JP3905603B2

JP3905603B2 - Film pasting method and apparatus

Info

Publication number: JP3905603B2
Application number: JP18278597A
Authority: JP
Inventors: 洋二鷲崎; 健次北川; 修小澤
Original assignee: Fujifilm Corp
Current assignee: Fujifilm Corp
Priority date: 1997-07-08
Filing date: 1997-07-08
Publication date: 2007-04-18
Anticipated expiration: 2017-07-08
Also published as: JPH1120115A

Description

【０００１】
【発明の属する技術分野】
この発明は、プリント配線板用基板あるいは液晶表示装置、プラズマ表示装置のガラス基板に例示される基板の表面にフィルムを張付けるためのフィルム張付方法及び装置に関する。
【０００２】
【従来の技術】
コンピュータ等の電子機器に使用されるプリント配線板の製造過程において、プリント配線板用基板の表面の導電層に、透光性支持フィルム（通常はポリエステルに代表される透光性樹脂フィルム）上に直接又は介在層を介して感光性樹脂層が形成され、且つ、これがカバーフィルムによって覆われた積層体フィルムを、カバーフィルムを剥して張付ける。そして、この後、配線パターンフィルムを重ね、この配線パターンフィルム及び前記透光性支持フィルムを通して、感光性樹脂層を所定時間露光する。次いで、透光性支持フィルムを剥した後、露光された感光性樹脂層を現像してエッチングマスクパターンを形成し、この後、前記導電層の不必要部分をエッチングにより除去し、これにより、所定の配線パターンを有するプリント配線板が形成される。又、液晶表示装置、プラズマ表示装置のガラス基板に表示セルを形成する工程で同様の積層体フィルムが張付けられる。
【０００３】
上記のような積層体フィルムを張り付けるためのフィルム張付装置としては、フィルムロールから連続フィルムを巻き出し、これを、基板搬送面上を搬送手段により間欠的に順次搬送されてくる複数の基板のフィルム張付面に沿って、その感光性樹脂層が該フィルム張付面側になるようにして、両者を重ねた状態でラミネーションロール間に通し、フィルムを複数の基板に連続的に圧着しつつ基板を搬送するようにした、いわゆる連続張りタイプのものがある。
【０００４】
基板に張り付けられた透光性支持フィルムは、露光の前又は後で、且つ、現像工程の前において感光性樹脂層を基板側に残して剥離されなければならないが、剥離と同時又は剥離の前又は後に各基板間で分離されなければならない。
【０００５】
透光性支持フィルムを剥離方向に引張る場合、その裏面の感光性樹脂層が、基板からのはみ出し部分から基板上に連続していると、透光性支持フィルムを剥離する際に残さなければならない基板上の感光性樹脂層までがはみ出し部分の感光性樹脂層に続いて剥離されてしまうという問題点がある。
【０００６】
これらの問題点を解消するため、従来、例えば特開平７−１５７１８６号公報に開示されるフィルム剥離装置においては、フィルムを基板に連続的に張り付けた後、各基板間の隙間位置で感光性樹脂層のみを基板の端縁に沿ってフィルム幅方向に切断し、しかる後、透光性支持フィルムを連続的に剥離するものであり、この際、剥離された透光性支持フィルム側には、各基板間部分での感光性樹脂層が付着されている。
【０００７】
又、特開平８−１５０６９４号公報に開示されるフィルム張付装置では、各基板間に対応する感光性樹脂層の部分に予めフィルム幅方向にスリットを形成し、そのまま基板に連続的に張り付けて、張付後に各基板間位置で切断し、切断端縁から透光性支持フィルムを剥離させるようにしている。
【０００８】
更に、特開平７−１１０５７５号公報に開示されるフィルム張付装置は、カバーフィルム剥離前に、各基板間に対応する部分の両端間よりもやや広めに、カバーフィルム及びその内側の感光性樹脂層と共にフィルム幅方向に切断し、次に、基板に張り付けられるべき部分のカバーフィルムのみを粘着テープにより剥離して感光性樹脂層を露出させ、この状態で基板に連続的に張り付けるようにしたものである。張付後、透光性支持フィルムは各基板間位置でカッターにより切断される。
【０００９】
【発明が解決しようとする課題】
上記特開平７−１１０５７５号公報に開示されるように、感光性樹脂層をカバーフィルムと共に切断する場合は基板に張り付けられる部位のカバーフィルムのみを選択的に剥離しなければならないので、その剥離機構が複雑となり、又、処理速度を低下せざるを得ないという問題点がある。
【００１０】
更に、特開平７−１５７１８６号公報のフィルム張付装置のように、フィルムが基板に張付けられた状態のまま基板間の隙間位置で感光性樹脂層のみを切断する場合、切断装置の位置合せ、構成が複雑となり、又、感光性樹脂層の粘性が低いとき、あるいは薄いときに、切断が非常に困難であり、又切断の際にカッターの刃先に感光性樹脂が付着して、これが周囲を汚したりするという問題点がある。
【００１１】
又、感光性樹脂層を切断すると、残りの透光性支持フィルムにかかる張力が大幅に変動し、特にカバーフィルムと共に切断した場合、カバーフィルムの厚さが透光性支持フィルムの厚さの約１／６であるので張力の変動が大きく、これにより、ラミネーションロールで基板に張付けられたとき、しわが発生することがあるという問題点があった。
【００１２】
この発明は、上記従来の問題点に鑑みてなされたものであって、基板への張付け前に感光性樹脂層を切断でき、又、カバーフィルムと共に感光性樹脂層を切断したとき、切断された部分のカバーフィルムを剥離する必要がなく、従って複雑な剥離機構が不要となり、且つ、処理速度を向上させることができると共に透光性支持フィルムを連続的に剥離することができ、又、感光性樹脂層又はこれとカバーフィルムを切断した後に、残りの透光性支持フィルムにかかる張力の大幅な変動を抑制し、しわが発生することなく積層体フィルムを基板に張付けることができるようにしたフィルム張付方法及び装置を提供することを目的とする。
【００１３】
【課題を解決するための手段】
本方法発明は、請求項１のように、フィルムロールから巻き出した、透光性支持フィルム、及び、感光性樹脂層の少なくとも２層を積層してなる積層体フィルムの前記感光性樹脂層をそのフィルム長手方向で、前記透光性支持フィルムの厚さ方向の一部を残してフィルム幅方向に切断するハーフカット工程と、このハーフカット工程後に、透光性支持フィルムを、その感光性樹脂層が、間欠的に順次送られてくる複数の基板のフィルム張付面に向くように、基板の搬送面に沿って供給し、該基板と共に回転するラミネーションロール間に送り込んで、複数の基板を間欠的に接続するようにこれらに連続的に張り付ける工程と、次に基板に張り付けられた透光性支持フィルムを基板から連続的に巻き取って剥離する工程とを含んでなり、前記ハーフカットの切断個所を、基板の後端及びこれに後行する基板の先端にほぼ対応する位置とすると共に、ハーフカット工程を実行する位置と前記ラミネーションロールとの間の位置で、該ラミネーションロールに送り込まれる前記積層体フィルムにその送り方向の張力を付加し、前記透光性支持フィルムを基板から連続的に巻き取って剥離する際、前記切断箇所の間の感光性樹脂層を、透光性支持フィルムに付着した状態で連続的に巻き取るようにしたことを特徴とするフィルム張付方法により、上記目的を達成するものである。
