JPH05147819A - Method and apparatus for separating mylar for dry film - Google Patents

Abstract

PURPOSE:To separate Mylar without any damage such as bending or the like given to a flexible base material or metallic foil formed thereon. CONSTITUTION:A Mylar separating apparatus comprises a pair of reels 11, 12 for continuously transporting, while winding a long flexible base material 20, and also a metallic foil stuck to the surface side thereof and a dry film stuck to the back side thereof, a sucking device 13 disposed between the reels 11, 12 for sucking the metallic foil sides of sequentially transported electronic parts loading sub-strates, and a collecting device 14 disposed on the opposite side to the sucking device for continuously collecting Mylar 32 of the dry film.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is a continuous dry film Mylar applied to a flexible base material when a large number of electronic component mounting substrates are continuously formed using the flexible base material. The present invention relates to a method and an apparatus for peeling off selectively.

[0002]

2. Description of the Related Art Various types of materials have been used to form substrates for mounting electronic parts, and so-called reels, which perform various processes continuously while being wound on a reel.
In order to conform to the to reel system, a flexible base material made of a long flexible material such as a long glass epoxy tape is used. Since this flexible base material has an insulating property, a large number of electronic component mounting boards are continuously formed by continuously applying a metal foil on the surface thereof and forming a predetermined pattern. ..

An etching resist, which is also called a dry film, is used when an electronic component mounting substrate is manufactured using such a long flexible base material. That is, the metal foil continuously attached to the flexible substrate is processed into a pattern which is a conductor circuit by etching the metal foil into a predetermined shape, and is used as an etching resist in this case. Is a dry film. As shown in FIG. 5, this dry film is generally composed of a photosensitive layer 31 which becomes an etching resist by exposure and phenomenon, and a Mylar 32 and a cover film 33 which protect both surfaces of the photosensitive layer 31. It is something.

First, as shown in FIG. 6, the dry film 30 as described above is adhered to the surface of the metal foil 21 adhered on the surface of the flexible substrate 20 while peeling off the cover film 33. As shown in FIG. 7, the photosensitive layer 31 of the dry film 30 thus attached is exposed through a negative mask having a predetermined pattern, and then, as shown in FIG. 32 is peeled off. While doing so, the metal foil 21 on the surface side of the flexible substrate 20 is etched to form a predetermined pattern.

By the way, in a board for mounting electronic parts using a flexible base material, a sufficiently large hole for accommodating and arranging electronic parts, a so-called device hole or the like is formed in the flexible base material 20. Is coming. This device hole is formed before the metal foil 21 is attached to the flexible substrate 20, and therefore the metal foil 21 is exposed in the etchant on the back surface side when the metal foil 21 is etched. is there. Therefore, in order to prevent the metal foil 21 from being etched through the device hole and to prevent the warp of the base material, a dry film 30 should be attached also to the flexible base material 20 surface side as shown in FIG. I have to. And this flexible base material 2
For the dry film 30 on the 0 side, the mylar 32
Therefore, the peeling work of is required.

[0006] Mylar 32 in the dry film 30 for etching resist on the surface side of the flexible substrate 20
As shown in FIG. 4, the peeling work of the flexible base material 2 is performed.
This is performed before forming the pattern 22 from the metal foil 21 on the front surface side of 0, and was performed in the state as shown in FIG. 8, for example. However, since the mylar 32 to be peeled off is adhered to the photosensitive layer 31, and the above-described reel-to-reel work is continuously performed at a constant speed, it is particularly flexible. In the vicinity of the device hole of the base material 20, a force for bending the flexible base material 20 as indicated by an arrow in FIG. 4 is applied. By this power,
The flexible base material 20 may remain bent, or the metal foil 21 in the device hole may be bent, so that it has perfect planarity when completed as an electronic component mounting substrate. It may not be what was done. In order to avoid this, it has been attempted to reduce the transport speed of the flexible base material 20, but this would reduce the workability of reel-to-reel by half.

Further, when the dry films 30 are attached to both surfaces of the electronic component mounting substrate, it is extremely difficult to simultaneously remove the mylars 32 on the front and back to cancel the stresses on the front and back. Therefore, for example, when the mylar 32 on the metal foil 21 side is peeled off first, the metal foil 21 is bent due to the tension of the dry film 30 on the flexible substrate 20 side as shown in FIG.

