiment, the manufacturing method of the present invention can be suppressed according to the manufacturing method of the present invention in which the thickness of the resin layer 14 is 1 to 100 μm, the bonding force (180° peeling strength) is 1 N/25 mm or more, and the Young's modulus is 100 MPa or more. When the initial composite 10a is cut along the scribe line 18 (the glass sheet 12 is broken), the rupture is enlarged, and the high-quality composite in which the glass sheet 12 does not have a crack of 5 mm or more can be produced.

相對於此,樹脂層較薄之比較例1、樹脂層之楊氏模數較低之比較例2、及樹脂層之接著力較低之比較例3,於沿著劃線18切割初始複合體10a時,破裂擴大,於玻璃片12產生5mm以上之破裂。 On the other hand, in Comparative Example 1 in which the resin layer was thin, Comparative Example 2 in which the Young's modulus of the resin layer was low, and Comparative Example 3 in which the adhesion of the resin layer was low, the initial composite was cut along the scribe line 18. At 10a, the rupture is enlarged, and the glass sheet 12 is broken by 5 mm or more.

根據以上之結果,本發明之效果顯而易見。 From the above results, the effects of the present invention are apparent.

本申請案係基於2014年5月13日提出申請之日本專利申請案2014-099381,其內容作為參照併入本文中。 The present application is based on Japanese Patent Application No. 2014-099381, filed on Jan.

[產業上之可利用性] [Industrial availability]

本發明可較佳地用於各種電子裝置之製造等。 The present invention can be preferably applied to the manufacture of various electronic devices and the like.

10‧‧‧複合體 10‧‧‧Compound

10a‧‧‧初始複合體 10a‧‧‧ initial complex

12‧‧‧玻璃片 12‧‧‧Stainless glass

14‧‧‧樹脂層 14‧‧‧ resin layer

18‧‧‧劃線 18‧‧‧dick

20‧‧‧切割器 20‧‧‧Cutter

Claims (5)

一種複合體之製造方法,其特徵在於:在具有玻璃片、及以180°剝離強度為1N/25mm以上之接著力接著於該玻璃片、距離與上述玻璃片之界面於法線方向為0~0.5μm之區域之楊氏模數為100MPa以上、且厚度為1~100μm的樹脂層之初始複合體中,貫通上述樹脂層而於玻璃片形成劃線,以該劃線為起點對上述初始複合體進行切割,藉此製造複合體。 A method for producing a composite body, comprising: a glass piece; and an adhesion force of 180° peeling strength of 1 N/25 mm or more followed by the glass piece, and an interface between the distance and the glass piece is 0 to a normal direction In the initial composite of a resin layer having a Young's modulus of 100 MPa or more and a thickness of 1 to 100 μm in a region of 0.5 μm, the resin layer is passed through to form a scribe line on the glass sheet, and the initial composite is formed using the scribe line as a starting point. The body is cut to thereby produce a composite. 如請求項1之複合體之製造方法,其中上述玻璃片之厚度為100μm以下。 The method for producing a composite according to claim 1, wherein the glass piece has a thickness of 100 μm or less. 一種積層體之製造方法,其特徵在於:在具有第1玻璃片、及以180°剝離強度為1N/25mm以上之接著力接著於該第1玻璃片、距離與上述第1玻璃片之界面於法線方向為0~0.5μm之區域之楊氏模數為100MPa以上、且厚度為1~100μm的樹脂層之初始複合體中,使主面之面積小於上述樹脂層之主面之第2玻璃片以上述第2玻璃片之主面之外周內包於上述樹脂層之主面之外周之方式積層於上述樹脂層上並接著而形成初始積層體,對上述初始積層體沿著上述第2玻璃片之主面之外周,貫通上述樹脂層於第1玻璃片形成劃線,以該劃線為起點對上述初始複合體進行切割,藉此製造積層體。 A method for producing a laminate, comprising: forming a first glass sheet and an adhesion force of 180° peel strength of 1 N/25 mm or more, followed by an interface between the first glass sheet and a distance from the first glass sheet; In the initial composite of the resin layer having a Young's modulus of 100 MPa or more and a thickness of 1 to 100 μm in a region of 0 to 0.5 μm in the normal direction, the second glass having a main surface area smaller than the main surface of the resin layer The sheet is laminated on the resin layer so as to surround the outer surface of the main surface of the resin layer in the outer periphery of the main surface of the resin sheet, and then an initial layered body is formed, and the initial layered body is along the second glass. On the outer circumference of the main surface of the sheet, a scribe line is formed in the first glass sheet through the resin layer, and the initial composite body is cut starting from the scribe line to produce a laminate. 如請求項3之積層體之製造方法,其中於進行上述初始複合體之切割後,進而進行上述積層體之端面之倒角處理。 The method for producing a laminate according to claim 3, wherein after the dicing of the initial composite is performed, chamfering of the end face of the laminate is further performed. 如請求項3或4之積層體之製造方法,其中上述第1玻璃片之厚度為100μm以下。 The method for producing a laminate according to claim 3 or 4, wherein the thickness of the first glass sheet is 100 μm or less.
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