【００１４】
請求項２のように、前記感光性樹脂層を切断する手段を積層体フィルムに沿って、これと等速、同方向に移動させつつ、フィルムを切断するようにしてもよい。
【００１５】
本装置発明は、請求項３のように、少なくとも透光性支持フィルム及び感光性樹脂層を積層してなる積層体フィルムを帯状に連続的に供給するフィルム供給源と、基板搬送面に沿って複数の基板を連続的に搬送する基板搬送手段と、前記透光性支持フィルムを、前記感光性樹脂層が基板搬送面に向くようにして前記基板とを重ねて挟み込みつつ送りをかける一対のラミネーションロールと、を有してなり、間欠的に順次搬送されてくる複数の基板に前記積層体フィルムを連続的に張り付けるフィルム張付装置において、
前記積層体フィルムにおける前記感光性樹脂層を前記透光性支持フィルムの厚さ方向の一部を残してフィルム幅方向に切断するハーフカッターと、このハーフカッターと前記ラミネーションロールの間に配置され、感光性樹脂層が切断された後の積層体フィルムに張力を付与する張力付与手段と、前記ラミネーションロールの出側に配置され、前記基板に張り付けられた後の前記透光性支持フィルムを、該基板から引き剥がす支持フィルム剥離手段と、を設け、前記ハーフカッターの切断個所は、基板の後端及びこれに後行する基板の先端にほぼ対応する位置とされ、前記支持フィルム剥離手段は、前記切断箇所の間の感光性樹脂層を、前記透光性支持フィルムに付着した状態で連続的に巻き取るように構成して、上記目的を達成するものである。
【００１６】
請求項４のように、前記ハーフカッターを、フィルム長手方向に前記所定間隔で一対配置され、フィルム幅方向に移動自在のディスクカッターと、このディスクカッターの先端に対して、フィルム搬送面を介して対向して配置され、ディスクカッターがフィルム幅方向に移動するとき前記積層体フィルムを支持するカッター台と、を含んで構成すると共に、前記一対のディスクカッター及びカッター台を、前記積層体フィルムの送り方向に、これと等速で移動させ得るカバーフィルムカッター移動装置を設けてもよい。
【００１７】
他の本方法発明は、請求項５のように、フィルムロールから巻き出した、透光性支持フィルム、この透光性支持フィルムに直接的又は間接的に積層された感光性樹脂層、該感光性樹脂層を被って積層されたカバーフィルムを有してなる積層体フィルムの前記カバーフィルムを、前記感光性樹脂層と共に、フィルム長手方向で、前記透光性支持フィルムの厚さ方向の一部を残してフィルム幅方向に切断するハーフカット工程と、このハーフカット工程で切断された切断部分を含むカバーフィルムを、粘着テープの粘着層を押圧して感光性樹脂層から引き剥がす工程と、カバーフィルムを剥がした後に、透光性支持フィルムを、その感光性樹脂層が、間欠的に順次送られてくる複数の基板のフィルム張付面に向くように、基板の搬送面に沿って供給し、該基板と共に回転するラミネーションロール間に送り込んで、複数の基板を間欠的に接続するようにこれらに連続的に張り付ける工程と、次に基板に張り付けられた透光性支持フィルムを基板から連続的に巻き取って剥離する工程とを含んでなり、前記切断個所を、前記基板の後端及びこれに後行する基板の先端にほぼ対応する位置とすると共に、ハーフカット工程を実行する位置と前記ラミネーションロールとの間の位置で、該ラミネーションロールに送り込まれる前記透光性支持フィルムにその送り方向の張力を付加し、前記透光性支持フィルムを基板から連続的に巻き取って剥離する際、前記切断箇所の間の感光性樹脂層を、透光性支持フィルムに付着した状態で連続的に巻き取るようにしたことを特徴とするフィルム張付方法により、上記目的を達成するものである。
【００１８】
請求項６のように、前記感光性樹脂層を切断する手段を積層体フィルムに沿って、これと等速、同方向に移動させつつ、フィルムを切断するようにしてもよい。
【００１９】
他の本装置発明は、請求項７のように、透光性支持フィルム、この透光性支持フィルムに積層された感光性樹脂層、この感光性樹脂層を被って積層されたカバーフィルムを含む積層体フィルムを帯状に連続的に供給するフィルム供給源と、このフィルム供給源から供給される積層体フィルムから前記カバーフィルムを連続的に剥離するカバーフィルム剥離手段と、基板搬送面に沿って複数の基板を連続的に搬送する基板搬送手段と、前記カバーフィルムが剥離された透光性支持フィルムを、前記感光性樹脂層が基板搬送面に向くようにして前記基板とを重ねて挟み込みつつ送りをかけるラミネーションロールと、を有してなり、間欠的に順次搬送されてくる複数の基板に前記カバーフィルムが剥された積層体フィルムを連続的に張り付けるフィルム張付装置において、
前記フィルム供給源と前記カバーフィルム剥離手段との間の位置に、前記カバーフィルムを前記感光性樹脂層と共に、前記透光性樹脂層の厚さ方向の一部を残してフィルム幅方向に切断するハーフカッターと、このハーフカッターと前記ラミネーションロールの間に配置され、感光性樹脂層が切断された後の透光性支持フィルムに張力を付与する張力付与手段と、前記ラミネーションロールの出側に配置され、前記基板に張り付けられた後の前記透光性支持フィルムを、該基板から引き剥がす支持フィルム剥離手段と、を設け、前記ハーフカッターの切断個所は、基板の後端及びこれに後行する基板の先端に、ほぼ対応する位置とされ、前記支持フィルム剥離手段は、前記切断箇所の間の感光性樹脂層を、前記透光性支持フィルムに付着した状態で連続的に巻き取るように構成し、前記カバーフィルム剥離手段を、粘着テープの粘着面を、前記切断された部分を含むカバーフィルムに連続的に粘着し、且つ、フィルム搬送面から離間させることにより前記カバーフィルムを引き剥がすように構成して、上記目的を達成するものである。
【００２０】
請求項８のように、前記ハーフカッターを、フィルム長手方向に前記所定間隔で一対配置され、フィルム幅方向に移動自在のディスクカッターと、このディスクカッターの先端に対して、フィルム搬送面を介して対向して配置され、ディスクカッターがフィルム幅方向に移動するとき前記積層体フィルムを支持するカッター台と、を含んで構成すると共に、前記一対のディスクカッター及びカッター台を、前記積層体フィルムの送り方向に、これと等速で移動させ得るハーフカッター移動装置を設けてもよい。
【００２１】
【発明の実施の形態】
以下本発明の実施の形態の例を図面を参照して詳細に説明する。
【００２２】
この発明に係るフィルム張付装置１０は、図１に示されるように、フィルム供給源であるフィルムロール１２から積層体フィルム１４を巻き出し、該積層体フィルム１４を構成するカバーフィルム１４Ｃ（後述）をカバーフィルム剥離装置１６によって剥離した後、基板搬送装置１８によって順次間欠的に搬送されてくる複数の基板２０の上面に重ねて、該基板２０と共に上下一対のラミネーションロール２２Ａ、２２Ｂ間に通して基板２０に積層体フィルム１４を圧着するものである。
【００２３】
複数の基板２０に連続的に圧着された透光性支持フィルム１４Ａは、各基板２０から連続的に剥離され、これにより各基板毎に分離される。
【００２４】
なお、この透光性支持フィルム１４Ａは、各基板間で切断してから非連続で剥離してもよい。
【００２５】
