JP3721231B2 - Film sticking method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a film attaching method and apparatus for attaching a film to the surface of a substrate exemplified by a printed wiring board substrate, a liquid crystal display panel substrate, a plasma display substrate and the like.
[0002]
[Prior art]
In the manufacturing process of printed wiring boards used in electronic devices such as computers, a photosensitive resin layer is formed on a light-transmitting support film (base film; usually a resin film typified by polyester), and this covers There is a step of attaching the laminate film covered with the film to the conductive layer on the surface of the printed wiring board substrate by removing the cover film. And in this post process, a wiring pattern film is piled up and a photosensitive resin layer is exposed for a predetermined time through this wiring pattern film and the said translucent support film. Next, after peeling off the translucent support film, the exposed photosensitive resin layer is developed to form an etching mask pattern, and then unnecessary portions of the conductive layer are removed by etching, whereby predetermined A printed wiring board having the following wiring pattern is formed.
[0003]
Similar pattern formation is used to form barriers for liquid crystal cells in liquid crystal display devices and barriers for discharge cells in plasma display panels.
[0004]
The film sticking apparatus for sticking the laminate film as described above is a photosensitive resin layer in which a continuous film (raw film) loaded in a film supply roll is placed on the tip of a substrate transported by a transport means. Is guided to the substrate side, and temporarily attached to the tip of the substrate by a temporary attachment means that can move toward and away from the substrate, and then the substrate is conveyed while the film is pressure-bonded to the substrate by a lamination roll. Has been.
[0005]
The film crimping and pasting to the substrate is performed so that the pasting length substantially corresponds to the substrate length, and the supply film is provided on the film temporary attaching means itself or a member in the vicinity thereof so as to be the length. The film is cut by the film cutting means. The cover film is peeled off before or after the tacking means.
[0006]
As another film sticking device, after sticking while continuously transporting the photosensitive resin layer side of the film from which the cover film has been peeled off in advance to the film sticking surface of the board being transported intermittently, between adjacent substrates There are some that cut the film.
[0007]
[Problems to be solved by the invention]
When the film is cut to a length substantially corresponding to the substrate length as described above and pasted to the substrate by the tacking means, the tacking member must be reciprocated for each substrate, and the entire pasting process In addition, there is a problem that a failure occurs due to frequent reciprocation of the temporary attachment means, and temporary attachment may not be possible.
[0008]
Recently, since the pattern formed on the substrate has been made finer, the thickness of the film affects the pattern accuracy, so that a very thin film has been used.
[0009]
As described above, when a thin film is pasted on a substrate with a lamination roll as compared with the conventional film, unless the film is pressure-bonded with a sufficient tensile force, particularly a sufficient tensile force on the rear end side, the film is sensitive. There is a problem that bubbles and wrinkles are generated on the film application surface due to the characteristics of the resin layer.
[0010]
On the other hand, in the case of so-called continuous tension in which the film is continuously applied to the substrate, the generation of bubbles and wrinkles due to insufficient film tensile force is reduced, but the film from which the cover film has been previously peeled is further removed from the lamination roll and from there. Since the operation is started while being stretched between the rolls on the downstream side, and it is crimped to the substrate, the film from the leading edge of the film to the leading edge of the first substrate starting to be stretched is wasted, and the cost is reduced. There is such a problem that the film tip portion that is usually discarded is about 20,000 to 30,000 yen.
[0011]
Furthermore, in the case of continuous lamination, the lamination roll itself becomes a film guide roll, and the contact time with the film is long, so when the film is thin, it is affected by the heat from the lamination roll, and the film is attached to the substrate. As a result, a spot-like or continuous streak-like defective portion may occur.
[0012]
Furthermore, in the case of continuous pasting, the film must be cut between the substrates in the step after the film is stuck to the substrate, but after the cutting, the photosensitive resin layer of the film in the portion protruding from the substrate is different from the other. There is a problem in that it adheres to the substrate or the film pressure-bonded thereto.
[0013]
In addition, in the case of continuous pasting, the leading edge of the film drawn from the raw roll is set manually between the guide roll and the lamination roll, but if the film is thin, the setting work is very difficult, In particular, there is a problem that it is not easy to manually pass the film through a narrow space near the lamination roll.
[0014]
The present invention has been made in view of the above-mentioned conventional problems, and can continuously apply a film to a substrate at a high speed, and when the film is cut after application, such as a photosensitive resin layer. It aims at providing the film sticking method and apparatus which prevented the adhesion layer from adhering to the circumference | surroundings.
