A7 B7 411742 五、發明説明（1 ) (發明所屬之技術領域） 本發明係關於一種用以將薄膜貼上於例示於印刷配線 板用基板或液晶顯示裝置，電漿顯示裝置之玻璃基板之基 板表面的薄膜貼上方法及裝置。 (以往之技術） 在使用於電腦等之電子機器的印刷配線板之製程中， 直接或經由介在屬有感光性樹脂層形成於透光性支持薄膜 (通常係以聚酯所代表之透光性樹脂薄膜）上，且將藉由 蓋薄膜覆蓋該層之疊層體薄膜，剝離蓋薄膜貼上於印刷配 線用基板表面之導電層1然後，重疊配線圖案薄膜，經該 配線圖案薄膜及上述透光性支持薄膜，曝光感光性樹脂層 所定時間，之後，剝離透光性支持薄膜後，顯像被曝光之 感光性樹脂層，以形成蝕刻掩蔽圖案，然後藉蝕刻除去上 述導電層之不需要部分。由此 > 形成具有所定配線圖案的 印刷配線板。又，在液晶顯示裝置 > 電漿顯示裝置之玻璃 基板形成顯示格之過程貼上同樣之疊層體薄膜。 作爲用以貼上如上所述之疊層體薄膜的薄膜貼上裝置 ，有所謂連續張貼型式者，該型式者係從薄膜輥捲出連續 薄膜，將此沿著藉搬運手段間歇地依順搬運在基板搬運面 ί 上的複數基板貼上面，使該感光性樹脂層成爲該薄膜貼上 面側，在重疊兩者之狀態下經疊層輥間，將薄膜連續地壓 接於複數基板下搬運基板者。 貼上於基板之透光性支持薄膜，係在曝光前或後，且 本紙張尺度诚川十阄围家標彳（rNS ) /V)規格（2丨0>< 297公f > (誚先閱讀背面之注意事項再填寫本I) Τ -9 線 if', 部 中 ib x ί/ί 合 i\ it. 卬 -4- 411742 at B7五、發明说明（2 ) 在顯像過程前，必須剝離成將感光性樹脂層留在基板側’ 惟必須在與剝離同時或剝離前或後’在各基板間被分離。 向剝離方向引拉透光性支持薄膜時，該背面之感光性 樹脂層，從基板所濾出之部分連續於基板上時，具有剝離 透光性支持薄膜時必須留下的基板上之感光性樹脂層也連 續於濾出部分之感光性樹脂層被剝離的問題點。 爲了解決這些問題點，以往，例如揭示於日本特開平 5 - 3 3 8 0 4 0號公報的薄膜剝離裝置中，在疊層輥之 上游側位置，將蓋薄膜從疊層體薄膜剝離後對應於各基板 間的部分，藉刀具切斷比該基板間稍寬之間隔的兩部位所 露出的感光性樹脂層，然後，藉由黏接帶剝離對應於基板 間之部分的感光性樹脂層，在該狀態下，與基板一起經疊 層輥間施以壓接。 因此，在該特開平5 — 3 3 8 0 4 0號公報的薄膜貼 上裝置中，在連續地貼上於依順序搬運之基板的薄膜的各 基板間之部分，由於久落感光性樹脂層，因此在貼上後從 基板連續地剝離透光性支持薄膜時，感光性樹脂層不會能 基板剝離。 又，例如在揭示於日本特開平7 - 1 5 7 1 8 6號公 報的薄膜剝離裝置中，將薄膜連續地貼上於基板之後’在 各基扳間之間隙位置，僅感光性樹脂層沿著基板之端緣向 薄膜寬度方向切斷，然後連續地剝離透光性支持薄膜者’ 此時，在被剝離之透光性支持薄膜側’附著有各基板部分 之感光性樹脂層。 本紙倀尺度過用屮闽1¾茱標彳，（rNS ) Λ4規格（210X 297公釐） _ 5 - (諳先閱讀背而之注意事項再填荇本頁)A7 B7 411742 V. Description of the invention (1) (Technical field to which the invention belongs) The present invention relates to a substrate for attaching a thin film to a substrate for a printed wiring board, a liquid crystal display device, or a glass substrate of a plasma display device. Method and device for attaching film on surface. (Previous technology) In the manufacturing process of printed wiring boards for electronic devices such as computers, it is formed directly or through a photosensitive resin layer on a light-transmitting support film (generally, light-transmittance represented by polyester) Resin film), and the laminate film covered with this layer by the cover film, the cover film is peeled off and pasted to the conductive layer 1 on the surface of the printed wiring substrate, and then the wiring pattern film is superimposed. The photosensitive support film is exposed to the photosensitive resin layer for a predetermined time. After the transparent support film is peeled off, the exposed photosensitive resin layer is developed to form an etching masking pattern, and then unnecessary portions of the conductive layer are removed by etching. . This > A printed wiring board having a predetermined wiring pattern is formed. In addition, the same laminate film was applied to the process of forming a display cell on the glass substrate of the liquid crystal display device > plasma display device. As a film sticking device for sticking the laminated film as described above, there is a so-called continuous sticking type, which rolls out a continuous film from a film roll and transports it intermittently and sequentially along a conveying means The substrate is affixed to a plurality of substrates on the substrate conveyance surface, so that the photosensitive resin layer becomes the upper surface of the film, and the films are continuously crimped to the plurality of substrates to be conveyed through the lamination rollers in a state of overlapping the two. By. The light-transmitting support film pasted on the substrate is before or after exposure, and the paper standard is Seikawa Tenkai Wai House Standard (rNS) / V) specifications (2 丨 0 > < 297 公 f > (诮 Please read the notes on the back before filling in this I) Τ -9 线 if ', 部 中 ib x ί / ί 合 i \ it. 卬 -4- 411742 at B7 V. Description of the invention (2) Before the development process It must be peeled to leave the photosensitive resin layer on the substrate side, but it must be separated between the substrates at the same time or before or after the peeling. When the transparent support film is pulled in the peeling direction, the photosensitivity of the back surface The resin layer has a problem that when the portion filtered from the substrate is continuously on the substrate, the photosensitive resin layer on the substrate that must be left when the transparent support film is peeled off is also peeled off from the photosensitive resin layer on the filtered portion. In order to solve these problems, conventionally, for example, in the film peeling device disclosed in Japanese Patent Laid-Open No. 5-3,380,400, the cover film is peeled from the laminate film at a position upstream of the laminating roll. The rear part corresponds to the part between the substrates. It is slightly wider than the space between the substrates by cutting with a cutter. The photosensitive resin layers exposed at the two spaced portions are then stripped of the photosensitive resin layer corresponding to the space between the substrates with an adhesive tape. In this state, the photosensitive resin layers are pressed together with the substrates through the laminating rolls. Therefore, in the film attaching device of Japanese Patent Application Laid-Open No. Hei 5-3 3 0 0 0, the portion between the substrates of the film that is successively pasted on the substrates that are sequentially conveyed has a long-standing photosensitive resin layer. Therefore, when the transparent support film is continuously peeled from the substrate after being pasted, the photosensitive resin layer cannot be peeled from the substrate. For example, the film disclosed in Japanese Patent Application Laid-Open No. 7-1 5 7 1 8 6 In the device, after the film is continuously attached to the substrate, at the position of the gap between the substrates, only the photosensitive resin layer is cut along the edge of the substrate in the width direction of the film, and then the transparent support film is continuously peeled off. 'At this time, the photosensitive resin layer of each substrate part is adhered to the side of the light-transmitting supporting film that has been peeled off. The paper is over-sized, and used as a standard, (rNS) Λ4 (210X 297 mm) _ 5-(谙 read first (Notes for filling out this page)