前記積層体フィルム１４は、図２に示されるように、透光性支持フィルム１４Ａ、この透光性支持フィルムに積層された感光性樹脂層１４Ｂ、及び、この感光性樹脂層１４Ｂを被って積層されたカバーフィルム１４Ｃからなり、帯状に巻かれたフィルムロール１２から連続的に巻き出されるようになっている。ここで透光性支持フィルム１４における「透光性」とは、感光性樹脂層１４Ｂを露光させる光あるいはビーム、即ち、可視光線、紫外光、Ｘ線、電子線等を透過できることを意味する。
【００２６】
フィルムロール１２は、例えば、トルクモータ１２Ａによりその巻き出し張力が制御されるようになっている。前記フィルムロール１２から巻き出された積層体フィルム１４は、一対のガイドロール２６Ａ、２６Ｂに巻き掛けられ、ここから、水平のフィルム搬送面に沿って延在され、張力付与ロール２８に巻き掛けられている。この張力付与ロール２８は、トルクモータ２９によりブレーキをかけつつ回転するようにされ、これにより、ラミネーションロール２２Ａ、２２Ｂとの間で、透光性支持フィルム１４Ａに適当な張力を付与（制御）するようにされ、表面は透光性支持フィルム１４Ａとの摩擦係数が大きいゴム等の材料から構成されされている（詳細図示省略）。又、張力の付与は、表面に負圧による多数吸引孔を備えた吸着ロール等の他の手段によってもよい。
【００２７】
ここで、積層体フィルム１４は、前記ガイドロール２６Ｂと張力付与ロール２８の間でカバーフィルム１４Ｃが上側となるようにされている。
【００２８】
前記カバーフィルム剥離装置１６は、前記張力付与ロール２８の直前位置に設けられ、粘着テープロール３０から粘着層をカバーフィルム１４Ｃ側に向けて巻き出された粘着テープ３２を、２対のピンチロール３４Ａ、３４Ｂにより積層体フィルム１４と共に挟み込み、更に、巻き取りロール３６によって粘着テープ３２を巻き取る際に、カバーフィルム１４Ｃを感光性樹脂層１４Ｂから引き剥がして、同時に巻き取るようにされている。
【００２９】
前記ガイドロール２６Ｂと前記カバーフィルム剥離装置１６の間の位置には、フィルム送り方向の所定間隔をもった２個所で、積層体フィルム１４における透光性支持フィルム１４Ａを残して、カバーフィルム１４Ｃを感光性樹脂層１４Ｂと共に、フィルム幅方向に切断するハーフカッター３８が設けられている。
【００３０】
このハーフカッター３８は、フィルム送り方向に上記所定間隔で配置された１対のディスクカッター３８Ａ、３８Ｂと、このディスクカッター３８Ａ、３８Ｂの先端（下端）に対してフィルム搬送面を介して対向して配置され、該ディスクカッター３８Ａ、３８Ｂがフィルム幅方向に移動するとき、前記積層体フィルムを支持する水平なカッター台３８Ｃと、ディスクカッター３８Ａ、３８Ｂがフィルム切断をするときに積層体フィルム１４をカッター台３８Ｃに押圧するフィルム押えシリンダ３８Ｅと、を含んで構成されている。ここで、カッター台３８Ｃは、積層体フィルム１４の図において幅方向下側を被う長さに形成されている。
【００３１】
前記ディスクカッター３８Ａ、３８Ｂは、図３に示されるように、例えばロッドレスシリンダからなる駆動装置３８Ｄによってフィルム幅方向に駆動され、幅方向に１回の往復動につき往動若しくは復動の一方で１回又は往動及び復動の両方で２回、カバーフィルム１４Ｃを切断できるようにされている。
【００３２】
前記カッター台３８Ｃと駆動装置３８Ｄは、ハーフカッター移動装置４０によって積層体フィルム１４の送りに同期して、同方向に等速度で移動され得るようになっている。従って、ディスクカッター３８Ａ、３８Ｂは、積層体フィルム１４の送りを停止させることなく、いわゆる走間カットをすることができる。
【００３３】
このハーフカッター移動装置４０は、フィルム搬送面と平行に配置されたラック４０Ａと、ラック４０Ａに噛み合うピニオン４０Ｂとを含み、ピニオン４０Ｂをカッター台３８Ｃ及び駆動装置３８Ｄ側に取り付け、該ピニオン４０Ｂをモータ４０Ｃによって駆動することにより、ディスクカッター３８Ａ、３８Ｂとカッター台３８Ｃを積層体フィルム１４と同期して移動させるものである。
【００３４】
前記張力付与ロール２８とラミネーションロール２２Ａ、２２Ｂとの間には、カバーフィルム１４Ｃが剥離された積層体フィルム１４（透光性支持フィルム１４Ａと感光性支持層１４Ｂ）を案内するためのガイドロール４２Ａ、４２Ｂ、及びフィルムプレヒータ４２Ｃが、この順で配置されている。
【００３５】
前記上側のガイドロール４２Ａには、テンションピックアップ４４が設けられ、ガイドロール４２Ａにかかる力によって、この位置での積層体フィルム１４の引張力を検出し、これによってフィルム張力が最適となるように制御装置４６を介して、前記張力付与ロール２８の負圧を制御している。
【００３６】
ガイドロール４２Ｂは、積層体フィルム１４がラミネーションロール２２Ａ、２２Ｂ間に斜めに入るように案内するものであり、又、フィルムプレヒータ４２Ｃは、基板圧着直前に積層体フィルム１４を所定温度にまで加熱するものである。
【００３７】
図１の符号４８は、基板搬送装置１８の上端に形成される基板搬送面１８Ａ上の基板２０を加熱するためのヒータを示す。
【００３８】
前記ラミネーションロール２２Ａ、２２Ｂの下流側には、基板搬送方向に離間して配置されたピンチロール５０Ａ、５０Ｂ、その上方には支持フィルム巻取りロール６０がそれぞれ配置されている。
【００３９】
前記上側のラミネーションロール２２Ａは、ラミネーションロール開閉装置５６（図４参照）により下側のラミネーションロール２２Ｂに対して離接（開閉）自在とされ、基板先端センサ５４が基板２０の先端を検出し、該先端がラミネーションロール２２Ａ、２２Ｂ間の位置に到達したとき、制御装置４６により該基板２０を挟み込むように「閉」とされ、又、基板後端センサ５８が基板後端を検出し、これがラミネーションロール２２Ａ、２２Ｂ間から抜け出るとき「開」となるようにされている。
【００４０】
次に上記フィルム張付装置の作用について説明する。
【００４１】
まず、積層体フィルム１４をフィルムロール１２から巻き出し、ガイドロール２６Ａ、２６Ｂ、張力付与ロール２８、ガイドロール４２Ａ、４２Ｂを経て、待機状態（開状態）のラミネーションロール２２Ａ、２２Ｂ間を通し、更にピンチロール５０Ａ、５０Ｂ間を通して先端を支持フィルム巻き取りロール６０に巻き取られるようにしておく。
【００４２】
このとき、カバーフィルム１４Ｃはカバーフィルム剥離装置１６により、その先端から剥離して巻き取っておく。
【００４３】
次に、フィルム張付装置１０全体を作動させるが、このとき、ハーフカッター３８は、そのディスクカッター３８Ａ、３８Ｂによる切断個所が、積層体フィルム１４を張り付けた状態での先行基板の後端及び後行基板の先端間に該当する位置で、且つ、これよりもわずかに広くなるように、予めセットしておく。
【００４４】
フィルム張付装置１０が作動されると、まず、積層体フィルム１４を搬送しつつ、ハーフカッター３８をハーフカッター移動装置４０によって積層体フィルム１４と同期して移動させつつ、駆動装置３８Ｄによりディスクカッター３８Ａ、３８Ｂを駆動して、カバーフィルム１４Ｃをその裏側の感光性樹脂層１４Ｂと共に、フィルム幅方向に切断する（図５参照）。この切断の際に、ディスクカッター３８Ａ、３８Ｂの刃先が、透光性支持フィルム１２に僅かに切込むようにすると、感光性樹脂層１４Ｂをより確実に切断できる。透光性支持フィルム１２は感光性樹脂層１４Ｂと比較すれば十分に厚いので少々切込まれても切断されることがない。
【００４５】
一方、カバーフィルム剥離装置１６は、粘着テープロール３０から巻き出される粘着テープ３２をピンチロール３４Ａ、３４Ｂ間でカバーフィルム１４Ｃに強く圧着した後、巻き取りロール３６によって巻き取るので、カバーフィルム１４Ｃは粘着テープ３２と共に巻き取られ、感光性樹脂層１４Ｂから剥離される。