Therefore, the inventors of the present invention have made various studies on how to eliminate the above-mentioned difficulties in the completed electronic component mounting substrate while making full use of the reel-to-reel work advantages. As a result, the present invention has been completed.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and the problem to be solved is to use a long flexible base material for reeling an electronic component mounting substrate. This is a force generated by Mylar peeling to bend the flexible base material or the metal foil formed on the surface of the flexible base material when manufacturing by the toe reel method.

The object of the present invention is to positively generate a force for canceling the force caused by peeling of Mylar so that the flexible base material or the metal foil formed on the surface thereof is not bent. It is an object of the present invention to provide a Mylar peeling method and apparatus that can be prevented from occurring by a simple configuration.

[0011]

In order to solve the above problems, first, the means adopted by each invention according to claim 1 and claim 2 will be described with the reference numerals used in the embodiments. , "Affixed to at least the flexible base material 20 side of an electronic component mounting board formed by sticking a metal foil 21 on the surface of a long flexible base material 20 having holes for physically or electrically connecting electronic parts. The method for continuously peeling off the mylar 32 of the dry film 30 thus prepared, the surface of the metal foil 21 including the portion where the mylar 32 is peeled off during continuous conveyance through the flexible base material 20 such as the metal foil 21. By continuously sucking the metal foil 21 and the like while continuously transporting the metal foil 21 and the like in a stable state, the surface of the side opposite to the suctioned side The method for continuously peeling off the iller 32 is also a method for peeling off the mylar 32 of the dry film 30 attached to both surfaces of the electronic component mounting substrate, and peeling off the mylar 32 on the metal foil 21 side. The method for continuously peeling off the mylar 32 according to claim 1, wherein the mylar 32 on the side of the flexible substrate 20 is peeled off before the treatment.
Is.

That is, in these peeling methods, the flexible base material 20 is conveyed while a negative pressure is generated in a part of the flexible base material 20 on the side of the metal foil 21, and the portion of the flexible base material 20 which is sucked. The mylar 32 of the dry film 30 is peeled off on the side opposite to the above.

According to this peeling method, the force for sucking the flexible base material 20 on both sides of the flexible base material 20 and the mylar 32 are used.
Since the force for peeling off is applied from the opposite sides, the forces from both sides are not balanced, and the force does not bend the flexible base material 20 or the metal foil 21 formed on the surface side thereof. is there. Moreover, this is the same when the flexible base material 20 is being conveyed between the drive reel 11 and the driven reel 12, so that the flexible base material 20 is conveyed while checking the bending of the metal foil 21 as in the conventional case. Therefore, it is possible to speed up the transportation of the flexible substrate 20 without performing the above.

The Mylar stripping apparatus 10 according to claim 3 embodies the stripping method as described above. The means adopted by the Mylar peeling apparatus 10 will be described with reference to the reference numerals used in the examples. "Along with the long flexible base material 20, the metal foil 21 attached to the front surface side and the back surface side thereof are attached. Suction for sucking the pair of reels 11 and 12 that continuously conveys the dry film 30 while winding and the metal foil 21 side of the electronic component mounting substrate that is arranged between the reels 11 and 12 and that is sequentially conveyed. Device 13 and this suction device 13
And a collecting device 14 for continuously collecting the mylar 32 of the dry film 30 which is disposed on the opposite side of the dry film mylar peeling device 10 ″.

According to the mylar peeling device 10, the mylar 32 is continuously peeled as follows. That is, the flexible base material 20 having the metal foil 21 formed on the front surface side and the dry film 30 protected by the mylar 32 formed on the back surface side is previously wound around the driven reel 12 side as shown in FIG. One end of the flexible base material 20 is wound around the drive reel 11 so that the metal foil 21 of the flexible base material 20 is on the suction device 13 side, and the flexible base material 20 is rotated by the rotation of the drive reel 11. Is transported on the suction device 13 at a constant speed. Further, one end of the mylar 32 of the dry film 30 attached to the flexible base material 20 is wound around the collecting device 14 arranged on the side opposite to the suction device 13, and this collecting device 14 is a drive reel. 1
The mylar 32 that has been peeled off is wound up at the same speed as the conveyance speed of the flexible substrate 20 according to No. 1.

