JPS6241158A - Stripping method for thin film and device thereof - Google Patents

Abstract

PURPOSE:To stably apply a uniform stripping force onto a thin film by using a thin-film stripping guide member which sets the direction of stripping nearly perpendicularly to a substrate. CONSTITUTION:As for a viscous rotary body 4, an arm 4C moves when the top edge part of a printed circuit board 1 is set at a prescribed position by the control of a transport control roller 3, and the viscous substance 4A contacts with the top edge part of a light transmitting resin film 1D. The light transmitting resin film 1D pulled up by the viscous rotary body 4 is guided by a thin-film stripping guide member 6B and nipped by a fixed belt conveyor 6A and a movable belt conveyor 6C, and transported under being stripped and automatic discharge is certainly carried out.

Description

Detailed Description of the Invention (1) Purpose of the Invention [Field of Industrial Application] The present invention relates to a thin film peeling technique, and in particular,
The present invention relates to a technique that is effective when applied to a technique for peeling off a protective film pasted to protect the surface of a substrate.

[Prior Art] Printed wiring boards used in electronic devices such as computers have copper wiring in a predetermined pattern formed on one or both sides of an insulating substrate.

This type of printed wiring board can be manufactured by a fourth manufacturing process. First, a laminate consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) for protecting it is laminated by thermocompression on the conductive layer of an insulating substrate. After this, a wiring pattern film is overlaid on the pattern film.

The photosensitive resin layer is exposed to light for a predetermined period of time through a transparent resin film. After peeling off the transparent resin film,
The exposed photosensitive resin is developed to form an etching mask pattern. Thereafter, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin is peeled off to form a printed wiring board having a predetermined wiring pattern.

[Problem that the invention attempts to solve] In the manufacturing process of the printed wiring board mentioned above.

When developing the photosensitive resin layer after exposure, a step of peeling off the light-transmitting resin film is required. Peeling off this translucent resin film relies on manual labor by one person, and since the film is thin, it requires finger dexterity and great skill to prevent damage or destruction due to uneven peeling force. There is.

For this reason, the peeling time of the light-transmitting resin film increases, resulting in a problem that the working time in the printed wiring board manufacturing process becomes longer.

The above-mentioned and other problems and novel features to be solved by the present invention will become clear from the description of this specification and the accompanying drawings.

(2) Structure of the Invention [Means for Solving Problems] Among the inventions disclosed in this application, a brief overview of typical inventions is as follows.

That is, the first invention of the present application is a peeling method for peeling off a thin film stuck to a substrate, and a thin film peeling guide member that sets the peeling direction of the thin film stuck to the substrate to be substantially perpendicular to the substrate. A second invention is a method for peeling a thin film, which is characterized in that the thin film attached to the substrate is pulled up, and the peeling direction of the pulled up thin film is directed with respect to the substrate. A thin film peeling method characterized in that the thin film pulled up by the thin film pulling means is transported while being peeled using a thin film peeling guide member set in a substantially vertical direction and nine film peeling conveyance means! 6 [Function] The present invention is a method of pulling up a thin film using the thin film pulling means, and with the back side of the pulled up thin film being applied to the thin film peeling guide member, the light-transmitting resin film, etc. Since the thin film is peeled off from the substrate, the peeling force is uniformly and stably applied to the thin film.

[Example] Hereinafter, an example in which the present invention is applied to a peeling device for a protective film of a printed wiring board will be described.

It should be noted that in all the examples, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 1 shows a schematic configuration of a peeling and conveying mechanism for a protective film of a printed wiring board according to an embodiment of the present invention.

The transport mechanism for the printed wiring board of this embodiment is as shown in FIGS. 1 and 2 (enlarged cross-sectional view of the main part of FIG. 1).
Mainly, a conveying roller 2 that conveys the printed wiring board 1. It is composed of a conveyance control roller 3.

The printed wiring board 1 has both sides (
A copper conductive layer IB is formed on one side (or one side).

On the conductive layer ID of this printed wiring board 1, a laminate consisting of a photosensitive resin ff1lc and a transparent resin film (protective film) ID is laminated by thermocompression bonding, and the photosensitive resin! ! 11c is exposed to a predetermined wiring pattern.

The conveyance roller 2 and the conveyance control roller 3 are shown in FIG.
In the transport path indicated by line -A, the printed wiring board l is transported in the direction of the arrow.

The protective film lifting mechanism is activated as shown in FIG. 3 when the tip of the printed wiring board 1 is at a predetermined position.

This is to raise a part of the translucent resin film ID, and the adhesive rotating body 4 is pressed and adhered to the translucent resin film ID of the printed wiring board 1, and lifted in that state to raise the translucent resin film ID. A part of the resin film ID can be pulled up reliably.

As shown in FIGS. 3 and 4, this sticky rotating body 4 includes a sticky object 4A provided on the circumferential surface of the cylindrical rotating body,
It is composed of an arm 4C movable around a rotating shaft 4B. This arm 4C is for moving the adhesive rotating body 4 up and down by rotation of the gear mechanism 5. As shown in FIG. 5, the arm 4C is inserted between the belts 6Cb of the movable conveyor belt mechanism.

When the tip of the printed wiring board 1 is set at a predetermined position under the control of the conveyance control roller 3, the adhesive rotating body 4 has an arm 4C that moves in the direction of arrow B, as shown in FIG. , the adhesive object 4A is brought into contact with the tip of the transparent resin film ID. After that, as shown in FIG. 4, when the printed wiring board 1 is conveyed in the conveyance direction by the conveyance control roller 3 and the arm 4C is moved in the direction of arrow C, the adhesive object 4A moves the transparent resin film. ID
The tip of the is pulled up. At this time, compared to the adhesive strength between the transparent resin film ID and the photosensitive resin layer IC, the adhesive strength between the photosensitive resin JIIC and the conductive layer IB, and between the insulating substrate IA and the conductive layer I
Since the adhesive force with B is stronger, the photosensitive resin layer IC does not peel off from the conductive layer IB.

In this way, by providing the adhesive rotating body 4 with a simple configuration, a part of the transparent resin film ID having a weak adhesive force can be easily raised. Moreover, the adhesive rotating body 4
A part of the translucent resin film 10 can be raised simply by touching and pulling it up, so there is no need to apply a mechanical attack.

L's does not cause damage or destruction to the photosensitive resin layer IC.In addition, by providing the adhesive rotating body 4 on the conveyance path of the printed wiring board 1, a part of the translucent resin film ID can be automatically removed. can be triggered.

The peeling and conveying mechanism 6 includes a fixed belt conveyor 6A, a thin film peeling guide member 6B, a movable belt conveyor 6C, and a thin film discharge conveying belt mechanism 6D.

The fixed belt conveyor 6A has a pair of rollers 6A as shown in the main part perspective views of FIGS. 1, 4, and 6.
A plurality of +6Aa' are provided, each pair of rollers 6Aa
, 6Aa' are wound around the belt 6Ab.

As shown in FIGS. 1, 4, and 5, the movable belt conveyor 6C includes a plurality of pairs of rollers 6Ca and 6Ca', and a belt 6Cb wound around each pair of rollers 6Ca and 6Ca'. has been done.

This movable belt conveyor 6C is movable by an air cylinder 6Cc around one roller 6Ca, and is configured to be close to or in contact with the belt 6Ab of the fixed belt conveyor 6A or the thin film peeling guide member 6B. The movable belt conveyor 6C is configured to reliably hold the transparent resin film ID peeled off by the adhesive rotating body 4 on the thin film peeling guide member 6B.

The fixed belt conveyor 6A and the movable belt conveyor 6C
Then, the transparent resin film 1 is peeled off using the adhesive rotating body 4.
A pair of rollers 6Aa, 6Aa' and a pair of rollers 6C are placed between each pair of rollers 6Aa, 6Aa' and a pair of rollers 6C at positions II shown by dotted lines in FIG.
It is configured to sequentially peel and discharge by driving a and 6Ca'.

The thin film peeling guide member 6B is connected to a fixed belt conveyor 6.
It is provided in the casing of the thin film peeling device on the A side, and is arranged between the belts GAb.

This thin film peeling guide member 6B is a transparent resin film I.
Preventing the peeling position from changing when peeling D.

It is possible to prevent deviation of peel stress, and the photosensitive resin layer IC
In order to prevent damage or destruction of the transparent resin film ID, the translucent resin film ID
It has a structure that guides the peeling. The tip of the thin film peeling guide member 6B is attached to the printed wiring board 1.
They are spaced far enough apart to prevent rubbing.

Further, the tip of the thin film peeling guide member 6B has a cross section in the shape of a circular arc with a small radius of curvature, for example, one radius of curvature is three or less.

By providing the thin film peeling guide member 6B in this way, the peeling position is stabilized and the transparent resin film I
Uniform peeling stress can be applied to D and the photosensitive resin layer IC.

As mentioned above, the peeling conveyance mechanism 6 includes a fixed belt conveyor 6A, a thin film peeling guide member 6B, and a movable belt conveyor 6.
By configuring C, the transparent resin film ID pulled up by the adhesive rotating body 4 can be attached to the thin film peeling guide member 6B.
The sheet is guided by the fixed belt conveyor 6A and the movable belt conveyor 6C, and is conveyed while being peeled off, and can be discharged in the discharge direction shown by the arrow out in FIG.

The conveyor belt machine i6D for discharging a thin film is composed of a plurality of rollers 6Da and a pair of belts 6Db, as shown in FIG. This thin film discharge conveyor belt mechanism 6D is connected to the translucent resin film ID on the upper surface side of the printed wiring board l.
is configured to emit.

Note that the movable belt conveyor 6C may be configured to be moved by an electromagnetic solenoid or a hydraulic cylinder instead of the air cylinder 6Cc.

In this way, by providing a thin film peeling device on the conveyance path of the printed wiring board l, a part of the transparent resin film ID of the printed wiring board l is pulled up by the adhesive rotating body 4, and then The peeling S conveying mechanism 6 automatically peels and conveys the transparent resin film ID, and then reliably discharges the peeled transparent resin film ID, which greatly reduces work time. Can be shortened.

After the transparent resin film 1'O is peeled off by the thin film peeling device, the printed wiring board 1 is transported by the transport control roller 3 and the transport roller 2 to a developing device that develops the photosensitive resin layer IC.

It should be noted that the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the spirit of the invention.

For example, the thin film peeling guide member 6B may be formed of a plurality of rod-like members in a lattice shape, as shown in FIG. It has a small arc-shaped structure.

In addition, the thin film peeling and conveying means includes a combination of rotating rollers, a combination of fixed belts and fixed belts, a method of winding the film around a single rotation roller,
It is also possible to use a method of peeling and conveying a thin film using the suction force of a suction cup.

Further, in the above embodiment, the present invention is applied to a device for removing a thin film of a printed wiring board. May be applied.

(3) Effects As explained above, according to the present invention, the thin film attached to the substrate is peeled off using a thin film peeling guide member that sets the peeling direction substantially perpendicular to the substrate.
Uniform peeling stress is applied to thin films such as translucent resin films and photosensitive resin layers to stabilize the peeling position, which prevents fluctuations in the peeling position and reduces peeling stress when peeling thin films such as translucent resin films. Unbalance can be prevented, and the photosensitive resin layer can be peeled off without being damaged or destroyed.

In addition, by creating a structure in which a part of the thin film attached to the substrate is lifted up, and the lifted thin film is peeled off in a direction approximately perpendicular to the substrate while being conveyed, transparent resin films, etc. It applies uniform peeling stress to the thin film and photosensitive resin layer and stabilizes the peeling position, so it can prevent fluctuations in the peeling position and uneven peeling stress when peeling thin films such as translucent resin films. And the photosensitive resin layer was damaged.

It can be peeled off automatically to avoid destruction.

Furthermore, since the thin film can be easily and instantaneously peeled off from the base material, the working time for peeling off the thin film can be significantly shortened.

[Brief explanation of the drawing]

Figure 1 shows a printed wiring diagram according to an embodiment of the present invention.
' A cross-sectional view showing a schematic configuration of a conveyance mechanism for peeling off a protective film on a substrate; FIG. 2 is an enlarged perspective view of a main part of the conveyance Ia ellipse in FIG. 1; FIG. Figure 4 is an enlarged sectional view showing the schematic configuration of the main parts of the peeling and conveying mechanism in Figure 1; Figure 5 is a perspective view showing the schematic configuration of the thin film peeling mechanism in Figure 1; figure. 6 is a perspective view showing a schematic structure of the fixed belt conveyor and the main parts of the thin film peeling guide member shown in FIG. 1, and FIG. 7 is a perspective view showing the schematic structure of another embodiment of the thin film peeling guide member. be. In the figure, l: printed wiring board, IA: insulating substrate, IB: conductive layer, IC: photosensitive resin layer, L
D... Transparent resin film (protective film), 2... Conveyance roller. 3... Conveyance control roller, 4... Adhesive rotating body, 4A
... Adhesive object, 4B... Rotating shaft, 4C... Arm, 5... K wheel mechanism, 6... Separate transport mechanism, 6A.
...Fixed belt conveyor, 6B...Thin film peeling guide member, 6C...Movable belt conveyor, 6D...Transport belt for thin film discharge aMI! It is. Director Somar Co., Ltd.

Claims (5)

[Claims] (1) In a thin film peeling method for peeling off a thin film pasted on a substrate, the thin film pasted on the substrate is peeled off using a thin film peeling guide member that sets the peeling direction of the thin film substantially perpendicular to the substrate. Characteristic thin film peeling method. (2) A thin film peeling device for peeling off a thin film stuck to a substrate, comprising a thin film pulling means for pulling up the thin film stuck to the substrate, and a peeling direction of the thin film pulled up at the time of peeling with respect to the substrate. 1. A thin film peeling apparatus comprising: a thin film peeling guide member set in a substantially vertical direction; and a thin film peeling and conveying means for peeling and conveying the thin film raised by the thin film raising means. (3) The thin film peeling and conveying means conveys the thin film while peeling it using a fixed belt conveyor provided with the thin film peeling guide member and a movable belt conveyor that sandwiches the thin film attached to the thin film peeling guide member. A thin film peeling apparatus according to claim 2, characterized in that the thin film peeling apparatus comprises: (4) The thin film peeling guide member is provided at a position that forms a small gap with the substrate.
The thin film peeling device described in Section 1. (5) The thin film peeling method according to claim 1 or the thin film according to claim 2, wherein the tip of the thin film peeling guide member has a cross section configured in an arc shape with a small radius of curvature. Peeling device.