【００４６】
粘着テープ３２は、カバーフィルム１４Ｃに連続的に圧着されるので、前記ディスクカッター３８Ａ、３８Ｂによって切断線の入っている部分も、確実に粘着されて巻き取りロール３６に巻き取られる。
【００４７】
ハーフカッター３８のディスクカッター３８Ａ、３８Ｂによって、カバーフィルム１４Ｃが切断される際、積層体フィルム１４は、フィルムロール１２の回転を制御するトルクモータ１２Ａと前記張力付与ロール２８とによって、切断に最適な張力が付与される。
【００４８】
カバーフィルム剥離装置１６によってカバーフィルム１４Ｃが剥離され、感光性樹脂層１４Ｂが露出された積層体フィルム１４は、該感光性樹脂層１４Ｂを基板搬送面１８Ａ側にしてガイドロール４２Ａ、４２Ｂ及びフィルムプレヒータ４２Ｃ位置を通過して、ラミネーションロール２２Ａ、２２Ｂに至る。
【００４９】
このとき、基板搬送装置１８によって搬送される基板２０の上面に、感光性樹脂層１４Ｂが圧着された状態で、透光性支持フィルム１４Ａが基板２０に張り付けられる。
【００５０】
前記透光性支持フィルム１４は、ハーフカッター３８によりカバーフィルム１４Ｃ及び感光性樹脂層１４Ｂが切断されると伸び易くなるため張力が大幅に減少するが、張力付与ロール２８がトルクモータ２９によりブレーキをかけながら回転されることにより、ラミネーションロール２２Ａ、２２Ｂとの間で張力が付与される。従って、基板２０への張付け状態でしわが発生することがない。
【００５１】
基板２０は、その後端が前記下流側のディスクカッター３８Ｂによって切断された位置が、基板後端近傍のフィルム張付面上に位置するように基板搬送装置１８によって搬送される。又、後行の基板２０の先端に対して、上流側のディスクカッター３８Ａによる切断位置が、該後行基板の先端近傍におけるフィルム張付面上に位置するように調整しておく。
【００５２】
従って、間欠的に搬送されてくる複数の基板２０上に張り付けられた積層体フィルム１４を、ディスクカッター３８Ａ、３８Ｂにより切断された切断線３９Ａ、３９Ｂは、図６に示されるようになる。
【００５３】
この状態で、基板に張り付けられている透光性支持フィルム１４Ａを、支持フィルム巻き取りロールにより巻き取ると、図７に示されるように、基板２０上の感光性樹脂層１４Ｂは、該基板２０に付着した状態で残り、各基板２０、２０間の感光性樹脂層１４Ｂは、付着する対象がないので、切断線３９Ａ、３９Ｂ位置で基板上の感光性樹脂層１４Ｂから分離して透光性支持フィルム１４Ａに付着した状態で支持フィルム巻き取りロール６０に巻き取られる。
【００５４】
従って、透光性支持フィルム１４Ａが基板２０から剥離されると同時に、各基板２０が分離されることになる。
【００５５】
ここで、ピンチロール５０Ａ、５０Ｂの出側近傍に、図１において符号６２で示されるように、透光性支持フィルム１４Ａを鋭角に案内する分離部材を設けるとよい。この場合、感光性樹脂層１４Ｂの透光性支持フィルム側と基板２０側部分との分離が円滑になされる。
【００５６】
なお、上記実施の形態の例においては、積層体フィルムは透光性支持フィルム、感光性樹脂層及びカバーフィルムを積層したものであるが、本発明は、図８に示されるように、透光性支持フィルム１５Ａ及び感光性樹脂層１５Ｂからなり、カバーフィルムを備えていない積層体フィルム１５を用いる場合にも適用されるものである。この場合、カッターは感光性樹脂層のみ、又は、透光性支持フィルムの一部と感光性樹脂層を切断することになる。
【００５７】
ここで切断とは、感光性樹脂層を遮断できるものであればよく、実質的には除去を含むものとする。
【００５８】
又、前記ハーフカッター３８は、積層体フィルム１４と同期して移動しつつ、該積層体フィルム１４を走間カットするものであるが、本発明はこれに限定されるものでなく、例えばハーフカッター３８とラミネーションロール２２Ａ、２２Ｂとの間の位置に、積層体フィルム１４を溜め込むアキュムレータを設け、ラミネーションロール２２Ａ、２２Ｂに積層体フィルム１４を供給しつつも、ハーフカッター３８の位置では積層体フィルム１４の送りを停止させ、カバーフィルム１４Ｃを切断する構成としてもよい。
【００５９】
又、上記切断線３９Ａ、３９Ｂは、基板２０へのフィルム張付け状態で、基板２０の搬送方向端面よりも僅かに基板上面中心側にずれた位置とされているが、本発明はこれに限定されるものではなく、図９（Ａ）〜（Ｅ）に示されるように、基板２０の端面と同位置、あるいははみ出した位置となるようにしてもよい。
【００６０】
又、本発明は基板の下面あるいは両面に積層体フィルムを張付ける場合、基板を上下方向又は斜め方向に搬送しつつ、その片面又は両面に積層体フィルムを張付ける場合にも適用されるものである。
【００６１】
【発明の効果】
本発明は上記のように構成したので、基板へのフィルム張付後に、感光性樹脂層を切断する必要がなく、感光性樹脂層を容易に切断できると共に透光性支持フィルムを連続的に剥離させて、処理速度を向上させることができ、又、感光性樹脂層の切断後に、ラミネーションロールの入側で張力を付与して、透光性支持フィルムを基板に張付けたときのしわの発生を防止できるという効果を有する。又感光性樹脂層をカバーフィルムと共に確実に切断し、且つ、感光性樹脂によるカッターの汚れ等を防止することができると共に、切断後のカバーフィルム全体を感光性樹脂層から連続的に剥離させた場合には、処理速度を増大させることができるという優れた効果を有する。
【図面の簡単な説明】
【図１】本発明の実施の形態に係るフィルム張付装置を示す一部ブロック図を含む略示側面図
【図２】同フィルム張付装置で用いる積層体フィルムを拡大して示す断面図
【図３】同フィルム張付装置におけるカバーフィルム切断装置の要部を示す斜視図
【図４】同フィルム張付装置の制御系を示すブロック図
【図５】カバーフィルムカッターにより切断された状態の積層体フィルムを拡大して示す断面図
【図６】基板に積層体フィルムを張付けた状態を示す拡大断面図
【図７】基板から積層体フィルムを剥離させる状態を拡大して示す断面図
【図８】他の積層体フィルムを拡大して示す断面図
【図９】積層体フィルムの基板への各種張付け態様を示す拡大断面図
【符号の説明】
１０…フィルム張付装置
１２…フィルムロール
１４、１５…積層体フィルム
１４Ａ、１５Ａ…透光性支持フィルム
１４Ｂ、１５Ｂ…感光性樹脂層
１４Ｃ…カバーフィルム
１６…カバーフィルム剥離装置
１８…基板搬送装置
１８Ａ…基板搬送面
２０…基板
２２Ａ、２２Ｂ…ラミネーションロール
２４…分離カッター
２８…張力付与ロール
２９…トルクモータ
３２…粘着テープ
３８…ハーフカッター
３８Ａ、３８Ｂ…ディスクカッター
３８Ｃ…カッター台
３８Ｄ…駆動装置
３９Ａ、３９Ｂ…切断線
４０…ハーフカッター移動装置
４６…制御装置
６０…支持フィルム巻き取りロール[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a film attaching method and apparatus for attaching a film to the surface of a substrate exemplified by a printed wiring board substrate, a liquid crystal display device, and a glass substrate of a plasma display device.