[0015]
It is another object of the present invention to provide a film sticking method and apparatus that allow a worker to set a film quickly and easily without putting a hand in a narrow space.
[0017]
[Means for Solving the Problems]
The method invention, as claimed in claim 1, continuously on a plurality of substrates which is conveyed intermittently and sequentially along the substrate transfer line, by a pair of lamination rolls, a laminated film on the front surface of the substrate Adhering to each other, after adhering, adsorb the adjoining part between the end faces of the substrate adjacent to the feeding direction of the laminate film by an adsorbing member that also serves as a cutter table, and transport the adsorbing member and the substrate while adjoining The laminate film is cut in the width direction at two positions near the end face to be cut , and compressed air is ejected from the adsorbing member after the cut, so that the cut portion of the laminate film is excluded from between the adjacent substrate end faces. Thus, the above object is achieved.
[0019]
According to a second aspect of the invention of claim 1, after cutting the laminate film, moving the suction member to the outside of the substrate transfer line while being attracted to the cutting portion, eliminate the cutting portion It is what you do.
[0023]
The apparatus invention, as claimed in claim 3, wherein, for a plurality of surfaces of the substrate along the substrate transfer line conveyed intermittently and sequentially, continuously adhered a laminate film by a pair of lamination rolls In the film sticking device to wear,
An adsorbing member that also serves as a cutter table that adsorbs a laminate film between opposing end surfaces of substrates adjacent to each other in the feeding direction, while being arranged on the downstream side of the lamination roll and moving in synchronization with the substrate,
A running cutter device that is disposed on the downstream side of the lamination roll and moves in synchronization with the substrate while cutting the laminated film in the width direction at two locations along the opposing end faces ;
The adsorbing member is configured to be able to eject compressed air toward the cut laminate film .
[0026]
According to a fourth aspect of the present invention, in the third aspect of the present invention, the adsorbing member can be moved out of the substrate conveying line in a state where the cut laminated film is adsorbed.
[0033]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the drawings.
[0034]
The film sticking apparatus 10 according to the example of this embodiment is configured such that a plurality of substrates 14 that are intermittently and sequentially conveyed along the substrate feed line 12 are subjected to an upper surface of the substrate 14 by a pair of lamination rolls 16A and 16B. Next, the laminate film 18 is continuously stuck, and after the sticking, the portion 19 between the end faces of the substrates 14 and 14 adjacent to each other in the feeding direction of the laminate film 18 is transported to the substrate 14 while transporting the substrate 14. From the lower side of the line 12, it is cut by the running cutter device 20.
[0035]
As shown in an enlarged view in FIG. 2, the laminate film 18 is formed by forming a photosensitive resin layer 18B on a translucent support film 18A and covering it with a cover film 18C. The cover film 18C is peeled off and attached to the upper surface of the substrate 14.
[0036]
As shown in an enlarged view in FIG. 3, the running cutter device 20 is a movable table that is disposed below the substrate feed line 12 so as to be reciprocally movable in a direction (film width direction) perpendicular to the substrate feed direction. 22 and a pair of disk cutters 24A and 24B attached in parallel to the moving table 22 with a width slightly smaller than the width between adjacent end faces of the substrate 14, and the moving table 22 And a synchronous moving base 26 that is supported so as to be movable in synchronization with the substrate 14 along the line 12.
[0037]
The synchronous moving table 26 is supported so as to be movable along a feed direction guide 28 arranged in parallel with the substrate feed line 12 and is engaged with a rack 28A formed on the feed direction guide 28, and a pinion 26A. A pulse motor 26B for driving the pinion 26A is provided, and can move in synchronization with the substrate 14.
[0038]
The moving table 22 is supported by a travel guide 30 in the film width direction supported by the synchronous moving table 26 so as to be reciprocable in the film width direction, and can be reciprocated in the film width direction by an air cylinder 32. ing.
[0039]
Reference numeral 34 in FIG. 4 indicates a control device for controlling the pulse motor 26B and the air cylinder 32. A substrate end sensor 36 for detecting the rear end of the substrate 14 being conveyed or the tip adjacent to the substrate 14 is disposed below the substrate feed line 12 at a position upstream of the running cutter device 20. The control device 34 uses the sensor output signal to start the movement of the synchronous moving table 26 so that the disk cutters 24A and 24B are synchronized with the opposing end surfaces 14A and 14B of the adjacent substrates 14 and 14 that are being transported. And the moving speed is controlled.