，1T " 屮决^箄^:^^消资合 ο、71印*'!-v 411742 A7 ____ B7五、發明説明（3 ) · 又，在揭示於日本特開平8— 1 5 0 6 9 4號公報之 薄膜貼上裝置中，在對應於各基板間之間隙的感光性樹脂 層之部办，於寬度方向事先形成開縫。並直接連續地貼上 於基板，貼上後在各基板間位置切斷，而從切斷端緣剝離 透光性支持薄膜。 又，揭示於日本特開平7 - 1 1 0 5 7 5號公報的薄 膜貼上裝置，係在剝離蓋薄膜前，比對應於各基板間的部 分的兩端間稍廣地，將蓋薄膜及其內側之感光性樹脂層一 起向薄膜寬度方向切斷，然後藉黏接帶剝離僅須貼上於基 板部分的蓋薄膜後露出感光性樹脂層，而在該狀態下連續 地貼上於基板者，貼上後，透光性支持薄膜係在各基板間 藉刀具被切斷。 如上所述，在任何情形，擬將透光性支持薄膜與不需 要之感光性樹脂層一起剝離時，必須使貼上於基板之感光 性樹脂層，不會連續於不需要部分之感光性樹脂層被剝離 ，而須在不需要部分與需要部分之感光性樹脂層間形成切 斷線。 作爲此種切斷線形成用之手段1使用圓盤狀之圓盤刀 具或直刀刃狀之刀具。 將這些刀具使用於切斷感光性樹脂層之所謂半切時， 感光性樹脂層或設於該感光性樹脂層之外側的蓋薄膜一起 與感光性樹脂層切斷，則須以極高精度實行刀具的刀尖之 薄膜厚度方向的位置控制。 (誚先閱讀背而之注意事項再稹寫本育)1T " 屮 定 ^ 屮 ^: ^^ Consumption of capital, 71 seals * '!-V 411742 A7 ____ B7 V. Description of the invention (3) · Also disclosed in Japanese Patent Application Laid-Open No. 8-1 5 0 6 In the film bonding apparatus of JP 4 No. 4, slits are formed in the width direction in advance in the portion of the photosensitive resin layer corresponding to the gap between the substrates. The substrate is directly and continuously attached to the substrate, and after cutting, the substrate is cut at a position between the substrates, and the light-transmitting supporting film is peeled from the cut edge. In addition, the film attaching device disclosed in Japanese Patent Application Laid-Open No. 7-1 0 5 7 5 is a method in which the cover film and the cover film are slightly wider than both ends of the portion corresponding to each substrate before the cover film is peeled off. The photosensitive resin layer on the inside is cut together in the width direction of the film, and then the adhesive film is peeled off by the adhesive tape, and the photosensitive resin layer is exposed only after being affixed to the substrate film. After being affixed, the translucent support film is cut between the substrates by a cutter. As described above, in any case, when the transparent support film is to be peeled off together with the unnecessary photosensitive resin layer, the photosensitive resin layer attached to the substrate must not be continuous with the unnecessary portion of the photosensitive resin. The layer is peeled off, and a cutting line must be formed between the unnecessary portion and the photosensitive resin layer. As the means 1 for forming such a cutting line, a disc-shaped disc cutter or a straight blade-shaped cutter is used. When these cutters are used for so-called half-cutting of the photosensitive resin layer, the photosensitive resin layer or the cover film provided on the outer side of the photosensitive resin layer is cut together with the photosensitive resin layer. Position control of the film thickness direction of the blade edge. (Read the back-to-back precautions before copying the textbook)
’1T 本紙乐尺度適圯十闽阀家標坪.（（'奶）八4現格（210/297公釐） -6- A7 B7 411742 五、發明説明（4 ) (發明欲解決之課題） 然而，刀具刀尖之薄膜厚度方向之精密的位置控制係 極難，特別是’圓盤狀刀具係製作精度上極難成爲真圓。 產生約±數厂之直徑偏差。另一方面’蓋薄膜及感光性樹 脂層之厚度也有偏差’故很難完全地切斷感光性樹脂層。 例如第1 0 ( A )圖之切斷線4所示’不完全地切斷 感光性樹脂層2時，如第1 0 ( B )圖及第1 0 ( C )圖 所示，剝離透光性支持薄膜1時，感光性樹脂層2之分離 線會散亂，本來需要部分之感光性樹脂層2被剝離’或在 基板3上留下本來不要之感光性樹脂層’而在後續過程產 生附著於周圍之問題點。 本發明係鑑於上述以往之問題點而創作者，其目的係 在於提供一種不需要控制刀具刀尖之精密的薄膜厚度方向 位置，或控制尺寸，可確實地切斷感光性樹脂層的薄膜貼 上方法及裝置。 (解決手段） 本方法發明，屬於將至少疊層透光性支持薄膜與感光 性樹脂層所形成的疊層體薄膜，在將上述感光性樹脂層至 少貼上於基板之範圍內露出後，以向搬運在基板搬運面上 ί 之基板的薄膜貼上面之狀態下沿著基板搬1運面供應，並在 重疊於基板之狀態下送進疊層輥，在越板貼上疊層體薄膜 *而在該貼上前或後，位於基板之搬運方向端部近旁位置 ，藉刀具向薄膜寬度方向切斷上述感光性樹脂層的薄膜貼 本紙张尺度適川中1¾¾家標彳（ΓΝ8 ) Λ4规格（2丨0X29?公漦） (誚先閱讀背而之注意事項再填寫本頁)'1T The scale of this paper music is suitable for the Shimin Valve Family Standard Ping. ((' Milk) 8 4 grid (210/297 mm) -6- A7 B7 411742 V. Description of the invention (4) (Questions to be solved by the invention) However, it is extremely difficult to precisely control the position of the film thickness direction of the tool tip. In particular, 'disc-shaped tool systems are extremely difficult to make a true circle. There is a diameter deviation of about ± several mills. On the other hand, the cover film And the thickness of the photosensitive resin layer also varies, so it is difficult to completely cut the photosensitive resin layer. For example, as shown by cutting line 4 in FIG. 10 (A), when the photosensitive resin layer 2 is not completely cut, As shown in FIG. 10 (B) and FIG. 10 (C), when the transparent support film 1 is peeled off, the separation lines of the photosensitive resin layer 2 are scattered, and a portion of the photosensitive resin layer 2 was originally required to be covered. The problem of peeling off or leaving an unnecessary photosensitive resin layer on the substrate 3 and causing adherence to the surroundings in the subsequent process occurs. The present invention was created by the creator in view of the above-mentioned conventional problems, and its object is to provide an unnecessary Control the precise film thickness position of the tool tip, or Method and device for applying a film capable of reliably cutting a photosensitive resin layer. (Solution) The invention of this method belongs to a laminate film formed by laminating at least a light-transmitting support film and a photosensitive resin layer, After the photosensitive resin layer is exposed on at least the surface of the substrate, it is supplied along the substrate transport surface with the upper surface of the film being transported to the substrate transported on the substrate transport surface, and is superposed on the substrate. In the state, it is fed into a laminating roll, and a laminated film is pasted on the crossover board. Before or after the pasting, it is located near the end of the substrate in the conveying direction, and the photosensitive resin is cut in the film width direction by a cutter. Layer of thin-film sticker paper size suitable for Sichuan 1¾¾ family standard Γ (ΓΝ8) Λ4 specifications (2 丨 0X29? Public 诮) (诮 Please read the precautions before filling in this page)
,1T 41174^ A7 B7 五、發明説明（5 ) 上方法，其特徵爲··-切斷上述感光性樹脂層時，將上述 刀具之刀尖凹進於上述透光性支持薄膜，並留下該透光性 支持薄膜之厚度方向一部予以切斷1來達成上述目的者。 在上述薄膜貼上方法中，對於上述透光性支持薄膜之 凹進量，係作爲該透光性支持薄膜的厚度1 / 2以下也可 以。 又，在上述薄膜貼上方法中，上述刀具之刀尖對於上 述透光性支持薄膜之凹進量，係作爲2 0 /z m以下也可以 〇 又，在該薄膜貼上方法中，上述刀具之刀尖對於上述 透光性支持薄膜之凹進量，係作爲約1 0 y m也可以。 上述疊層體薄膜係蓋薄膜疊層於上述感光性樹脂層之 外側所構成，上述感光性樹脂層係上述疊層輥之上游被切 斷，在該切斷時，上述蓋薄膜在疊層於感光性樹脂層之狀 態下，藉上述刀具同時地被切斷，而在切斷後，該蓋薄膜 至少在貼上於基板之範圍內，從感光性樹脂層剝離也可以 0 又，貼上於上述基板，且感光性樹脂層被切斷之狀態 的透光性支持薄膜，係對應於各基板之端部間之間隙部分 ，在附著依上述刀具之切斷線間的感光性樹脂層之狀態下 從基板連續地剝離也可以。 V 又，上述薄膜貼上方法中，於薄膜移送方向1隔著對 應於上述各基板之端部間的間隙之間隔配置一對刀具，並 將此等向薄膜寬度方向同時地移動以切斷感光性樹脂層及 -'β 本紙张尺度適扪中闽阀家棍々-((，NS ) Μ現輅（210Χ 297公麓） -8 - 411742 A7 B7五、發明説明（6 ) 透光性支持薄膜的厚度方向一部分也可以。 又，在上述薄膜貼上方法中，上述一對刀具係分別向 薄膜寬度方向可旋轉的圓盤刀具也可以。 本裝置發明係具有沿著基板搬運面搬運基板的搬運裝 置，及將至少疊層透光性支持薄膜與感光性樹脂層所形成 之疊層體薄膜連續比供應的薄膜供應源，及配置成沿著上 述基板搬運面，且將沿著該基板搬運面所搬運之基板，在 夾持於該厚度方向之狀態下旋轉並將疊層體薄膜貼上於基 板的疊層輥，及配置於上述疊層輥之上游或下游位置，將 上述感光性樹脂層向薄膜寬度切斷的半刀具所構成；將上 述疊層體薄膜在至少貼上於基板之長度範圍內露出上述感 光性樹脂層之後，將該感光性樹脂層在向沿著上述基板搬 運面所搬運之基板的薄膜貼上面之狀態下，與該基板一起 送進上述疊層輥，並貼上於基板的薄膜貼上裝置，其特徵 爲：上述半刀具係構成其前端刀尖切斷感光性樹脂層時， 凹進在上述透光性支持薄膜之厚度方向一部分的薄膜貼上 裝置，達成上述目的者。 在本發明中，由於切斷感光性樹脂層時，該半刀具之 刀尖凹進至支持感光性樹脂層之透光性支持薄膜之厚度方 向一部分，因此，即使刀具之尺寸有偏差，或感光性樹脂 層之厚度有偏差，感光性樹脂層係確實地^被切斷。 (發明之實施形態） 以下參照圖式詳述本發明之實施形態之例子。 (請先閱讀背而之注意事項再填寫本頁) 訂 線 本紙依尺度適川巾阐阄家榡5f ( ('NS ) Λ4规格（210x 297公费_ ) -9 - 411742 at ___ B7 五、發明説明（7 ) ' 本發明之薄膜貼上裝置1 0係如第1圖所示，從薄膜 供應源之薄膜輥1 2捲出疊層體薄膜1 4，將構成該疊層 體薄膜1 4之蓋薄膜1 4 C (如下述）藉由蓋薄膜剝離裝 置1 6予以剝離之後，重疊於藉基板搬運裝置1 8依順序 間歇地搬運來的複數基板2 0之上面，與該基板2 0 —起 經上下一對疊層輥2 2A，2 2 B之間而在基板2 0壓接 疊層體薄膜1 4者。 連續地壓接於複數基板2 0的疊層體薄膜1 4，係從 各基板2 0連續地被剝離，由此被分離成每一各基板。 上述疊層體薄膜1 4係如第2圖所示，由透光性支持 薄膜1 4 A，及疊層於該透光性支持薄膜的感光性樹脂層 (含有中間層，惟也有不含有之情形）1 4 B，及覆蓋該 感光性樹脂層1 4 B被疊層的蓋薄膜1 4 C所構成，形成 從帶狀地捲繞之薄膜輥1 2連續地被捲出。透光性支持薄 膜1 4之「透光性」係可透過曝光感光性樹脂層1 4 B之 光或射束，亦即指可透過可視光線，紫外光，X線，電子 線等。 