[0002]
[Prior art]
In the process of manufacturing a printed wiring board used for electronic devices such as computers, a conductive layer on the surface of the printed wiring board substrate is formed on a translucent support film (usually a translucent resin film typified by polyester). A laminate film in which a photosensitive resin layer is formed directly or via an intervening layer and covered with a cover film is peeled off and attached to the laminate film. Thereafter, the wiring pattern film is overlaid, and the photosensitive resin layer is exposed for a predetermined time through the wiring pattern film and the translucent support film. Next, after peeling off the translucent support film, the exposed photosensitive resin layer is developed to form an etching mask pattern, and then unnecessary portions of the conductive layer are removed by etching, whereby predetermined A printed wiring board having the following wiring pattern is formed. In addition, a similar laminate film is applied in a process of forming display cells on a glass substrate of a liquid crystal display device or a plasma display device.
[0003]
As a film pasting apparatus for pasting the laminate film as described above, a continuous film is unwound from a film roll, and a plurality of substrates are sequentially and intermittently transported on a substrate transport surface by a transport means. Along the film tension surface, the photosensitive resin layer is on the film tension surface side, and the two layers are passed between the lamination rolls, and the film is continuously crimped to a plurality of substrates. There is a so-called continuous tension type in which the substrate is conveyed.
[0004]
The translucent support film attached to the substrate must be peeled off before or after exposure and before the development process, leaving the photosensitive resin layer on the substrate side. Or it must later be separated between each substrate.
[0005]
When the translucent support film is pulled in the peeling direction, if the photosensitive resin layer on the back side is continuous from the protruding portion from the substrate onto the substrate, it must be left when peeling the translucent support film. There is a problem that the photosensitive resin layer on the substrate is peeled off following the photosensitive resin layer at the protruding portion.
[0006]
In order to solve these problems, conventionally, in a film peeling apparatus disclosed in, for example, Japanese Patent Application Laid-Open No. 7-157186, after a film is continuously attached to a substrate, a photosensitive resin is formed at a gap position between the substrates. Only the layer is cut in the film width direction along the edge of the substrate, and then the translucent support film is continuously peeled, and at this time, the peeled translucent support film side is A photosensitive resin layer is attached between the substrates.
[0007]
Moreover, in the film pasting apparatus disclosed in Japanese Patent Laid-Open No. 8-150694, slits are formed in the width direction of the film in advance in the portions of the photosensitive resin layer corresponding to the respective substrates, and are continuously pasted to the substrates as they are. Then, after pasting, the substrate is cut at positions between the substrates, and the translucent support film is peeled off from the cut edge.
[0008]
Furthermore, the film pasting apparatus disclosed in Japanese Patent Application Laid-Open No. 7-110575 discloses a cover film and a photosensitive resin inside the cover film, which are slightly wider than both ends of a portion corresponding to each substrate before peeling the cover film. The film was cut in the film width direction together with the layer, and then only the cover film to be attached to the substrate was peeled off with an adhesive tape to expose the photosensitive resin layer, and in this state, it was continuously attached to the substrate. Is. After pasting, the translucent support film is cut with a cutter at each inter-substrate position.
[0009]
[Problems to be solved by the invention]
As disclosed in Japanese Unexamined Patent Publication No. 7-110575, when the photosensitive resin layer is cut together with the cover film, only the cover film of the portion attached to the substrate has to be selectively peeled off. However, there is a problem that the processing speed is inevitably reduced.
[0010]
Further, when only the photosensitive resin layer is cut at a gap position between the substrates while the film is stuck to the substrate as in the film pasting device of JP-A-7-157186, the alignment of the cutting device is performed. When the structure is complicated and the viscosity of the photosensitive resin layer is low or thin, cutting is very difficult, and the photosensitive resin adheres to the blade edge of the cutter during the cutting, and this surrounds the surroundings. There is a problem of getting dirty.
[0011]
Further, when the photosensitive resin layer is cut, the tension applied to the remaining light-transmitting support film varies greatly, and particularly when cut together with the cover film, the thickness of the cover film is about the thickness of the light-transmitting support film. Since the tension is 1/6, the fluctuation of the tension is large, and there is a problem that wrinkles may occur when the tension roll is applied to the substrate.
[0012]
The present invention has been made in view of the above-described conventional problems. The photosensitive resin layer can be cut before being attached to the substrate, and when the photosensitive resin layer is cut together with the cover film, the cut is made. There is no need to peel off the cover film of the part, so that a complicated peeling mechanism is unnecessary, the processing speed can be improved, and the translucent support film can be continuously peeled, and the photosensitive property After cutting the resin layer or this and the cover film, significant fluctuations in the tension applied to the remaining translucent support film are suppressed, and the laminate film can be attached to the substrate without wrinkling. It is an object of the present invention to provide a film pasting method and apparatus.
[0013]
[Means for Solving the Problems]
The method of the present invention is the method of claim 1, wherein the photosensitive resin layer of the laminate film formed by laminating at least two layers of the translucent support film and the photosensitive resin layer unwound from the film roll is provided. In the film longitudinal direction, the thickness direction of the translucent support film One A half-cut process of cutting in the film width direction, leaving a portion, and after this half-cut process, the translucent support film is attached to a plurality of substrates by which the photosensitive resin layer is intermittently sent sequentially. Supplying the substrate along the conveyance surface of the substrate so as to face the substrate, feeding it between the lamination rolls that rotate together with the substrate, and successively attaching the plurality of substrates to each other so as to be connected intermittently; and On the board R Attached translucent support film from substrate Wind up continuously And a peeling step, The cutting position of the half cut is a position that substantially corresponds to the rear end of the substrate and the front end of the substrate that follows this, Tension in the feeding direction is added to the laminate film fed to the lamination roll at a position between the position where the half-cut process is performed and the lamination roll. When the translucent support film is continuously wound from the substrate and peeled off, the photosensitive resin layer between the cut portions is continuously wound in a state of being attached to the translucent support film. The above object is achieved by a film sticking method characterized in that it is configured as described above.
[0014]
According to a second aspect of the present invention, the film may be cut while moving the means for cutting the photosensitive resin layer along the laminated film in the same direction and in the same direction.
[0015]
According to the present invention, as in claim 3, a film supply source that continuously supplies at least a laminated film formed by laminating a translucent support film and a photosensitive resin layer in a strip shape, and along a substrate transport surface A pair of laminations for feeding a substrate conveying means for continuously conveying a plurality of substrates and the translucent support film while sandwiching the substrate so that the photosensitive resin layer faces the substrate conveying surface. A film pasting apparatus for continuously pasting the laminate film on a plurality of substrates that are sequentially and intermittently conveyed,
The photosensitive resin layer in the laminate film Leave a part in the thickness direction of the translucent support film A half cutter that cuts in the film width direction, a tension applying means that is disposed between the half cutter and the lamination roll and applies tension to the laminate film after the photosensitive resin layer is cut, and the lamination roll A support film peeling means disposed on the exit side and for peeling off the translucent support film after being attached to the substrate from the substrate; The cutting portion of the half cutter is a position that substantially corresponds to the rear end of the substrate and the front end of the substrate that follows the substrate, and the support film peeling means includes the photosensitive resin layer between the cut portions, It is configured to be continuously wound while attached to the translucent support film. Thus, the above object is achieved.
[0016]
As in claim 4, a pair of the half cutters are arranged at the predetermined interval in the film longitudinal direction and are movable in the film width direction, and the tip of the disk cutter is interposed via the film conveying surface. And a cutter table that supports the laminated film when the disk cutter moves in the film width direction, and the pair of disk cutters and the cutter table are fed to the laminated film. A cover film cutter moving device that can be moved in the direction at the same speed may be provided.