When the mylar peeling device 10 is operated after the above-mentioned setting, the flexible substrate 20 is sucked and fixed on the suction device 13, and the sucked and fixed part of the mylar 32 is peeled off. is there. After that, the suction is released, the flexible base material 20 is conveyed by the tension roller 15 for a predetermined length, is again adsorbed and fixed on the suction device 13, and the mylar 32 is peeled off. A metal foil 21 is formed on the side of the suction device 13 of the flexible base material 20. If the metal foil 21 comes into direct contact with the suction device 13, the metal foil 21 will be damaged. In the case of the fixed type as shown in (4), the conveyed flexible substrate 20 is kept at a constant distance L from the suction device 13.
Further, as shown in FIG. 3, the use of the suction roller 13a that matches the moving speed of the flexible base material 20 also prevents the metal foil 21 from being damaged.

As described above, in the flexible substrate 20 conveyed along the suction device 13 or the suction roller 13a, the mylar 32 is peeled off at the portion located on the side opposite to the suction device 13 or the suction roller 13a. Due to this peeling, a pulling force is applied to the side opposite to the suction device 13 or the suction roller 13a, but this force is canceled by the suction force of the suction device 13 or the suction roller 13a. Therefore, in the portion of the flexible base material 20 being conveyed where the mylar 32 is being peeled off, no force is applied to bend the flexible base material 20 or the metal foil 21 attached to the surface of the flexible base material 20. As a result, the flexible substrate 20 or the metal foil 21 is transported without any deformation and the mylar 32 is peeled off.

[0018]

Next, the invention according to each claim will be described in detail according to the embodiments shown in the drawings. The stripping method of claims 1 and 2 is substantially the same as that of the mylar stripping device 10 of claim 3. Therefore, the following is the Mylar stripping device 10
I will explain mainly.

First, the flexible base material 20 to be embodied by the present invention will be described. The flexible base material 20 is formed in a long length by a glass epoxy tape or the like. It is wound around the driven reel 12. Further, as shown in FIG. 4, the flexible base material 20 is used to configure a large number of electronic component mounting boards using this as an insulating base material, and is provided with necessary sprocket holes and electronic components. A device hole for mounting is formed. Then, on the surface of the flexible base material 20, a metal foil 21 which is to be a pattern 22 (conductor circuit) required as a substrate for mounting electronic components is attached. The pattern 22 is formed by using a dry film as shown in FIG.

The pattern 22 is formed by continuous etching. In order to prevent the etchant from flowing from the device hole of the flexible base material 20 during this etching, the dry film on the front side of the flexible base material 20 is formed. Another dry film 30 is attached to the back surface side of the flexible substrate 20, and the mylar 32 of this dry film 30 must be peeled off when it is no longer needed. The peeling method or the mylar peeling apparatus 10 according to the present invention is used for peeling the mylar 32.

FIG. 1 is a schematic side view of a mylar peeling device 10 according to the present invention. The mylar peeling device 10 has a driven reel 12 around which a flexible base material 20 is wound, and the driven reel 12. A drive reel 11 for winding the wound flexible base material 20 is provided. Then, the drive reel 11 and the driven reel 12
The suction device 13 is disposed between the suction device 13 and the suction device 13, and the recovery device 14 for winding the separated mylar 32 is disposed on the opposite side of the suction device 13.

The suction device 13 shown in FIG. 1 or FIG.
Is, so to speak, a fixed type, and is adapted to intermittently suck a fixed length portion of the flexible base material 20 arranged on the upper side in the drawing. Since this suction device 13 is of a fixed type, when the flexible base material 20 passes therethrough, it may damage the lower surface side of the flexible base material 20 as shown in the drawing. The flexible base material 20 is guided to the position 13 at a height of the dimension L. That is, when the fixed length of the flexible base material 20 is fixed to the suction device 13 by suction, that is, when the flexible base material 20 is transported, the suction device 1 is used.
The mylar 32 is peeled off in a state of being stopped on the above 3. After that, the suction is released, and the fixed length of the flexible base material 20 is conveyed by the action of the tension roller 15, and again sucked and fixed to the suction device 13, and the mylar 32 in this portion is peeled off.

FIG. 3 shows an example in which the metal foil 21 side of the flexible substrate 20 is sucked by the suction roller 13a. That is, the suction roller 13a is
While rotating at the same speed as the movement of the flexible base material 20, air is sucked through the holes formed in the outer peripheral surface of the flexible base material 20 to suck the flexible base material 20 that is being conveyed.