薄膜輥1 2係形成藉輥矩馬達1 2 A來控制其捲出張 力。從上述薄膜輥1 2所捲出之疊層體薄膜1 4係被捲繞 在一對導輥2 6 A，2 6 B，由此，沿著水平之薄膜搬運 面延伸，而被捲繞在附與拉力之吸入輥2 8。 該附與拉力之吸入輥2 8係於其外圓週具備多數吸孔 ，吸引被捲繞之疊層體薄膜1 4並旋轉（省略詳細圖式） 〇 I I I ' I 1 .1 n n Ί »^11 H .線 *" (Is先聞讀背而之注意事項再填寫本頁) 木纸乐X度诮用中闽®家標瑋（CNS ) Λ4^格（210X 297公漦） -10- 411748 a7 B7五、發明説明（8 ) 疊層體薄膜1 4係在上述導輥2 6 B與附與拉力之吸 入輥2 8之間使蓋薄膜1 4 C成爲上側。 上迦蓋薄膜剝離裝置1 6係設於上述附與拉力之吸入 輥28之正前方位置，藉兩對推壓輥34A，34B與疊 層體薄膜1 4 一起夾進從從黏接帶輥3 0將黏接層向蓋薄 膜1 4 C側捲出的黏接帶3 2，又經導輥3 4 C藉由捲繞 輥3 6捲繞黏接帶3 2時，從感光性樹脂層1 4 B剝離蓋 薄膜14 C，並同時地被捲繞。 在上述導輥2 6 B安裝有旋轉編碼器2 7，形成能輸 出隨著疊層體薄膜14之移送量之數的脈衝信號。 在上述導輥2 6 B與上述蓋薄膜剝離裝置1 6之間的 位置，設置半刀具3 8係設在隔著薄膜移送方向之所定間 隔的兩部位，留下疊層體薄膜1 4之透光性支持薄膜 1 4A，將蓋薄膜1 4 C與感光性樹脂層1 4 B —起向薄 膜寬度方向切斷者。 該半工具3 8係包含以上述所定間隔配置於薄膜移送 方向的一對圓盤刀具3 8A，3 8B，及經由薄膜搬運面 對向配置於該圓盤刀具38A，58B之前端（下端）， 當該圓盤刀具38A，38B向薄膜寬度方向移動時，支 持上述疊層體薄膜的水平之刀具台3 8 C，及圓盤刀具 3 8A，3 8B移動時，將疊層體薄膜14推向刀具台 3 8 C的推壓薄膜氣缸3 8 E所構成。刀具台3 8 C保形 成覆蓋疊層體薄膜14之圖中寬度方向下側的長度。 上述圓盤刀具38A，38B係如第3圖所示，例如 (請先"讀背而之注意事項再"宵本頁1T 41174 ^ A7 B7 V. Description of the invention (5) The above method is characterized in that when cutting the photosensitive resin layer, the tip of the cutter is recessed into the transparent support film and left This light-transmitting supporting film is partially cut 1 in the thickness direction to achieve the above object. In the film attaching method, the recessed amount of the light-transmitting support film may be a thickness of 1/2 or less of the light-transmitting support film. In the film attaching method, the recessed amount of the cutting edge of the cutter with respect to the light-transmitting supporting film may be 20 / zm or less. In the film attaching method, the cutter The recessed amount of the blade tip with respect to the above-mentioned light-transmitting supporting film may be about 10 μm. The laminate film is a cover film laminated on the outside of the photosensitive resin layer, and the photosensitive resin layer is cut upstream of the lamination roll. When the cutting is performed, the cover film is laminated on the In the state of the photosensitive resin layer, the cutter is cut at the same time. After the cutting, the cover film is at least attached to the substrate, and the film can be peeled off from the photosensitive resin layer. The transparent support film in which the substrate and the photosensitive resin layer are cut corresponds to the gap portion between the ends of each substrate, and the photosensitive resin layer between the cutting lines according to the cutter is attached. It may be continuously peeled from the substrate. V. In the above-mentioned film attaching method, a pair of cutters are arranged in the film transfer direction 1 with an interval corresponding to the gap between the ends of the respective substrates, and these are simultaneously moved in the film width direction to cut off the light. Resin resin layer and -'β This paper is suitable for Zhongmin valve family stick (-(, NS) M now (210 × 297 male foot) -8-411742 A7 B7 V. Description of the invention (6) Transparency support A part of the thickness direction of the film may be sufficient. In the film attaching method, the pair of cutters may be disc cutters that can be rotated in the film width direction. The present invention relates to a method for transporting a substrate along a substrate conveying surface. A conveying device, a film supply source that continuously supplies at least a laminate film formed by laminating a light-transmitting support film and a photosensitive resin layer, and is arranged along the substrate conveying surface and conveys the substrate The substrate carried on the surface is rotated while being held in the thickness direction, and a laminated roll is attached to the substrate. The laminated roll is disposed upstream or downstream of the laminated roll to place the photosensitive tree. It consists of a half cutter that cuts the fat layer to the width of the film; after exposing the laminated film to the photosensitive resin layer at least over the length of the substrate, the photosensitive resin layer is transported along the substrate In a state where the film of the substrate carried on the surface is stuck on the upper surface, it is fed into the above-mentioned lamination roll together with the substrate, and is attached to the film on the substrate. The device is characterized in that the half-knife is configured to cut off the tip of the tip. In the case of a photosensitive resin layer, a film-applying device recessed in a part of the thickness direction of the light-transmitting support film achieves the above object. In the present invention, when the photosensitive resin layer is cut, the tip of the half-knife It is recessed to a part of the thickness direction of the light-transmitting supporting film supporting the photosensitive resin layer. Therefore, even if the size of the cutter is deviated or the thickness of the photosensitive resin layer is deviated, the photosensitive resin layer is surely cut. (Embodiment of the Invention) The following is a detailed example of the embodiment of the present invention with reference to the drawings. (Please read the precautions on the back before filling this page.) 5f (('NS) Λ4 size (210x 297 public expense _) -9-411742 at ___ B7 V. Description of the invention (7)' The film attaching device 10 of the present invention is shown in Figure 1 After the laminate film 14 is unwound from the film roll 12 of the film supply source, the cover film 1 4 C (as described below) constituting the laminate film 14 is peeled by the cover film peeling device 16 , Is superimposed on the plurality of substrates 20 that are intermittently conveyed in sequence by the substrate conveying device 18, and passes through the upper and lower pair of lamination rollers 2 2A, 2 2 B together with the substrate 20 to the substrate 20 The laminated film 14 is pressure-bonded. The laminated film 14 which is continuously pressure-bonded to a plurality of substrates 20 is continuously peeled from each substrate 20 and is separated into each substrate. As shown in FIG. 2, the laminate film 14 is composed of a light-transmitting support film 1 4 A and a photosensitive resin layer (including an intermediate layer, but also a photoresist layer) laminated on the light-transmitting support film. (Case) 1 4 B and a cover film 1 4 C laminated with the photosensitive resin layer 1 4 B to form a film roll 12 wound continuously from a strip. The "transparency" of the translucent support film 14 can transmit light or beam that exposes the photosensitive resin layer 1 4 B, which means that it can transmit visible light, ultraviolet light, X-rays, electron rays, and the like. The film roll 12 is formed by a roll torque motor 12 A to control its unwinding tension. The laminated film 1 4 unwound from the film roll 12 is wound around a pair of guide rolls 2 6 A, 2 6 