[0017]
According to another invention of the present invention, as in claim 5, a translucent support film unwound from a film roll, a photosensitive resin layer laminated directly or indirectly on the translucent support film, The cover film of the laminate film having a cover film laminated with a light-sensitive resin layer, together with the photosensitive resin layer, in the film longitudinal direction, the thickness direction of the translucent support film One A half-cut process for cutting in the film width direction leaving a portion, and a process for peeling the cover film including the cut part cut in the half-cut process from the photosensitive resin layer by pressing the adhesive layer of the adhesive tape, After the cover film is peeled off, the translucent support film is supplied along the transport surface of the substrate so that the photosensitive resin layer faces the film pasting surface of the plurality of substrates that are intermittently fed sequentially. A step of feeding between the lamination rolls rotating together with the substrate, and continuously attaching the plurality of substrates to the substrate so as to be intermittently connected; R Attached translucent support film continuously from substrate Wind up A step of peeling, wherein the cutting portion is defined by a rear end of the substrate and a front end of the substrate following the substrate. Niho In addition, the tension in the feeding direction is applied to the translucent support film fed to the lamination roll at a position between the lamination roll and the position where the half-cut process is performed. When the translucent support film is continuously wound from the substrate and peeled off, the photosensitive resin layer between the cut portions is continuously wound in a state of being attached to the translucent support film. The above object is achieved by a film sticking method characterized in that it is configured as described above.
[0018]
The film may be cut while moving the means for cutting the photosensitive resin layer along the laminate film in the same direction and in the same direction as the sixth aspect.
[0019]
Another invention of the present invention includes a light-transmitting support film, a photosensitive resin layer laminated on the light-transmitting support film, and a cover film laminated on the photosensitive resin layer. A film supply source for continuously supplying the laminate film in a strip shape, a cover film peeling means for continuously peeling the cover film from the laminate film supplied from the film supply source, and a plurality along the substrate transport surface The substrate transport means for continuously transporting the substrate and the translucent support film from which the cover film has been peeled are sent while being sandwiched between the substrate so that the photosensitive resin layer faces the substrate transport surface. A laminating roll for continuously applying the laminate film from which the cover film has been peeled off to a plurality of substrates that are intermittently conveyed sequentially. In with Lum applying apparatus,
In the position between the film supply source and the cover film peeling means, the cover film together with the photosensitive resin layer and the thickness direction of the translucent resin layer One Cutter that cuts in the film width direction leaving a portion, and tension applying means that is disposed between the half cutter and the lamination roll and applies tension to the translucent support film after the photosensitive resin layer is cut And a support film peeling means that is disposed on the exit side of the lamination roll and peels the translucent support film after being attached to the substrate from the substrate. The cutting part of the half cutter is a position substantially corresponding to the rear end of the substrate and the front end of the substrate following the substrate, and the support film peeling means includes a photosensitive resin layer between the cutting points, Constructed to continuously wind up in a state attached to the translucent support film, The cover film peeling means is configured to continuously adhere the adhesive surface of the adhesive tape to the cover film including the cut portion, and to peel the cover film away from the film transport surface. Thus, the above object is achieved.
[0020]
As in claim 8, a pair of the half cutters are arranged at the predetermined interval in the film longitudinal direction and are movable in the film width direction, and the leading end of the disk cutter via the film conveying surface. And a cutter table that supports the laminated film when the disk cutter moves in the film width direction, and the pair of disk cutters and the cutter table are fed to the laminated film. You may provide the half cutter moving apparatus which can be moved to this direction at the same speed as this.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the drawings.
[0022]
As shown in FIG. 1, the film tensioning apparatus 10 according to the present invention unwinds a laminate film 14 from a film roll 12 that is a film supply source, and forms a cover film 14 C (described later) constituting the laminate film 14. Is peeled off by the cover film peeling device 16, and then superimposed on the upper surfaces of the plurality of substrates 20 that are sequentially and intermittently conveyed by the substrate conveying device 18, and is passed between the upper and lower lamination rolls 22 A and 22 B together with the substrate 20. The laminate film 14 is pressure-bonded to the substrate 20.
[0023]
The translucent support film 14A continuously bonded to the plurality of substrates 20 is continuously peeled from each substrate 20 and thereby separated for each substrate.
[0024]
The translucent support film 14A may be discontinuously peeled after being cut between the substrates.
[0025]
As shown in FIG. 2, the laminate film 14 is laminated so as to cover the translucent support film 14A, the photosensitive resin layer 14B laminated on the translucent support film, and the photosensitive resin layer 14B. The cover film 14 C is formed and continuously unwound from the film roll 12 wound in a band shape. Here, “translucency” in the translucent support film 14 means that light or a beam that exposes the photosensitive resin layer 14B, that is, visible light, ultraviolet light, X-ray, electron beam, or the like can be transmitted.
[0026]
For example, the unwinding tension of the film roll 12 is controlled by a torque motor 12A. The laminate film 14 unwound from the film roll 12 is wound around a pair of guide rolls 26A and 26B, and is extended along a horizontal film transport surface from here and wound around a tension applying roll 28. ing. The tension applying roll 28 is rotated while being braked by a torque motor 29, thereby applying (controlling) appropriate tension to the translucent support film 14A between the lamination rolls 22A and 22B. The surface is made of a material such as rubber having a large friction coefficient with the translucent support film 14A (detailed illustration is omitted). The tension may be applied by other means such as a suction roll having a plurality of suction holes due to negative pressure on the surface.
[0027]
Here, the laminate film 14 is configured such that the cover film 14 C is on the upper side between the guide roll 26 B and the tension applying roll 28.
[0028]
The cover film peeling device 16 is provided at a position immediately before the tension applying roll 28, and the adhesive tape 32 unwound from the adhesive tape roll 30 toward the cover film 14C side is used as two pairs of pinch rolls 34A. 34B is sandwiched with the laminate film 14, and when the adhesive tape 32 is taken up by the take-up roll 36, the cover film 14C is peeled off from the photosensitive resin layer 14B and taken up at the same time.
[0029]
The cover film 14C is placed at a position between the guide roll 26B and the cover film peeling device 16 at two locations having a predetermined interval in the film feeding direction, leaving the translucent support film 14A in the laminate film 14. A half cutter 38 for cutting in the film width direction is provided together with the photosensitive resin layer 14B.
[0030]
The half cutter 38 is opposed to the pair of disc cutters 38A and 38B arranged at the predetermined intervals in the film feeding direction and the front ends (lower ends) of the disc cutters 38A and 38B via the film conveyance surface. When the disc cutters 38A and 38B move in the film width direction, the horizontal cutter table 38C that supports the laminate film, and the disc cutters 38A and 38B cut the laminate film 14 when the film is cut. And a film pressing cylinder 38E that presses against the base 38C. Here, the cutter base 38 C is formed to have a length that covers the lower side in the width direction in the drawing of the laminate film 14.
[0031]
As shown in FIG. 3, the disk cutters 38A and 38B are driven in the film width direction by a driving device 38D made of, for example, a rodless cylinder, and either forward or backward for one reciprocation in the width direction. The cover film 14C can be cut once, or twice in both forward and backward movements.
[0032]
The cutter base 38C and the driving device 38D can be moved at the same speed in the same direction in synchronization with the feeding of the laminated film 14 by the half cutter moving device 40. Therefore, the disk cutters 38A and 38B can perform so-called running cut without stopping the feeding of the laminated film 14.
[0033]
The half-cutter moving device 40 includes a rack 40A arranged in parallel with the film conveying surface and a pinion 40B meshing with the rack 40A. By being driven by 40C, the disk cutters 38A, 38B and the cutter table 38C are moved in synchronization with the laminate film 14.
[0034]
Between the tension applying roll 28 and the lamination rolls 22A and 22B, a guide roll 42A for guiding the laminate film 14 (the translucent support film 14A and the photosensitive support layer 14B) from which the cover film 14C has been peeled off. 42B and the film preheater 42C are arranged in this order.
[0035]
The upper guide roll 42A is provided with a tension pickup 44. The force applied to the guide roll 42A is used to detect the tensile force of the laminated film 14 at this position, thereby controlling the film tension to be optimum. The negative pressure of the tension applying roll 28 is controlled via the device 46.
