JPH058419B2 - - Google Patents
Info
- Publication number
- JPH058419B2 JPH058419B2 JP58028065A JP2806583A JPH058419B2 JP H058419 B2 JPH058419 B2 JP H058419B2 JP 58028065 A JP58028065 A JP 58028065A JP 2806583 A JP2806583 A JP 2806583A JP H058419 B2 JPH058419 B2 JP H058419B2
- Authority
- JP
- Japan
- Prior art keywords
- cover film
- substrate
- film
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000013039 cover film Substances 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 30
- 239000010408 film Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims 1
- 206010040844 Skin exfoliation Diseases 0.000 description 11
- 239000002390 adhesive tape Substances 0.000 description 10
- 238000004804 winding Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
- B29C63/0013—Removing old coatings
Description
【発明の詳細な説明】
本発明は、印刷配線板用基板に貼合されたカバ
ーフイルム付感光性樹脂フイルムのカバーフイル
ム剥離方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for peeling off a cover film from a photosensitive resin film attached to a printed wiring board substrate.
印刷配線板の製造工程において銅張積層板、回
路加工された配線板、絶縁板等の印刷配線板用基
板に感光性樹脂フイルムを貼合せ、露光、現像し
て硬化樹脂のメツキレジスト、エツチングレジス
ト、ハンダレジストが形成される。 In the manufacturing process of printed wiring boards, a photosensitive resin film is laminated to printed wiring board substrates such as copper-clad laminates, circuit-processed wiring boards, and insulating boards, exposed to light, and developed to form hardened resin plating resists and etching resists. , a solder resist is formed.
印刷配線板用基板に感光性樹脂フイルムを貼合
せる場合カバーフイルム付感光性樹脂フイルムが
使用されている。第１図は印刷配線板用基板１に
カバーフイルム２付感光性樹脂フイルム３が貼合
されたものを示す断面図である。 When laminating a photosensitive resin film to a substrate for a printed wiring board, a photosensitive resin film with a cover film is used. FIG. 1 is a sectional view showing a photosensitive resin film 3 with a cover film 2 attached to a substrate 1 for a printed wiring board.
このようなカバーフイルム付感光性樹脂フイル
ムでは、現像工程の前にカバーフイルムを剥離す
る必要がある。 In such a photosensitive resin film with a cover film, it is necessary to peel off the cover film before the development step.
カバーフイルムは、透明薄物シートのため剥離
残りがあつても検知することが困難であり、また
検知漏れで次工程が基板が送られると部分的現像
残りとなり製品を不良としてしまう。そのために
も確実に完全にカバーフイルムを除去しなければ
ならない。 Since the cover film is a transparent thin sheet, it is difficult to detect any residual peeling, and if detection fails and the substrate is sent to the next process, partial development remains, resulting in a defective product. For this purpose, the cover film must be completely removed.
ところで、カバーフイルムを剥離するのに、剥
離する前段階において剥離の「きつかけ」を引つ
掻き部材により作り、後段階において前記剥離し
たカバーベースを完全に除去するという提案がな
されている（実公昭56−47634号公報参照）。 By the way, in order to peel off the cover film, there has been a proposal to create a "tight spot" for peeling with a scratching member in the pre-peeling stage, and to completely remove the peeled off cover base in the post-peeling stage. (See Publication No. 56-47634).
しかし、一般にカバーフイルムは、ポリエステ
ル製のため、伸びが少なく印刷配線板用基板が薄
板であり、且つ片面のみにカバーフイルムが貼り
付けてある場合でないと、適用できない。さらに
引つ掻ける最初の接触部が印刷配線板用基板の端
部にない場合の適用は難しい。 However, since the cover film is generally made of polyester, it has little elongation and cannot be applied unless the printed wiring board substrate is a thin plate and the cover film is attached to only one side. Furthermore, the application is difficult when the first scratchable contact is not at the edge of the printed wiring board substrate.
本発明はこのような点に鑑みてなされたもの
で、印刷配線板用基板に貼合されたカバーフイル
ム付感光性樹脂フイルムのカバーフイルムを完成
に除去する方法を提供することを目的とする。 The present invention has been made in view of these points, and an object of the present invention is to provide a method for completely removing a cover film of a photosensitive resin film with a cover film bonded to a substrate for a printed wiring board.