B, thereby extending along the horizontal film conveying surface and being wound around With the suction roller 2 8 with tension. The suction roller 28 with tension is provided with a large number of suction holes on its outer circumference, and sucks the wound laminate film 14 and rotates (detailed illustration is omitted) 〇III 'I 1.1 .1 nn Ί »^ 11 H. LINE * " (Is first read and read the precautions before filling out this page) Wood Paper Music X Degrees (Zhongmin® Family Standard Wei (CNS)) Λ4 ^ grid (210X 297) -10- 411748 a7 B7 V. Description of the invention (8) The laminated film 1 4 is such that the cover film 1 4 C is on the upper side between the above-mentioned guide roller 2 6 B and the suction roller 28 with tension. The upper cap cover film peeling device 16 is located directly in front of the suction roller 28 with tensile force, and is sandwiched by two pairs of pressing rollers 34A, 34B and the laminated film 1 4 from the adhesive tape roller 3 0 When the adhesive layer 3 2 is rolled out to the cover film 1 4 C side, and the adhesive tape 3 2 is wound by the guide roller 3 4 C by the winding roller 3 6, the photosensitive resin layer 1 The 4 B peels the cover film 14 C and is simultaneously wound. A rotary encoder 27 is mounted on the guide roller 26B, and a pulse signal capable of outputting a number corresponding to the amount of movement of the laminated film 14 is formed. Between the guide roller 2 6 B and the cover film peeling device 16, a half cutter 3 8 is provided at two positions at a predetermined interval across the film conveying direction, leaving the laminated film 14 transparent. The optical support film 1 4A, the cover film 1 4 C and the photosensitive resin layer 1 4 B are cut from the film width direction. The semi-tool 38 includes a pair of disc cutters 38A and 38B arranged at the predetermined interval in the film transfer direction, and a front end (lower end) of the disc cutters 38A and 58B disposed through the film conveying surface. When the disc cutters 38A and 38B move in the film width direction, the horizontal tool table 3 8 C supporting the above-mentioned laminated film and the disc cutters 38A and 38B move the laminated film 14 toward The tool table 3 8 C is constituted by a pressing film cylinder 3 8 E. The tool table 3 8 C is formed so as to cover the length of the lower side in the width direction in the figure covering the laminate film 14. The above-mentioned disc cutters 38A and 38B are as shown in FIG. 3, for example (please read & read the precautions before reading this page)
Jt9 線 本紙张尺度谪川屮阀阄家標卑（「NS ) Λ4規格（210X297公麓） -11- 411742 A7 B7 __五、發明説明（9 ) 藉由無負載缸所構成的驅動裝置3 8 D向薄膜寬度方向驅 動，向寬度方向每一次之往復動，在往動或復動之其中一 方以一次或在往動及復動之雙方以兩次，可切斷蓋薄膜 1 4 C ° 上述圓盤刀具3 8 A ’ 3 8 B係切斷蓋薄膜1 4 C及 感光性樹脂層1 4 B時，其前端刀尖3 9如第5圖所示’ 設成凹進透光性支持薄膜1 4 A之厚度方向一部分。 一般，例如感光性樹脂層1 4 B之厚度爲數μ m時’ 蓋薄膜1 4 C係十數# m，而透光性支持薄膜係大約 lOOym，對此，由於圓盤刀具38A，38B之徑向 的直徑之偏差係最大也爲.數/，因此，前端刀尖3 9設 成例如凹進透光性支持薄膜1 4 A約1 0 μ m，即可確定 地切斷感光性樹脂層i 4 B。 由於透光性支持薄膜1 4 A係即使被切斷至其厚度方 向約1 / 2，在後續過程從基板剝離時也不會破損，因此 ，即使圓盤刀具3 8A，38 B之徑在偏差範圍內成爲最 大，該凹進量也不會超過2 0 ，因此，在後續過程也 不會有透光性支持薄膜1 4 A有損傷之情形。 上述刀具台3 8 C與驅動裝置3 8 D係形成藉由半刀 具移動裝置4 0同步於疊層體薄膜1 4之移送，向相同方 向以等速移動。故，圓盤切斷器3 8A，3 8B係不會停 止疊層體薄膜1 4之移送，可實行行走間切斷。 該半刀具移動裝置4 0係包含與薄膜搬運面平行地配 置的齒條4 0 A，及嚙合於齒條4 0 A的小齒輪4 0 B， (請先閱讀背而之注意事項再硝，"本页) 'V9 線 本纸张尺度鸿川十闽阀家標冷.（rNS ) Λ4規輅（2丨ΟΧ2.97公釐） -12- A7__411742 B7 _五、發明説明（10 ) 將小齒輪4 0 B安裝於刀具台3 8 C及驅動裝置3 8D側 ，藉由馬達4 0 C來驅動該小齒輪4 0 B，將圓盤刀具 38A1，38B與刀具台38C同步於疊層體薄膜14並 予以移動者。 半刀具3 8及半刀具移動裝置4 0係藉控制裝置4 6 加以控制，又半刀具3 8依第1〜第3計數器4 7A， 47B，47C之順序地輸出》 此等第1〜第3計數器47A，47B，47C係輸 入有來自控制裝置4 6之開始切斷定時信號時，分別開始 計數來自上述旋轉編碼器2 7之脈衝信號，計數疊層體薄 膜1 4上之切斷部位到達設於上述疊層輥2 2A，2 2B 入側近旁的特定點（假想點）4 9 A爲止的薄膜移送量時 ，能將到達檢測信號輸出至上述控制裝置4 6。第1〜第 3計數器4 7 A，4 7 B，4 7 C係在輸出到達檢測信號 後，藉控制裝置4 6施以復置。 在上述附與拉力之吸'入輥2 8與疊層輥2 2A， 2 2 B之間，依順序配置有用以引導蓋薄膜1 4 C被剝離 之疊層體薄膜1 4 (透光性支持薄膜1 4 A與感光性樹脂 層14B)的導輥42A，42B，及薄膜預熱器42C σ 在上述上側之導輥4 2 Α設有拉力拾取器4 4。藉由 施加於導輥4 2 A之力量，檢測在該位置之疊層體薄膜 1 4之拉力，由此，經由控制裝置4 6控制上述附與拉力 之吸入輥2 8之負壓，使薄膜拉力成爲最適當。 4_、紙張尺廋诚用巾國1¾.家榡肀（CNS } Λ4規格（2】0·〆297公釐） -13 - (誚先閱讀背而之注意事項再填寫本玎) 訂 線 411742 at B7 較泌部t-^梂氺扃只'消资合ΐϊτίΊ.卬y 五、發明説明（11 ) ' 1 1 導 輥 4 2 B 係 引 導 疊 層 體 薄 膜 1 4 斜 進 疊 層 輥 2 2 A I I ) 2 2 B 之 間 者 t 又 ? 薄 膜 預 熱 器 4 2 C 係在 剛 基 板 壓 接 I 1 之 -Λ-t 刖 將 蠱 層 體 薄 膜 1 4 加 熱 至 所定 溫 度 者 〇 1*1 [ 1 I 第 1 圖 之 記 號 4 8 係用 以 加 熱 形 成在 基 板 搬 運 裝 置 先 閱 讀 1 1 1 8 之 上 j-tLr m 的 基 板 搬 運 面 1 8 A 上 之 基 板 2 0 的 加 熱 器 〇 背， 而 之 1 1 在 上 述 疊 層 輥 2 2 A 2 2 B 之 下 游 側 配 置 有於 基 注\ 意 京 1 | 板 搬 運 方 向 隔 離 地 配 置 之 夾 送 輥 5 0 A 5 0 B 而在其 Ψ 項 再 1 填 1 上 方 配 置 有支 持 薄 膜 捲 繞 輥 6 0 〇 上 側 之 夾 送 輥 5 0 A 係 Μ 本 y \ 成 爲 由 控 制 裝 置 4 6 施 以 控 制 之狀 態 〇 頁 1 i 上 述 上 側 之 Φ 層 輥 2 2 A 係 藉 疊 層 輥 開 閉 裝 置 5 6 ( 1 1 參 照 第 1 圖 第 4 圖 ) 對 於 下 側 之 疊 層 輥 2 2 B 成 爲 離 接 1 1 ( 開 閉 ) 商 如 之 狀 態 當 基 板 2 0 之 刖 端 到 達 疊 層 輥 訂 1 2 2 A 2 2 B 間 之位 置 時 藉 由 控 制 裝 置 4 6 成 爲 夾 入 1 1 該 基 板 2 0 之 厂 閑 J 狀 態 又 基 板 後 端 從 疊 層 輥 2 2 A 1 1 ) 2 2 B 間 脫 離 時 成 爲 厂 開 J 之 狀 m Jr、·、 〇 1 沿 著 上 述 基 板 搬 運 面 1 8 A 在 上 述 預 熱 器 4 8 之 出 線 | 側 端 部 與 疊 層 輥 2 2 A 2 2 B 之 間 如 第 1 圖 所示 從 1 I 預 熱 器 4 8 側 依 順 序 配 置 有 第 1 基 板 察 覺 器 5 8 A 自 由 1 1 1 輥 1 9 A 第 2 基 板 察 覺 器 5 8 B 移 送 輥 1 9 B 0 移 送 - 1 ! 輥 X 9 B 係形成 與 疊 層 輥 2 2 A 2 2 B 以 等 速 旋 轉 之 狀 1 1 態 〇 1 I 上 述 第 2 基 板 察 覺 器 5 8 B 係配 置 於來 白 疊 層 輥 1 1 | 2 2 A 2 2 B 之距 離 相 等 於上述特 定 點 4 9 A 與 疊 層 輕 1 1 2 2 A 2 2 B 間 之 距 離 的 待 機 點 ( 假 想 點 ) 4 9 B 之正 1 1 1 本紙张人瓜過川屮阐1¾家榡命（（，NS ) Λ4现格（210 x 297公漦） 14- __ 411742 ；； 五、發明説明（12 ) 下方。 控制裝置46係藉來自上述第1，第2基板察覺器 58Ai 58B之信號，及來自第1〜第3計數器47A 〜4 7 C之信號，來控制搬運裝置1 8，疊層輥用開閉裝 置5 6等，惟詳細將予下述。 以下，說明上述薄膜貼上裝置之作用。 首先，從薄膜輥1 2捲出疊層體薄膜1 4，經導輥 26A，26B，附與拉力之吸入輥28，導輥42A， 4 2 B後，通過待機狀態（開狀態）之疊層輥2 2 A， 2 2 B之間，又通過開狀態之夾送輥5 0 A，5 Ο B間， 將前端被捲取在支持薄捲繞輥6 0之後關閉夾送輥5 0A 〇 此時，蓋薄膜1 4 C係藉蓋薄膜剝離裝置1 6，從其 前端剝離後'予以捲取。 又，在控制裝置4 6，輸入，設定先行基板之後端與 後端基板之前端間的間隙。對於基板之薄膜貼上長度（圖 案化長度），及從貼上境界至基板端之邊緣的資料等- 然後1將薄膜貼上裝置1 0整體予以動作，此時，半 刀具3 8係事先設定成該圓盤刀具3 8A，5 8B間的薄 膜移送方向距離，比貼上疊層體薄膜1 4之狀態的先行基 { 板之後端及後行基板之前端間的距離稍廣1。 當薄膜貼上裝置被動作時，首先，控制裝置4 6係開 始夾送輥5 0 A，5 Ο B之旋轉，附與拉力之吸入輥2 8 之施加負壓，旋轉。又，疊層體薄膜1 4之移送速度成爲 ---------f------ΐτ------ * * (請先閱讀背而之注意事項再填寫本頁} 本紙張尺度適/Π十构囤家標々.（rNS ) Λ4规格（210X297公赞〉 -15- 411742 at __B7 _ 五、發明说明〇3 ) 一定時’搬運疊層體薄膜1 4之狀態下，將半刀具3 8藉 由半刀具移動裝置4 0與疊層體薄膜1 4同步並予以移動 。藉由驅動裝置3 8D來驅動圓盤刀具3 8A，3 8B， 將蓋薄膜1 4 C與其背面側之感光性樹脂層1 4 B —起， 向薄膜寬度方向切斷（參照第5圖）。在該切斷時，如上 所述’由於圓盤刀具3 8A，3 8 B之刀尖係設定成凹進 透光性支持薄膜1 4A約1 〇 μΜ，因此，藉由圓盤刀具 3 8 A ’ 3 8 Β之製造上之偏差，即使刀具之半徑成爲偏 差之最小限界，也可以確實地切斷感光性樹脂層1 4 B。 又’即使圓盤刀具3 8A，3 8 B之直徑在容許之偏 差範圍內成爲最大値。也不會有透光性支持薄膜1 4 A之 切斷深度成爲過剩，而在後續製程也不會從該處破損。 另一方面，由於蓋薄膜剝離裝置1 6，係將從黏接帶 輥3 0所捲出之黏接帶3 2，在推壓輥3 4 A，3 4 B間 強壓接於蓋薄膜1 4 C之後，藉由捲取輥3 6來捲取，因 此，蓋薄膜1 4 C係與黏接帶3 2 —起被捲取，而從感光 性樹脂層1 4 B被剝離。 由於黏接帶3 2係連續地壓接於蓋薄膜1 4 C，因此 ，藉由上述圓盤刀具38A，38B有切斷線部分1也確 實地被黏接而被捲取在捲取輥3 6。 藉由半刀具38之圓盤刀具38六/388，當蓋薄 膜1 4 C被切斷時，疊層體薄膜14係藉由控制薄膜輥1 2 之旋轉的轉矩馬達1 2 A，及一面吸附疊層體薄膜1 4 一 面施以移動的上述附與拉力之吸入輥2 8 ，在切斷時附與 II I I I, . n I. 線 t (誚先閱讀背而之注意事項再填衿本頁} 本纸张夂度蝻州中因國家標碑丨ΓΝδ ) Λ4说格（210X297公f } -16- 411742 kl B7 -*---- 五、發明説明（14 ) • 1 I m 取 適 當 之 拉 力 0 1 I 半 刀 具 輸 入 開 始 薄 膜 之 切 me. m 之 定 時 的 信 號 時 j 第 1 計 1 I 數 器 4 1 A 係 開 始計 數 旋 轉 編 碼 器 2 7 所 產 生 之 脈 衝 0 η 1 1 蓋 薄 膜 剝 離 裝 置 1 6 剝 離 蓋 薄 膜 1 4 C » 而 感 光性 樹 先 閱 讀 ! 