[0036]
The guide roll 42B guides the laminated film 14 so that it enters obliquely between the lamination rolls 22A and 22B, and the film preheater 42C heats the laminated film 14 to a predetermined temperature immediately before the substrate pressure bonding. Is.
[0037]
Reference numeral 48 in FIG. 1 denotes a heater for heating the substrate 20 on the substrate transfer surface 18A formed at the upper end of the substrate transfer device 18.
[0038]
On the downstream side of the lamination rolls 22A and 22B, pinch rolls 50A and 50B that are spaced apart from each other in the substrate transport direction, and a support film winding roll 60 are disposed above them.
[0039]
The upper lamination roll 22A can be separated from (opened / closed) the lower lamination roll 22B by a lamination roll opening / closing device 56 (see FIG. 4), and the substrate tip sensor 54 detects the tip of the substrate 20. When the leading edge reaches the position between the lamination rolls 22A and 22B, the controller 46 is closed so as to sandwich the substrate 20, and the substrate trailing edge sensor 58 detects the substrate trailing edge, which is the lamination. It is set to “open” when it comes out between the rolls 22A and 22B.
[0040]
Next, the operation of the film pasting apparatus will be described.
[0041]
First, the laminate film 14 is unwound from the film roll 12, passed through the guide rolls 26A and 26B, the tension applying roll 28, the guide rolls 42A and 42B, and passed between the lamination rolls 22A and 22B in the standby state (open state). The tip is wound around the support film winding roll 60 through the pinch rolls 50A and 50B.
[0042]
At this time, the cover film 14 C is peeled off from the tip by the cover film peeling device 16 and wound up.
[0043]
Next, the entire film sticking apparatus 10 is operated. At this time, the half cutter 38 is cut by the disc cutters 38A and 38B at the rear end and rear end of the preceding substrate in a state where the laminate film 14 is stuck. It is set in advance so as to be slightly wider than the position corresponding to the tip of the row substrate.
[0044]
When the film sticking device 10 is operated, first, while transporting the laminate film 14, the half cutter 38 is moved in synchronization with the laminate film 14 by the half cutter moving device 40, and the disk cutter is driven by the driving device 38D. 38A and 38B are driven, and the cover film 14C is cut along with the photosensitive resin layer 14B on the back side in the film width direction (see FIG. 5). If the cutting edges of the disk cutters 38A and 38B are slightly cut into the translucent support film 12 during this cutting, the photosensitive resin layer 14B can be cut more reliably. The translucent support film 12 is sufficiently thick as compared with the photosensitive resin layer 14B, so that even if it is cut slightly, it is not cut.
[0045]
On the other hand, the cover film peeling device 16 strongly presses the adhesive tape 32 unwound from the adhesive tape roll 30 to the cover film 14C between the pinch rolls 34A and 34B, and then winds it by the take-up roll 36. It is wound together with the adhesive tape 32 and peeled off from the photosensitive resin layer 14B.
[0046]
Since the adhesive tape 32 is continuously pressed onto the cover film 14C, the portion where the cutting line is inserted is surely adhered by the disk cutters 38A and 38B and is taken up by the take-up roll 36.
[0047]
When the cover film 14C is cut by the disk cutters 38A and 38B of the half cutter 38, the laminate film 14 is optimally cut by the torque motor 12A for controlling the rotation of the film roll 12 and the tension applying roll 28. Tension is applied.
[0048]
The laminate film 14 from which the cover film 14C has been peeled off by the cover film peeling device 16 and the photosensitive resin layer 14B has been exposed has guide rolls 42A and 42B and a film preheater with the photosensitive resin layer 14B facing the substrate transport surface 18A. Passing the 42C position, it reaches the lamination rolls 22A and 22B.
[0049]
At this time, the translucent support film 14 A is attached to the substrate 20 in a state where the photosensitive resin layer 14 B is pressure-bonded to the upper surface of the substrate 20 conveyed by the substrate conveying device 18.
[0050]
The translucent support film 14 is easily stretched when the cover film 14C and the photosensitive resin layer 14B are cut by the half cutter 38, so that the tension is greatly reduced. However, the tension applying roll 28 is braked by the torque motor 29. By being rotated while being applied, tension is applied between the lamination rolls 22A and 22B. Therefore, wrinkles do not occur in the state of being attached to the substrate 20.
[0051]
The substrate 20 is transported by the substrate transport device 18 so that the position where the rear end is cut by the downstream disk cutter 38B is located on the film pasting surface near the rear end of the substrate. Further, the cutting position by the upstream disk cutter 38A with respect to the leading end of the succeeding substrate 20 is adjusted so as to be positioned on the film pasting surface in the vicinity of the leading end of the succeeding substrate.
[0052]
Accordingly, cutting lines 39A and 39B obtained by cutting the laminated film 14 stuck on the plurality of substrates 20 conveyed intermittently by the disk cutters 38A and 38B are as shown in FIG.
[0053]
In this state, when the translucent support film 14A attached to the substrate is taken up by a support film take-up roll, the photosensitive resin layer 14B on the substrate 20 becomes as shown in FIG. Since the photosensitive resin layer 14B between the substrates 20 and 20 is not attached to the substrate 20, the photosensitive resin layer 14B is separated from the photosensitive resin layer 14B on the substrate at the positions of the cutting lines 39A and 39B. The film is wound on the support film winding roll 60 in a state of being attached to the support film 14A.
[0054]
Therefore, each substrate 20 is separated at the same time as the translucent support film 14A is peeled from the substrate 20.
[0055]
Here, a separating member for guiding the translucent support film 14A at an acute angle may be provided near the exit side of the pinch rolls 50A and 50B, as indicated by reference numeral 62 in FIG. In this case, separation between the light transmissive support film side and the substrate 20 side portion of the photosensitive resin layer 14B is smoothly performed.
[0056]
In the example of the above embodiment, the laminate film is a laminate of a translucent support film, a photosensitive resin layer, and a cover film. However, as shown in FIG. The present invention is also applicable to the case of using a laminate film 15 that includes a conductive support film 15A and a photosensitive resin layer 15B and does not include a cover film. In this case, the cutter cuts only the photosensitive resin layer or a part of the translucent support film and the photosensitive resin layer.
[0057]
Here, the cutting may be anything that can block the photosensitive resin layer, and substantially includes removal.
[0058]
The half cutter 38 cuts the laminate film 14 while moving in synchronization with the laminate film 14, but the present invention is not limited to this. For example, the half cutter 38 The accumulator which accumulates the laminated body film 14 is provided in the position between 38 and the lamination rolls 22A and 22B, and the laminated body film 14 is supplied at the position of the half cutter 38 while supplying the laminated body film 14 to the lamination rolls 22A and 22B. It is good also as a structure which stops the feed and cut | disconnects the cover film 14C.
[0059]
The cutting lines 39A and 39B are positioned slightly shifted from the end surface in the transport direction of the substrate 20 toward the center of the substrate upper surface when the film is attached to the substrate 20, but the present invention is not limited to this. 9A to 9E, the same position as the end face of the substrate 20 or a protruding position may be used.
[0060]
The present invention is also applicable to the case where a laminate film is attached to the lower surface or both surfaces of a substrate, and the laminate film is attached to one or both surfaces of the substrate while transporting the substrate in a vertical direction or an oblique direction. is there.
[0061]
【The invention's effect】
Since the present invention is configured as described above, it is not necessary to cut the photosensitive resin layer after the film is attached to the substrate, and the photosensitive resin layer can be easily cut and the translucent support film is continuously peeled off. The processing speed can be improved, and after the photosensitive resin layer is cut, wrinkles are generated when the translucent support film is attached to the substrate by applying tension on the entry side of the lamination roll. It has the effect that it can be prevented. In addition, the photosensitive resin layer can be reliably cut together with the cover film, and contamination of the cutter by the photosensitive resin can be prevented, and the entire cover film after cutting is continuously peeled from the photosensitive resin layer. In this case, it has an excellent effect that the processing speed can be increased.
