JPH1134280A - Method and equipment for sticking film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cut a photosensitive resin layer of a laminate film used for film sticking equipment, together with a cover film, and to ensure positional alignment of a cut place with a base. SOLUTION: A cover film of a laminate film 14 supplied from a film roll 12 in film sticking equipment 10 is cut in the direction of the width of the film, together with a photosensitive resin layer, by a half cutter 38, and the whole cover film including the cut part is peeled consecutively from the photosensitive resin layer by an adhesive tape 32 of a cover film peeling device 16. A place to be cut by the half cutter 38 is detected by a rotary encoder 27, and at the time when the cut place reaches a specified point 49A, a base 20 standing by at a standby point 49B beforehand is sent between lamination rolls 22A and 22B synchronously with the cut place.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for attaching a film to a surface of a substrate such as a glass substrate of a printed wiring board, a liquid crystal display, or a plasma display.

[0002]

2. Description of the Related Art In the process of manufacturing a printed wiring board used for an electronic device such as a computer, a light-transmitting support film (usually a light-transmitting film represented by polyester) is formed on a conductive layer on the surface of the printed wiring board substrate. A laminate film in which a photosensitive resin layer is formed directly on the resin film) or through an intervening layer and which is covered with a cover film is peeled off and pasted on the cover film. After that, a wiring pattern film is overlaid, and the photosensitive resin layer is exposed for a predetermined time through the wiring pattern film and the translucent support film. Next, after the light-transmitting support film is peeled off, the exposed photosensitive resin layer is developed to form an etching mask pattern, and thereafter, unnecessary portions of the conductive layer are removed by etching. A printed wiring board having the above wiring pattern is formed.
Further, in the step of forming a display cell on a glass substrate of a liquid crystal display device or a plasma display device, a similar laminate film is stuck.

As a film sticking apparatus for sticking a laminate film as described above, a continuous film is unwound from a film roll, and the film is intermittently conveyed on a substrate conveying surface by a conveying means. Along the film-attached surface of a plurality of substrates, with the photosensitive resin layer on the film-attached surface side, the two are passed through a lamination roll in a stacked state, and the film is continuously applied to the plurality of substrates. There is a so-called continuous tension type in which a substrate is transported while being pressed.

The light-transmitting support film attached to the substrate must be peeled off before or after exposure and before the developing step while leaving the photosensitive resin layer on the substrate side. It must be separated between each substrate before or after stripping.

When the light-transmitting support film is pulled in the peeling direction, if the photosensitive resin layer on the back surface is continuous on the substrate from a portion protruding from the substrate, the light-transmitting support film may be left when the light-transmitting support film is peeled. There is a problem that the photosensitive resin layer on the substrate, which must be removed, is peeled off following the portion of the photosensitive resin layer which protrudes.

In order to solve these problems, conventionally, for example, in a film peeling device disclosed in Japanese Patent Application Laid-Open No. 7-157186, after a film is continuously attached to a substrate, the film is removed at a gap position between the substrates. Cut only the photosensitive resin layer in the film width direction along the edge of the substrate, and then
The light-transmitting support film is continuously peeled off, and at this time, a photosensitive resin layer in a portion between the respective substrates is attached to the peeled light-transmitting support film side.

In the film sticking apparatus disclosed in Japanese Patent Application Laid-Open No. 8-150694, slits are formed in advance in the width direction of the film in portions of the photosensitive resin layer corresponding to the gaps between the substrates, and the slits are formed on the substrates as they are. The film is continuously adhered, cut at each position between the substrates after the application, and the translucent support film is peeled off from the cut edge.

Further, the film sticking device disclosed in Japanese Patent Application Laid-Open No. 7-110575 discloses a cover film and an inner portion of the cover film that are slightly wider than both ends of a portion corresponding to each substrate before the cover film is peeled off. Cut in the film width direction together with the photosensitive resin layer, then peel off only the cover film of the part to be attached to the substrate with adhesive tape to expose the photosensitive resin layer, and continuously attach to the substrate in this state It is like that. After the attachment, the translucent support film is cut by a cutter at a position between the substrates.

[0009]

The above-mentioned JP-A-7-110
As disclosed in JP-A-575-575, when the photosensitive resin layer is cut together with the cover film, only the cover film of the portion to be attached to the substrate must be selectively peeled, so that the peeling mechanism becomes complicated. However, there is a problem that the processing speed must be reduced. Also, when the film is stuck to the substrate, the cutting point must substantially match the rear end of the preceding substrate and the front end of the following substrate,
There is a problem that control is not easy.

Further, in the case where only the photosensitive resin layer is cut at the gap between the substrates while the film is being stuck to the substrates as in a film sticking device disclosed in Japanese Patent Application Laid-Open No. 7-157186, the cutting device is Positioning and configuration become complicated,
Also, when the viscosity of the photosensitive resin layer is low or thin, it is very difficult to cut, and at the time of cutting, the photosensitive resin adheres to the cutting edge of the cutter, and this stains the surroundings. There is a point.