1 脂 層 1 4 B 路 出 之 疊 層 體 薄 膜 1 4 j 係 以 該 感 光性 樹 脂 層 背Τ 面 之 I 1 1 4 B 成 爲 基 板 搬 運 面 1 8 A 側 通 過 導 輥 4 2 A 1 ii 意* 亩 1 I 4 2 B 及 薄 膜 預 熱 器 4 2 C 位 置 到 達 疊 層 輕 2 2 A Ψ 項 1 填 1 2 2 B 之 近 旁 〇 本 另 一 方 面 基 板 2 0 係被 待 微 在加 熱 器 4 8 之 位 置 > 1 1 上 述 第 1 計 數 器 4 7 A 之計 數 値 到 達 基 板 接 受 定時 値 ( 1 1 1 C 1 ) 時 藉 由 控 制 裝 置 4 6 基 板 搬 運 裝 置 1 8 被 導 1 I 通 同 時 施 以 第 2 枚 之 基 板 2 0 之 接 受 指 示 □ 訂 { 最 初 之 基 板 2 0 之 刖 端 越 、、xa m 第 1 基 板 察 覺 器 5 8 A 而 1 1 達 到 第 2 基 板 察 覺 器 5 8 B 時 則停 止 基 板 搬 運 裝 置 1 8 1 I 基 板 2 0 係 以 待 機 點 4 9 B 待 機 0 1 t 第 1 計 數 器 4 7 A 之計 數 値 薄 膜 之 切 斷 線 成 爲 達 到 線 I 特定 點 4 9 A 之 數 値 ( K 2 値 ) 時 控 制 裝 置 4 6 係在 該 1 I 定 時 來 驅 動 基 板 搬 運 裝 置 18 ( 包含 移 送 輥 ) 9 B ) 將 Λ 1 1 基 板 2 0 與 薄 膜 同 步 地 送 入 疊 層 輥 2 2 A 2 2 B 間 0 1 1 1 上 側 之 疊 層 輥 2 2 A 係 基 板 2 〇 之 Ji J . 刖 端 到 其 正 下 方 位 1 1 置 時 藉 疊 層 輥 開 閉 裝 置 5 6 從 厂 開 J 狀 態 成 爲 厂 閉 J 狀 1 I 能 基 板 2 0 係 與 疊 層 體 薄 膜 1 4 "~· 起被 夾持在 疊 層 輥 1 ( 2 2 A 2 2 B 間 由 此 在 藉 由 基 板 運 送 裝 置 1 8 所 搬 1 1 1 運 之 基 板 2 0 之 上 面 t 壓 接 感 光 性 樹 脂 層 1 4 B 之狀 態 下 1 1 ! 本紙張尺度油爪屮闽阀家輮彳（CNS ) Λ4規格U〗〇X 297公犛） .Λγ , «'.老部十Λ標丨局只.Ti/ί资合；印緊 411742 at B7五、發明説明（15 ) ，疊層體薄膜1 4貼上於基板2 0 = 上述K 2値係藉由上述下游側之圓盤刀具3 8 B被切 斷之位置，設成位於基板後端近旁之薄膜貼上面上之位置 ，又，對於後行之基板2 0之前端，藉上游側之圓盤刀具 3 8 A的切斷位置設定成位於該後行基板之前端近旁的薄 膜貼上面上。 另一方面，對於後行基板（第2基板），第1計數器 4 7 A之計數値成爲基板之長度分量之脈衝數時，藉控制 裝置4 6開始半刀具3 8之切斷動作，同時地開始依第2 計數器4 7 B之脈衝的計數^ 當第2計數器4 7 B之計數値成爲基板長度時，開始 第3計數器4 7 C之計數，之後重複開始第1計數器 47A之計數的工程。 第2枚以後之基板2 0係其前端到達第1基板察覺器 5 8 A之狀態下暫時停止，以後，先行基板2 0之後端內 第2基板察覺器5 8 B被檢測之後，後行基板2 0係進行 至其前端被第2基板察覺器5 8 B檢測，在待機點4 9 B 待機，與上述第1基板2 0之情形同樣地被控制> 如上所述1藉由基板搬運裝置1 8，將基板2 0搬運 至疊層輥22A，22B時，以比疊層體薄膜14較快之 定時到達疊層輥2 2 A，2 2 B之入側近旁，暫時停止之 後，當接近疊層體薄膜1 4上的對應部位時，與此同步地 再進行。則基板2 0與疊層體薄膜1 4之同步成爲更確實 ---------.------ΪΓ-----.線 (請先閱讀背而之注意事項再填tr本頁― 木紙张尺度诚用中闽IS家標乎.（CNS ) AAi-m ( 2IOX 297/^f ) -18- 411742 A7 B7 五、發明説明（16 ) 1 因此，將貼上於間歇地搬運之複數基板2 0上的疊層 體薄膜1 4，介經圓盤刀具3 8 A，3 8 B切斷之切斷線 39At 39B，係成爲表示於第6圖之狀態。 在該狀態，將貼上於基板之透光性薄膜1 4 A，經上 側之夾送輥5 Ο A介經由支持薄膜捲取輥予以捲取時，則 如第7圖所示，基板2 0上之感光性樹脂層1 4 B係以附 著於該基扳2 0之狀態下留下，因各基板2 0，2 0間之 感光性樹脂層1 4 B係沒有附著之對象，因此，在切斷線 3 9 A，3 9 B位置從基板上之感光性樹脂層1 4 B分離 ，而以附著在透光性支持薄膜14A之狀態下被捲取在薄 膜捲取輥6 0。 因此，透光性支持薄膜1 4A由基板2 0剝離之同時 1各基板2 0成爲被分離。又，冷卻上側之夾送輥5 0A 之外圓週時，則感光性樹脂層1 4 B之黏度降低，使分離 成爲確實。 在夾送輥50A，50B之出側近旁’如在第1圖中 以部號6 2所示，設置銳角地引導透光性支持薄膜1 4 A 的分離構件較理想。此時’可順利地實行感光性樹脂層 1 4 B之透光性支持薄膜側與基板2 0側部分之分離。 又，在上述實施形態之例子中，疊層體薄膜係疊層透 < 光性支持薄膜’感光性樹脂層及蓋薄膜者’惟本發明係如 第8圖所示，透光性支持薄膜1 5 A及感光性樹脂層 1 5 B所形成，也適用於使用未具備蓋薄膜之疊層體薄膜 1 5之情形者。此時，刀具係成爲僅切斷感光性樹脂層’ κ :¾ ) Λ 4規格（21 ο X 29 7公f } - 19 - (誚先閱绩背面之注意事項4填巧本頁) 訂 411742 ΑΊ Β7 五、發明説明（17 ) ' 或是切斷透光性支持薄膜之一部與感光性樹脂層。 在此，本發明所推之切斷係切斷感光性樹脂層者就可 以實質上包含除去者。 又，上述半刀具3 8係與疊層體薄膜1 4同步地移動 下，在行走間切斷該疊層體薄膜1 4者，惟本發明係並不 被限定於此者，例如在半刀具3 8與疊層輥2 2 A， 2 2 B之間的位置，設置儲存疊層體薄膜1 4之儲存器， 將疊層體薄膜14供應於疊層輥22A，22B，惟在半 刀具3 8之位置上停止疊層體薄膜1 4之移送，切斷蓋薄 膜14C之構成也可以。 又，上述切斷線3 9A，3 9 B係薄膜貼上於基板 2 0之狀態，作爲比基板2 0之搬運方向端面僅偏向基板 上面中心側之位置，惟本發明係並不被限定於此者，如表 示於第9 (A)至（E)圖，成爲與基板20之端面相同 位置，或是溢出位置也可以。 又，本發明係將疊層體薄膜貼上於基板之下面或兩面 時，將基板向上下方向或斜方向搬運下，在其一面或兩面 貼上疊層薄膜時也可適用者。 又，在上述實施形態之例子中，透光性支持薄膜 1 4 A，係在貼上於基板2 0之後連續地剝離1惟本發明 係並不被限定於此者，在各基板2 0間之位置，著刀具施 以切斷也可以。 各基板2 0係藉由該切斷被分離。又，透光性支持薄 膜1 4Α及不要部分之感光性樹脂層1 4 Β，係在該切斷 ---------V------11------^ =* (¾先閱讀背而之注意事項再^'本I ) 本纸張尺度试州中阀1¾家標呤（（，NS ) Λ4規格（210Χ297公漦） -20 - ‘部十Aif準^H.r.消t合竹.=1-1印私 411742 Α7 Β7 五、發明説明（18 ) ‘ 後，藉引拉從基板2 0溢出部分而被剝離。 又，上述半刀具3 8係使用一對圓盤刀具3 8Α， 3 8 Β者，惟本發明係並不被限定於此者，將其他之刀具 ，例如將直刀刃狀刀具行走在薄膜寬度方向者也可以，或 是，依半刀具之感光性樹脂層之切斷位置係在疊層輥之下 游側也可以。 在疊層輥之下游側切斷感光性樹脂層時，一般成爲在 接近於先行基板之後端與後行基板之前端的位置施以切斷 者。 (圖式之簡單說明） 第1圖係包括表示本發明之實施形態之薄膜貼上裝置 之一部分方塊圖的槪略側面圖。 第2圖係放大表示同薄膜貼上裝置所使用之疊層體薄 膜的剖面圖。 第3圖係表示同薄膜貼上裝置之半刀具之要部的斜視 圖。 第4圖係表示同薄膜貼上裝置之控制系統的方塊圖。 第5圖係放大表示藉半刀具切斷中之疊層體薄膜的剖 面圖。 f 第6圖係表示將疊層薄膜貼上於基板之狀態的放大剖 面圖。 第7圖係放大表示從基板剝離疊層體薄膜之狀態的剖 面圖。 (对先閱讀背..S之注意ί項再填.??本I) -•tl 腺 木紙張尺度屮阀囚家樣个（（:NS ) Λ4规格（2丨Ο X 297公漦） -21 - ^1742 A7 五、發明説明（19 ) ' 第8圖係放大表示其他疊層體薄膜的剖面圖。 第9圖係表示疊層體薄膜對於基板之各種貼上態樣的 放大剖商圖。 第10圖係表示半切斷不完全時之疊層體薄膜的放大 剖面圖。 (記號之說明） 10 薄膜貼上裝置 1 2 薄膜輥 14-15 疊層體薄膜 16 蓋薄膜剝離裝置 18 基板搬運裝置 2 0 基板 2 6 A - 2 6 B 導輥 27 旋轉編碼器 28 附與拉力之吸入輥 3 0 黏接帶輥 3 2 黏接帶 3 4 A - 3 4 B 推壓輥 3 4 C 導輥 3 6 捲取輥 3 8 半刀具 3 8 A - 3 8 B 圓盤刀具台 3 8 C 刀具台 本紙张尺度诚川中因囤家標肀（（'NS ) Λ4規格（21 0X 297公梦—） .22 - (誚先間讀背而之;±意事項再填寫本頁} T -νβ .:線 411742 Αν B7五、發明説明（2〇 ) 3 9 前端刀尖 40 半刀具移動裝置 4 0 A ί 齒條 4 0 Β 小齒條 4 0 C 馬達 4 6 控制裝置 4 8 加熱器 5 0 A * 5 0 Β 夾送輥 5 6 疊層輥開閉裝置 5 8 A 第1基板察覺器 5 8 B 第2基板察覺器 60 支持薄膜捲取輥 62 分離構件。 ---------f-------訂------>線 Λ (誚先閱讀背1€Ι之注意事項再填寫本頁) 木紙悵尺度適川中阀阀家標;?_( ('NS > Λ4規格（210'乂 297公1 ) -23-Jt9 line paper scale 谪 gawa 屮 valve 阄 house standard ("NS) Λ4 specification (210X297 Gonglu) -11- 411742 A7 B7 __V. Description of the invention (9) Drive device composed of no-load cylinder 3 8 D Driven in the width direction of the film, each reciprocating movement in the width direction, once in one of the forward or double movements, or twice in both the forward and double movements, can cut the cover film 1 4 C ° When the above-mentioned disc cutter 3 8 A '3 8 B is used to cut the cover film 1 4 C and the photosensitive resin layer 1 4 B, the tip 3 9 of the tip is shown in FIG. Part of the thickness direction of the film 1 4 A. Generally, for example, when the thickness of the photosensitive resin layer 1 4 B is several μm, the cover film 1 4 C is ten tens # m, and the transmissive support film is about 100 μm. Since the radial diameter deviation of the disk cutters 38A and 38B is also the largest number, the front tip 39 is set to, for example, a recessed transparent support film 1 4 A of about 10 μm, that is, The photosensitive resin layer i 4 B can be cut with certainty. Since the light-transmissive supporting film 1 4 A is cut to a thickness direction of about 1/2, It will not be damaged when it is peeled from the substrate during the process. Therefore, even if the diameters of the disk cutters 38A and 38B become the largest within the deviation range, the recessed amount will not exceed 20, so there will be no subsequent processes. The translucent support film 1 4 A may be damaged. The above-mentioned tool table 3 8 C and the driving device 3 8 D are formed by the half-tool moving device 40 to synchronize the movement of the laminated film 1 4 in the same direction. It moves at a constant speed. Therefore, the disc cutters 3 8A and 3 8B do not stop the transfer of the laminated film 14 and can perform cutting between walks. The half cutter moving device 40 includes a film parallel to the film conveying surface. The configured rack 4 0 A and the pinion 4 0 B meshing with the rack 40 A, (Please read the precautions on the back first, and then quoting this page) 'V9 paper size Hongchuan Shimin Valve house standard cold. (RNS) Λ4 gauge (2 丨 〇 × 2.97 mm) -12- A7__411742 B7 _V. Description of the invention (10) Install the pinion 4 0 B on the tool table 3 8 C and drive device 3 On the 8D side, the pinion 4 0 B is driven by a motor 4 C, and the disk cutters 38A1, 38B and the tool table 38C are synchronized with the laminated film. 14 and move them. The half tool 3 8 and the half tool moving device 40 are controlled by the control device 4 6, and the half tool 3 8 is output in the order of the first to third counters 4 7A, 47B, 47C. When the first to third counters 47A, 47B, and 47C are input with the start-cut timing signals from the control device 46, they start counting pulse signals from the rotary encoder 27, respectively, and count on the laminated film 14 When the cut position reaches the film transfer amount up to a specific point (imaginary point) 4 9 A provided near the entrance side of the above-mentioned laminating rolls 2 2A, 2 2B, the arrival detection signal can be output to the control device 46. The first to third counters 4 7 A, 4 7 B, and 4 7 C are reset by the control device 46 after the output detection signals are reached. A laminate film 1 4 (light-transmitting support) for guiding the cover film 1 4 C to be peeled off is arranged in this order between the suction-suction suction roller 28 and the lamination rollers 2 2A, 2 2 B in this order. The guide rollers 42A, 42B of the film 1 4 A and the photosensitive resin layer 14B), and the film preheater 42C σ are provided with a tension pickup 44 on the upper guide roller 4 2 A. The tensile force of the laminated film 14 at this position is detected by the force applied to the guide roller 4 2 A, and thus the negative pressure of the suction roller 28 with the tensile force is controlled by the control device 46 to make the film Rally becomes the most appropriate. 4_ 、 Paper ruler: Sincerely used towel country 1¾. Furniture (CNS) Λ4 specification (2) 0 ·） 297mm) -13-(诮 Please read the precautions on the back first and then fill in this card) 411742 at B7 Compared to the secretory part t- ^ 梂 氺 扃 只 '消 资 合 ΐϊτίΊ. 卬 y V. Description of the invention (11)' 1 1 Guide roll 4 2 B-based guide laminated film 1 4 Slant feed lamination roll 2 2 AII ) Which is between 2 2 B and t? The film preheater 4 2 C is -Λ-t on the rigid substrate and is crimped to I 1-蛊 The layered film 1 4 is heated to a predetermined temperature 〇1 * 1 [1 I The symbol 4 in FIG. 1 is a heater for heating the substrate conveying surface formed on the substrate conveying device to read the j-tLrm above 1 1 1 8 1 on the substrate 20 on the 8 A, and the back 1 1 On the downstream side of the above-mentioned lamination roll 2 2 A 2 2 B, a pinch roll 5 0 A 5 0 B which is arranged in the base note \ Yijing 1 | board conveying direction is isolated, and 1 is filled in the top of the item 1 With support for film rolls Roller 6 0 〇Pinching roller 50 A on the upper side M y \ is in a state controlled by the control device 4 6 〇Page 1 i The above-mentioned Φ layer roller 2 2 A is opened and closed by the laminating roller 5 6 (1 1 Refer to the first figure and the fourth figure.) For the lower lamination roller 2 2 B, it is separated from the 1 1 (open and closed) state of commerce, when the end of the substrate 2 0 reaches the lamination roller. 1 2 2 A 2 When the position between 2B, the control device 4 6 will be clamped 1 1 The substrate 20 is in the factory idle J state, and the rear end of the substrate is removed from the lamination roller 2 2 A 1 1) When the 2 B is separated, it becomes the factory open J The state m Jr, ·, 〇1 along the substrate conveying surface 1 8 A between the exit of the preheater 4 8 | side end and the lamination roller 2 2 A 2 2 B as shown in Figure 1 The first substrate detector 5 is arranged in order from the side of the 1 I preheater 4 8 5 8 A free 1 1 1 roller 1 9 A 2nd substrate detector 5 8 B transfer roller 1 9 B 0 transfer-1 The roll X 9 B is formed in a state of 1 1 and the lamination roll 2 2 A 2 2 B is rotated at a constant speed. 1 I The above-mentioned second substrate detector 5 8 B is arranged on the white lamination roll 1 1 | 2 The distance between 2 A 2 2 B is equal to the above-mentioned specific point 4 9 A and the stand-by point (the imaginary point) of the distance between the light 1 1 2 2 A 2 2 B 4 9 B positive 1 1 1 Chuanxiong explained the fate of the family ((, NS) Λ4 is now (210 x 297)) 14- _ 411742; 5. The description of the invention (12) is below. The control device 46 controls the conveying device 18 and the opening / closing device 5 for the lamination rollers by signals from the first and second substrate sensors 58Ai 58B and signals from the first to third counters 47A to 4 7 C. 6 and so on, but the details will be described below. The operation of the above-mentioned film application device will be described below. First, the laminated film 14 is rolled out from the film roll 12 and passed through the guide rolls 26A, 26B, the suction roller 28 with the tensile force, and the guide rolls 42A, 4 2 B, and then passes through the stack in the standby state (open state). Between the rollers 2 2 A, 2 2 B, and through the open pinch rollers 5 0 A, 50 B, the leading end is wound up to support the thin winding roller 60, and then the pinch roller 5 0A is closed. At this time, the cover film 1 4 C is taken up by the cover film peeling device 16 and peeled off from its front end. In the control device 46, the gap between the rear end of the preceding substrate and the front end of the rear substrate is input and set. For the film pasting length (patterned length) of the substrate, and the data from the pasting realm to the edge of the substrate, etc.-then 1 the film is attached to the device 10 and the whole operation is performed. At this time, the half cutter 3 8 is set in advance The distance in the film transfer direction between the disk cutters 3 8A, 5 8B is slightly wider than the distance between the leading substrate {the rear end of the board and the leading end of the rear substrate 1 in the state where the laminated film 14 is attached. When the film attaching device is actuated, first, the control device 4 6 starts the rotation of the pinch rollers 50 A, 50 B, and the suction roller 2 8 attached to the pulling force applies a negative pressure and rotates. In addition, the transfer speed of the laminated film 14 becomes --------- f ------ ΐτ ------ * * (Please read the precautions on the back before filling in this page } This paper is suitable for the standard / Π structure standard. (RNS) Λ4 specification (210X297 public praise) -15- 411742 at __B7 _ V. Description of the invention 〇 3) The state of the transported laminated film 14 at a certain time Next, the half cutter 3 8 is synchronized with the laminated film 14 by the half cutter moving device 40 and moved. The disk cutters 3 8A, 3 8B are driven by the driving device 3 8D, and the cover film 1 4 C is moved. It is cut with the photosensitive resin layer 1 4 B on the back side in the width direction of the film (refer to FIG. 5). At the time of the cutting, as described above, 'the blades of the disk cutter 3 8A, 3 8 B Since the recessed light-transmitting supporting film 1 4A is set to about 10 μM, the manufacturing deviation of the disk cutter 3 8 A '3 8 Β can be confirmed even if the radius of the cutter becomes the minimum limit of the deviation. Cut the photosensitive resin layer 1 4 B. Even if the diameters of the disk cutters 3 8A and 3 8 B become the maximum within the allowable deviation range, there will be no transparent support film. The cutting depth of 1 4 A becomes excessive, and it will not be damaged in the subsequent processes. On the other hand, the cover film peeling device 16 is an adhesive tape rolled from the adhesive tape roller 30 3 2. After the pressure rollers 3 4 A and 3 4 B are strongly pressure-bonded to the cover film 1 4 C, they are taken up by the take-up roller 36, so the cover film 1 4 C is connected to the adhesive tape 3 2 -It is wound up and peeled off from the photosensitive resin layer 1 4 B. Since the adhesive tape 3 2 is continuously crimped to the cover film 1 4 C, it is cut by the above-mentioned disc cutters 38A and 38B. The wire portion 1 is also reliably adhered and wound up on the take-up roll 36. With the half cutter 38 of the disk cutter 38/6/388, when the cover film 1 4 C is cut, the laminated film 14 It is a torque motor 1 2 A that controls the rotation of the film roll 12 and the suction roller 2 8 with the above-mentioned tensile force that is applied while the laminated film 1 4 is adsorbed, and II III is attached at the time of cutting. ,. n I. Line t (诮 Please read the precautions before filling in this page} This paper is based on the national inscription in Yinzhou 丨 Γδδ Λ4 (210X297 公 f) -16- 411742 kl B7 -*---- Fives, Explanation (14) • 1 I m Take the appropriate pulling force 0 1 I When the half-tool enters the signal to start the film cutting me. M timing signal j First count 1 I Counter 4 1 A Series start counting rotary encoder 2 7 Generated pulses 0 η 1 1 Cover film peeling device 1 6 Cover film peeling 1 4 C »And the photosensitive tree reads first! 1 Fat layer 1 4 B The laminated film exiting 1 4 j is based on the photosensitive resin I 1 1 4 B on the back side of the layer becomes the substrate conveying surface 1 8 A side through the guide roller 4 2 A 1 ii Note * Mu 1 I 4 2 B and the film preheater 4 2 C reach the laminated light 2 2 A Ψ Item 1 Fill in the vicinity of 1 2 2 B. On the other hand, the substrate 2 0 is left at the position of the heater 4 8 > 1 1 The above-mentioned first counter 4 7 A counts up to the substrate receiving timing 値 (1 1 1 C 1) is guided by the control device 4 6 substrate transfer device 1 8 1 I pass the acceptance instruction of the second substrate 2 0 at the same time □ Order {the original substrate 2 0 of the end of the board, xa m the first substrate detector 5 8 A and 1 1 reaches the second substrate detector 5 At 8 B, the substrate conveying device is stopped. 1 8 1 I The substrate 2 0 is at the standby point 4 9 B Standby 0 1 t The first counter 4 7 A counts the cut line of the film to reach the specific point of line I 4 9 A When counting (K 2 値), the control device 4 6 drives the substrate transfer device 18 (including the transfer roller) 9 B at this 1 I timing. Λ 1 1 The substrate 2 is fed into the lamination roller 2 2 in synchronization with the film. A 2 2 B room 0 1 1 1 Laminating roller on the upper side 2 2 Ji J of A-based substrate 2 〇 The end is directly below the position 1 1 When the laminating roller opening and closing device 5 6 is placed, the state from the factory opening J becomes Factory closed J-shaped 1 I energy substrate 2 0 system and laminate film 1 4 " ~~ are held between the lamination rolls 1 (2 2 A 2 2 B, thus In the state where the photosensitive resin layer 1 4 B is crimped by the substrate conveying device 1 8 carried 1 1 1 on the substrate 2 0 1 1! This paper scale oil claw 屮 Min valve home 輮 彳 (CNS) Λ4 Specifications U〗 〇X 297 male 牦) .Λγ, «'. Old Ministry Ten Λ standard 丨 Bureau only. Ti / ί capital; printed tightly 411742 at B7 V. Description of the invention (15), laminated film 1 4 stickers On the substrate 2 0 = The above K 2 値 is a position where the disk cutter 3 8 B on the downstream side is cut off, and it is set to the position on the upper surface of the film near the rear end of the substrate. At the front end of the substrate 20, the cutting position by the upstream disk cutter 3 8 A is set to the upper surface of the film located near the front end of the rear substrate. On the other hand, for the following substrate (second substrate), when the count of the first counter 4 7 A becomes the number of pulses of the length component of the substrate, the control device 4 6 starts the cutting operation of the half cutter 3 8 and simultaneously Start counting pulses according to the second counter 4 7 B ^ When the count 値 of the second counter 4 7 B becomes the length of the substrate, the counting of the third counter 4 7 C is started, and then the counting process of the first counter 47A is repeated. The second and subsequent substrates 20 are temporarily stopped when the front end reaches the first substrate detector 5 8 A, and after that, the second substrate detector 5 8 B in the rear end of the preceding substrate 20 is detected, and the subsequent substrate The 2 0 system is detected until the front end is detected by the second substrate sensor 5 8 B, and is waited at the standby point 4 9 B, and is controlled in the same manner as in the case of the first substrate 20 above. 18. When the substrate 20 is transferred to the laminating rolls 22A and 22B, it arrives near the entrance side of the laminating rolls 2 2 A and 2 2 B at a faster timing than the laminated body film 14. After temporarily stopping, when approaching In the case of corresponding portions on the laminated film 14, it is performed in synchronization with this. Then the synchronization of the substrate 20 and the laminated film 1 4 becomes more reliable. --------.-------- ΪΓ -----. Fill out this page ― Wooden paper scales are used in China and Fujian IS standard. (CNS) AAi-m (2IOX 297 / ^ f) -18- 411742 A7 B7 V. Description of the invention (16) 1 The laminated film 14 on the plurality of substrates 20 intermittently conveyed is cut through the cutting lines 39At 39B through the disk cutters 3 8 A and 3 8 B, as shown in FIG. 6. In this state, when the translucent film 1 A attached to the substrate is taken up by the upper pinch roller 5 0 A through the supporting film take-up roller, as shown in FIG. 7, the substrate 20 The photosensitive resin layer 1 4 B is left in a state of being adhered to the base plate 20. Since the photosensitive resin layer 1 4 B between the substrates 20 and 20 is not an object to be adhered, The broken lines 3 9 A and 3 9 B are separated from the photosensitive resin layer 1 4 B on the substrate, and are wound on the film take-up roll 60 while being attached to the transparent support film 14A. Optical support film 1 4A while being peeled from substrate 2 0 The substrate 20 is separated. When the outer circumference of the upper pinch roller 50A is cooled, the viscosity of the photosensitive resin layer 14B decreases, and the separation becomes reliable. Near the exit sides of the pinch rollers 50A and 50B 'As shown in the first figure as part number 62, it is preferable to provide a separating member that guides the light-transmitting support film 1 4 A at an acute angle. At this time, the light transmission of the photosensitive resin layer 1 4 B can be smoothly performed. The part of the support film side and the substrate 20 side are separated. In the example of the above embodiment, the laminated film is a laminated transparent film < optical support film " photosensitive resin layer and cover film " As shown in FIG. 8, the transparent support film 15 A and the photosensitive resin layer 15 B are formed, and it is also suitable for a case where a laminated film 15 without a cover film is used. In this case, the cutter Is to cut only the photosensitive resin layer 'κ: ¾) Λ 4 specifications (21 ο X 29 7 male f)-19-(诮 Notes on the back of the first reading 4Fill this page) Order 411742 ΑΊ Β7 V. Description of the invention (17) 'Or, a part of a light-transmitting supporting film and a photosensitive resin layer are cut. Here, this The cutting system proposed in the next section may substantially include a person who removes the photosensitive resin layer. In addition, the above-mentioned half cutter 38 is moved in synchronization with the laminate film 14 and the laminate is cut during walking. The film 14 is one, but the present invention is not limited to this. For example, at a position between the half cutter 38 and the lamination rolls 2 2 A, 2 2 B, a storage for storing the laminated film 14 is provided. The laminated film 14 is supplied to the laminated rollers 22A and 22B, but the transfer of the laminated film 14 is stopped at the position of the half cutter 38, and the cover film 14C may be cut. In addition, the cutting lines 3 9A, 3 9 B are in a state in which the thin film is attached to the substrate 20, and the end surface is shifted only to the center side of the upper surface of the substrate than in the carrying direction of the substrate 20. However, the present invention is not limited to this. In this case, as shown in FIGS. 9 (A) to (E), it may be the same position as the end face of the substrate 20 or the overflow position. In addition, the present invention is applicable to a case where a laminate film is attached to the lower surface or both surfaces of a substrate, the substrate is transported in an up-down direction or an oblique direction, and the laminate film is applied to one or both surfaces thereof. In the example of the above-mentioned embodiment, the light-transmitting supporting film 1 4 A is continuously peeled off 1 after being attached to the substrate 20. However, the present invention is not limited to this. In this position, cutting with the cutter is also acceptable. Each substrate 20 is separated by this cutting. In addition, the light-transmissive supporting film 14A and the unnecessary photosensitive resin layer 1 4B are cut at this time --------- V ------ 11 ------ ^ = * (¾Read the precautions before back ^^ 本本) The paper size test state valve 1¾ house standard ((, NS) Λ4 specifications (210 × 297) 漦 -20-'部 十 Aif 准 ^ Hr eliminates the bamboo. = 1-1 Indian private 411742 Α7 Β7 V. Description of the invention (18), after being pulled away from the substrate 20 by pulling and pulling, it is peeled off. Also, the above-mentioned half-knife 3-8 series uses a pair of circles Disc cutters 3 8A, 3 8 B, but the present invention is not limited to this. Other cutters, such as straight blades, can be moved in the width direction of the film, or the sensitivity of the half cutter can be used. The cutting position of the flexible resin layer may be on the downstream side of the laminating roll. When cutting the photosensitive resin layer on the downstream side of the laminating roll, it is generally applied at a position close to the rear end of the leading substrate and the front end of the trailing substrate. (Simplified description of the drawing) Fig. 1 is a schematic side view including a block diagram showing a part of a film attaching device according to an embodiment of the present invention. Fig. 2 The enlarged view is a cross-sectional view of a laminated film used in the same film attaching device. Fig. 3 is a perspective view showing the main part of the half cutter of the same film attaching device. Block diagram of the control system. Fig. 5 is an enlarged cross-sectional view showing a laminated film during cutting by a half cutter. F Fig. 6 is an enlarged cross-sectional view showing a state where the laminated film is attached to a substrate. The figure is an enlarged cross-sectional view showing a state in which the laminate film is peeled off from the substrate. (Note to the back of the first reading..S and then fill in. ?? This I)-• tl gland wood paper scale 屮 valve prisoner sample ((: NS) Λ4 specifications (2 丨 〇 X 297 cm) -21-^ 1742 A7 V. Description of the invention (19) 'Figure 8 shows enlarged cross-sectional views of other laminated films. Figure 9 shows Enlarged cross-section quotient of various laminated states of the laminated film to the substrate. Fig. 10 is an enlarged sectional view of the laminated film when the half-cut is incomplete. (Description of symbols) 10 Film attaching device 1 2 Film roll 14-15 Laminate film 16 Cover film peeling device 18 Substrate carrying device 2 0 Substrate 2 6 A-2 6 B Guide roller 27 Rotary encoder 28 Suction roller with pulling force 3 0 Adhesive tape roller 3 2 Adhesive tape 3 4 A-3 4 B Push roller 3 4 C Guide roller 3 6 Take-up Roller 3 8 Half cutter 3 8 A-3 8 B Disc cutter table 3 8 C cutter table Paper size Seikawa Nakamura standard (('NS) Λ4 specification (21 0X 297 public dream —) .22-(读 Read it first; then fill in this page with the meanings. T-νβ.: Line 411742 Αν B7 V. Description of the invention (2〇) 3 9 Tip of the front end 40 Half-tool moving device 4 0 A ί rack 4 0 Β small rack 4 0 C motor 4 6 control device 4 8 heater 5 0 A * 5 0 Β pinch roller 5 6 lamination roller opening and closing device 5 8 A 1st substrate sensor 5 8 B 2nd substrate sensor 60 Supports the film take-up roll 62 to separate the members. --------- f ------- Order ------ > Line Λ (诮 Read the notes on the back 1 € Ι before filling in this page) Wood paper 怅 适中 川Valve valve standard;? _ (('NS > Λ4 size (210' 乂 297 male 1) -23-