本発明は、印刷配線板用基に貼合されたカバー
フイルム付感光性樹脂フイルムのカバーフイルム
の先端にカツターにより切れ目を入れてカバーフ
イルムを基板から浮き上がらせることを特徴とす
る印刷配線板用基板に貼合されたカバーフイルム
付感光性樹脂フイルムのカバーフイルム剥離方法
である。 The present invention provides a substrate for a printed wiring board, characterized in that a cut is made at the tip of the cover film of a photosensitive resin film with a cover film attached to a substrate for a printed wiring board to lift the cover film from the substrate. This is a method for peeling off a cover film from a photosensitive resin film with a cover film laminated to a photosensitive resin film.
カバーフイルムの先端に切れ目を入れるとカバ
ーフイルムは、残留応力により収縮して浮き上が
る。この方法だと、カバーフイルムが両面にある
場合でも、カバーフイルムが印刷配線板用基板の
端部にまで貼合わされていない場合でも確実に
「きつかけ」を作り出し剥離を容易にならしめる。
その後は、浮き上がつたカバーフイルムを粘着テ
ープや粘着ロール等で完全に剥離する。 When a cut is made at the tip of the cover film, the cover film contracts and floats due to residual stress. With this method, even if the cover film is on both sides, or if the cover film is not attached to the edge of the printed wiring board substrate, it will surely create a "tight grip" and make peeling easier.
After that, completely peel off the lifted cover film using adhesive tape, adhesive roll, etc.
第２図は本発明の方法を実施するための剥離装
置の一例を示すものである。 FIG. 2 shows an example of a peeling apparatus for carrying out the method of the present invention.
装置本体はおおよそナイフカツト部とテープヘ
ツド部と巻取り部からなつている。 The main body of the device roughly consists of a knife cut section, a tape head section, and a winding section.
ナイフカツト部は光電管４、タイマー５、ロー
ラーコンベヤー６、ストツパー７、カツター８か
らなる。光電管４は基板９が通過時点からタイマ
ー５を作動させ、ローラーコンベヤー６、ストツ
パー７、カツター８、テープヘツド１０の動作を
制御する様になつている。ストツパー７は基板９
の先端を位置決めしカツター８が基板９に降りた
場合基板先端から５mmだけカバーフイルム１１を
切れる様になつている。カツター８はカバーフイ
ルム１１の残留応力により若干の剥がれ状態を作
るべく取りつけてある。テープヘツド部は第２
図、第３図に示すようにテープヘツド昇降用のエ
アーシリンダー１２、粘着テープ１３、圧着ロー
ル１４、巻き取りボビン１５、圧着ロール回転用
のラチエツト歯車１６及びエアーシリンダーに取
りつけられたラチエツト爪１７から構成される。
粘着テープ１３は圧着ロール１４にて粘着面が表
向きになる様、すなわちカバーフイルムに面して
装着しその先端を取り巻き取りボビン１５に固定
しておく。粘着テープ１３の巻き取りは、ラチエ
ツト機構により圧着ロール１４を回転させまたこ
の回転力をチエーン１８により巻き取りボビン１
５に伝えこれも回転させ寸送りする様になつてい
る。巻き取り部は突き出しピン１９、巻き取りコ
ンベヤー、カゴ２０からなつている。エアーシリ
ンダーに取り付けられた先端が半球状の棒（以下
単に突き出しピン１９）はテープヘツドの前方か
ら水平に動きすなわち、基板の移動方向と同じ方
向に動き最も突き出した場合、複数個のプーリー
２１とＶベルト２２からなる巻き取りコンベヤー
のプーリー２１の間に５mm程度食い込む様に調整
されている。また巻き取りコンベヤーの後にはカ
ゴ２０を取り付けておくこれらの機構により以下
に述べる様な動きでカバーフイルム１１が剥離さ
れる。基板９はローラーコンベヤー６によつて運
ばれ光電管４を通過するとストツパー７が下降す
る。基板９がストツパー７に到着すると若干秒後
ローラーコンベヤー６が停止し、基板先端の位置
決めがなされ、次にカツター８が基板９をはさむ
様に上昇及び下降しカバーフイルム１１に傷をつ
けた後定位値にもどる。次にストツパー７が上昇
し再びローラーコンベヤー６が動き基板９の先端
を圧着ローラー１４の真下まで運び停止する。次
にテープヘツド１０は基板９に向つて下降ないし
上昇する。圧着ロール１４が基板面に到着すると
粘着テープ１３が回転しカバーフイルム１１が接
着し巻き取られる。カバーフイルム１３の下面
（剥離される面）に空気を吹込めば剥離は容易に
行なわれる。 The knife cutting section consists of a phototube 4, a timer 5, a roller conveyor 6, a stopper 7, and a cutter 8. The phototube 4 operates a timer 5 from the time the substrate 9 passes, and controls the operations of the roller conveyor 6, stopper 7, cutter 8, and tape head 10. Stopper 7 is board 9
When the tip of the cutter 8 is positioned and the cutter 8 is lowered onto the substrate 9, the cover film 11 can be cut by 5 mm from the tip of the substrate. The cutter 8 is attached so as to cause the cover film 11 to be slightly peeled off due to residual stress. The tape head is the second
As shown in FIGS. 3 and 3, it consists of an air cylinder 12 for lifting and lowering the tape head, an adhesive tape 13, a pressure roll 14, a take-up bobbin 15, a ratchet gear 16 for rotating the pressure roll, and a ratchet pawl 17 attached to the air cylinder. be done.
The adhesive tape 13 is mounted on a pressure roll 14 with the adhesive surface facing upward, that is, facing the cover film, and its tip is taken up and fixed to the bobbin 15. The adhesive tape 13 is wound by rotating the pressure roll 14 by a ratchet mechanism, and applying this rotational force to the winding bobbin 1 by a chain 18.
5, which is also rotated and fed by an inch. The winding section consists of an ejector pin 19, a winding conveyor, and a basket 20. A rod with a hemispherical tip (hereinafter simply referred to as the ejector pin 19) attached to the air cylinder moves horizontally from the front of the tape head, that is, in the same direction as the board movement direction, and when it protrudes the most, it connects the plurality of pulleys 21 and V. It is adjusted to fit approximately 5 mm between the pulleys 21 of the take-up conveyor consisting of the belt 22. Further, the cover film 11 is peeled off by the mechanism to which the basket 20 is attached after the take-up conveyor in the manner described below. When the substrate 9 is carried by the roller conveyor 6 and passes the phototube 4, the stopper 7 is lowered. When the substrate 9 arrives at the stopper 7, the roller conveyor 6 stops a few seconds later, and the tip of the substrate is positioned.Then, the cutter 8 rises and descends to sandwich the substrate 9, scratching the cover film 11, and then positioning it. Return to values. Next, the stopper 7 rises and the roller conveyor 6 moves again to convey the tip of the substrate 9 to just below the pressure roller 14 and stop. Tape head 10 is then lowered or raised toward substrate 9. When the pressure roll 14 reaches the substrate surface, the adhesive tape 13 rotates and the cover film 11 is adhered and wound up. If air is blown into the lower surface of the cover film 13 (the surface to be peeled off), peeling can be easily performed.
次にテープヘツドを上昇ないし下降させカバー
フイルム１１を剥がしつつローラーコンベヤー６
を動かせ、テープヘツド１０が定位値にもどると
突き出しピン１９が前進し、カバーフイルム１１
を巻き取りコンベヤーに押し込む。突き出しピン
１９はカバーフイルム１１を押し込み後定位値に
もどり、カバーフイルム１１は巻き取りコンベヤ
ーによりカゴ２０に運ばれ、一方基板９はローラ
ーコンベヤー６により次工程に運ばれる。 Next, the tape head is raised or lowered and the cover film 11 is peeled off while the roller conveyor 6
When the tape head 10 returns to its normal position, the ejector pin 19 moves forward and the cover film 11
is rolled up and pushed onto the conveyor. After pushing the cover film 11 in, the ejecting pin 19 returns to its normal position, and the cover film 11 is carried to the basket 20 by the take-up conveyor, while the substrate 9 is carried by the roller conveyor 6 to the next process.
巻き取り部としては、第２図に示すような突き
出しピン１９によるものの他、カバーフイルム背
後に吸引ダクトを設置し、カバーフイルムを吸引
除去する方法、カバーフイルム前後より棒状のチ
ヤツク装置を接近させチヤツク後、水平に移動さ
せても、回転させてもよいから、粘着テープから
カバーフイルムを剥ぐ方法等を使用し得る。 In addition to using the ejecting pin 19 as shown in Fig. 2 for the winding section, there are also methods in which a suction duct is installed behind the cover film to remove the cover film by suction, and a chuck device in which a bar-shaped chuck device is brought close to the front and back of the cover film to remove the cover film. After that, the adhesive tape may be moved horizontally or rotated, so that a method such as peeling off the cover film from the adhesive tape may be used.
更に用途によつては、巻き取り部をこのように
別途設けなくても良い。 Furthermore, depending on the application, it may not be necessary to separately provide a winding section.
以上説明したように本発明においては粘着テー
プにより予め切れ目を入れられたカバーフイルム
を押圧接着し、粘着テープを基板から離してゆく
様にしたため巻き取りコンベヤーにカバーフイル
ムを確実に送り込め、さらにカバーフイルムが裂
けることが無いため剥離残りも無くなりカバーフ
イルム剥離作業の自動化が可能となつた。 As explained above, in the present invention, a cover film with pre-slits made with adhesive tape is pressure-adhered, and the adhesive tape is separated from the substrate, so that the cover film can be reliably fed to the take-up conveyor, and Since the film does not tear, there is no residue left after removal, making it possible to automate the cover film removal work.
第１図は、印刷配線板用基板の断面図、感材、
第２図、第３図は剥離装置の簡略側面図である。
符号の説明、１……印刷配線板用基板、２……
カバーフイルム、３……感光性樹脂フイルム、６
……ローラーコンベヤー、８……カツター、９…
…基板、１０……テープヘツド、１１……カバー
フイルム、１３……粘着テープ、１４……圧着ロ
ール、１５……巻き取りボビン、１９……付だし
ピン、２２……Ｖベルト。
FIG. 1 is a cross-sectional view of a substrate for a printed wiring board, a photosensitive material,
2 and 3 are simplified side views of the peeling device. Explanation of symbols, 1... Printed wiring board substrate, 2...
Cover film, 3...Photosensitive resin film, 6
...Roller conveyor, 8...Cutter, 9...
... Substrate, 10 ... Tape head, 11 ... Cover film, 13 ... Adhesive tape, 14 ... Pressure roll, 15 ... Winding bobbin, 19 ... Output pin, 22 ... V-belt.
Claims (1)
ム付感光性樹脂フイルムのカバーフイルムの先端
にカツターにより切れ目を入れてカバーフイルム
を基板から浮き上がらせることを特徴とする印刷
配線板用基板に貼合されたカバーフイルム付感光
性樹脂フイルムのカバーフイルム剥離方法。1. Lamination to a substrate for a printed wiring board, characterized by making a cut with a cutter at the tip of the cover film of a photosensitive resin film with a cover film laminated to a substrate for a printed wiring board to lift the cover film from the substrate. A method for removing a cover film from a photosensitive resin film with a cover film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2806583A JPS59154447A (en) | 1983-02-22 | 1983-02-22 | Method for stripping cover film of photosensitive resin film pasted to printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2806583A JPS59154447A (en) | 1983-02-22 | 1983-02-22 | Method for stripping cover film of photosensitive resin film pasted to printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59154447A JPS59154447A (en) | 1984-09-03 |
| JPH058419B2 true JPH058419B2 (en) | 1993-02-02 |
Family
ID=12238362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2806583A Granted JPS59154447A (en) | 1983-02-22 | 1983-02-22 | Method for stripping cover film of photosensitive resin film pasted to printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59154447A (en) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61191353U (en) * | 1985-05-22 | 1986-11-28 | ||
| JPH0719060B2 (en) * | 1985-07-08 | 1995-03-06 | 東レ株式会社 | Cover sheet peeling device |
| JPS6239850A (en) * | 1985-08-14 | 1987-02-20 | Hakutou Kk | Method for stripping protective film from printed board |
| DE3650181T2 (en) * | 1985-08-16 | 1995-08-24 | Somar Corp | Method and device for peeling a film. |
| JPS6241158A (en) * | 1985-08-16 | 1987-02-23 | Somar Corp | Stripping method for thin film and device thereof |
| US4867836A (en) * | 1985-08-30 | 1989-09-19 | Somar Corporation | Film peeling apparatus |
| JPS6256243A (en) * | 1985-08-31 | 1987-03-11 | Somar Corp | Exfoliating apparatus for thin film |
| JPS6251556A (en) * | 1985-08-30 | 1987-03-06 | Somar Corp | Thin film defoliating device |
| JPS6251555A (en) * | 1985-08-30 | 1987-03-06 | Somar Corp | Thin film defoliating device |
| JPS62180858A (en) * | 1986-02-05 | 1987-08-08 | Somar Corp | Film stripping device |
| ATE116511T1 (en) * | 1985-08-31 | 1995-01-15 | Somar Corp | DEVICE FOR PEELING A FILM. |
| JPS6256244A (en) * | 1985-08-31 | 1987-03-11 | Somar Corp | Thin film exfoliating apparatus |
| JPS62181489A (en) * | 1986-02-05 | 1987-08-08 | ソマ−ル株式会社 | Thin film remover |
| JPS6256247A (en) * | 1985-09-05 | 1987-03-11 | Somar Corp | Exfoliating apparatus for thin film |
| ATE116789T1 (en) * | 1985-09-05 | 1995-01-15 | Somar Corp | DEVICE FOR PEELING A FILM. |
| DE3532553C1 (en) * | 1985-09-12 | 1987-03-12 | Loehr & Herrmann Gmbh | Method and device for removing the protective film from a printed circuit board coated with exposed photoresist |
| US4724032A (en) * | 1985-10-02 | 1988-02-09 | Thomas Kay | Sheet separating machine and method |
| DE3683137D1 (en) * | 1985-11-12 | 1992-02-06 | Somar Corp | DEVICE FOR FILM REMOVAL. |
| JPH063550B2 (en) * | 1985-11-12 | 1994-01-12 | ソマ−ル株式会社 | Thin film stripping equipment |
| EP0223198B1 (en) * | 1985-11-12 | 1992-07-29 | Somar Corporation | Apparatus for peeling a film stuck on a board |
| JPS62180371A (en) * | 1986-02-05 | 1987-08-07 | Somar Corp | Projection pressing device for thin film flotation |
| JPS62196259A (en) * | 1986-02-24 | 1987-08-29 | Somar Corp | Film separator with peeled film housing vessel |
| DE3781908T2 (en) * | 1986-02-05 | 1993-05-13 | Somar Corp | FILM TRANSPORT DEVICE. |
| JP2534658B2 (en) * | 1986-02-24 | 1996-09-18 | ソマ−ル株式会社 | Thin film stripping device with fluid spraying device |
| US4867837A (en) * | 1986-11-18 | 1989-09-19 | Somar Corporation | Film peeler |
| JPS63128695A (en) * | 1986-11-18 | 1988-06-01 | ソマ−ル株式会社 | Thin film remover |
| JPH0755559Y2 (en) * | 1988-09-16 | 1995-12-20 | 富山日本電気株式会社 | Protective film peeling device for photosensitive resin |
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|---|---|---|---|---|
| JPS519451A (en) * | 1974-07-12 | 1976-01-26 | Nitto Electric Ind Co | Fuirumuno hakurihoho |
| JPS5354019A (en) * | 1976-10-27 | 1978-05-17 | Fuji Photo Film Co Ltd | Device for developing photosensitive material |
| JPS5647634U (en) * | 1979-09-19 | 1981-04-27 |
-
1983
- 1983-02-22 JP JP2806583A patent/JPS59154447A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519451A (en) * | 1974-07-12 | 1976-01-26 | Nitto Electric Ind Co | Fuirumuno hakurihoho |
| JPS5354019A (en) * | 1976-10-27 | 1978-05-17 | Fuji Photo Film Co Ltd | Device for developing photosensitive material |
| JPS5647634U (en) * | 1979-09-19 | 1981-04-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59154447A (en) | 1984-09-03 |
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