[0040]
Opposing to the running cutter device 20, a cutter table 38 is arranged above the substrate feed line 12 so as to move in synchronization with the disk cutters 24A and 24B in the substrate feed direction.
[0041]
As shown in an enlarged view in FIG. 5, the cutter base 38 has a length that slightly protrudes upstream and downstream from the end surfaces 14A and 14B of the adjacent substrates 14 and 14 in the substrate feeding direction, respectively. In the direction perpendicular to the substrate feed direction, the air pressure is formed longer than the entire width of the substrate 14, and air pressure or negative pressure transmitted from the air pressure line 39B via the air chamber 39A is formed on the lower side surface thereof. A number of suction holes 39 to be applied are formed.
[0042]
As shown in FIG. 3, the cutter table 38 is supported by a synchronous movement device 40 so as to be able to reciprocate in the substrate feed direction in synchronization with the disk cutters 24A and 24B moved in the substrate feed direction. In the cutter operating position, as shown in FIG. 1 and FIG. 5, it is adsorbed on the upper surface of the laminate film 18 adhered to the substrate 14 and descends to a cutting position to keep it in place, and After the film cutting is completed, it is supported by the vertical movement device 42 so as to be separated upward.
[0043]
Both the synchronous movement device 40 and the vertical movement device 42 are controlled by the control device 34, and on / off of negative pressure applied to the suction hole 39 and on / off of positive pressure are controlled. ing.
[0044]
Here, the range of movement of the cutter table 38 in the downstream direction is set to be larger than the range of movement of the disk cutters 24A, 24B in the downstream direction, and a cut film receiver 44 is disposed below the extended portion. Has been.
[0045]
Between the pair of lamination rolls 16A and 16B, the laminate film 18 is supplied from the raw roll 46 along the film supply line 48 in a substantially vertical direction, but the upper side of the lamination roll 16A is on the side of the substrate feed line 12 In addition, in the range of approximately ¼ arc on the upstream side, the tension bar 50 is provided so that the laminate film 18 is supplied between the lamination rolls 16A and 16B without contacting the lamination roll 16A.
[0046]
As shown in an enlarged view of FIG. 6, the tension bar 50 has a plurality of suction holes 50 </ b> B formed in the outer arcuate portion 50 </ b> A in a range where the laminated film 18 is in sliding contact, and a negative pressure source ( Negative pressure from (not shown) is applied.
[0047]
The suction force of the laminate film 18 by the suction holes 50B based on the negative pressure is such that the laminate film 18 is allowed to move when the laminate film 18 is pulled while being thermocompression bonded to the substrate 14 between the lamination rolls 16A and 16B. Yes.
[0048]
The film supply line 48 is on a line extending downward beyond the substrate feed line 12 and has a substantially vertical suction surface 52A at a position near the entrance side of the lower lamination roll 16B. Means 52 are arranged. Reference numeral 52B in FIG. 6 indicates suction holes for applying a plurality of negative pressures formed on the suction surface 52A.
[0049]
1 denotes a film separating means for peeling the cover film 18C from the laminated film 18, 56 denotes a cover film winding roll for winding the separated cover film 18C, and 58 denotes a guide roll. .
[0050]
Next, the process of sticking the laminated body film 18 to the board | substrate 14 with the said film sticking apparatus 10 is demonstrated.
[0051]
First, the laminate film 18 is unwound from the raw fabric roll 46, the cover film 18C is guided to the cover film take-up roll 56 through the film separating means 54, and the cover film 18C is peeled off. The tip portion 18D of the light transmitting support film 18A side is sucked and held on the suction surface 52A of the suction means 52.
[0052]
In this state, the substrate 14 is transported along the substrate feed line 12, and a dummy substrate 15 having the same thickness and width as the substrate 14 and a small feed direction dimension is disposed at the top.
[0053]
As shown in FIG. 6, after the dummy substrate 15 abuts at right angles to the laminated film 18 whose tip 18D is adsorbed by the adsorbing means 52 at the tip, the laminated film 18 is further moved as shown in FIG. Since it pushes to the right direction of a figure, the photosensitive resin layer 18B adheres to the back surface and surface of the advancing direction front-end | tip of the dummy board | substrate 15, and the laminated body film 18 is wound so that this front-end | tip may be covered.
[0054]
In this state, the laminate film 18 enters between the lamination rolls 16A and 16B, and the laminate film 18 is thermocompression bonded to the upper surface of the dummy substrate 15. Further, the dummy substrate 15 advances by the feed force generated by the rotation of the lamination rolls 16A and 16B.
[0055]
Since the laminating rolls 16 </ b> A and 16 </ b> B have a strong feeding force in the traveling direction of the dummy substrate 15 and the laminate film 18, the leading end portion 18 </ b> D of the laminate film 18 is peeled off from the suction means 52 and proceeds with the dummy substrate 15. .
[0056]
On the other hand, the laminate film 18 is unwound from the raw roll 46 as the dummy substrate 15 advances, and is supplied between the lamination rolls 16 </ b> A and 16 </ b> B along the tension bar 50.
[0057]
In this way, the laminate film 18 is thermocompression bonded to the substrate 14 subsequent to the dummy substrate 15 by the lamination rolls 16A and 16B sequentially.
[0058]
The laminated film 18 is in sliding contact with the tension bar 50 on the entry side of the lamination rolls 16A and 16B, and at this time, is sucked by the negative pressure applied to the suction hole 50B formed in the outer arcuate portion 50A. Therefore, it receives a tensile force when it is wound between the lamination rolls 16A and 16B.
[0059]
Therefore, at any position on the substrate 14, the laminate film 18 is subjected to a rearward pulling force and is thermocompression bonded to the upper surface of the substrate 14 without generating wrinkles or bubbles.
[0060]
Furthermore, even when the laminate film 18 is very thin, the tension bar 50 blocks heat from the lamination roll 16A, and heat generated in the tension bar 50 is also discharged to the outside by suction. The body film 18 is not excessively heated on the entry side of the lamination roll 16A. Therefore, the state of sticking to the substrate 14 is also stable.
[0061]
When the dummy substrate 15 to which the laminated film 18 is pasted and the substrate 14 continuing to the dummy substrate 15 travel further downstream, and the end face thereof is detected by the substrate end sensor 36, the control device 34 causes the synchronous moving base 26 to The synchronous movement device 40 is driven in the substrate traveling direction at the same speed and at the same timing as the end face 14A or 14B.
[0062]
At this time, the control device 34 drives the vertical movement device 42 in the synchronous movement device 40 to move the cutter table 38 at a position between the adjacent end surfaces 14A and 14B of the substrate or the dummy substrate, as shown in FIG. The laminate film 18 is pressure-bonded from above in a state where it is lowered and bridges between adjacent substrates or dummy substrates.
[0063]
At this time, a negative pressure is applied to the suction hole 39 of the cutter base 38, and the portion 19 between the end faces between the end faces 14A and 14B of the adjacent substrates is sucked and held.
[0064]
At the same time, the control device 34 starts the movement of the moving table 22 located at the outer position in the width direction of the substrate feed line 12, and the disk cutters 24A and 24B enter between the end surfaces 14A and 14B of the adjacent substrates to form a stack. The body film 18 is cut in the film width direction in a state where the body film 18 is pressed against the cutter base 38.
[0065]
After the end of cutting, the movable table 22 comes out on the opposite side of the substrate feed line 12 and stands by at a position where it does not interfere with the substrate 14.
[0066]
At the same time, the negative pressure applied to the suction hole 39 of the cutter base 38 is switched to the positive pressure, and compressed air is ejected at a position above the cut film receiver 44, whereby a portion between the end faces of the laminate film 18 is obtained. 19 is blown down through the gap between the end faces 14A and 14B, falls into the cut film receiver 44, and is collected.
[0067]
The steps as described above are repeated, and the laminate film 18 is attached to the substrate 14, and the portion 19 between the end faces in the subsequent steps is cut and removed.
[0068]
Note that the laminated film 18 adhered to the dummy substrate 15 is discarded together with the dummy substrate 15. Accordingly, the tip 18D of the laminate film 18 unwound from the original roll 46 is not used by being attached to a substrate, and thus may not be cut at right angles to the film width direction. Further, even if the unwinding tip of the laminate film 18 is not accurately adsorbed by the adsorption surface 52A of the adsorption means 52, it may be adsorbed at a position beyond this, so that the end of the laminate film 18 is at a right angle. Therefore, it is not necessary to make them adsorb to the adsorption surface 52A accurately.
[0069]
In the film pasting device 10, the portion 19 between the cut end faces is removed by being blown downward by the compressed air ejected from the suction hole 39 of the cutter base 38. The substrate feed line 12 is not limited to the means, for example, in a state in which a negative pressure is applied to the suction hole 39 of the cutter base 38, that is, in a state in which the portion 19 between the cut end faces is adsorbed. You may make it carry out outside.
[0070]
Further, as shown in FIG. 7, without providing a cutter table and from the opposite side of the case of FIG. 1, that is, from the laminated film 18 side, the substrate 14 is attached by a pair of disk cutters 58A and 58B. You may make it cut | disconnect this in a film width direction, moving. In this case, the board | substrate 14 with which the laminated body film 18 is affixed fulfill | performs the function of a cutter stand.
[0071]
The means 19 for removing the portion 19 between the end faces cut by the disk cutters 58A and 58B may be sucked by the suction means 60 to which negative pressure is applied and discharged out of the line, as described above. An air jet nozzle 62 for blowing out compressed air downward is provided at a central position between the adjacent end faces 14A and 14B of the substrate, and the portion 19 between the cut end faces is blown down from between the adjacent end faces to be discharged. You may make it do.
[0072]
Furthermore, in any of the above cases, the portion 19 between the cut end faces is excluded by suction by negative pressure and blown by compressed air, but this is not limited to pneumatic means, for example, Alternatively, mechanical discharge means such as pinching with a hook-shaped lever and discharging may be used.
[0073]
【The invention's effect】
Since the present invention is configured as described above, it is possible to reliably adhere the film continuously to the substrate while suppressing the generation of bubbles and wrinkles due to insufficient film tension and without increasing the waste portion at the end of the continuous film. It has an excellent effect of being able to.
[Brief description of the drawings]
FIG. 1 is a schematic side view showing a film sticking apparatus according to an example of an embodiment of the present invention. FIG. 2 is an enlarged cross-sectional view showing a laminate film. FIG. 4 is a block diagram showing a control system in the film sticking apparatus. FIG. 5 is a cross-sectional view showing the vicinity of the cutter base in an enlarged manner. FIG. FIG. 7 is an enlarged side view showing the vicinity of the tension bar. FIG. 7 is a schematic side view showing an example of another embodiment of a running cutter.
DESCRIPTION OF SYMBOLS 10 ... Film sticking apparatus 12 ... Board | substrate feed line 14 ... Board | substrate 14A, 14B ... End surface 15 ... Dummy board | substrate 16A, 16B ... Lamination roll 18 ... Laminated body film 18A ... Translucent support film 18B ... Photosensitive resin layer 18C ... Cover film DESCRIPTION OF SYMBOLS 19 ... The part 20 between end surfaces ... Running cutter apparatus 24A, 24B ... Disc cutter 26 ... Synchronous movement stand 34 ... Control apparatus 36 ... Substrate edge sensor 38 ... Cutter stand 39 ... Suction hole 40 ... Synchronous movement device 46 ... Original fabric Roll 48 ... Film supply line 50 ... Tension bar 50A ... Outer arcuate portion 50B ... Suction hole 52 ... Suction means 52A ... Suction surface 58A, 58B ... Disc cutter 60 ... Suction means 62 ... Air jet nozzle

Claims (4)

For a plurality of substrates which is conveyed intermittently and sequentially along the substrate transfer line, by a pair of lamination rolls, continuously adhering the laminate film on the front surface of the substrate, after sticking, the laminate The portion between the end faces of the substrates adjacent to each other in the film feeding direction is adsorbed by an adsorbing member that also serves as a cutter table, and while transporting the adsorbing member and the substrate, the laminated film is placed at two positions near the adjacent end surfaces. A film sticking method comprising cutting in the width direction, and ejecting compressed air from the adsorbing member after cutting to remove a cut portion of the laminate film from between the adjacent end faces of the substrate . According to claim 1, wherein after cutting the laminated film, said moving the suction member to the outside of the substrate transfer line while being attracted to the cutting portion, a film sticking method characterized in that it eliminate the cutting portion. For a plurality of surfaces of the substrate along the substrate transfer line conveyed intermittently and sequentially, in a film sticking device for continuously adhering the laminate film by a pair of lamination rolls,
An adsorbing member that also serves as a cutter table that adsorbs a laminate film between opposing end surfaces of substrates adjacent to each other in the feeding direction, while being arranged on the downstream side of the lamination roll and moving in synchronization with the substrate,
A running cutter device that is disposed on the downstream side of the lamination roll and moves in synchronization with the substrate while cutting the laminated film in the width direction at two locations along the opposing end faces ;
The said adhering member is comprised so that compressed air can be ejected toward the cut said laminated body film, The film sticking apparatus characterized by the above-mentioned . 4. The film sticking apparatus according to claim 3 , wherein the suction member is movable to the outside of the substrate transport line in a state where the cut laminated film is sucked.

Images