The collecting device 14 arranged on the opposite side of the suction device 13 or the suction roller 13a from the flexible substrate 20 as described above winds up the separated mylar 32 as shown in FIG. The take-up speed corresponds to the carrying speed of the flexible substrate 20. In the mylar peeling device 10 according to the present embodiment, the tension roller 15 is arranged between the suction device 13 and the drive reel 11, and a certain tension is applied to the flexible base material 20 conveyed by the tension roller 15. So that the flexible base material 20 is in a stable state with respect to the suction device 13, and also exerts a buffering function in the case where the speed mismatch occurs between the recovery device 14 and the drive reel 11 for some reason. I am doing it.

The Mylar peeling apparatus 1 according to the present embodiment
In No. 0, the sensor 16 for detecting the presence or absence of the mylar 32 is arranged between the mylar peeling device 10 and the suction device 13, and when the sensor 16 detects that the mylar 32 does not exist, The operation of the entire Mylar peeling device 10 is stopped.

[0026]

As described above, in the inventions according to claim 1 and claim 2, as illustrated in the above-mentioned embodiment, mainly, "holes for physically or electrically connecting electronic parts are provided. Long flexible base material 2
A method for continuously peeling off the Mylar 32 of the dry film 30 attached to at least the flexible base material 20 side of the electronic component mounting substrate formed by attaching the metal foil 21 to the surface of the metal foil 21. During the continuous transportation through the flexible base material 20, the metal foil 21 and the like are kept in a state of continuously sucking the surface of the metal foil 21 including the part where the mylar 32 is peeled off, so that the flexible base material 2 is removed.
It is characterized in that the Mylar 32 on the side opposite to the suctioned side is continuously peeled off while being continuously conveyed in a stable state together with 0. The unnecessary mylar 32 can be reliably peeled off without being bent or damaged. In particular, according to the method of claim 2, since the metal foil 21 is not pulled through the Mylar 32 into the opening formed in the flexible base material 20 (this does not occur as shown in FIG. 9), the above-mentioned opening Metal foil 21 located at
There will be no bends or swells.

A Mylar stripping apparatus 1 according to claim 2
0, the peeling method according to claim 1 can be concretely implemented, and the conventional equipment can be easily configured without changing the equipment by attaching the suction device 13 or the suction roller 13a. Can be done.

[Brief description of drawings]

FIG. 1 is a side view showing a schematic configuration of a Mylar peeling apparatus according to the present invention.

FIG. 2 is an enlarged cross-sectional view of a main part centering on a suction device in the Mylar peeling device of FIG.

FIG. 3 is a side view showing a suction roller.

FIG. 4 is a partially enlarged side view of a flexible base material and a dry film, which are objects when implementing the present invention.

FIG. 5 is a perspective view showing a general configuration of a dry film.

FIG. 6 is a partially enlarged side view showing a state where a dry film is attached on a metal foil of a flexible base material.

FIG. 7 is a partially enlarged cross-sectional view showing a state in which the photosensitive layer of the dry film is exposed.

FIG. 8 is a partially enlarged cross-sectional view showing a conventional method for removing unnecessary mylar.

FIG. 9 is a partially enlarged sectional view showing a conventional technique.

[Explanation of symbols]

 10 Mylar Peeling Device 11 Drive Reel 12 Driven Reel 13 Suction Device 13a Suction Roller 14 Collection Device 15 Tension Roller 16 Sensor 20 Flexible Base Material 21 Metal Foil 22 Pattern 30 Dry Film 31 Photosensitive Layer 32 Mylar 33 Cover Film

Claims (3)

[Claims] 1. An electronic component mounting substrate comprising a metal foil attached to the surface of a long flexible substrate having holes for physically or electrically connecting electronic components to at least the flexible substrate side. A method for continuously peeling off the mylar of the attached dry film, in the course of continuous transportation through the flexible base material such as the metal foil, the metal foil surface is continuously peeled including the portion where the mylar is peeled off. By maintaining the suction state, the metal foil or the like is continuously conveyed in a stable state together with the flexible base material while continuously peeling off the mylar on the side opposite to the suctioned side. Method. 2. A method of peeling the mylar of a dry film attached to both surfaces of the electronic component mounting substrate, wherein the mylar of the flexible substrate is peeled before the mylar of the metal foil side is peeled. A method for continuously peeling the mylar according to claim 1. 3. A pair of reels for continuously transporting while winding a metal foil attached to the front surface side and a dry film attached to the back surface side together with a long flexible base material, and arranged between these reels. A suction device that sucks the metal foil side of the electronic component mounting substrate that is sequentially conveyed, and a collection device that is disposed on the opposite side of the suction device and that continuously collects the Mylar of the dry film A dry film mylar peeling device comprising: