JP2956928B2 - Film tip processing method and apparatus in film sticking apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film sticking device, and more particularly to a film sticking device for continuously sticking a film to the surface of a printed wiring board or a glass substrate for a liquid crystal panel. The present invention relates to a processing method and apparatus.

[0002]

2. Description of the Related Art A film sticking apparatus as described above removes a cover film from a laminated film formed by laminating a photosensitive resin layer and a cover film on a light-transmitting support film, and then releases the photosensitive film. Thermocompression bonding with a lamination roll so that the conductive resin layer side is in close contact with the substrate, but the type in which the laminate film is cut in advance according to the substrate length and then thermocompression bonded, and the substrate is spaced apart There is a continuous tension type in which a film is continuously superimposed and supplied along with the film while being sequentially conveyed, without being cut, and the film is fed between a pair of rotating lamination rolls and thermocompression-bonded.

[0003] The continuous stretching type film sticking apparatus comprises:
After passing through the lamination roll and thermocompression bonding, the film is cut by a cutter between the rear end of the adjacent preceding substrate and the front end of the following substrate to separate each substrate.

In the continuous stretching type film sticking apparatus, the distance from the lamination roll to the cutter may be longer than the length of the substrate in some cases.

At the start of the sticking operation, the laminated film needs to be set in advance through the lamination rolls, through the nip rolls in the middle, and further through the cutters. There is a surplus portion up to the leading end of the set film, which must be cut and removed after thermocompression bonding of the film to the foremost substrate.

[0006]

However, recently, the circuit formed on the surface of the printed wiring board or the glass substrate for a liquid crystal panel has become extremely fine, and even if a small amount of dust adheres to the circuit, it becomes defective. Therefore, this type of film sticking apparatus is operated in a clean room or a similar room, and is entirely covered to prevent dust and the like from entering.

Therefore, even if the surplus portion at the leading end of the film is cut by a cutter, it cannot be taken out. In particular, since many transporting devices and other components are arranged also on the cutter exit side, there is a problem that the surplus film cut to the substrate length or longer cannot be easily taken out.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has been made in consideration of the above-described problems, and has been made so that an excessive portion at the leading end of a film can be removed without removing a device body cover. It is an object of the present invention to provide a method and an apparatus for processing a leading edge of a film in an apparatus.

[0009]

According to the present invention, a substrate is formed by
Along a substrate transport surface passing between a pair of lamination rolls, a film is continuously supplied along one surface of the substrate while being sequentially and sequentially transported at an interval, and the pair of laminations is provided together with the substrate. By passing between the rolls, the film is thermocompression-bonded to the surface of the substrate, and on the exit side of the lamination roll, the film between the rear end of the preceding substrate and the front end of the succeeding substrate adjacent in the transport direction is transferred. In a method of processing an excess film front end from the front end of the most preceding substrate in the film sticking apparatus that is configured to be cut by a cutter, in the entrance side of the lamination roll, the first leading substrate conveyed. When the front end is detected and this detection signal is output, the leading edge is detected based on the distance from the detection position to the cutter and the transport speed of the film and the substrate. The film cutting position near the front end of the film is calculated, and the film between the film front end and the film cutting expected position is removed while being divided into a plurality of pieces from the front end by the cutter while the film is being transported together with the substrate. In this way, the above object is achieved.

That is, the surplus portion between the portion where the film is to be cut near the front end of the foremost substrate and the front end of the film is cut into a plurality of pieces by a cutter so that it can be easily taken out.

[0011] The present invention also relates to a method for continuously transporting a substrate along one surface of a substrate while sequentially and continuously transporting the substrate at intervals along a substrate transport surface passing between a pair of lamination rolls. Supply, passing between the pair of lamination rolls together with the substrate,
The film is thermocompression-bonded to the surface of the substrate, and on the exit side of the lamination roll, the film between the rear end of the preceding substrate and the front end of the succeeding substrate adjacent in the transport direction is cut by a cutter. In the apparatus for processing the excess film front from the front end of the most preceding substrate in the film sticking device, the substrate front end which is arranged on the lamination roll entry side and detects the front end of the first leading substrate being conveyed. From the position detection sensor, the output signal of the substrate tip position detection sensor, the distance from the substrate tip position detection sensor to the cutter, and the substrate transfer speed, the film cutting scheduled portion near the foremost substrate tip is the Calculate the time to reach the cutter, the scheduled cutting location, and
A control device for driving the cutter at at least one intermediate cut-off point from now on to the film leading end to cut a plurality of portions from the film cut-off point to the film leading end; A film that is disposed below the transport surface, receives a film that is divided and cut by the cutter, and drops, and has a film outlet that allows the cut film to be removed from the side below the substrate transport surface. The above object is achieved by providing a receiver.

That is, a surplus portion from the vicinity of the front end of the foremost substrate to the front end of the film is cut into a plurality of pieces by a cutter, and the cut portion is dropped into a film receiver provided below the substrate transfer surface, and the film of the film receiver is cut off. It can be taken out sideways from the outlet.

[0013]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a first embodiment of the present invention;

As shown in FIG. 1, a film sticking apparatus 10 according to this embodiment includes a substrate 12 made of a substrate for printed wiring or a glass substrate for a liquid crystal panel. And a film supply means 18 for continuously supplying a film 16 along the upper surface of the substrate 12 conveyed by the substrate conveyer 14, and the conveyed substrate 12 and the film 16 and a pair of upper and lower lamination rolls 20A and 20B which are sandwiched from above and below and thermocompression-bonded with each other, and
A rotary cutter 24 disposed on the outlet side of the rotary cutter 24A and the rotary cutter 24 via a transfer device 22;
An opening 2 is provided at the upper end at the lower side of the substrate transfer surface II on the exit side of
6A, and a film receiver 26 having one side surface in the film width direction opened as a film outlet 26B.

The film supply means 18 includes a film supply roll 19, and a cover film 16A of the film 16 unwound from the film supply means 19 is provided with a peeling member 18A.
After being peeled off by the winding roll 18B, it is wound up by the winding roll 18B.

The rotary cutter 24 includes a rotary blade 24.
A and a fixed blade 24B.
Since the substrate 12 has a constant thickness, the substrate 12 is driven to a position in contact with the rotary blade 24A only at the time of cutting in order to avoid interference with the substrate 12 (a driving device is not shown).

The lamination rolls 20A, 20A
At a position near the entry side of B, a substrate tip position detection sensor 28 is arranged to detect the tip of the foremost substrate 12 and output a detection signal to the control device 30.

The control device 30 receives information about the distance from the substrate tip position detection sensor 28 to the rotary cutter 24 and the transport speed of the film 16 in advance. From the point in time when the tip of the substrate 12 is detected,
The time required for the film cutting scheduled portion near the front end of the robot to reach the rotary cutter 24 is calculated.

Further, the control device 30 drives the rotary cutter 24 at a portion where the film is to be cut near the leading end of the foremost substrate 12 and at a plurality of positions from there to the leading end of the film based on the calculated time. It is configured to divide and cut the surplus portion at the tip into a plurality.

Here, the number of cuts of the surplus portion of the leading end of the film is set to such a length that the divided film can be dropped from the opening 26A at the upper end of the film receiver 26 and taken out from the film outlet 26B to the side. It is to become.

Reference numeral 32 in FIG.
Reference numeral 34 denotes a substrate presence / absence detection sensor disposed near the output side, and reference numeral 34 denotes a nip roll disposed between the lamination rolls 20A and 20B and the rotary cutter 24, respectively.

The substrate presence / absence detection sensor 32 detects when the foremost substrate 12 on which the film 16 has been thermocompression-bonded has passed through the rotary cutter 24, and
A signal is output to 0. After inputting the signal, the control device 30 drives the rotary cutter 24 only at a position between the substrates.

The nip roll 34 is formed between the substrate 12 and the film 1 by the lamination rolls 20A and 20B.
When thermocompression bonding 6 is performed, the front end side of the substrate 12 is restrained and held on the substrate transfer surface II.

The film receiver 26, the substrate tip position detection sensor 28, and the control device 30 constitute a film tip processing device 36.

Next, the operation of the film sticking device 10 and the film leading end processing device 36 will be described.

Prior to the operation of the apparatus, the film supply means 1
8 unwinds the film 16 from the cover film 16A
After peeling, a pair of open lamination rolls 2
0A, 20B, the nip roll 34 and the rotary cutter 24 between the rotary blade 24A and the fixed blade 24B. Next, lamination rolls 20A and 20B
And the nip roll 34 sandwiches the film 16,
Start driving. On the other hand, the substrate 12 is fed by the substrate transport device 14 between the lamination rolls 20A and 20B so as to be below the film 16, and the substrate 12 and the film 16 are thermocompression-bonded.

Prior to the thermocompression bonding of the foremost substrate 12, when the tip of the substrate 12 is detected by the substrate tip position detecting sensor 28, a detection signal is output to the control device 30, and the control device 30 The time required for the film cutting scheduled portion near the front end of the substrate 12 to reach the rotary cutter 24 is calculated.

Thus, the surplus film from the leading end of the film to the portion where the film is to be cut is driven a predetermined number of times by driving the rotary cutter 24 to cut the surplus film as the film 16 advances.

Since the division length at this time is as described above, the divided and cut film 16 sequentially falls into the film receiver 26 from the opening 26A. Film receiver 2
If it falls into the inside 6 and accumulates a certain number or more, it is taken out sideways from the film outlet 26B and discarded.

Here, the leading end of the film 16 cut first by the rotary cutter 24 is a fraction of a plurality of cuts, and is equal to or less than the length of other divided portions.

As described above, when the surplus portion of the film tip is sequentially cut by the rotary cutter 24 and the cutting position near the tip of the foremost substrate 12 is finally cut, the rotary blade 24A and the fixed blade 24B of the rotary cutter 24 are cut. From the middle, the tip of the foremost substrate 12 appears, and when this is detected by the substrate presence / absence detection sensor 32, until the next time,
There is no occurrence of split cutting of the surplus portion of the film tip by the rotary cutter 24.

Thereafter, the film is cut between the substrates 12 in a regular manner.

Although the film sticking apparatus 10 sticks the film 16 on the upper surface of the substrate 12, the present invention is not limited to this. Is naturally applied.

In the above embodiment, the film 16 is cut by the rotary cutter 24 having the rotary blades 24A and the fixed blades 24B. This is performed by another cutting device such as a guillotine cutter, a disk cutter or the like. There may be.

Further, a substrate presence / absence detection sensor 32 is provided on the output side of the rotary cutter 24 so as not to divide the surplus portion at the leading end of the film based on the output signal. May be performed based only on the output signal of the substrate tip position detection sensor 28.

[0036]

As described above, according to the present invention, the surplus film from the leading edge of the preceding substrate to the leading edge of the film in the continuous stretching type film sticking apparatus is cut into a plurality of pieces to cut the surplus film. This has an excellent effect that the device can be easily taken out and discarded without removing the cover or the like of the device.

[Brief description of the drawings]

FIG. 1 is a schematic side view including a partial block diagram showing a film sticking apparatus and a film leading end processing apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Film sticking apparatus 12 ... Substrate 14 ... Substrate conveying apparatus 16 ... Film 16A ... Cover film 18 ... Film supply means 20A, 20B ... Lamination roll 22 ... Conveying apparatus 24 ... Rotary cutter 26 ... Film receiving 26A ... Opening 26B ... Film Take-out port 28 ... Substrate tip position detection sensor 30 ... Control device 32 ... Substrate presence / absence detection sensor 36 ... Film tip processing device II ... Substrate transfer surface

────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification symbol FIB29L 31:34 (56) References JP-A-6-349727 (JP, A) JP-A-5-254017 (JP, A) JP-A-2-95851 (JP, A) JP-A-3-166945 (JP, A) JP-A-4-182116 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) B29C 65 / 00-65/78 B29C 63/02 B32B 31/00-31/28 H05K 3/28

Claims (2)

(57) [Claims] A film is continuously supplied along one surface of the substrate while the substrate is sequentially and continuously transported at intervals along a substrate transport surface passing between a pair of lamination rolls. By passing the film between the pair of lamination rolls together with the substrate, the film is thermocompression-bonded to the surface of the substrate, on the exit side of the lamination roll, the rear end of the preceding substrate and the subsequent substrate adjacent in the transport direction. The film between the leading edge, in a film pasting device adapted to be cut by a cutter, in a method of processing the excess film leading end forward from the front end of the most preceding substrate, on the entrance side of the lamination roll, Detects the front end of the leading substrate that is being conveyed, and when this detection signal is output, the distance from the detection position to the cutter, and the conveyance speed of the film and substrate Next, calculate a film cutting scheduled position near the front end of the foremost substrate, the film between the film leading end and the film cutting scheduled position, while transporting the film with the substrate, sequentially from the leading end by the cutter into a plurality. A method for processing the leading edge of a film in a film sticking device, wherein the film is cut and removed. 2. A film is continuously supplied along one surface of the substrate while the substrate is sequentially and continuously transported at intervals along a substrate transport surface passing between a pair of lamination rolls. By passing the film between the pair of lamination rolls together with the substrate, the film is thermocompression-bonded to the surface of the substrate, on the exit side of the lamination roll, the rear end of the preceding substrate and the subsequent substrate adjacent in the transport direction. The film between the leading edge, in a film sticking apparatus adapted to be cut by a cutter, in a device for processing an excess film leading end forward from the front end of the most preceding substrate, disposed on the lamination roll entry side. A substrate leading edge position detection sensor for detecting the leading edge of the conveyed frontmost substrate; an output signal of the substrate leading edge position detection sensor; The distance from the support to the cutter,
And, from the substrate transfer speed, the time at which the film cutting scheduled portion near the leading edge of the foremost substrate reaches the cutter is calculated, and the scheduled cutting portion, and at least one intermediate cutting schedule from this to the film leading edge. At a point, a control device that drives the cutter and cuts a plurality of portions between the film cutting scheduled portion and the film front end,
Disposed on the exit side of the cutter and below the substrate transfer surface, cut and divided by the cutter, and receives the falling film, and from the lower side of the substrate transfer surface to the side,
A film receiving device provided with a film take-out port capable of taking out a cut film;