[Brief description of the drawings]
FIG. 1 is a schematic side view including a partial block diagram showing a film pasting apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view showing a laminate film used in the film pasting apparatus
FIG. 3 is a perspective view showing a main part of a cover film cutting device in the film sticking device.
FIG. 4 is a block diagram showing a control system of the film pasting apparatus.
FIG. 5 is an enlarged cross-sectional view showing a laminate film cut by a cover film cutter
FIG. 6 is an enlarged sectional view showing a state in which a laminate film is attached to a substrate.
FIG. 7 is an enlarged cross-sectional view showing a state in which a laminate film is peeled from a substrate
FIG. 8 is an enlarged cross-sectional view showing another laminated film
FIG. 9 is an enlarged cross-sectional view showing various manners of attaching the laminated film to the substrate.
[Explanation of symbols]
10 ... Film sticking device
12 ... Film roll
14, 15 ... Laminated film
14A, 15A ... Translucent support film
14B, 15B ... photosensitive resin layer
14C ... Cover film
16 ... Cover film peeling device
18 ... Substrate transfer device
18A ... substrate transfer surface
20 ... Board
22A, 22B ... Lamination roll
24 ... Separation cutter
28 ... tension applying roll
29 ... Torque motor
32 ... Adhesive tape
38 ... Half cutter
38A, 38B ... Disc cutter
38C ... Cutter stand
38D ... Drive device
39A, 39B ... cutting line
40 ... Half cutter moving device
46 ... Control device
60 ... Support film take-up roll

Claims

The light transmissive support film and the light transmissive support film, and the light transmissive support film of the laminate film formed by laminating at least two layers of the light sensitive resin layer in the film longitudinal direction. more a half-cut process of cutting in the thickness transverse direction of the film leaving a part of direction, after the half-cutting step, the light transmissive support film, the photosensitive resin layer, comes intermittently and sequentially transmitted The substrate is supplied along the substrate transfer surface so as to face the film-clamping surface of the substrate, and is fed between lamination rolls that rotate together with the substrate, so that a plurality of substrates are intermittently connected to each other. a step of pasting, then becomes Zhang Ri Tagged translucent support film to the substrate and a step of peeling wound continuously from the substrate, the cleavage point of the half-cut, after the substrate And with a position substantially corresponding to the tip of the substrate to be trailing thereto, at a location between the position and the lamination roll to perform half-cut process, the feed direction on the laminate film to be fed to the lamination roll When the above-mentioned translucent support film is continuously wound from the substrate and peeled off, the photosensitive resin layer between the cut portions is continuously attached to the translucent support film. way with film Zhang, characterized in that it was so that the winding.

2. The film sticking method according to claim 1, wherein the film is cut while moving the means for cutting the photosensitive resin layer along the laminated film in the same direction and in the same direction.

A film supply source for continuously supplying a laminated film formed by laminating at least a translucent support film and a photosensitive resin layer in a strip shape, and a substrate conveying means for continuously conveying a plurality of substrates along the substrate conveying surface And a pair of lamination rolls that feed the translucent support film while sandwiching the substrate so that the photosensitive resin layer faces the substrate transport surface, and intermittently. In a film sticking apparatus for continuously sticking the laminate film to a plurality of substrates that are sequentially conveyed,
A half cutter that cuts the photosensitive resin layer in the laminate film in the film width direction leaving a part in the thickness direction of the translucent support film, and is disposed between the half cutter and the lamination roll, A tension applying means for applying tension to the laminate film after the photosensitive resin layer is cut; and the translucent support film disposed on the exit side of the lamination roll and attached to the substrate. Supporting film peeling means for peeling off from the substrate, and the cutting portion of the half cutter is located at a position substantially corresponding to the rear end of the substrate and the front end of the substrate following the substrate. the photosensitive resin layer between the cut portion, the film Zhang, characterized by being configured to continuously wound in a state of adhering to the transparent support film Apparatus.

4. The disk cutter according to claim 3, wherein a pair of the half cutters are arranged at the predetermined interval in the film longitudinal direction and are movable in the film width direction, and are opposed to the tip of the disk cutter via the film conveyance surface. And a cutter stand that supports the laminate film when the disc cutter moves in the film width direction, and the pair of disc cutters and the cutter stand in the feed direction of the laminate film. A film sticking apparatus comprising a cover film cutter moving device capable of moving at a constant speed.

A translucent support film unwound from a film roll, a photosensitive resin layer laminated directly or indirectly on the translucent support film, and a cover film laminated over the photosensitive resin layer the cover film of the laminate film composed of Te, with the photosensitive resin layer, in the longitudinal direction of the film, a half-cut process of cutting the film width direction, leaving part of the thickness direction of the translucent support film, The step of peeling the cover film including the cut portion cut in the half-cut step from the photosensitive resin layer by pressing the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape, and the light-transmitting support film after peeling the cover film, A laminating mechanism in which a photosensitive resin layer is supplied along a substrate transport surface so that the photosensitive resin layer is directed to a film-pasting surface of a plurality of substrates that are intermittently fed sequentially, and rotates together with the substrate. By feeding between Nroru, a step of pasting continuously thereto so as to connect the plurality of substrates intermittently, then Zhang Ri Tagged translucent support film to the substrate taking continuously wound from the substrate comprises a step of peeling, the cutting point, while the rear end and the tip on almost corresponding positions of the substrate succeeding thereto of the substrate, and position the lamination roll to perform half-cut process When the tension is applied to the translucent support film that is fed into the lamination roll at a position in between, and the translucent support film is continuously wound up and peeled off from the substrate, the cut location photosensitive resin layer, a method film applying, characterized in that the so that the winding is continuously in a state of adhering to the translucent support film between.

6. The film sticking method according to claim 5, wherein the film is cut while moving the means for cutting the photosensitive resin layer along the laminated film in the same direction and in the same direction.

Film supply source for continuously supplying a laminated film including a translucent support film, a photosensitive resin layer laminated on the translucent support film, and a cover film laminated over the photosensitive resin layer in a band shape Cover film peeling means for continuously peeling the cover film from the laminate film supplied from the film supply source, substrate transport means for continuously transporting a plurality of substrates along the substrate transport surface, A laminating roll that feeds the translucent support film from which the cover film has been peeled off while sandwiching the substrate with the photosensitive resin layer facing the substrate transport surface, and intermittently. In a film sticking apparatus for continuously sticking a laminate film from which the cover film has been peeled off to a plurality of substrates that are sequentially conveyed to
A position between the cover film peeling means and said film supply source, said cover film with the photosensitive resin layer is cut leaving a part of the thickness direction of the transparent resin layer in the film width direction A half cutter, a tension applying means that is arranged between the half cutter and the lamination roll and applies tension to the translucent support film after the photosensitive resin layer is cut, and arranged on the exit side of the lamination roll And a support film peeling means for peeling off the translucent support film after being attached to the substrate from the substrate, and a cutting portion of the half cutter follows the rear end of the substrate and the substrate. The support film peeling means attaches the photosensitive resin layer between the cut portions to the translucent support film. Configured to continuously wound in state, the cover film peeling means, the adhesive surface of the adhesive tape, continuously adhere to the cover film including the cut portions, and, to separate from the film conveying surface A film sticking apparatus, wherein the cover film is peeled off.

8. The disk cutter according to claim 7, wherein a pair of the half cutters is disposed at the predetermined interval in the film longitudinal direction and is movable in the film width direction, and is opposed to the tip of the disk cutter via the film conveyance surface. And a cutter stand that supports the laminate film when the disc cutter moves in the film width direction, and the pair of disc cutters and the cutter stand in the feed direction of the laminate film. A film pasting apparatus provided with a half cutter moving device capable of moving at a constant speed.