The present invention has been made in view of the above-mentioned conventional problems, and it is possible to cut a photosensitive resin layer before attaching it to a substrate, and to cut a photosensitive resin layer together with a cover film. There is no need to peel off the cut part of the cover film, so no complicated peeling mechanism is required,
It is another object of the present invention to provide a film sticking method and apparatus capable of improving the processing speed and facilitating the alignment between the cutting position and the edge of the substrate.

[0012]

According to the present invention, there is provided a method comprising:
The photosensitive resin layer of a laminated film formed by laminating at least two layers of a light-transmitting support film and a photosensitive resin layer unwound from a film roll as described above is placed at two positions at predetermined intervals in the longitudinal direction of the film. In the step of cutting in the film width direction leaving at least a part in the thickness direction of the translucent support film, after the cutting, the translucent support film, the photosensitive resin layer, intermittently sequentially A plurality of substrates are supplied along the transport surface of the substrate so as to face the film attachment surface of the plurality of substrates, and are fed together with the substrate between a pair of rotating lamination rolls to intermittently connect the plurality of substrates. Before the lamination roll reaches a specific point on the film feeding surface near the entry side of the lamination roll. The substrate is forwarded and waited until the leading end reaches a standby point on the substrate transfer surface near the entry side of the lamination roll, and the substrate is laminated in synchronization with the film when the cut point reaches the specific point. The two points to be cut are the rear end of the substrate and the front end of the substrate following the film. The above object is achieved by a film sticking method characterized by being set to substantially correspond to the position.

According to another aspect of the present invention, there is provided a light-transmitting support film unwound from a film roll, and a photosensitive resin layer directly or indirectly laminated on the light-transmitting support film. The cover film of the laminate film having the cover film laminated by covering the photosensitive resin layer, together with the photosensitive resin layer, at two predetermined intervals in the longitudinal direction of the film, A step of cutting in the film width direction while leaving at least a part in the thickness direction of the support film, and after the cutting, the cover film including the cut portion is peeled off from the photosensitive resin layer by pressing the adhesive layer of the adhesive tape. After the step and the cover film is peeled off, the light-transmitting support film is placed on the transport surface of the substrate so that the photosensitive resin layer faces the film-attached surfaces of the plurality of substrates that are intermittently sequentially sent. And feeding the substrate together with the substrate between a pair of rotating lamination rolls and continuously attaching the substrates so as to intermittently connect the plurality of substrates. Before reaching the specific point on the film feed surface near the entry side of the lamination roll, advance the substrate until the tip reaches a standby point on the substrate transfer surface near the entry side of the lamination roll. When the cutting point reaches the specific point, the substrate is fed between the lamination rolls in synchronization with the film, and the specific point and the standby point are in a state where the film is stuck to the substrate. By setting the two locations to be cut to be positions substantially corresponding to the rear end of the substrate and the front end of the substrate following the substrate, It is intended to achieve the purpose.

According to a third aspect of the present invention, the film may be cut while moving the means for cutting the photosensitive resin layer along the laminated film in the same direction and at the same speed.

According to a fourth aspect of the present invention, there is provided a film supply source for continuously supplying a laminated film formed by laminating at least a light-transmitting support film and a photosensitive resin layer in a belt shape, and a substrate transport surface. And a substrate transporting means for continuously transporting a plurality of substrates along the substrate, and sending the translucent support film while interposing and sandwiching the substrate so that the photosensitive resin layer faces the substrate transport surface. A film laminating device comprising: a pair of lamination rolls; and a laminating roll for continuously laminating the laminated film to a plurality of substrates that are intermittently sequentially transported. The photosensitive resin layer can be cut in the film width direction at two predetermined intervals in the longitudinal direction of the film substantially equal to the distance between the rear end and the front end of the following substrate, and the cutting position A half-cutter adjustable in the longitudinal direction of the film, arrival detecting means for detecting a timing at which a portion cut by the half-cutter reaches a specific point on a film feeding surface near the entry side of the lamination roll, and the substrate A substrate sensor that detects at least one of a leading end and a trailing end of the substrate conveyed by the conveying unit, and based on an output signal of the substrate sensor, based on an output signal of the substrate sensor, before the cutting point reaches the specific point, the detected substrate When the leading edge of the lamination roll is forwarded and waited until it reaches a standby point on the substrate transfer surface near the entry side of the lamination roll, and when the cutting point reaches the specific point,
A control device for controlling the substrate transport device so as to feed the substrate between the lamination rolls in synchronization with the film, wherein the specific point and the standby point are such that the two film cutting portions are connected to the substrate. The above object is achieved by setting the front end of the preceding substrate and the vicinity of the front end of the succeeding substrate in a film-attached state.

According to another aspect of the present invention, there is provided a light-transmitting support film, a photosensitive resin layer laminated on the light-transmitting support film, and a cover laminated on the photosensitive resin layer. A film supply source that continuously supplies a laminate film including a film in a strip shape, a cover film peeling unit that continuously peels the cover film from the laminate film supplied from the film supply source, and a substrate transfer surface. Board transfer means for continuously transferring a plurality of substrates along the
The translucent support film from which the cover film has been peeled off, comprising a pair of lamination rolls that feed while overlapping and sandwiching the substrate so that the photosensitive resin layer faces the substrate transport surface. In a film pasting apparatus for continuously laminating a laminate film from which the cover film has been peeled to a plurality of substrates that are intermittently conveyed sequentially, a position between the film supply source and the cover film peeling means. In two places at a predetermined distance in the longitudinal direction of the film, substantially equal to the distance between the rear end of the preceding substrate and the front end of the succeeding substrate conveyed by the substrate conveying means, the cover film and the photosensitive resin layer, The translucent support film can be cut in the film width direction while leaving at least a part in the thickness direction, and the cutting position can be adjusted in the film longitudinal direction. A half cutter, a point cut by the half cutter, arrival detecting means for detecting a timing of reaching a specific point on a film feeding surface near the entry side of the lamination roll, and transported by the substrate transport means. A substrate sensor for detecting at least one of the leading edge and the trailing edge of the incoming substrate; and, based on an output signal from the substrate sensor, before the cutting point reaches the specific point, the detected substrate is laminated. Forward and wait until reaching the standby point on the substrate transfer surface near the entry side of the roll, and when the cutting point reaches the specific point, so as to feed the substrate between the lamination rolls in synchronization with the film, And a control device for controlling the substrate transfer device, wherein the specific point and the standby point are the two films. The cut portion is set so as to be near the rear end of the preceding substrate and near the front end of the subsequent substrate in a state where the film is attached to the substrate, and the cover film peeling means cuts the adhesive surface of the adhesive tape at the two positions. Continuously adhered to the cover film including the part,
Further, the cover film is continuously peeled off by separating the cover film from the film transport surface, thereby achieving the above object.

According to a sixth aspect of the present invention, a pair of the half cutters are arranged at the predetermined interval in the longitudinal direction of the film,
A disk cutter that is movable in the film width direction, and a cutter that is disposed to face the tip of the disk cutter via the film transport surface and supports the laminated film when the disk cutter moves in the film width direction. And a half-cutter moving device capable of moving the pair of disk cutters and the cutter table in the feed direction of the laminated film at a constant speed.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

The film sticking apparatus 10 according to the present invention comprises:
As shown in FIG. 1, the laminate film 14 is unwound from a film roll 12 that is a film supply source, and a cover film 14 </ b> C (described later) constituting the laminate film 14 is peeled off by a cover film peeling device 16. One in which the laminated film 14 is pressed onto the substrate 20 by overlapping the upper surface of a plurality of substrates 20 sequentially and intermittently transported by the substrate transporting device 18 and passing the substrate 20 between the pair of upper and lower lamination rolls 22A and 22B. It is.

As shown in FIG. 2, the laminate film 14 includes a light-transmitting support film 14A, a photosensitive resin layer 14B laminated on the light-transmitting support film, and the photosensitive resin layer 14B. It is composed of a cover film 14C laminated and covered, and is continuously unwound from a film roll 12 wound in a belt shape. Here, "translucent" in the translucent support film 14 means that light or a beam for exposing the photosensitive resin layer 14B, that is, visible light, ultraviolet light, X-ray, electron beam, or the like can be transmitted.

The laminate film 14 from which the cover film 14C has been peeled off is supplied to the substrate 20 by the photosensitive resin layer 14
B is performed so as to face the film attaching surface of the substrate 20. The photosensitive resin layer 14B adheres to the substrate 20 by pressure bonding to the substrate 20.

The laminated film 14 from which the cover film 14C has been peeled off is continuously pressed to a plurality of substrates 20, and the photosensitive resin layer 14B is stuck (transferred) to the substrate 20, and the light-transmitting support is not stuck. The film 14 </ b> A is continuously peeled from each substrate 20, thereby separating each substrate.

The film roll 12 includes a torque motor 12
A controls the unwinding tension. The laminated film 14 unwound from the film roll 12 is wound around a pair of guide rolls 26A and 26B, and extends therefrom along a horizontal film transport surface, and is wound around a tensioning suction roll 28. Have been.

The tension applying suction roll 28 has a large number of suction holes on its outer periphery, and is configured to rotate while sucking the wound laminated film 14 (detailed illustration is omitted).

Here, the laminated film 14 is arranged such that the cover film 14C is on the upper side between the guide roll 26B and the tension applying suction roll 28.

The cover film peeling device 16 is provided immediately before the tension applying suction roll 28,
From the adhesive tape roll 30, the adhesive layer is covered with the cover film 14.
When the adhesive tape 32 unwound toward the C side is sandwiched together with the laminated film 14 by two pairs of pressing rolls 34A and 34B, and further when the adhesive tape 32 is wound by the winding roll 36 via the guide roll 34C. The cover film 14C is peeled off from the photosensitive resin layer 14B and wound up at the same time.

A rotary encoder 27 is attached to the guide roll 26B so as to output pulse signals of a number corresponding to the feed amount of the laminated film 14.

At a position between the guide roll 26B and the cover film peeling device 16, at two places with a predetermined interval in the film feeding direction, the cover film 14A of the laminated film 14 is left, and the cover film 14A is left. A half cutter 38 for cutting the film 14C along with the photosensitive resin layer 14B in the film width direction is provided.

The half cutter 38 includes a pair of disk cutters 38A and 38B arranged at the above-mentioned predetermined intervals in the film feeding direction, and the disk cutters 38A and 38B.
A horizontal cutter table 38C that is disposed to face the leading end (lower end) of the stack 8B via the film transport surface and supports the laminated film when the disk cutters 38A and 38B move in the film width direction; Disk cutter 3
The film holding cylinder 38 presses the laminated film 14 against the cutter table 38C as the 8A and 38B move.
And E. Here, the cutter table 3
8C is formed to have a length covering the lower side in the width direction in the drawing of the laminated film 14.

The disk cutters 38A and 38B are
As shown in FIG. 3, the film is driven in the width direction of the film by a driving device 38D composed of, for example, a rodless cylinder, and one reciprocation in the width direction is performed once or forward and backward in one of the forward movement and the backward movement. The cover film 14C can be cut twice by both movements.

The cutter table 38C and the driving device 38D
Can be moved at the same speed in the same direction by the half cutter moving device 40 in synchronization with the feeding of the laminated body film 14. Therefore, the disk cutter 38
A and 38B can perform a so-called running cut without stopping the feeding of the laminated film 14.

The half cutter moving device 40 includes a rack 40A arranged parallel to the film transport surface, and a pinion 40B meshing with the rack 40A.
The disc cutters 38A and 38B and the cutter table 38C are moved in synchronization with the laminated film 14 by attaching the OB to the cutter table 38C and the driving device 38D and driving the pinion 40B by a motor 40C.

The half-cutter 38 and the half-cutter moving device 40 are controlled by the control device 46. When the half-cutter 38 starts to cut the film, the control device 46 sends a signal of the cutting start timing to the first to third counters 47A. , 47B, 47C.

The first to third counters 47A, 47
B and 47C respectively start counting the pulse signal from the rotary encoder 27 when the cutting start timing signal is input from the control device 46, and the cutting position on the laminated film 14 is changed to the lamination roll 22
A, a specific point (virtual point) 49 provided near the entry side of 22B 49
When the film feed amount until reaching A is counted,
An arrival detection signal is output to the control device 46. First to third counters 47A, 47B, 47C
Is output by the controller 46 after outputting the arrival detection signal.

Between the tension applying suction roll 28 and the lamination rolls 22A and 22B, the laminated film 14 (the transparent support film 14A and the photosensitive support layer 14B) from which the cover film 14C has been peeled is guided. The guide rolls 42A and 42B and the film preheater 42C are arranged in this order.

A tension pickup 44 is provided on the upper guide roll 42A.
Due to the force on A, the laminate film 1 at this position
The negative pressure of the tension applying suction roll 28 is controlled via the control device 46 so that the tensile force of No. 4 is detected, and thereby the film tension is optimized.

The guide roll 42B is used for the laminated film 1
The film preheater 42C heats the laminated film 14 up to a predetermined temperature immediately before the substrate is pressed against the laminating rolls 22A and 22B.

Reference numeral 48 in FIG. 1 denotes a heater for heating the substrate 20 on the substrate transfer surface 18A formed at the upper end of the substrate transfer device 18.

The lamination rolls 22A and 22B
On the downstream side, pinch rolls 50A and 50B spaced apart from each other in the substrate transport direction, and above the support film take-up roll 60 are arranged. The upper pinch roll 50A is opened and closed by the control device 46.

The upper lamination roll 22A
The lamination roll opening / closing device 56 (see FIGS. 1 and 4) allows the lamination roll 22B to be freely separated (closed) from the lower lamination roll 22B, and the leading end of the substrate 20 reaches a position between the lamination rolls 22A and 22B. At this time, the substrate 20 is closed by the control device 46 so that the substrate 20 is sandwiched between the lamination rolls 22A and 22A.
It is set to be "open" when exiting from between 2B.

Along the substrate transport surface 18A, the outlet end of the heater 48 and the lamination rolls 22A, 22A
As shown in FIG. 1, the first substrate sensor 58A, the free roller 19A, the second substrate sensor 58B,
The feed rollers 19B are arranged in this order from the heater 48 side. The feed roller 19B is a lamination roll 22
A and 22B can be rotated at a constant speed.

The distance from the lamination rolls 22A and 22B is determined by the second substrate sensor 58B.
It is located immediately below a standby point (virtual point) 49B equal to the distance between 9A and the lamination rolls 22A, 22B.

The control unit 46 controls signals from the first and second substrate sensors 58A and 58B,
The transport device 18, the lamination roll opening / closing device 56, and the like are controlled by signals from 7A to 47C, and the details will be described later.

Next, the operation of the film sticking apparatus will be described.

First, the laminated film 14 is unwound from the film roll 12, and the guide rolls 26A and 26B, the tension applying suction roll 28, the guide rolls 42A and
After passing through the lamination rolls 22A and 22B in the standby state (open state) through 2B, and further passing between the pinch rolls 50A and 50B in the open state, the leading end can be wound on the support film take-up roll 60 and then the pinch roll 50A. Is closed.

At this time, the cover film 14C is peeled off from the tip by the cover film peeling device 16 and wound up.

The control device 46 also stores data on the gap between the rear end of the preceding substrate and the front end of the succeeding substrate, the length of the film attached to the substrate (patterning length), and the margin from the attachment boundary to the edge of the substrate. Etc. are entered and set.

Next, the entire film sticking apparatus 10 is operated. At this time, the half-cutter 38 determines that the distance between the disk cutters 38A and 38B in the film feeding direction is lower than the distance in the state where the laminated film 14 is stuck. It is set in advance so as to be slightly wider than the distance between the rear end of the substrate and the front end of the following substrate.

When the film sticking device 10 is operated, first, the control device 46 starts rotation of the pinch rolls 50A and 50B and application of negative pressure and rotation of the tension applying suction roll 28. The rotary encoder 27 starts generating a pulse. When the feed speed of the laminate film 14 becomes constant, the half cutter 38 is moved by the half cutter moving device 40 in synchronization with the laminate film 14 while the laminate film 14 is being conveyed.
D drives the disk cutters 38A and 38B,
The cover film 14C is coated on the back side of the photosensitive resin layer 14B.
At the same time, the film is cut in the width direction (see FIG. 5). If the cutting edges of the disk cutters 38A and 38B are slightly cut into the translucent support film 14A during this cutting, the photosensitive resin layer 14B can be cut more reliably. Since the translucent support film 14A is sufficiently thicker than the photosensitive resin layer 14B, it is not cut even if it is slightly cut.

On the other hand, the cover film peeling device 16 strongly presses the pressure-sensitive adhesive tape 32 unwound from the pressure-sensitive adhesive tape roll 30 onto the cover film 14C between the pressing rolls 34A and 34B, and then winds it up by the wind-up roll 36. The film 14C is wound up together with the adhesive tape 32, and is separated from the photosensitive resin layer 14B.

The adhesive tape 32 is made of a cover film 14C.
The disk cutter 38 is continuously pressed.
The portion where the cutting line is inserted by A and 38B is securely adhered and wound up by the winding roll 36.

The disk cutter 3 of the half cutter 38
8A and 38B, when the cover film 14C is cut, the laminated film 14 includes a torque motor 12A that controls the rotation of the film roll 12, and the tension applying suction roll 28 that feeds the laminated film 14 while attracting the laminated film 14. Thus, an optimal tension for cutting is applied. After cutting, the half cutter 38 is reset to a standby state.

When a signal indicating the timing at which the half cutter 38 starts cutting the film is input, the first counter 47A starts counting pulses generated by the rotary encoder 27.

The laminate film 14 from which the cover film 14C is peeled off by the cover film peeling device 16 and the photosensitive resin layer 14B is exposed is separated from the photosensitive resin layer 14B.
The guide rolls 42A and 42
B and the position of the film preheater 42C, and reaches the vicinity of the lamination rolls 22A and 22B.

On the other hand, the substrate 20 is waiting at the position of the heater 48, and when the count value of the first counter 47A reaches the substrate receiving timing value (K1), the control device 4
6, the substrate transport device 18 is turned ON, and an instruction to accept the second substrate 20 (an instruction to accept the second substrate into the film sticking device 10) is issued.

The tip of the first substrate 20 is the first substrate sensor 5
When reaching the second substrate sensor 58B beyond 8A, the substrate transfer device 18 stops, and the substrate 20 waits at the standby point 49B.

The count value of the first counter 47A is a numerical value (K2 value) at which the cutting line on the film reaches the specific point 49A.
At this time, the control device 46 drives the substrate transport device 18 (including the feed roller 19B) at that timing, and synchronizes the substrate 20 with the film and drives the lamination roll 22
A, Send between 22B.

The upper lamination roll 22A is changed from the “open” state to the “closed” state by the lamination roll opening / closing device 56 when the leading end of the substrate 20 comes to a position directly below the same. The laminated film 14 is adhered to the substrate 20 in a state where the photosensitive resin layer 14B is pressed on the upper surface of the substrate 20 transported by the substrate transport device 18 by being sandwiched between the rolls 22A and 22B.

Here, the K2 value is such that the position cut by the disk cutter 38B on the downstream side is located on the film sticking surface near the rear end of the substrate, and the substrate 20
The cutting position by the upstream disk cutter 38A is set so as to be located on the film attaching surface near the front end of the subsequent substrate with respect to the front end of the substrate.

On the other hand, when the count value of the first counter 47A reaches the number of pulses corresponding to the length of the substrate, the cutting operation of the half cutter 38 is performed by the control device 46 for the succeeding substrate (second substrate). Then, the counting of the pulses by the second counter 47B is started at the same time.

Thereafter, when the count value of the second counter 47B reaches the number of pulses corresponding to the length of the substrate, the third counter 4B
The step of starting counting of 7C and then starting counting of first counter 47A is repeated.

The leading end of the second and subsequent substrates 20 is the first.
When the second substrate sensor 58B detects the rear end of the preceding substrate 20, the second substrate sensor 58B detects the rear end of the preceding substrate 20, and then the second substrate sensor 58B detects the rear end of the preceding substrate 20. The process proceeds to the standby point 49 </ b> B and is controlled in the same manner as in the case of the first substrate 20 described above.

As described above, when the substrate 20 is transported to the lamination rolls 22A, 22B by the substrate transport device 18, the substrate 20 is made to arrive near the entry sides of the lamination rolls 22A, 22B at a timing earlier than that of the laminated film 14. After the primary stop, when the corresponding portion on the laminated film 14 approaches, when the corresponding portion is made to proceed again in synchronization with the approach, the synchronization between the substrate 20 and the laminated film 14 is further ensured.

Therefore, the laminated film 14 stuck on the plurality of substrates 20 conveyed intermittently is cut along the cutting line 3 cut by the disk cutters 38A and 38B.
9A and 39B are as shown in FIG.

In this state, the translucent support film 14A stuck to the substrate is attached to the upper pinch roll 50A.
After winding with a support film winding roll through
As shown in FIG. 7, the photosensitive resin layer 14 on the substrate 20
B remains attached to the substrate 20, and each substrate 20
Since the photosensitive resin layer 14B between the two has no target to be attached, the photosensitive resin layer 14B is separated from the photosensitive resin layer 14B on the substrate at the cutting lines 39A and 39B and is wound around the support film in a state of being attached to the translucent support film 14A. It is taken up by a take-up roll 60.

Accordingly, each substrate 20 is separated at the same time as the translucent support film 14A is separated from the substrate 20. In addition, when the outer periphery of the upper pinch roll 50A is cooled, the viscosity of the photosensitive resin layer 14B decreases, and the separation is ensured.

Here, a separation member for guiding the light-transmitting support film 14A at an acute angle may be provided near the exit sides of the pinch rolls 50A and 50B, as indicated by reference numeral 62 in FIG. In this case, the separation between the portion of the photosensitive resin layer 14B on the side of the porous support film and the side of the substrate 20 is smoothly performed.

In the above embodiment, the laminated film is formed by laminating a light-transmitting support film, a photosensitive resin layer and a cover film, but the present invention is not limited to that shown in FIG. Also, the present invention is applied to a case where a laminated film 15 including a translucent support film 15A and a photosensitive resin layer 15B and having no cover film is used. In this case, the cutter cuts only the photosensitive resin layer or a part of the porous support film and the photosensitive resin layer.

Here, in the present invention, the term "cut" means that the photosensitive resin layer can be cut off, and substantially includes removal.

The half-cutter 38 moves while synchronizing with the laminated film 14,
4, but the present invention is not limited to this. For example, an accumulator for storing the laminated film 14 is provided at a position between the half cutter 38 and the lamination rolls 22A and 22B. A configuration may be adopted in which the feeding of the laminated film 14 is stopped at the position of the half cutter 38 and the cover film 14C is cut while the laminated film 14 is being supplied to the lamination rolls 22A and 22B.

The cutting lines 39A and 39B correspond to the substrate 2
In the state in which the film is stuck to 0, the position is slightly shifted toward the center of the upper surface of the substrate from the end surface in the transport direction of the substrate 20, but the present invention is not limited to this.
As shown in (A) to (E), the position may be the same position as the end surface of the substrate 20 or a position protruding from the end surface.

The present invention is also applicable to a case where a laminate film is stuck on the lower surface or both surfaces of a substrate, and a case where the laminate film is stuck on one surface or both surfaces of the substrate while the substrate is conveyed vertically or obliquely. Things.

Further, in the example of the above embodiment, the translucent support film 14A is continuously peeled off after being attached to the substrate 20, but the present invention is not limited to this.
For example, as shown in FIG. 10, cutting may be performed by a cutter 64 at a position between the substrates 20.

Each substrate 20 is separated by this cutting. After the cutting, the translucent support film 14A and the unnecessary portion of the photosensitive resin layer 14B are peeled off by pulling the portion protruding from the substrate 20 upward from the substrate surface manually or by a clamping means, a suction pulling up means or the like. Is done.

[0075]

Since the present invention is constructed as described above, it is not necessary to cut the photosensitive resin layer after the film is attached to the substrate. And the processing speed can be improved. In addition, the photosensitive resin layer can be reliably cut together with the cover film, and the cutter can be prevented from being stained by the photosensitive resin. In addition, the cutting position and the substrate can be surely aligned to increase the processing speed. It has an excellent effect that it can be produced.

[Brief description of the drawings]

FIG. 1 is a schematic side view including a partial block diagram showing a film sticking apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view showing a laminated film used in the film sticking apparatus.

FIG. 3 is a perspective view showing a main part of a cover film cutting device in the film sticking device.

FIG. 4 is a block diagram showing a control system of the film sticking apparatus.

FIG. 5 is an enlarged cross-sectional view showing a laminate film cut by a half cutter.

FIG. 6 is an enlarged cross-sectional view showing a state in which a laminate film is attached to a substrate.

FIG. 7 is an enlarged sectional view showing a state in which a laminate film is peeled from a substrate.

FIG. 8 is an enlarged sectional view showing another laminated film.

FIG. 9 is an enlarged cross-sectional view showing various modes of attaching a laminate film to a substrate.

FIG. 10 is a schematic side view showing an example of another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Film sticking apparatus 12 ... Film roll 14, 15 ... Laminated film 14A, 15A ... Translucent support film 14B, 15B ... Photosensitive resin layer 14C ... Cover film 16 ... Cover film peeling apparatus 18 ... Substrate transporting apparatus 18A ... Substrate transfer surface 20 ... Substrates 22A, 22B ... Lamination roll 24 ... Separation cutter 22 ... Rotary encoder 28 ... Tension applying suction roll 32 ... Adhesive tape 38 ... Half cutter 38A, 38B ... Disc cutter 38C ... Cutter base 38D ... Driver 39A 39B cutting line 40 half-cutter moving device 46 control device 54 substrate tip sensor 60 support film take-up roll

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[Procedure amendment]

[Submission date] July 30, 1997

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] FIG.

[Correction method] Change

[Correction contents]

FIG. 10

Claims (6)

[Claims] 1. A method according to claim 1, wherein said photosensitive resin layer of a laminated film formed by laminating at least two layers of a light-transmitting support film and a photosensitive resin layer unwound from a film roll has a predetermined distance in a longitudinal direction of the film. At a point, a step of cutting in the film width direction while leaving at least a part in the thickness direction of the light-transmitting support film, and after the cutting, the light-transmitting support film is intermittently formed by the photosensitive resin layer. A plurality of substrates are supplied along the transport surface of the substrates so as to face the film attachment surfaces of the substrates sequentially sent, and are fed together with the substrates between a pair of rotating lamination rolls to intermittently connect the plurality of substrates. Before the cutting point of the film reaches a specific point on the film feeding surface near the entry side of the lamination roll, The substrate is forwarded and waited until the leading end reaches a standby point on the substrate transfer surface near the entry side of the lamination roll, and when the cutting point reaches the specific point, the substrate is synchronized with the film. The lamination roll is fed between the lamination rolls, and the specific point and the standby point are in a state where the film is stuck to the substrate, and the two places to be cut are the rear end of the substrate and the rear end of the substrate. A film sticking method characterized by being set so as to be located substantially at a front end. 2. A light-transmitting support film unwound from a film roll, a photosensitive resin layer directly or indirectly laminated on the light-transmitting support film, and laminated by covering the photosensitive resin layer. The cover film of the laminate film having a cover film, together with the photosensitive resin layer, at least two portions at predetermined intervals in the longitudinal direction of the film, leaving at least a part in the thickness direction of the translucent support film. Cutting the film in the width direction of the film, and after the cutting, peeling the cover film including the cut portion from the photosensitive resin layer by pressing the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape; The support film is supplied along the transport surface of the substrate such that the photosensitive resin layer faces the film attachment surfaces of the plurality of substrates that are intermittently sent sequentially, and a pair of rotating substrates is provided together with the substrate. Feeding between the lamination rolls, and continuously attaching a plurality of substrates to the lamination rolls so as to intermittently connect the plurality of substrates to each other. Before reaching the specific point on the surface, the substrate is advanced until it reaches a standby point on the substrate transfer surface in the vicinity of the entry side of the lamination roll, and the substrate is caused to stand by, and the cutting point is set to the specific point. When it reaches
The substrate is fed between the lamination rolls in synchronization with the film, and the specific point and the standby point are in a state where the film is stuck to the substrate, and the two locations to be cut are the rear end of the substrate and At the end of the substrate that follows this,
A film sticking method characterized by being set so as to substantially correspond to a position. 3. The method according to claim 1, wherein the means for cutting the photosensitive resin layer is cut along the laminate film while moving the same at the same speed and in the same direction. Film sticking method. 4. A film supply source for continuously supplying a laminate film comprising at least a light-transmitting support film and a photosensitive resin layer in a strip form, and a plurality of substrates continuously along a substrate transport surface. A substrate transporting means for transporting, and a pair of lamination rolls for feeding the translucent support film while sandwiching the substrate so that the photosensitive resin layer faces the substrate transport surface while sandwiching the substrate. In a film sticking apparatus for continuously sticking the laminated film to a plurality of substrates that are sequentially and intermittently conveyed, between the rear end of the preceding substrate and the front end of the succeeding substrate conveyed by the substrate conveying means. The photosensitive resin layer can be cut in the film width direction at two predetermined positions in the film longitudinal direction which are substantially equal to the distance of the film, and the cutting position can be adjusted in the film longitudinal direction. A half-cutter, an arrival detecting unit for detecting a timing at which a portion cut by the half cutter reaches a specific point on a film feeding surface near an entrance side of the lamination roll, and a substrate conveyed by the substrate conveying unit. A substrate sensor that detects at least one of the leading end and the trailing end of the lamination roll, based on an output signal of the substrate sensor, before the cutting point reaches the specific point, the detected substrate has a lamination roll. The substrate is moved forward until it reaches a standby point on the substrate transfer surface in the vicinity of the entry side, and when the cutting point reaches the specific point, the substrate is fed between lamination rolls in synchronization with a film. A control device for controlling the transport device, wherein the specific point and the standby point are the two film cutting pieces. But a film sticking state of the substrate, prior substrate film applying apparatus being characterized in that set to be near the tip of the rear end and the trailing substrate. 5. A laminated film including a light-transmitting support film, a photosensitive resin layer laminated on the light-transmitting support film, and a cover film laminated on the photosensitive resin layer, is continuously formed in a belt shape. A film supply source to be supplied, a cover film peeling means for continuously peeling the cover film from the laminated film supplied from the film supply source, and a substrate for continuously transporting a plurality of substrates along the substrate transport surface Conveying means, a pair of lamination rolls for feeding the translucent support film from which the cover film has been peeled, while sandwiching and sandwiching the substrate so that the photosensitive resin layer faces the substrate conveying surface. A film sticking apparatus for continuously sticking the laminated film from which the cover film has been peeled to a plurality of substrates which are intermittently sequentially conveyed. A predetermined position in the longitudinal direction of the film substantially equal to the distance between the rear end of the preceding substrate and the front end of the succeeding substrate transported by the substrate transporting device at a position between the film supply source and the cover film peeling device. At two places in the gap, the cover film together with the photosensitive resin layer can be cut in the film width direction while leaving at least a part in the thickness direction of the translucent support film, and the cut position is set to the film position. A half-cutter that is adjustable in the longitudinal direction, arrival detecting means for detecting a timing at which a portion cut by the half-cutter reaches a specific point on a film feeding surface near the entry side of the lamination roll, and the substrate transporter A substrate sensor for detecting at least one of the front end and the rear end of the substrate conveyed by the means, and based on an output signal of the substrate sensor. Before the cutting point reaches the specific point, the detected substrate is forwarded and waited until the tip reaches a standby point on the substrate transfer surface near the entry side of the lamination roll, and the cutting point is set. And a control device for controlling the substrate transfer device so that the substrate is fed between the lamination rolls in synchronization with a film when the specific point is reached. The two film cutting portions are set so as to be near the rear end of the preceding substrate and near the front end of the succeeding substrate in a state where the film is stuck to the substrate, and the cover film peeling means removes the adhesive surface of the adhesive tape from the two positions. To continuously peel off the cover film by continuously adhering to the cover film including the portion cut in the above, and separating from the film transport surface. Film applying apparatus characterized by being configured. 6. A disk cutter according to claim 4, wherein a pair of said half cutters are disposed at said predetermined interval in a longitudinal direction of the film, and are movable in a film width direction.
And a cutter table that is arranged to face the tip of the disc cutter via a film transport surface and supports the laminated film when the disc cutter moves in the film width direction, and A film sticking device comprising a half-cutter moving device capable of moving a pair of disk cutters and a cutter table in the direction of feeding the laminate film at a constant speed.